JP4049330B2 - 電界発光ディスプレイ装置及びその製造方法 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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Description
120 バッファ層
130 半導体活性層
140 ゲート絶縁層
150 ゲート電極
160 中間層
170 ソース/ドレイン電極
180 保護層
210 第1電極層
220 画素定義層
240 画素開口部
300 駆動電源供給ライン
400 第2電極層
410 電極電源供給ライン
500 垂直駆動回路部
600 水平駆動回路部
800 密封部
Claims (15)
- 基板上に各々少なくとも1層からなる第1電極層及び第2電極層と,前記第1電極層及び前記第2電極層間に形成される電界発光部と,を有する画素が形成されたディスプレイ領域と,
前記ディスプレイ領域の電極に電源を供給する電極電源供給ラインと,
前記電極電源供給ライン上に形成されて少なくとも1つのビアホールを有し,有機物を含む,少なくとも1つの絶縁層と,
前記電極電源供給ライン上部で,前記ビアホールを含む前記絶縁層上に形成される補助導電層と,
を備え,
前記電極電源供給ラインと前記第2電極層とは,前記ビアホールで前記補助導電層を介して互いに電気的に連結され,前記絶縁層上の前記補助導電層は少なくとも1つの貫通部を有することを特徴とする,電界発光ディスプレイ装置。 - 前記補助導電層は,前記第1電極層の少なくとも一部と同一の層で形成されていることを特徴とする,請求項1に記載の電界発光ディスプレイ装置。
- 前記補助導電層は複数の貫通部を有し,前記貫通部間の距離は前記第1電極層の両端間の最大距離より短いことを特徴とする,請求項1または2に記載の電界発光ディスプレイ装置。
- 前記ビアホールの外側部には,少なくとも1つの貫通部が配置されていることを特徴とする,請求項1または2に記載の電界発光ディスプレイ装置。
- 前記貫通部は,少なくとも1つの貫通孔で形成されていることを特徴とする,請求項1〜4のいずれかに記載の電界発光ディスプレイ装置。
- 前記貫通孔は,ライン状に形成されていることを特徴とする,請求項1〜4のいずれかに記載の電界発光ディスプレイ装置。
- 前記第1電極層の下部に薄膜トランジスタ層が配置され,前記電極電源供給ラインは,少なくとも前記薄膜トランジスタ層のソース/ドレイン電極と同一の層を有していることを特徴とする,請求項1〜6のいずれかに記載の電界発光ディスプレイ装置。
- 前記第1電極層の下部に薄膜トランジスタ層が配置され,前記電極電源供給ラインは,少なくとも前記薄膜トランジスタ層の半導体活性層と同一の層を有していることを特徴とする,請求項1〜6のいずれかに記載の電界発光ディスプレイ装置。
- 基板上に各々少なくとも1層からなる第1電極層及び第2電極層と,前記第1電極層及び前記第2電極層間に形成される電界発光部と,を有する画素が形成されたディスプレイ領域と,
前記ディスプレイ領域の電極に電源を供給する電極電源供給ラインと,
前記電極電源供給ライン上に形成されて少なくとも1つのビアホールを有し,有機物を含む,少なくとも1つの絶縁層と,
前記電極電源供給ライン上部で,前記ビアホールを含む前記絶縁層上に形成される,複数の単位補助導電層を有する補助導電層と,
を備え,
前記電極電源供給ラインと前記第2電極層とは,前記ビアホールで前記補助導電層を介して互いに電気的に連結され,前記絶縁層上の前記単位補助導電層は互いに離隔されていることを特徴とする,電界発光ディスプレイ装置。 - 前記単位補助導電層内の一地点と前記単位補助導電層端部との距離は,前記第1電極層の一地点と前記第1電極層端部との最大距離以下であることを特徴とする,請求項9に記載の電界発光ディスプレイ装置。
- 基板上に各々少なくとも1層からなる第1電極層及び第2電極層と,前記第1電極層及び前記第2電極層間に形成される電界発光部と,を有する画素が形成されたディスプレイ領域と,前記ディスプレイ領域に電極電源を供給する電極電源供給ラインと,を備える電界発光ディスプレイ装置の製造方法において;
前記電極電源供給ライン上に,有機物を含む少なくとも1つの絶縁層を形成する段階と,
前記絶縁層上に,少なくとも1つのビアホールを形成する段階と,
前記ビアホールを含む前記絶縁層上に補助導電層を形成する段階と,
前記補助導電層上に貫通部を形成する段階と,
を含むことを特徴とする,電界発光ディスプレイ装置の製造方法。 - 前記補助導電層の形成段階は,前記第1電極層の少なくとも一部の層を形成する際に同時に形成されることを特徴とする,請求項11に記載の電界発光ディスプレイ装置の製造方法。
- 前記ビアホールは複数形成され,前記貫通部は前記ビアホール間に形成されることを特徴とする,請求項11または12に記載の電界発光ディスプレイ装置の製造方法。
- 前記貫通部は複数形成され,前記貫通部間の距離は,前記第1電極層の両端間の最大距離以下であることを特徴とする,請求項11〜13のいずれかに記載の電界発光ディスプレイ装置の製造方法。
- 基板上に各々少なくとも1層からなる第1電極層及び第2電極層と,前記第1電極層及び前記第2電極層間に形成される電界発光部と,を有する画素が形成されたディスプレイ領域と,前記ディスプレイ領域の電極に電源を供給する電極電源供給ラインと,を備える電界発光ディスプレイ装置の製造方法において;
前記電極電源供給ライン上に,有機物を含む少なくとも1つの絶縁層を形成する段階と,
前記絶縁層上に少なくとも1つのビアホールを形成する段階と,
前記ビアホールを含む前記絶縁層上に,複数の単位補助導電層を有する補助導電層を形成する段階と,
を含むことを特徴とする,電界発光ディスプレイ装置の製造方法。
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KR1020040038735A KR100573149B1 (ko) | 2004-05-29 | 2004-05-29 | 전계 발광 디스플레이 장치 및 이의 제조 방법 |
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JP (1) | JP4049330B2 (ja) |
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US8633919B2 (en) * | 2005-04-14 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device, driving method of the display device, and electronic device |
EP1760776B1 (en) * | 2005-08-31 | 2019-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for semiconductor device with flexible substrate |
KR101324756B1 (ko) | 2005-10-18 | 2013-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 그의 구동방법 |
JP4513777B2 (ja) * | 2005-11-14 | 2010-07-28 | セイコーエプソン株式会社 | 発光装置および電子機器 |
KR100875102B1 (ko) * | 2007-09-03 | 2008-12-19 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 |
KR100875103B1 (ko) | 2007-11-16 | 2008-12-19 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 |
KR20110019498A (ko) | 2009-08-20 | 2011-02-28 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
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WO2011045911A1 (ja) | 2009-10-15 | 2011-04-21 | パナソニック株式会社 | 表示パネル装置及びその製造方法 |
JP5209123B2 (ja) | 2009-11-04 | 2013-06-12 | パナソニック株式会社 | 表示パネル装置及びその製造方法 |
KR101035627B1 (ko) * | 2010-01-21 | 2011-05-19 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
KR101084198B1 (ko) | 2010-02-24 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
KR101097337B1 (ko) | 2010-03-05 | 2011-12-21 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
KR101097338B1 (ko) | 2010-03-05 | 2011-12-21 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
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