JP2018094636A - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP2018094636A JP2018094636A JP2016238428A JP2016238428A JP2018094636A JP 2018094636 A JP2018094636 A JP 2018094636A JP 2016238428 A JP2016238428 A JP 2016238428A JP 2016238428 A JP2016238428 A JP 2016238428A JP 2018094636 A JP2018094636 A JP 2018094636A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- grinding wheel
- chuck table
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
12 ターンテーブル
13 14 15 チャックテーブルセット
20 第1研削手段
22 スピンドルユニット
23 スピンドル
25 第1研削ホイール
26 研削砥石
26a 研削面
30 第2研削手段
32 スピンドルユニット
33 スピンドル
35 第2研削ホイール
36 研削砥石
36a 研削面
41 吸着保持部
42 吸着面
50 微調整手段
E1 被加工物着脱域
E2 第1研削域
E3 第2研削域
M 支持部
P1 P2 P3 P4 回転軸
S1 S2 S3 S4 加工ライン
TA 第1チャックテーブル
TB 第2チャックテーブル
W 被加工物
Wa 被研削面
Claims (1)
- 被加工物を保持する複数のチャックテーブルと、該チャックテーブルを回動可能に支持しかつ回転可能なターンテーブルと、該チャックテーブルに保持された被加工物の被研削面に対して第1の研削を施す第1研削手段と、該チャックテーブルに保持され該第1の研削が施された該被加工物の被研削面に対して第2の研削を施す第2研削手段とから少なくとも構成される研削装置であって、
該第1研削手段は、研削面を有する研削砥石が配設された第1研削ホイールと、該第1研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、
該第2研削手段は、研削面を有する研削砥石が配設された第2研削ホイールと、該第2研削ホイールを支持して回転可能なスピンドルを有するスピンドルユニットとから少なくとも構成され、
該チャックテーブルは、該第1研削手段及び該第2研削手段に対応してそれぞれ2個ずつ配設され、
該第1研削ホイールに配設された該研削砥石の研削面と2個の該チャックテーブルの2個の吸着面とが対面する半径領域において研削が施され、
該第2研削ホイールに配設された該研削砥石の研削面と2個の該チャックテーブルの2個の吸着面とが対面する半径領域において研削が施されることを特徴とする研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016238428A JP6858539B2 (ja) | 2016-12-08 | 2016-12-08 | 研削装置 |
TW106137924A TWI730192B (zh) | 2016-12-08 | 2017-11-02 | 磨削裝置 |
KR1020170160552A KR102408593B1 (ko) | 2016-12-08 | 2017-11-28 | 연삭 장치 |
CN201711237844.8A CN108177038A (zh) | 2016-12-08 | 2017-11-30 | 磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016238428A JP6858539B2 (ja) | 2016-12-08 | 2016-12-08 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018094636A true JP2018094636A (ja) | 2018-06-21 |
JP6858539B2 JP6858539B2 (ja) | 2021-04-14 |
Family
ID=62545350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016238428A Active JP6858539B2 (ja) | 2016-12-08 | 2016-12-08 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6858539B2 (ja) |
KR (1) | KR102408593B1 (ja) |
CN (1) | CN108177038A (ja) |
TW (1) | TWI730192B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111152086A (zh) * | 2018-10-22 | 2020-05-15 | 株式会社迪思科 | 被加工物的加工方法和加工装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7301512B2 (ja) * | 2018-09-13 | 2023-07-03 | 株式会社岡本工作機械製作所 | 基板研削装置及び基板研削方法 |
TWI860380B (zh) * | 2019-07-17 | 2024-11-01 | 日商東京威力科創股份有限公司 | 基板加工裝置、基板處理系統及基板處理方法 |
CN113305732B (zh) * | 2021-06-22 | 2022-05-03 | 北京中电科电子装备有限公司 | 一种用于半导体设备的多工位全自动减薄磨削方法 |
CN114639601B (zh) * | 2022-02-17 | 2023-04-28 | 中环领先半导体材料有限公司 | 一种提升减薄机稼动率的新型工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61168462A (ja) * | 1985-01-18 | 1986-07-30 | Hitachi Ltd | ウエハ研削装置 |
JPH05277915A (ja) * | 1992-03-31 | 1993-10-26 | Nec Yamagata Ltd | ウェーハ裏面研削装置 |
JPH06143112A (ja) * | 1992-10-27 | 1994-05-24 | Koyo Mach Ind Co Ltd | 平面研削盤の研削方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138719B (en) * | 1983-04-26 | 1986-08-13 | Marconi Electronic Devices | Grinding apparatus |
JP3589621B2 (ja) | 2000-07-03 | 2004-11-17 | 株式会社ミツトヨ | 光電式エンコーダ及びそのセンサヘッドの製造方法 |
JP4455750B2 (ja) * | 2000-12-27 | 2010-04-21 | 株式会社ディスコ | 研削装置 |
JP4790322B2 (ja) * | 2005-06-10 | 2011-10-12 | 株式会社ディスコ | 加工装置および加工方法 |
JP2008047696A (ja) * | 2006-08-16 | 2008-02-28 | Disco Abrasive Syst Ltd | ウエーハ搬送方法および研削装置 |
JP4348360B2 (ja) * | 2006-12-12 | 2009-10-21 | Okiセミコンダクタ株式会社 | 研削ヘッド、研削装置、研削方法、及び、半導体装置の製造方法 |
JP4818995B2 (ja) * | 2007-06-25 | 2011-11-16 | 大昌精機株式会社 | 両頭平面研削盤 |
JP5149020B2 (ja) * | 2008-01-23 | 2013-02-20 | 株式会社ディスコ | ウエーハの研削方法 |
JP5342253B2 (ja) | 2009-01-28 | 2013-11-13 | 株式会社ディスコ | 加工装置 |
JP5619559B2 (ja) * | 2010-10-12 | 2014-11-05 | 株式会社ディスコ | 加工装置 |
KR101297848B1 (ko) * | 2011-11-14 | 2013-08-19 | 주식회사 엘지실트론 | 웨이퍼 연마장치 |
JP2014004663A (ja) * | 2012-06-26 | 2014-01-16 | Disco Abrasive Syst Ltd | 被加工物の加工方法 |
JP2014030884A (ja) * | 2012-08-06 | 2014-02-20 | Disco Abrasive Syst Ltd | 研削装置 |
JP6087565B2 (ja) * | 2012-10-03 | 2017-03-01 | 株式会社ディスコ | 研削装置および研削方法 |
JP6425505B2 (ja) | 2014-11-17 | 2018-11-21 | 株式会社ディスコ | 被加工物の研削方法 |
JP6441056B2 (ja) * | 2014-12-10 | 2018-12-19 | 株式会社ディスコ | 研削装置 |
-
2016
- 2016-12-08 JP JP2016238428A patent/JP6858539B2/ja active Active
-
2017
- 2017-11-02 TW TW106137924A patent/TWI730192B/zh active
- 2017-11-28 KR KR1020170160552A patent/KR102408593B1/ko active Active
- 2017-11-30 CN CN201711237844.8A patent/CN108177038A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61168462A (ja) * | 1985-01-18 | 1986-07-30 | Hitachi Ltd | ウエハ研削装置 |
JPH05277915A (ja) * | 1992-03-31 | 1993-10-26 | Nec Yamagata Ltd | ウェーハ裏面研削装置 |
JPH06143112A (ja) * | 1992-10-27 | 1994-05-24 | Koyo Mach Ind Co Ltd | 平面研削盤の研削方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111152086A (zh) * | 2018-10-22 | 2020-05-15 | 株式会社迪思科 | 被加工物的加工方法和加工装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI730192B (zh) | 2021-06-11 |
TW201821217A (zh) | 2018-06-16 |
KR20180065903A (ko) | 2018-06-18 |
CN108177038A (zh) | 2018-06-19 |
KR102408593B1 (ko) | 2022-06-14 |
JP6858539B2 (ja) | 2021-04-14 |
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