KR102536717B1 - Printed assembly circuit board assembly inspection device - Google Patents

Abstract

A PCBA inspection device according to an embodiment of the present invention is provided by photographing first and second probes that measure electrical signals by contacting both terminals of an electrical element of a test board and the direction the end of the first probe faces. A first camera module for generating a first probe image, a second camera module for generating a second probe image by photographing a direction in which an end of the second probe is facing, and the first probe and the first camera module. A first driving member for moving in a plurality of axial directions, a second driving member for moving the second probe and the second camera module in a plurality of axial directions, and attached to either one of the first and second probes a laser module for generating height information by radiating laser light to electric elements of the reference inspection substrate, receiving reflected laser beams, and measuring heights of the electric elements on the substrate; and a control module for controlling a movement of each of the first and second driving members so that the first and second probes come into contact with both terminals of an electric element, wherein the control module is configured to: Based on the board design data including the design information of the reference inspection board, position coordinates are set for each electrical element, and a first inspection order is set so that the inspection proceeds in the order of the first electric element to be inspected and the adjacent electric element. Based on the height information and the board design data, the first inspection sequence is corrected to generate a second inspection sequence, and when the first inspection substrate having the same structure as the reference inspection substrate is inspected, according to the second inspection sequence The first and second probes are controlled to move to the first positional coordinates so that the first and second probes come into contact with respective terminals of the disposed electric element.

Description

PCBA inspection device {PRINTED ASSEMBLY CIRCUIT BOARD ASSEMBLY INSPECTION DEVICE}

The present invention relates to a PCBA inspection device.

Electronic devices are generally operated by supplying power to a board on which electronic devices are mounted, and electrical characteristics of the board can be inspected only after the manufacturing process is completed. An electronic device must be stably attached to the board, but since the electronic device is electrically coupled to the board through a soldering process, contact failure may occur during the process. In addition, when an electronic device is defective or does not have an appropriate capacity, the substrate cannot be operated normally.

In order to determine whether a board is defective, an inspection device for measuring electrical signals of each electronic element is used. In general, the inspection device includes a stage for supporting the board, an aligner for fixing the board, and a probe. The inspection apparatus may determine whether an electronic element is defective by measuring an electrical signal by bringing a probe into contact with an electrode of the electronic element.

A technical problem to be achieved by the present invention is to provide a PCBA inspection device that automatically inspects whether or not electronic elements disposed on an entire inspection board are defective by measuring electrical signals flowing through electronic elements through a contact probe.

A PCBA inspection device according to an embodiment of the present invention is provided by photographing first and second probes that measure electrical signals by contacting both terminals of an electrical element of a test board and the direction the end of the first probe faces. A first camera module for generating a first probe image, a second camera module for generating a second probe image by photographing a direction in which an end of the second probe is facing, and the first probe and the first camera module. A first driving member for moving in a plurality of axial directions, a second driving member for moving the second probe and the second camera module in a plurality of axial directions, and attached to either one of the first and second probes a laser module for generating height information by irradiating a laser beam to the electric element of the reference inspection board, receiving the reflected laser beam, and measuring the height of each electric element on the board; and the first and second probes of the electric element A control module for controlling the movement of each of the first and second driving members so as to come into contact with both terminals, wherein the control module includes design information of the reference inspection substrate when inspecting the reference inspection substrate. Based on the data, position coordinates are set for each electric element, and a first inspection sequence is set so that the inspection proceeds in the order of an electric element adjacent to the first electric element to be inspected, and based on the height information and the board design data, A second inspection sequence is generated by correcting the first inspection sequence, and when the first inspection substrate having the same structure as the reference inspection substrate is inspected, each terminal of an electrical element disposed according to the second inspection sequence has the first inspection sequence. and controlling the first and second driving members so that the second probes come into contact with each other to move them to the first positional coordinates.

According to an embodiment, the control module analyzes the shape of each electric element based on the board design data when inspecting the reference inspection substrate, so that a body area viewed from a direction perpendicular to the plane of the reference inspection substrate is a terminal. In the case of first electric elements overlapping a certain range or more of the region, the second inspection sequence may be created by excluding the inspection of the first electric element.

According to an embodiment, the control module analyzes the height information, and when there is a first electric element having a reference height or higher among the electric elements, a height corresponding to the first electric element and the height of the first electric element on the substrate. The second inspection sequence is generated by excluding the inspection of the second electric element located within the predetermined area, and as the height of the first electric element on the substrate increases, the area of the predetermined area may widen according to a predetermined ratio. .

According to an embodiment, when inspecting the reference inspection substrate, the control module combines first probe images captured by the first camera module in each region of the reference inspection substrate to obtain an entire substrate including the front surface of the reference inspection substrate. An image is generated, position coordinates are set for each electrical element included in the whole board image, and the first camera module captures the reference inspection substrate centered on the reference position coordinates set based on the board design data. 1 The probe image is stored as a reference coordinate image, and when inspecting the first inspection substrate, the first camera module positions the first probe image captured by the first inspection substrate around the reference position coordinates before the inspection starts. It may be stored as a coordinate image, and a corrected first location coordinate may be generated by comparing the reference coordinate image and the location coordinate image with each other.

According to an embodiment, the control module calculates a distortion rate of the position coordinate image based on the reference coordinate image, and the second reference point in the position coordinate image is separated from the center of the first reference point in the reference coordinate image. The offset information may be generated by calculating the distance and the y-axis distance, and the corrected first location coordinate may be generated by applying the offset information to the first location coordinate.

According to an embodiment, the PCBA inspection device further includes an input means for receiving input information from a user, a display unit for displaying the entire board image, and the first and second probe images, and the control module is configured to: When inspecting a reference inspection board, if the board design data is not previously stored, receiving and storing body regions and probe contact positions of electric elements included in the first probe image from the user through the input means, Positional coordinates may be set at the body region and the probe contact position.

According to an embodiment, the control module may set an area located within a first reference distance from the body area as a restricted area in which the first and second probes cannot contact each other.

According to an embodiment, when inspecting the reference inspection substrate, the control module stores a first probe image obtained by photographing each electrical element of the reference inspection substrate by the first camera module as a reference device image, and stores the first probe image as a reference device image. When inspecting a test substrate, the first camera module stores a first probe image obtained by photographing each electrical element of the first test substrate as a test device image, and analyzes the image concordance rate between the reference device image and the test device image. Accordingly, an electric device having an image matching rate lower than a reference matching rate may be determined as a defective device.

According to an embodiment, when the first inspection substrate is inspected, the control module compares the electrical signals measured by the first and second probes with a reference electrical signal to primarily determine the state of the device, and , The device may be determined as a normal device only when the state of the device is secondarily judged through the image matching rate analysis and all are determined to be normal.

According to the PCBA inspection apparatus according to an embodiment of the present invention, it is possible to accurately select errors due to defects or damage of a board by automatically determining whether an electronic element is defective based on an electrical signal measured from a probe.

1 is a schematic block diagram of a PCBA inspection device according to an embodiment of the present invention.
2a and 2b are conceptual diagrams of a PCBA inspection device according to an embodiment of the present invention.
3 is a diagram for explaining an entire substrate image according to an embodiment of the present invention.
4 is a diagram for explaining a method of setting position coordinates by a PCBA inspection device according to an embodiment of the present invention.
5A and 5B are diagrams for explaining how the PCBA inspection apparatus according to an embodiment of the present invention determines the characteristics of an electric element.
6A and 6B are diagrams for explaining a method of setting an inspection order of electrical elements by a PCBA inspection apparatus according to an embodiment of the present invention.
7 is a diagram for explaining the operation of the PCBA inspection device according to an embodiment of the present invention.
8 is a diagram for explaining the operation of a PCBA inspection device according to another embodiment of the present invention.
9 is a diagram for explaining the operation of a PCBA inspection device according to another embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only illustrated for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention It can be embodied in various forms and is not limited to the embodiments described herein. In the embodiments described in this specification, a 'module' or 'unit' refers to a functional part that performs at least one function or operation, and may be implemented with hardware or software or a combination of hardware and software.

1 is a schematic block diagram of a PCBA inspection device according to an embodiment of the present invention, and FIGS. 2a and 2b are conceptual diagrams of a PCBA inspection device according to an embodiment of the present invention.

1, 2a, and 2b, the PCBA (Printed Circuit Board Assembly) inspection apparatus 100 according to an embodiment of the present invention contacts a probe to an inspection substrate (SUB), which is a type of PCBA, to detect electrical elements. As a test device for measuring electrical characteristics, it may be implemented as a flying probe tester.

The PCBA inspection device 100 includes a control module 102, a first probe 104, a second probe 106, an aligner 108, a display module 110, a first driving member 112, and a second drive. It includes a member 114, a first camera module 116, a second camera module 118, a laser module 120, a power module 122, and an input means 124.

The control module 102 may read board design data including design information of the reference inspection board SUB_RF to determine positional information of electric elements disposed on the inspection board SUB. Based on the board design data, the positions where the first and second probes 104 and 106 should contact can be set as x coordinate values and y coordinate values, and the electrical elements disposed on the inspection board SUB are You will have different x and y coordinates. The board design data may include not only positional information of the electric element, but also reference position coordinates set based on the origin coordinates, and body regions, types, names, and the like of each electric element.

If the board design data is not separately provided, the PCBA inspection device 100 directly displays the board image displayed on the display unit 110 through the input means 124 from the user, that is, the area where the electric element is disposed, that is, the body area of the electric element , the position of the terminal to be contacted by the first and second probes 104 and 106, and the type and name of each electrical element may be directly input. In this case, the control module 102 may calculate the body region and the terminal position as x coordinate values and y coordinate values and store them as contact points of the first and second probes 104 and 106 .

After the control module 102 sets the positional coordinates of each electric element, the set positional coordinates may be used to inspect the first inspection substrate SUB1 having the same structure as the reference inspection substrate SUB_RF. Here, the reference inspection substrate SUB_RF means an inspection substrate SUB that provides a standard for inspecting whether or not the plurality of first inspection substrates SUB1 having the same structure are defective.

In order to equally apply the positional coordinates set based on the reference inspection substrate (SUB_RF) to the first inspection substrate (SUB1), the reference inspection substrate (SUB_RF) and the first inspection substrate (SUB1) are located at the same position on the aligner 108. should be seated in

Specifically, the PCBA inspection device 100 converts and stores the position of each electric element, wiring, etc. into x coordinates and y coordinates based on the reference inspection substrate (SUB_RF), and the first and second The two probes 104 and 106 inspect the first inspection substrate SUB1 using the coordinate information generated based on the reference inspection substrate SUB_RF. If the first inspection substrate SUB1 is the reference inspection substrate ( SUB_RF), the first and second probes 104 and 106 cannot contact desired positions when they are seated on the aligner 108 .

Therefore, the control module 102 is configured to reflect the positional difference between the reference inspection substrate SUB_RF and the first inspection substrate SUB1 on the aligner 108 when the first inspection substrate SUB1 is inspected, the reference inspection substrate ( SUB_RF) can be used to correct the set coordinate information.

To this end, the control module 102 stores the probe image of the first inspection substrate SUB1 disposed on the aligner 108 centered on the reference position coordinates as a positional coordinate image, and converts the reference coordinate image and positional coordinates It is possible to correct the positional coordinates set in the electric element of the first inspection substrate SUB1 by comparing the images with each other.

In addition, the control module 102 controls the movement of the first and second driving members 112 and 114 according to the order of testing the electrical elements to move the first and second probes 104 and 106 to the inspection substrate SUB. , and a test signal can be applied to the electrical element through the first and second probes 104 and 106 . The control module 102 may analyze an electrical signal output from an electrical device in response to the inspection signal, and determine whether the electrical device is defective based on the analysis result.

The first and second probes 104 and 106 may receive electrical signals by directly contacting terminals of electrical elements. Each of the first and second probes 104 and 106 includes an elastic member therein so that shock is absorbed by an elastic action when contacting an electric element, thereby preventing damage to the electric element. The first probe 104 is fixedly mounted to the first driving member 112 and the second probe 106 is fixedly mounted to the first driving member 112 . According to embodiments, the first and second probes may be implemented as flying probes.

The aligner 108 may fix the inspection substrate SUB for inspection, and fixed coupling may be performed according to the size of the inspection substrate SUB by adjusting a coupling member of the aligner 108 .

The first camera module 116 may capture a direction in which an end of the first probe 104 faces, and may capture a shape of a terminal of an electrical element contacting the first probe 104 in detail. Since the first camera module 116 is fixedly mounted to one side of the first driving member 112 together with the first probe 104, an area to be photographed is changed in response to the movement of the first driving member 112. That is, the area to be captured is changed corresponding to the moving path of the first probe 104 .

The second camera module 118 may capture a direction in which the end of the second probe 106 faces, and may capture a shape of a terminal of an electric element to which the second probe 106 is in contact. Since the second camera module 118 is fixedly mounted to one side of the first driving member 112 together with the second probe 106, the area to be photographed is changed in response to the movement of the first driving member 112. That is, the area to be photographed is changed corresponding to the moving path of the second probe 106 .

Here, the captured image of the inspection substrate SUB generated by the first camera module 116 is referred to as a first probe image, and the captured image of the inspection substrate SUB generated by the second camera module 118 is referred to as a first probe image. It is called 2-probe image.

In addition, the reference coordinate image is an image obtained by photographing the reference inspection substrate (SUB_RF) disposed on the aligner 108 with the first camera module 116 or the second camera module 118 as the center of the reference position coordinates. The module 102 may store a probe image obtained by capturing the reference position coordinates by the first camera module 116 or the second camera module 118 as a reference coordinate image.

When the reference inspection substrate SUB_RF is fixedly disposed on the aligner 108, one of the first and second camera modules 116 and 118 photographs each region of the reference inspection substrate SUB_RF to form a divided substrate. images can be created. The control module 102 may generate an entire substrate image by combining the divided substrate images, and the entire substrate image includes all electrical elements disposed on one surface of the inspection substrate SUB. Here, the divided substrate images may be created to have the same area and shape in order to prevent errors such as image distortion and asymmetry.

According to an embodiment, the control module 102 may extract and store a reference coordinate image from an entire substrate image of the reference inspection substrate SUB_RF for coordinate correction when inspecting the first inspection substrate SUB1.

In addition, the control module 102 may analyze the shape of each electric element based on the board design data when inspecting the reference inspection board SUB_RF. When looking at the plane of the reference inspection substrate (SUB_RF) in a vertical direction, if there is an electrical element in which the body area and the terminal area overlap more than a certain range, the control module 102 excludes the corresponding electrical element from the inspection target. That is, the control module 102 determines the body area and the terminal area of the electrical element mounted on the reference inspection board (SUB_RF) using the board design data, and the two areas are It can be excluded from the inspection target by determining the degree of overlap on the plane.

If, when viewed from the plane of the reference inspection substrate SUB_RF, if the extent to which the body area of the electric element covers the terminal area is large, the first and second probes may be caught or collided with the body so that they cannot contact the terminal. can Accordingly, the control module 102 may generate an inspection order by excluding the corresponding inspection element when the degree of overlap between the body area and the terminal area is equal to or greater than the range of one range.

The control module 102 analyzes the height information generated by the laser module 120, and when there is a first electric element of a reference height or higher among electric elements on the reference inspection board, the first electric element and the first electric element The inspection of the second electric element located within a certain area corresponding to the height on the substrate may be excluded. In this case, as the height of the first electric element on the substrate increases, the area of the predetermined region may increase according to a preset ratio.

For example, when the reference height is 10 mm, and an electric element having a height of 11 mm and an electric element having a height of 15 mm exist on the test board, the electric element having a height of 15 mm may have a wider range than the electric element having a height of 11 mm, Inspection of electrical elements within the above range may be excluded.

Each of the first and second driving members 112 and 114 is controlled by the control module 102 to position each of the first and second probes 104 and 106 at the determined position coordinates in the x-axis direction, y It can move in the axial direction and the z-axis direction. Since the height of the inspection substrate SUB is fixed by the aligner 108, the movement path in the z-axis direction can maintain a constant value whenever the electric device is inspected.

The display unit 110 displays an image of the entire substrate, and displays a first probe image and a second probe image together in a partial area of the entire substrate image to provide the user with the terminal state of the electric element in real time.

The laser module 120 may irradiate the laser onto the inspection substrate SUB. A first time when the laser is reflected on the inspection substrate SUB and returned is measured and a second time when the laser is reflected and returned from the center of the electric element is measured. Height information of each electrical element may be generated, and the height of each electrical element may be used by the control module 102 to determine an inspection order of each electrical element.

The power supply unit 122 may provide rated power to the inspection board SUB when the inspection board SUB is tested in the power input mode according to the second inspection method.

The input means 124 may mean a series of means capable of receiving input information from a user, such as a mouse, keyboard, and touch panel, and providing it to the control module 102 .

3 is a diagram for explaining an entire substrate image according to an embodiment of the present invention, and FIG. 4 is a diagram for explaining a method for setting position coordinates by a control module according to an embodiment of the present invention.

Referring to FIG. 3 , in the PCBA inspection device 100 according to an embodiment of the present invention, when the reference inspection substrate SUB_RF is fixed to the aligner 108, the first and second camera modules 116 and 118 Divided substrate images DI may be generated by photographing each region of the reference inspection substrate SUB_RF using any one of the modules.

Divided substrate images (DI) may be generated to have the same area and shape to prevent errors such as image distortion and asymmetry. SUB_RF) may be set, and divided substrate images DI may be generated by moving one of the first and second camera modules 116 and 118 to the center of each of the imaging areas.

The control module 102 may generate an entire substrate image (IM_REF) by combining the divided substrate images (DI), and the entire substrate image (IM_REF) includes all electrical elements disposed on one side of the reference inspection substrate (SUB_RF), , Position coordinates may be set for each electric element.

The entire substrate image (IM_REF) is displayed on the display unit 110 and can be used to inspect the first inspection substrate (SUB1). Displayed as , it is possible to provide a function of confirming to the user the electric element currently being inspected.

Referring to FIG. 4 , the control module 102 may set position coordinates at each position of the entire substrate image IM_REF. Position coordinates may be set at regular intervals along the x-axis and the y-axis based on the origin coordinates Po. can

The origin coordinates (Po) may be set to the vertex of the upper left corner of the entire substrate image (IM_REF), but are not limited thereto, and may be set to the center of the entire substrate image (IM_REF) or other positions.

In addition, in FIG. 4, the rectangular first vertex Po is set to the origin coordinates (0,0) based on the rectangular entire substrate image IM_REF, and the second vertex Pn is set to the end point coordinates (n, m). ), but the entire substrate image (IM_REF) can be implemented as a polygon including a circle, semicircle, or curved surface, and in this case, the origin coordinates (Po) can be set at an arbitrary position by the user.

The control module 102 sets positional coordinates at each position in the whole board image (IM_REF), and then, when the user inputs the body region and terminal position of the electric element, the positional coordinates corresponding to the body region and terminal position can be set

5A and 5B are views for explaining how the PCBA inspection apparatus according to an embodiment of the present invention determines the characteristics of an electric element.

Referring to FIG. 5A , characteristic information and location coordinates of electric elements extracted from the board design data DAT by the control module 102 are shown. The control module 102 may determine the type of each electric element and its location on the inspection board based on the board design data (DAT), and based on the determined information, the first and second probes 104 and 106 may The location to be touched can be set as x coordinate value and y coordinate value. Since a plurality of electrical elements of the same type may be disposed on the inspection substrate SUB, the control module may set position coordinates for each of the electrical elements of the same type.

In addition, the board design data (DAT) may include the width of the body region corresponding to the type of each former indictor, the width of the terminal region, and the degree of overlap between the body region and the terminal region, where the degree of overlap is the inspection substrate (SUB) This means the extent to which the body area covers the terminal area when viewed on a plane, and the control module may exclude an electric device in which the body area and the terminal area overlap a certain range or more from the inspection target.

Referring to FIG. 5B , the control module 102 includes a first electric element ED1 mounted on the inspection board SUB to describe a method of determining the overlapping degree of the electric elements based on the board design data DAT. and the second electric element ED2 are shown.

The control module 102 may determine the area occupied by the body area of the electric device and the area occupied by the terminal area when viewing the inspection substrate SUB on a flat surface. For example, the control module 102 determines the area occupied by the first body area BD1 and the first terminal area TE1 of the first electrical element ED1 and the degree of overlap when viewing the inspection substrate SUB on a plane. In addition, the area occupied by the second body area BD2 and the second terminal area TE2 of the second electric element ED2 and the overlapping degree can be determined.

If the body region of the electric element and the terminal region overlap with each other over a certain range, the control module 102 may prevent the body of the electric element from interfering with the movement of the first and second probes 104 and 106 so that the electric element It can be determined that it is difficult to contact the terminal of the terminal, and the corresponding electric element can be excluded from the inspection target.

For example, since all of the first terminal regions TE1 of the first electric element ED1 overlap the first body region BD1 when viewing the inspection substrate SUB on a plane, the control module 102 may 1 The electric element BD1 can be excluded from the inspection target. However, since there is no overlapping area between the second terminal area TE2 and the second body area TE2 of the second electric element ED1, the control module 102 controls the second electric element ED2. may be included in the inspection.

6A and 6B are diagrams for explaining a method of setting an inspection order of electric elements by a PCBA inspection apparatus according to an embodiment of the present invention.

Referring to FIG. 6A, the first movement path PA1 of the first and second probes 104 and 106 according to the first inspection order set by the control module 102 is shown in the entire substrate image IM_REF. there is. The control module 102 may set an electric device closest to the reference origin PO' as an inspection start position, and may determine a first inspection order such that the inspection proceeds in the order of electric elements adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 follow the first movement path PA1. can be moved along.

For example, if the electric element closest to the reference origin PO' is the first electric element ED1, the control module 102 sets the inspection start position to the first electric element ED1, and sets the electric element to be inspected to the first electric element ED1. The first movement path PA1 to the second electric element ED2 may be set by determining the first inspection order in an adjacent order.

Referring to FIG. 6B, the second movement path PA2 of the first and second probes 104 and 106 according to the second inspection order set by the control module 102 is shown in the entire substrate image IM_REF. there is.

The control module 102 may determine the height of each electric element on the board based on the height information generated by the laser module 120, correct the first inspection sequence based on the height information and the board design data, and You can create 2 inspection sequences.

That is, the control module 102 selects electric elements of a standard height or higher based on the height information, and based on the board design data, when the inspection board is viewed as a plane, the body area overlaps the terminal area by more than a certain range. can be selected. The control module may generate a second inspection sequence excluding electrical components selected from the first inspection sequence.

When the first and second probe terminals 104 and 106 are moved to inspect the electric element and the height of the electric element is equal to or greater than the reference height, the first and second probe terminals 104 and 106 move the corresponding electric element It may get caught or blocked in the body of the machine, making it impossible to perform the inspection properly. In addition, when the body region of the electric element overlaps the terminal region by a certain range or more, the first and second probe terminals 104 and 106 may be blocked from contacting the terminal by the body of the electric element.

Accordingly, the control module 102 may generate a second inspection sequence excluding selected electrical elements from the first inspection sequence.

For example, if the heights of the fourth and fifth electric elements ED4 and ED5 on the substrate are equal to or greater than the reference height, the control module 102 performs the inspection of the fourth and fifth electric elements ED4 and ED5 in the order of inspection. can be excluded.

In addition, the control module 102 analyzes the height information, and if there is an electric element higher than the reference height among the electronic elements, it is possible to exclude the inspection of electric elements located within a certain area corresponding to the height of the corresponding electric element on the board. there is.

For example, the heights of the fourth and fifth electric elements ED4 and ED5 on the substrate are equal to or greater than the reference height, and the body regions of the sixth to ninth electric elements E6 to E9 overlap the terminal regions by a certain range or more. If so, the control module 102 excludes the fourth to ninth electric elements ED4 to ED9 from the inspection order, and excludes the third electric element ED3 adjacent to the fourth electric element ED4 from the inspection order. can

As such, the control module 102 may determine a second inspection sequence by excluding some electrical elements from the first inspection sequence, and the second movement path PA2 may be set corresponding to the second inspection sequence.

The control module 102 may set an electric device closest to the reference origin PO' as an inspection start position, and may determine a first inspection order such that the inspection proceeds in the order of electric elements adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 follow the first movement path PA1. can be moved along.

7 is a diagram for explaining the operation of the PCBA inspection device according to an embodiment of the present invention.

Referring to FIG. 7 , an entire substrate image (IM_REF) obtained by capturing the reference inspection substrate (SUB_RF) displayed on the display unit 100 and a first probe image (IM1) obtained by enlarging a part of the entire substrate image (IM_REF) are captured. this is shown The entire substrate image IM_REF and the first probe image IM1 may be simultaneously displayed on the display unit, and the first probe image IM1 may be separately displayed adjacent to the entire substrate image IM_REF or may be displayed on the entire substrate image IM_REF. ) can be displayed overlapping.

In the entire substrate image IM_REF, the center position CP2 of the first probe image IM1 is displayed as the intersection of the first and second leader lines L1 and L2, and the center of the first probe image IM1 is provided. The position CP2 may be moved in response to the user's control. That is, when the user provides movement input information through the input means 124, for example, when the user provides movement input information by clicking the movement buttons MB1 to MB4, the control module 102 controls the movement input information. Correspondingly, it is possible to control the first driving member 112.

In order to determine the positional coordinates to be contacted by the first and second probes 104 and 106 when the board design data DAT does not exist, the PCBA inspection device 100 uses the body area BD of the electric device ED. ) and terminal location (PD) must be input from the user.

The user may set the body region BD and the terminal position PD on the electric element ED displayed on the first probe image IM1 through the input means 124 . For example, the user may select the body region by performing a drag input using a mouse on the electrical element ED displayed on the first probe image IM1. In addition, the user may provide movement input information through the input means 124 to move the center position CP2 of the first probe image IM1 to the terminal position, and store the moved position as the terminal position.

8 is a diagram for explaining the operation of a PCBA inspection device according to another embodiment of the present invention.

Referring to FIG. 8 , an entire substrate image IM_REF displayed on the display unit 110 and a reference coordinate image IM1 ′ superimposed on the entire substrate image IM_REF are shown. The reference coordinate image IM1' is a first probe image captured in real time by the first camera module 116, and may be displayed in an overlapped state on one side of the entire substrate image IM_REF, and the reference coordinate image IM1 ') may be moved according to the user's control.

When the reference inspection substrate SUB_RF is placed on the aligner 108, the control module 102 uses the origin coordinates determined by reading the board design data as reference to generate the reference coordinate image IM1'. It is possible to move the first camera module 116 to the reference position coordinates set to . Here, the reference position coordinates are position coordinates of the first reference point PO1 displayed to correct the position coordinates of the inspection substrates, and the first reference point PO1 may be provided at a plurality of positions of the reference inspection substrate SUB_RF, The origin coordinates may refer to the position of the edge of the uppermost left corner of the substrate.

The control module 102 may generate a first probe image by moving the first camera module 116 to the reference position coordinates of the reference inspection substrate SUB_RF, and the generated first probe image may be the reference coordinate image IM1. It is stored as , and displayed superimposed on one side of the entire substrate image IM_REF in real time, and the center of the first reference point PO1 is disposed at the very center of the reference coordinate image IM1.

The position coordinate image IM2' is generated in real time by the first camera module 116 during the inspection of the first inspection substrate SUB1, and may be displayed superimposed on the other side of the entire substrate image IM_REF, , The position where the entire substrate image (IM_REF) is displayed can be moved according to the user's control.

When the first inspection substrate SUB1 is placed on the aligner 108, the control module 102 controls the first camera module ( 116) can be moved. Here, the reference position coordinates have the same values as the reference position coordinates used when capturing the reference coordinate image IM1'.

The control module 102 may generate a first probe image including the second reference point PO2 by moving the first camera module 116 to the reference position coordinates, which is stored as a position coordinate image IM2'. It can be displayed on the other side of the entire substrate image (IM_REF). Here, the second reference point PO2 is marked on the first inspection substrate SUB1 to correct the positional coordinates of the first inspection substrate SUB1, and is different from the first reference point PO1 in the reference inspection substrate SUB_RF. 1 The second reference point PO2 in the inspection substrate SUB1 is displayed at the same position as each other.

The first camera module 116 captures the fixed reference position coordinates to generate a position coordinate image IM2'. If the position of the first inspection board SUB1 on the aligner 108 is somewhat different from the target position In the case of misalignment, the center of the second reference point PO2 may not be positioned at the exact center of the position coordinate image IM2.

That is, in order to equally apply the positional coordinates set based on the reference inspection substrate SUB_RF to the first inspection substrate SUB1, the reference inspection substrate SUB_RF and the first inspection substrate SUB1 are located on the aligner 108. It should be seated in the same position. In this way, when the first inspection substrate SBU1 is disposed on the aligner at a position different from the position where the reference inspection substrate SUB_RF was disposed, the first and second probes 104 and 106 You cannot reach the desired location.

Therefore, the control module 102 is configured to reflect the positional difference between the reference inspection substrate SUB_RF and the first inspection substrate SUB1 on the aligner 108 when the first inspection substrate SUB1 is inspected, the reference inspection substrate ( SUB_RF) can be used to correct the set coordinate information.

To this end, the control module 102 compares the reference coordinate image IM1' and the position coordinate image IM2' with each other, calculates the distortion rate of the position coordinate image based on the reference coordinate image, and calculates the distortion rate of the position coordinate image IM2'. Offset information may be generated by calculating the x-axis distance and the y-axis distance of the second reference point in ') from the center of the first reference point in the reference coordinate image IM1'.

Thereafter, the control module 102 may apply offset information to the position coordinates of the electric elements to correct the position coordinates set for the electric elements of the first inspection board SUB1.

Meanwhile, a plurality of first reference points PO1 may be provided on the reference inspection substrate SUB_RF, and second reference points PO2 corresponding to the first reference points PO1 may be provided on the first inspection substrate SUB1. In this case, the control module 102 may individually generate offset information for each of the second reference points PO2 . The control module 102 may use offset information of the second reference point PO2 disposed closest to the electric element to correct the position coordinates of the electric element. That is, offset information of the nearest second reference point PO2 may be applied to correcting the positional coordinates of the electric elements of the first inspection substrate SUB1.

9 is a diagram for explaining the operation of a PCBA inspection device according to another embodiment of the present invention.

Referring to FIG. 9 , the first image S_IM is an image of the first electronic device ED1′ extracted from the entire substrate image IM_REF, and the second image B_IM is a photograph of the first inspection substrate SUB1. This is an image of the first electronic device ED1 ″ extracted from one first probe image.

The control module 102 may compare the first and second images S_IM and B_IM with each other to calculate the video concordance rate. If the video concordance rate is greater than or equal to the reference concordance rate, it may be determined that the device is normal.

For example, when the video concordance rate of the first and second images S_IM and B_IM is 90% and the reference concordance rate is 60%, the first electronic device ED1 ″ included in the first inspection substrate SUB1 is normal. It can be judged as an element.

However, when the first electronic device ED1'' is reversely mounted on the first inspection substrate SUB1, the image matching rate of the first and second images S_IM and B_IM' is calculated to be less than 60%, The first electronic device ED1' may be determined to be a defective device.

Although the embodiments of the present invention have been described above, it is understood that those skilled in the art can make various modifications without departing from the scope of the claims of the present invention.

100: PCBA inspection device
102: control module
104: first probe
106: second probe
108: aligner
110: display unit
112: first driving member
114: second driving member
116: first camera module
118: second camera module
120: laser module
122: power supply
124: input means

Claims (9)

first and second probes measuring electrical signals by contacting both terminals of the electrical element of the test substrate;
a first camera module generating a first probe image by capturing a direction in which an end of the first probe faces;
a second camera module generating a second probe image by capturing a direction in which an end of the second probe faces;
a first driving member for moving the first probe and the first camera module in a plurality of axial directions;
a second driving member for moving the second probe and the second camera module in a plurality of axial directions;
A laser module attached to any one of the first and second probes to irradiate a laser beam on an electric element of the reference inspection board, receive the reflected laser beam, measure the height of each electric element on the board, and generate height information. ; and
A control module controlling the movement of each of the first and second driving members so that the first and second probes come into contact with both terminals of the electric element;
The control module,
When inspecting the reference inspection board, position coordinates are set for each electrical element based on the board design data including the design information of the reference inspection board, and the inspection is performed in the order of the first electric element to be inspected and the adjacent electric element. 1 setting an inspection order, correcting the first inspection order based on the height information and the board design data to create a second inspection order,
When inspecting a first inspection substrate having the same structure as the reference inspection substrate, the first and second driving members allow the first and second probes to come into contact with respective terminals of electrical elements arranged according to the second inspection sequence. A PCBA inspection device that controls and moves them to the first position coordinates. The method of claim 1, wherein the control module,
When the reference inspection board is inspected, the shape of each electric element is analyzed based on the board design data, and the body area viewed from the direction perpendicular to the plane of the reference inspection board is overlapped with the terminal area by more than a certain range. In the case of an electric element, the PCBA inspection apparatus for generating the second inspection sequence by excluding the inspection of the first electric element. According to claim 1,
The control module analyzes the height information, and when there is a first electric element having a reference height or higher among the electric elements, the first electric element and a first electric element located within a predetermined area corresponding to the height of the first electric element on the substrate are present. 2 create the second inspection sequence by excluding inspections for electrical components;
The PCBA inspection device in which the area of the predetermined area widens according to a predetermined ratio as the height of the first electric element on the substrate increases. The method of claim 1, wherein the control module,
When inspecting the reference inspection substrate, the first camera module generates an entire substrate image including the front surface of the reference inspection substrate by summing the first probe images photographed in each region of the reference inspection substrate, and Positional coordinates are set for each included electric element, and the first camera module stores a first probe image of the reference inspection substrate as a reference coordinate image centered on the reference position coordinates set based on the board design data. ,
When inspecting the first inspection substrate, before the inspection starts, the first camera module stores a first probe image obtained by taking a picture of the first inspection substrate centered on the reference position coordinates as a positional coordinate image, and the reference coordinate image and PCBA inspection device for generating a corrected first position coordinate by comparing the position coordinate images with each other. The method of claim 4, wherein the control module,
A distortion rate of the position coordinate image is calculated based on the reference coordinate image, and an x-axis distance and a y-axis distance apart from the center of the first reference point in the reference coordinate image are calculated to obtain offset information from the second reference point in the position coordinate image. and generating the corrected first position coordinates by applying the offset information to the first position coordinates. According to claim 4,
an input means for receiving input information from a user; and
Further comprising a display unit displaying the entire substrate image and the first and second probe images;
When inspecting the reference inspection board, if the board design data is not stored in advance, the control module determines the body region of the electric element included in the first probe image and the probe contact position through the input means from the user. A PCBA inspection device for receiving and storing settings and setting positional coordinates at the body region and the probe contact position. The method of claim 6, wherein the control module,
A PCBA inspection device for setting an area located within a first reference distance from the body area as a restricted area in which contact between the first and second probes is impossible. The method of claim 1, wherein the control module,
When the reference inspection substrate is inspected, the first camera module stores a first probe image obtained by photographing each electrical element of the reference inspection substrate as a reference device image;
When the first inspection substrate is inspected, the first camera module stores a first probe image obtained by photographing each electrical element of the first inspection substrate as an inspection device image, and images of the reference device image and the inspection device image. A PCBA inspection device that analyzes the matching rate and determines electrical devices with image matching rates lower than the standard matching rate as defective devices. The method of claim 8, wherein the control module,
When inspecting the first inspection substrate, the electrical signal measured by the first and second probes is compared with a reference electrical signal to primarily determine the state of the electrical element, and the electrical signal is determined through the image coincidence analysis. A PCBA inspection device that secondarily determines the state of the device and determines the electrical device as a normal device only when all are determined to be normal.

Images