JP3144103U - 放熱部材および該放熱部材を有するラジエータ - Google Patents
放熱部材および該放熱部材を有するラジエータ Download PDFInfo
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- JP3144103U JP3144103U JP2008003783U JP2008003783U JP3144103U JP 3144103 U JP3144103 U JP 3144103U JP 2008003783 U JP2008003783 U JP 2008003783U JP 2008003783 U JP2008003783 U JP 2008003783U JP 3144103 U JP3144103 U JP 3144103U
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- heat radiating
- heat
- radiator
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- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】放熱部材3および該放熱部材3を有するラジエータであって、そのラジエータは、少なくとも一枚の基板部材2と複数の放熱部材3を含み、基板部材2は、ベース部21および複数の延出アーム22を含み、延出アーム22が隣接の他の2つの延出アーム22との間にスロット23を有し、各放熱部材3は、基板部材2の対応するスロット23に挿着され、各延出アーム22の両側壁面が、各放熱部材3の両表面31に強く当接し、各放熱部材2の少なくとも一方の表面に複数のエンボス放熱部311が突設され、各放熱部材3の頂端部301が基板部材2の上面から延出し、底端部302が該基板部材2の底面から延出する。
【選択図】図2
Description
111 上面
112 底面
12 半田
13 放熱フィン
131 表面
2 基板部材
2’ 基板部材
21 ベース部
21’ ベース部
211 上面
211’ 上面
212 底面
213 側壁
22 延出アーム
22’ 延出アーム
23 スロット
23’ スロット
3 放熱部材
31 表面
301 頂端部
302 底端部
311 エンボス放熱部
4 接続部
5 圧迫工具
Claims (5)
- 放熱部材を形成する少なくとも一方の表面に複数のエンボス放熱部が突設されたことを特徴とする放熱部材。
- 前記各エンボス放熱部は菱形であり、前記放熱部材は、放熱フィンまたは金属カップであることを特徴とする請求項1記載の放熱部材。
- ベース部と前記ベース部から延び出した複数の延出アームと各延出アームの隣接する他の延出アームとの間に形成されるスロットとを有する基板部材と、
少なくとも一方の表面に複数のエンボス放熱部が突設された複数の放熱部材とを備え、
前記スロットに前記放熱部材が挿着され且つ少なくとも延出アームの一側面と基板部材の一側面とが強く当接し、各放熱部材の頂端部が基板部材の上面から延出すると共に底端部が基板部材の底面から延出して成ることを特徴とする放熱部材を有するラジエータ。 - 前記各放熱部材は、放熱フィンであることを特徴とする請求項3記載の放熱部材を有するラジエータ。
- 前記各放熱部材のエンボス放熱部は菱形であることを特徴とする請求項4記載の放熱部材を有するラジエータ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097202290U TWM337229U (en) | 2008-02-01 | 2008-02-01 | Heat dissipating element and heat radiator containing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3144103U true JP3144103U (ja) | 2008-08-14 |
Family
ID=39705145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008003783U Expired - Fee Related JP3144103U (ja) | 2008-02-01 | 2008-06-05 | 放熱部材および該放熱部材を有するラジエータ |
Country Status (4)
Country | Link |
---|---|
US (1) | US8230902B2 (ja) |
EP (1) | EP2086305B1 (ja) |
JP (1) | JP3144103U (ja) |
TW (1) | TWM337229U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010245215A (ja) * | 2009-04-03 | 2010-10-28 | Neng Tyi Precision Industrial Co Ltd | 放熱器の製造方法、この製造方法により製造する放熱器、この製造方法に用いる位置合わせ移動機構並びに切断モジュール |
JP2016066694A (ja) * | 2014-09-24 | 2016-04-28 | 株式会社東芝 | ヒートシンク及び照明装置 |
US20180148827A1 (en) * | 2016-03-16 | 2018-05-31 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Thermal conduction device and vapor deposition crucible |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI357479B (en) * | 2008-11-28 | 2012-02-01 | Univ Nat Taiwan Science Tech | A thermal module for light source |
EP2241390B1 (en) * | 2009-04-16 | 2012-08-08 | Neng Tyi Precision Industries Co., Ltd. | Radiator manufacturing method |
US20110267821A1 (en) * | 2010-02-12 | 2011-11-03 | Cree, Inc. | Lighting device with heat dissipation elements |
US8498116B2 (en) * | 2010-07-16 | 2013-07-30 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
JP5185346B2 (ja) * | 2010-09-15 | 2013-04-17 | 株式会社日本自動車部品総合研究所 | ヒートシンク |
US9182085B2 (en) * | 2011-04-29 | 2015-11-10 | Koninklijke Philips N.V. | LED lighting device with upper heat dissipating structure |
US20130235578A1 (en) * | 2011-07-05 | 2013-09-12 | Industrial Technology Research Institute | Illumination device and assembling method thereof |
CN102290382A (zh) * | 2011-08-31 | 2011-12-21 | 昆山锦泰电子器材有限公司 | 热交换面积大的散热片 |
US20130118725A1 (en) * | 2011-11-10 | 2013-05-16 | Shyh-Ming Chen | Heat Sink and Fins Thereof |
DE102012104779A1 (de) * | 2012-06-01 | 2013-12-05 | Sumolight Gmbh | Beleuchtungsvorrichtung und Scheinwerfer |
TWI589814B (zh) * | 2014-07-24 | 2017-07-01 | 光寶電子(廣州)有限公司 | 發光裝置 |
JP6711204B2 (ja) * | 2016-08-22 | 2020-06-17 | 市光工業株式会社 | 車両用灯具 |
EP3663642A1 (de) * | 2018-12-04 | 2020-06-10 | ZKW Group GmbH | Kühlkörper für ein kraftfahrzeuglichtmodul |
USD907278S1 (en) * | 2019-06-03 | 2021-01-05 | Foshan Shine-Tech Lighting Electric Ltd | Light |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5794684A (en) | 1996-11-08 | 1998-08-18 | Jacoby; John | Stacked fin heat sink construction and method of manufacturing the same |
GB2323434B (en) * | 1997-03-22 | 2000-09-20 | Imi Marston Ltd | Heat sink |
US6269864B1 (en) * | 2000-02-18 | 2001-08-07 | Intel Corporation | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors |
US6644388B1 (en) | 2000-10-27 | 2003-11-11 | Alcoa Inc. | Micro-textured heat transfer surfaces |
US7097332B2 (en) | 2003-09-05 | 2006-08-29 | Gabor Vamberi | Light fixture with fins |
US20050211416A1 (en) | 2003-10-17 | 2005-09-29 | Kenya Kawabata | Heat sink with fins and a method for manufacturing the same |
US7296619B2 (en) * | 2004-10-21 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with heat spreader |
TW200934361A (en) * | 2008-01-16 | 2009-08-01 | Neng Tyi Prec Ind Co Ltd | Method of manufacturing heat dissipater and structure thereof |
-
2008
- 2008-02-01 TW TW097202290U patent/TWM337229U/zh not_active IP Right Cessation
- 2008-03-25 US US12/076,877 patent/US8230902B2/en not_active Expired - Fee Related
- 2008-03-26 EP EP08153333A patent/EP2086305B1/en not_active Not-in-force
- 2008-06-05 JP JP2008003783U patent/JP3144103U/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010245215A (ja) * | 2009-04-03 | 2010-10-28 | Neng Tyi Precision Industrial Co Ltd | 放熱器の製造方法、この製造方法により製造する放熱器、この製造方法に用いる位置合わせ移動機構並びに切断モジュール |
JP2016066694A (ja) * | 2014-09-24 | 2016-04-28 | 株式会社東芝 | ヒートシンク及び照明装置 |
US20180148827A1 (en) * | 2016-03-16 | 2018-05-31 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Thermal conduction device and vapor deposition crucible |
Also Published As
Publication number | Publication date |
---|---|
EP2086305A3 (en) | 2010-04-14 |
EP2086305B1 (en) | 2013-03-20 |
US20090194251A1 (en) | 2009-08-06 |
TWM337229U (en) | 2008-07-21 |
US8230902B2 (en) | 2012-07-31 |
EP2086305A2 (en) | 2009-08-05 |
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