JP2018031711A - Substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect a probe without removing a probe unit.SOLUTION: A substrate inspection device comprises: a probe unit 2 in which multiple probes to bring distal end to an inspection spot of a substrate 100 are disposed; a movement mechanism 3 for the probe unit; a measurement part 5 for measuring electrical characteristics of the inspection spot in contact with the distal ends of the probes via the probes; a processing part 9 for executing movement control processing with respect to the movement mechanism 3; an imaging part 6 for picking up an image of an abutment surface 41a of the unit 2; a storage part 8 for storing positional information Dp indicating arrangement positions of the probes on the abutment surface 41a; a display part 11; and an operation part 10. The processing part 9 displays a probe arrangement image indicating the arrangement positions of the probes n the abutment surface 41a on a screen of the display part 11 based on the positional information Dp, causes the imaging part 6 to pick up an image of an arrangement surface within a predetermined range including a specific coordinate CO in the probe arrangement image when the coordinate CO is inputted from the operation part 10, and displays the picked-up image on the screen together with the probe arrangement image.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate inspection apparatus having a probe unit in which a plurality of probes are arranged.

  As this type of substrate inspection apparatus, a substrate inspection apparatus proposed by the applicant of the present application in Patent Document 1 below is already known. The substrate inspection apparatus includes a probe unit, a moving mechanism that moves the probe unit, a mounting table, a measurement unit, an inspection unit, a storage unit, and a processing unit, and is configured to be able to inspect the substrate. The probe unit includes a plurality of probes, a support portion, and an electrode plate. Each probe is used to input and output electrical signals by contacting a conductor part such as a conductor pattern on the substrate during inspection, and is formed into a rod having a circular cross section that can be elastically deformed by a conductive metal material. ing.

Japanese Patent Laying-Open No. 2015-21726 (page 5-6, FIG. 1-5)

  However, the conventional board inspection apparatus has the following problems to be improved. That is, in this type of substrate inspection apparatus, when doubt arises as a result of the inspection of the substrate (for example, the case where the inspection result for a specific inspection portion of the plurality of inspection portions on the substrate is not stable or a specific inspection) If the inspection result for a location becomes a defective inspection result at a high frequency), the probe used for the inspection of this specific inspection location may be defective. The probe is removed and transported to a work place for inspection, and the state of the probe is confirmed by enlarging the corresponding probe with a high magnification camera.

  However, this substrate inspection apparatus has a problem to be improved in that it takes time to inspect the probe because it is necessary to remove the probe unit from the moving mechanism each time the probe is inspected.

  This invention is made | formed in view of this subject, and it aims at providing the board | substrate inspection apparatus which can implement a test | inspection of a probe, without removing a probe unit.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 is provided with a probe unit in which a plurality of probes for bringing a tip portion into contact with a corresponding inspection location on a substrate to be inspected, and a moving mechanism for moving the probe unit. A measurement unit that measures electrical characteristics of the inspection point that contacts the tip of the probe via a probe selected from the plurality of probes, a movement control process for the moving mechanism, and the measurement A substrate inspection apparatus including a processing unit that performs an inspection process on the inspection location based on the electrical characteristics, the imaging unit being capable of capturing an image of an arrangement surface of the plurality of probes in the probe unit; A storage unit storing position information indicating the arrangement positions of the plurality of probes on the arrangement surface, a display unit, and an operation unit And the processing unit displays a probe arrangement image indicating an arrangement position of the plurality of probes on the arrangement surface based on the position information read from the storage unit when the inspection process is not performed. When the specific coordinates in the probe arrangement image are input from the operation unit, the image of the arrangement surface within a predetermined range including the specific coordinates is displayed on the imaging unit. A probe imaging process is performed in which an image is captured and the captured image is displayed on the screen together with the probe arrangement image.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the imaging unit includes a high-magnification camera, and includes an imaging unit moving mechanism that moves the imaging unit, and the processing unit. In the probe imaging process, movement control for the imaging unit moving mechanism is executed based on the specific coordinates, so that the imaging unit is moved to the imaging position within the predetermined range for imaging.

  The substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 1 or 2, wherein the processing unit is configured to perform the plurality of probes based on a result of the inspection processing performed on the plurality of substrates. A specific process for identifying a specific probe that may have a problem, and in the probe imaging process, the arrangement position of the specific probe can be distinguished from the arrangement position of other probes. A probe placement image is displayed.

  The substrate inspection apparatus according to claim 1, wherein the processing unit executes a probe imaging process, and displays a probe arrangement image indicating a plurality of probe arrangement positions on the arrangement surface based on position information stored in the storage unit. And when the specific coordinates in the probe arrangement image are input from the operation unit, the imaging unit images the image of the arrangement surface within a predetermined range including the specific coordinates, and This captured image is displayed on the screen together with the probe arrangement image.

  Therefore, according to this board inspection apparatus, the operator can display the inspection of the probe arranged at a desired position on the arrangement surface of the probe unit on the screen without removing the probe unit from the moving mechanism. Therefore, it is possible to greatly reduce the labor required for the probe inspection work. Further, according to the substrate inspection apparatus, the processing unit displays the probe arrangement image on the screen of the display unit based on the position information stored in the storage unit. In addition to the image pickup unit, an image pickup unit for picking up an image (an alternative image of the probe arrangement image) of an area larger than the image picked up by the image pickup unit (for example, the entire arrangement surface) and its moving mechanism Compared with the provided configuration, the configuration of the substrate inspection apparatus can be greatly simplified.

  According to the substrate inspection apparatus of the second aspect, since the imaging unit is configured by a high-magnification camera, for example, the imaging unit is configured by a normal-magnification camera and a specific image in an image captured by the camera is specified. Unlike the configuration in which an image in a predetermined range including coordinates is cut out and displayed (enlarged display), the image in the predetermined range including specific coordinates is displayed on the display unit screen in a clearer state. As a result, the inspection work of the probe can be performed more accurately.

  In the substrate inspection apparatus according to claim 3, when the inspection processing for a plurality of substrates has already been performed at the time of executing the probe imaging processing, that is, the inspection results for the plurality of substrates are stored in the storage unit. In this case, the processing unit performs a specific process of identifying a probe (specific probe) that may have a defect among a plurality of probes based on the inspection result as a pre-process of the probe imaging process. In the probe imaging process, a probe arrangement image is generated and displayed in such a manner that the arrangement position (image showing) of the specific probe can be distinguished from the arrangement position (image showing) of the other probe.

  Therefore, according to this board inspection apparatus, an operator can specify a probe (specific probe) that is highly likely to be defective only by looking at the probe arrangement image displayed on the screen. For this reason, the operator can immediately output the coordinates (specific coordinates) of the specific probe to the processing unit by operating the operation unit and quickly display an image including the specific probe on the screen. The inspection for the specific probe can be performed in a shorter time.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a plan view of a probe 21. FIG. It is a perspective view of the probe unit 2 seen from the support plate 41 side (the contact surface 41a side as an arrangement surface). Front view of the probe unit 2 and the mounting table 4 in a state in which the distal end side support portion 31 is farthest from the spacer 33 fixed to the proximal end side support portion 32 (a state where a gap G1 is generated between them). It is. It is a front view of the probe unit 2 and the mounting table 4 in a state where the distal end side support portion 31 is in contact with the spacer 33 fixed to the proximal end side support portion 32 (a state where the gap G1 is zero). . FIG. 5 is a partial cross-sectional view of the probe unit 2 cut along a plane parallel to the paper surface in FIG. 4 for explaining the support structure of the probe 21 in the probe unit 2. It is sectional drawing of the probe unit 2 cut | disconnected along the plane parallel to the paper surface in FIG. 5 for demonstrating the support structure of the probe 21 in the probe unit 2. FIG. It is a display state figure of the screen 11a in the display part 11 for demonstrating operation | movement of the board | substrate inspection apparatus 1. FIG. It is another display state figure of the screen 11a in the display part 11 for demonstrating operation | movement of the board | substrate inspection apparatus.

  Hereinafter, embodiments of a substrate inspection apparatus will be described with reference to the drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the substrate inspection apparatus will be described. A substrate inspection apparatus 1 shown in FIG. 1 includes a probe unit 2, a moving mechanism 3, a mounting table 4, a measuring unit 5, an imaging unit 6, an imaging unit moving mechanism 7, a storage unit 8, a processing unit 9, an operation unit 10, and a display unit. 11 is configured so that the substrate 100 can be inspected.

  As an example, the probe unit 2 is configured in a jig shape in the same manner as the probe unit of the above-described conventional substrate inspection apparatus (substrate inspection apparatus disclosed in Patent Document 1), and as shown in FIGS. A plurality of probes 21, a support portion 22, and an electrode plate 23 are provided.

  The probe 21 is used to input and output an electric signal by contacting a conductor portion such as a conductor pattern in the substrate 100 at the time of inspection. As an example, the probe 21 has a circular cross section that can be elastically deformed by a conductive metal material. It is formed in a rod shape (see FIG. 2). In addition, an insulating layer made of an insulating coating material is formed on the peripheral surface of the intermediate portion 21a of the probe 21. For this reason, as shown in the figure, the intermediate portion 21a has a diameter L2 larger than the diameter L1 of the distal end portion 21b and the diameter L3 of the proximal end portion 21c. That is, the probe 21 has a distal end portion 21b and a proximal end portion 21c that are smaller in diameter than the intermediate portion 21a.

  As shown in FIGS. 3 to 7, the support portion 22 includes a distal end portion side support portion 31, a proximal end portion side support portion 32, and a spacer 33, and is configured to support the probe 21.

  The tip portion side support portion 31 is a member that supports the tip portion 21 b side of the probe 21, and includes support plates 41 and 42.

  For example, the support plate 41 is formed in a plate shape from a non-conductive resin material. Further, as shown in FIGS. 3, 6, and 7, the support plate 41 has a plurality of support holes 51 (the same number as the number of probes 21) that are circular in plan view. The support hole 51 is a hole for inserting the distal end portion 21b of the probe 21 to support the distal end portion 21b. The diameter of the support hole 51 is slightly larger than the diameter L1 of the distal end portion 21b of the probe 21. It is formed to be slightly smaller than the diameter L2 of the intermediate portion 21a, and only the distal end portion 21b can be inserted without inserting the intermediate portion 21a.

  The support plate 42 is formed in a plate shape using the same material as the support plate 41 (in this example, a non-conductive resin material). The support plate 42 has a plurality of support holes 52 (see FIGS. 6 and 7) that are circular in plan view (the same number as the number of probes 21). The support hole 52 is a hole through which the distal end portion 21b of the probe 21 is inserted to support the distal end portion 21b. The diameter of the support hole 52 is the same as the diameter of the support hole 51 of the support plate 41, and the intermediate portion 21a. It is possible to insert only the distal end portion 21b without inserting.

  The base end side support portion 32 is a member that supports the base end portion 21c side of the probe 21, and includes support plates 43 and 44 as shown in FIGS.

  As an example, the support plate 43 is formed in a plate shape from a non-conductive resin material. Further, as shown in FIGS. 6 and 7, a plurality of support holes 53 (the same number as the number of probes 21) having a circular shape in plan view are formed in the support plate 43. The support hole 53 is a hole for inserting the base end portion 21c of the probe 21 to support the base end portion 21c, and allows the probe 21 to be inserted with the electrode plate 23 removed when the probe 21 is replaced. The diameter of the intermediate portion 21a is slightly larger than the diameter L2 of the intermediate portion 21a of the probe 21, and the intermediate portion 21a can be inserted therethrough.

  The support plate 44 is formed in a plate shape using the same material as the support plate 43 (in this example, a non-conductive resin material). Further, as shown in FIGS. 6 and 7, a plurality of support holes 54 (the same number as the number of probes 21) that are circular in plan view are formed in the support plate 44. The support hole 54 is a hole for inserting the base end portion 21c of the probe 21 to support the base end portion 21c, and is a hole for inserting the probe 21 when the probe 21 is replaced. The diameter is the same as the diameter of the support hole 53 of the support plate 43 so that the intermediate part 21a can be inserted.

  The spacer 33 is disposed between the distal end side support portion 31 and the proximal end side support portion 32 (specifically, between the support plate 42 and the support plate 43) while being fixed to the support plate 43. Has been. Further, although not shown, the spacer 33 has a support hole 52 formation region in the support plate 42 and a support hole 53 formation region in the support plate 43 (both are the formation regions of the support holes 51 in the support plate 41 shown in FIG. 3. Surrounding the formation region of the same shape and the same size (in this example, the formation region having a rectangular shape in plan view), that is, as shown in FIGS. It is formed in a U shape (or B shape) in a plan view surrounding the plurality of probes 21 supported between the side support portions 32.

  As shown in FIGS. 3 to 7, the electrode plate 23 is formed in a plate shape from a non-conductive resin material or the like. In addition, as shown in FIGS. 6 and 7, the electrode plate 23 is in contact with each base end portion 21c of each probe 21 to input / output electric signals to / from the measuring unit 5 (an example of an external device). A plurality of electrodes 81 for fitting are fitted, and a cable (not shown) is connected to each of the electrodes 81.

  In this probe unit 2, as shown in FIGS. 3, 4, and 5, the support plates 41 and 42 are in contact with each other, and all the support holes 51 are in communication with the corresponding support holes 52. It is fixed by a pin. In addition, the electrode plate 23, the support plates 44 and 43, and the spacer 33 are also laminated in this order, and all the support holes 53 of the support plate 43 communicate with the support holes 54 of the corresponding support plate 44. It is fixed by a fixing pin (not shown).

  In the probe unit 2, as shown in FIG. 4, the distal end side support portion 31 is connected to the spacer 33 via a plurality of rod-like members (plungers) 34 erected on the lower surface of the spacer 33. The support portion 32 (specifically, the spacer 33) is attached so as to be movable toward and away from the support portion 32 (specifically, the spacer 33). Further, the probe unit 2 is in a state where the distal end side support portion 31 is farthest from the spacer 33 fixed to the proximal end side support portion 32 shown in FIGS. In a state where the support plate 41 is not in contact with the substrate 100 (hereinafter also referred to as “non-contact state”), a predetermined distance is provided between the spacer 33 (the lower surface thereof) and the support plate 42 of the distal end side support portion 31. The gap G1 is generated. 5 and 7, the probe unit 2 is in a state in which the tip end side support portion 31 is closest to the spacer 33 (the support plate 41 is in contact with the substrate 100 and is pressed against the substrate 100 by the spacer 33). In the state (hereinafter also referred to as “pressed state”), the gap G1 disappears and the spacer 33 and the support plate 42 of the distal end side support portion 31 are in contact with each other.

  In the probe unit 2, each probe 21 has a tip portion in a period during which the non-contact state illustrated in FIGS. 4 and 6 is shifted to the pressed state illustrated in FIGS. 21b is inserted into the support holes 51, 52, the base end portion 21c is inserted into the support holes 53, 54, the end of the support hole 52 in the intermediate portion 21a abuts the edge of the support hole 52 in the support plate 42, In addition, the base end portion 21 c is supported between the tip end side support portion 31 and the base end portion side support portion 32 in a state where the base end portion 21 c is in contact with the electrode 81 of the electrode plate 23.

  Further, in the probe unit 2, in the pressed state shown in FIG. 7, the intermediate portion 21a of the probe 21 is bent by the amount that the distance between the support plate 42 and the support plate 43 is shortened (the gap G1). The distal end portion 21b reliably contacts the substrate 100 by the elastic force of the probe 21 generated at that time.

  The moving mechanism 3 performs probing for moving the probe unit 2 in a direction toward and away from the mounting table 4 (the substrate 100 mounted on the mounting table 4) according to the control of the processing unit 9. The mounting table 4 is configured to be able to mount the substrate 100 and to be able to fix the mounted substrate 100. The measuring unit 5 is connected to each electrode 81 arranged on the electrode plate 23 via a cable (not shown), and based on an electrical signal input via the probe 21, the electrode 81 and the cable, an inspection location on the substrate 100 Electrical characteristics (for example, a resistance value, a capacitance value, an inductance value, etc.) (for example, an inspection location located between the tip portions 21b of the pair of probes 21 selected from the plurality of probes 21 by the processing unit 9) Is measured and output to the processing unit 9.

  The imaging unit 6 is configured to include, for example, a camera, and the arrangement surface of the plurality of probes 21 in the probe unit 2 (in this example, the distal end portion 21b of each probe 21 is inserted under the control of the processing unit 9. The support plate 41 in which the support hole 51 is formed is configured to be able to take an image of the contact surface 41a) with the substrate 100. In this example, as an example, the imaging unit 6 is configured by a high-magnification camera, and is not an entire image of the contact surface 41a but a partial image of the contact surface 41a (for example, only a few support holes 51). An image of a narrow range (hereinafter also referred to as “narrow range”) including: a predetermined range) is captured (that is, a part of the contact surface 41a is enlarged and imaged). Further, the imaging unit 6 outputs image data Dim indicating the captured image to the processing unit 9.

  As shown in FIG. 1, the imaging unit moving mechanism 7 moves the imaging unit 6 on a virtual plane PL <b> 1 parallel to the contact surface 41 a of the support plate 41 with the substrate 100 according to the control of the processing unit 9. The storage unit 8 stores in advance position information Dp (which is also position information of the plurality of support holes 51 in the support plate 41) indicating the arrangement positions of the plurality of probes 21 on the contact surface 41a and an operation program for the processing unit 9. Has been. The storage unit 8 stores a resistance value measured by the measurement unit 5 and a result of an inspection performed by the processing unit 9 according to the control of the processing unit 9.

  The processing unit 9 is configured by a computer, for example, and executes control on each unit (the moving mechanism 3, the imaging unit 6, the imaging unit moving mechanism 7, and the like) constituting the substrate inspection apparatus 1. Further, the processing unit 9 performs an inspection process on each inspection point based on the electrical characteristics of a plurality of predetermined inspection points on the substrate 100 measured by the measurement unit 5, and on a screen 11 a described later of the display unit 11. Probe imaging processing for displaying the probe arrangement image IM1 and the captured image IM2 (see FIGS. 8 and 9) is executed.

  The operation unit 10 includes, for example, an unillustrated touch panel provided on the screen 11a (see FIGS. 8 and 9) of the display unit 11 and an input device such as a mouse. Specific coordinates CO in the arrangement image display area AR1 defined on 11a (for example, a pointer PT that moves in the arrangement image display area AR1 in response to an operation on the operation unit 10 (in this example, a cross-shaped pointer) Are output to the processing unit 9 (two-dimensional coordinates). In the arrangement image display area AR1, as shown in FIGS. 8 and 9, the processing unit 9 causes the arrangement of the probes 21 on the contact surface 41a defined based on the probe arrangement image IM1 (position information Dp). An image showing a position) is displayed at a predetermined position. Therefore, the above-mentioned coordinates CO can be said to be the coordinates of the pointer PT in the probe arrangement image IM1. In addition, the operation unit 10 includes an instruction key (not shown) for instructing the processing unit 9 to perform either inspection processing or probe imaging processing.

  The display unit 11 is configured by a display device such as an LCD (liquid crystal display), for example, and displays the probe arrangement image IM1 and the pointer PT in the arrangement image display area AR1 defined in advance on the screen 11a according to the control of the processing unit 9. While displaying (refer FIG. 8, 9), captured image IM2 is displayed in captured image display area AR2.

  Next, an operation in the inspection process of the substrate inspection apparatus 1 and an operation in the probe imaging process will be described with reference to the drawings.

  First, the operation in the inspection process will be described. As shown in FIG. 1, the probe unit 2 is fixed to the moving mechanism 3 with the support plate 41 facing the mounting table 4, and the substrate 100 to be inspected is mounted on the mounting surface of the mounting table 4. It is assumed that

  In this state, when an operation on the instruction key of the operation unit 10 is performed and an instruction for executing the inspection process is output from the operation unit 10 to the processing unit 9, the processing unit 9 executes the inspection process. In this inspection process, the processing unit 9 first controls the imaging unit moving mechanism 7 to move the imaging unit 6 to a retracted position (a position that does not interfere with the probe unit 2 on the virtual plane PL1). Next, the processing unit 9 controls the moving mechanism 3 so that the probe unit 2 approaches the substrate 100 (the mounting surface of the mounting table 4) from the position shown in FIGS. ) To move to the pressed state shown in FIGS. 5 and 7, and then stop (lower) the probe unit 2. As a result, in the probe unit 2, the tip 21 b of each probe 21 comes into contact with the substrate 100.

  Subsequently, the processing unit 9 executes an inspection process. In this inspection process, the processing unit 9 specifies a plurality of inspection points defined on the substrate 100 one by one in a predetermined order based on the operation program, and is used for inspection of the specified one inspection point. A pair of probes 21 are identified. In addition, the processing unit 9 causes the measurement unit 5 to measure the electrical characteristics of this one inspection location via the specified pair of probes 21. Further, the processing unit 9 performs an inspection on the one inspection location based on the electrical characteristics measured by the measurement unit 5 (for example, whether or not the measured electrical measurement is included in a reference range indicating normality). (Examination to determine normality / abnormality). Further, the processing unit 9 stores the inspection result in the storage unit 8 in association with the identification information about the current one inspection location. Therefore, when the processing unit 9 executes this inspection process, the inspection results for a plurality of inspection points defined on one substrate 100 are stored in the storage unit 8 in association with the identification information for each inspection point. The

  As a result, when a plurality of substrates 100 (substrates having the same specifications) are inspected using the substrate inspection apparatus 1, the storage unit 8 of the substrate inspection apparatus 1 stores the plurality of substrates defined in the substrate 100. The inspection result for each substrate 100 regarding the inspection location is stored in association with the identification information for each inspection location.

  In the substrate inspection apparatus 1, when the inspection process is not executed, an operation is performed on the instruction key of the operation unit 10, and an instruction for executing the probe imaging process is output from the operation unit 10 to the processing unit 9. When this happens, the processing unit 9 executes a probe imaging process. In this probe imaging process, the processing unit 9 first controls the moving mechanism 3 to move the probe unit 2 to the position shown in FIGS.

  Next, the processing unit 9 is based on the position information Dp stored in the storage unit 8, and shows an image showing the arrangement positions of the plurality of probes 21 on the contact surface 41 a (the probe 21 when the contact surface 41 a is viewed from the front. A probe arrangement image IM1 which is an image equivalent to an image showing the arrangement position of the display unit 11 is generated and displayed in the arrangement image display area AR1 defined on the screen 11a of the display unit 11 as shown in FIG. In this case, for example, the processing unit 9 uses, as the probe arrangement image IM1, an image in which dots having a single color (a color that can be distinguished from the background color) and the same planar shape (for example, a circle) are arranged at the arrangement positions of the probes 21. Generate.

  Subsequently, the processing unit 9 acquires the coordinate CO output from the operation unit 10 and displays the pointer PT at a position in the arrangement image display area AR1 indicated by the coordinate CO. Further, the processing unit 9 controls the imaging unit moving mechanism 7 so that the imaging center position indicated by the coordinates CO on the actual contact surface 41a coincides with the optical axis of the camera constituting the imaging unit 6. The imaging unit 6 is moved on the virtual plane PL1. The imaging unit 6 has a narrow range as described above in the contact surface 41a centered on the optical axis (in this example, as a small range that includes several probes 21 as indicated by broken lines in FIGS. 8 and 9). Then, an image included in a square range (which may be a circular range or the like) is captured in real time, and image data Dim indicating the image is output to the processing unit 9.

  The processing unit 9 acquires the image data Dim output from the imaging unit 6 at, for example, a constant period while executing the movement of the imaging unit 6 based on the coordinates CO, and also performs the above-described processing indicated by the image data Dim. As shown in FIG. 8, the narrow-range image on the contact surface 41a is updated and displayed as a captured image IM2 in the captured image display area AR2 defined on the screen 11a of the display unit 11. Since the captured image IM2 is a narrow-range image including only a part of the contact surface 41a imaged by the imaging unit 6 as described above, an enlarged image obtained by enlarging the part of the contact surface 41a. It has become.

  As a result, the operator of the substrate inspection apparatus 1 attaches the probe unit 2 to the moving mechanism 3 when inspecting the desired probe 21 among the plurality of probes 21 arranged in the probe unit 2. In the state as it is, the operation unit 10 is operated while viewing the probe arrangement image IM1 and the pointer PT displayed in the arrangement image display area AR1 on the screen 11a of the display unit 11, and the above-described desired in the probe arrangement image IM1. The pointer PT is moved to the position where the probe 21 is arranged. In this case, in the substrate inspection apparatus 1, an enlarged image (imaging unit) in the vicinity including the arrangement position of the desired probe 21 in the arrangement area (formation area of the support hole 51) of the probe 21 on the actual contact surface 41 a. 6 is displayed in real time in the captured image display area AR2 of the screen 11a. The operator performs an inspection for the desired probe 21 based on the enlarged image displayed in the captured image display area AR2. The inspection of the probe 21 is, for example, the tip of the probe 21 from the inside of the support hole 51 due to abnormal wear of the tip 21b of the probe 21 or occurrence of defects such as deformation of the intermediate portion 21a of the probe 21. It is visually determined whether or not the protruding amount of the portion 21b is smaller than the protruding amount of the tip portion 21b of the other probe 21 and whether or not the shape of the end surface of the tip portion 21b is abnormal. It is an inspection.

  As described above, in the substrate inspection apparatus 1, the processing unit 9 allows the plurality of probes 21 on the contact surface 41a (arrangement surface) to be based on the position information Dp read from the storage unit 8 when the inspection process is not performed. When the probe arrangement image IM1 indicating the arrangement position is displayed on the screen 11a of the display unit 11 and the coordinates CO of the pointer PT, which is a specific coordinate in the probe arrangement image IM1, are input from the operation unit 10, this specific A probe imaging process is performed to cause the imaging unit 6 to capture the captured image IM2 that is an image of the contact surface 41a within a narrow range including the coordinates CO, and to display the captured image IM2 on the screen 11a together with the probe arrangement image IM1. .

  Therefore, according to the substrate inspection apparatus 1, the operator can place the probe unit 2 at a desired position within the arrangement region of the probe 21 on the contact surface 41a of the probe unit 2 without removing the probe unit 2 from the moving mechanism 3. Since the inspection of the probe 21 can be performed based on the captured image IM2 displayed on the screen 11a, the labor required for the inspection work of the probe 21 can be greatly reduced. Moreover, according to this board | substrate inspection apparatus 1, the process part 9 displays the probe arrangement | positioning image IM1 on the screen 11a of the display part 11 based on the positional information Dp read from the memory | storage part 8 in the probe imaging process as mentioned above. Therefore, for example, apart from the imaging unit 6 that captures the captured image IM2, an image (an alternative image of the probe arrangement image IM1) of an area wider than the captured image IM2 (for example, the entire area of the contact surface 41a) is captured. The configuration of the substrate inspection apparatus 1 can be greatly simplified as compared with a configuration in which an imaging unit and a moving mechanism therefor are provided.

  In this substrate inspection apparatus 1, the imaging unit 6 may be a normal magnification camera. In this example, the imaging unit 6 is configured by a high magnification camera in particular, and the processing unit 9 performs imaging based on specific coordinates CO in the probe imaging process. By executing the movement control for the part moving mechanism 7, the imaging unit 6 is moved to an imaging position in a narrow range including this specific coordinate CO (imaging position where the narrow range can be imaged) and imaged. Therefore, according to the substrate inspection apparatus 1, for example, the imaging unit 6 is configured with a normal magnification camera, and a narrow-range image including the specific coordinate CO in an image captured by the camera is cut out to obtain a captured image IM2. Unlike the configuration in which the image is displayed (enlarged display), the captured image IM2 can be displayed on the screen 11a of the display unit 11 in a clearer state, so that the inspection work of the probe 21 can be performed more accurately. it can.

  In addition, the board | substrate inspection apparatus 1 is not limited to said structure. For example, even when the imaging unit 6 is configured with a normal magnification camera, and a configuration in which a narrow range image including the specific coordinate CO in the image captured by the camera is cut out and enlarged and displayed as the captured image IM2, the inspection accuracy is high. Needless to say, the imaging unit 6 may be configured with a normal magnification camera. Further, for example, in the substrate inspection apparatus 1, when the inspection processing for the plurality of substrates 100 is already performed at the time of executing the probe imaging processing, that is, the inspection results for the plurality of substrates 100 are stored in the storage unit 8. There may be. In this case, as a pre-process of the probe imaging process, the processing unit 9 selects a probe 21 (also referred to as a specific probe) that may have a defect among the plurality of probes 21 based on the inspection result. The specified specific process is executed, and in the probe imaging process, the probe arrangement image IM1 is generated in such a manner that the arrangement position (image showing) of the specific probe 21 can be distinguished from the arrangement position (image showing) of the other probe 21 Can also be displayed.

  For example, the actual substrate 100 is manufactured so that the inspection results of all the inspection points can be normal in the inspection process. For this reason, in the actual inspection of the substrate 100, for most of the substrates 100, the inspection results indicate that all the inspection locations are normal, and there are only a few substrates 100 that indicate the inspection results as abnormal. Usually, the inspection location is not constant. However, when a failure occurs in a specific probe 21 (for example, a failure such as significant wear of the tip 21b as compared with other probes 21), a specific inspection location inspected using this probe 21 is not detected. The test result becomes abnormal with a high probability. Therefore, the processing unit 9 examines the inspection results for the plurality of substrates 100 read from the storage unit 8 in the specific process, and when the inspection part where the inspection result becomes abnormal with high probability can be detected, A probe arrangement image IM1 is generated in such a manner that a probe 21 (usually a pair of probes 21) used for inspection of an inspection location is specified as the above-described specific probe 21 and can be distinguished from other probes 21 on the screen 11a. To display. As an aspect that can be distinguished, an image showing the arrangement position of the specific probe 21 (in this example, as described above, a single color and a circular dot) is set to a color different from the color of the image showing the arrangement position of other probes. A mode or a mode in which a mark that can identify the position of the specific probe 21 is attached only to the image of the specific probe 21 (for example, as shown in FIG. 9, a square frame-shaped mark M is added to the image (dot) of the specific probe 21. A variety of modes can be employed, such as a mode (a mode surrounded by a mark M).

  According to the substrate inspection apparatus 1 that employs this configuration, the operator can identify the probe 21 that is likely to have a defect only by looking at the probe arrangement image IM1 displayed on the screen 11a. it can. Therefore, according to the board inspection apparatus 1, the operator operates the operation unit 10 and immediately moves the pointer PT to the specific probe 21 to display the captured image IM2 including the specific probe 21 on the screen 11a. Since the information can be displayed quickly, the inspection for the specific probe 21 can be performed in a shorter time.

  Further, the probe unit is not limited to the probe unit 2 having the above-described configuration. For example, although not illustrated, a plurality of probe units are erected with a plurality of needle-shaped probes exposed on the contact surface with the substrate. Various known configurations such as a probe unit having a jig configuration arranged in a state may be employed.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Probe unit 3 Movement mechanism 5 Measurement part 6 Imaging part 8 Storage part 9 Processing part 10 Operation part 11 Display part 11a Screen 21 Probe 100 Board | substrate Dp Position information IM1 Probe arrangement image IM2 Captured image

Claims (3)

A probe unit in which a plurality of probes for bringing the tip portion into contact with a corresponding inspection location on a substrate to be inspected is disposed, a moving mechanism for moving the probe unit, and a probe selected from the plurality of probes. A measurement unit that measures electrical characteristics of the inspection location that contacts the tip of the probe, and a process that executes a movement control process for the moving mechanism and an inspection process for the inspection location based on the measured electrical characteristics. A board inspection apparatus comprising a unit,
An imaging unit capable of capturing an image of an arrangement surface of the plurality of probes in the probe unit;
A storage unit in which position information indicating an arrangement position of the plurality of probes on the arrangement surface is stored;
A display unit;
With an operation unit,
The processing unit displays, on the screen of the display unit, a probe arrangement image indicating an arrangement position of the plurality of probes on the arrangement surface based on the position information read from the storage unit when the inspection process is not executed. And when the specific coordinates in the probe arrangement image are input from the operation unit, the imaging unit images the image of the arrangement surface within a predetermined range including the specific coordinates, And the board | substrate inspection apparatus which performs the probe imaging process which displays the said imaged image on the said screen with the said probe arrangement | positioning image. The imaging unit is composed of a high magnification camera,
An imaging unit moving mechanism for moving the imaging unit;
In the probe imaging process, the processing unit moves the imaging unit to the imaging position within the predetermined range by performing movement control on the imaging unit moving mechanism based on the specific coordinates, and performs imaging. The substrate inspection apparatus according to claim 1.   The processing unit executes a specific process for identifying a specific probe that may have a defect among the plurality of probes based on the results of the inspection process performed on the plurality of substrates. The substrate inspection apparatus according to claim 1, wherein, in the probe imaging process, the probe arrangement image is displayed in such a manner that the arrangement position of the specific probe can be distinguished from the arrangement positions of other probes.

Images