KR102536716B1 - Printed assembly circuit board assembly inspection device - Google Patents

Abstract

The PCBA inspection apparatus according to the present invention includes first and second probes that measure electrical signals by contacting both terminals of an electronic device of an inspection board, and a first probe image by capturing a direction in which an end of the first probe is facing. A first camera module that generates a first camera module, a second camera module that generates a second probe image by photographing a direction in which an end of the second probe is facing, and a plurality of axial directions of the first probe and the first camera module. A first driving member for moving the second probe and the second camera module in a plurality of axial directions, and a first camera module capturing each area of the standard inspection substrate. An entire substrate image including the front surface of the reference inspection substrate is created by summing the probe images, position coordinates are set for each electrical element included in the entire substrate image, and the first and second probes are moved to the position coordinates. A control module for controlling the movement of each of the first and second driving members, and a control module attached to any one of the first and second probes to irradiate a laser beam onto the electric element of the reference inspection substrate, and to reflect the laser beam. and a laser module for generating height information by measuring the height of each of the electric elements on the substrate by receiving the first and second electric elements, and the control module proceeds the inspection in the order of the first electric element and the adjacent electric element. 2 A first inspection order according to the moving path of the probes is set, and a second inspection order is generated by correcting the first inspection order based on the height information.

Description

PCBA inspection device {PRINTED ASSEMBLY CIRCUIT BOARD ASSEMBLY INSPECTION DEVICE}

The present invention relates to a PCBA inspection device.

Electronic devices are generally operated by supplying power to a board on which electronic devices are mounted, and electrical characteristics of the board can be inspected only after the manufacturing process is completed. An electronic device must be stably attached to the board, but since the electronic device is electrically coupled to the board through a soldering process, contact failure may occur during the process. In addition, when an electronic device is defective or does not have an appropriate capacity, the substrate cannot be operated normally.

In order to determine whether a board is defective, an inspection device for measuring electrical signals of each electronic element is used. In general, the inspection device includes a stage for supporting the board, an aligner for fixing the board, and a probe. The inspection apparatus may determine whether an electronic element is defective by measuring an electrical signal by bringing a probe into contact with an electrode of the electronic element.

A technical problem to be achieved by the present invention is to provide a PCBA inspection device that automatically inspects whether or not electronic elements disposed on an entire inspection board are defective by measuring electrical signals flowing through electronic elements through a contact probe.

A PCBA inspection apparatus according to an embodiment of the present invention is provided by photographing first and second probes that measure electrical signals by contacting both terminals of an electronic device of an inspection board and the direction the end of the first probe faces. A first camera module for generating a first probe image, a second camera module for generating a second probe image by photographing a direction in which an end of the second probe is facing, and the first probe and the first camera module. A first driving member for moving the second probe and the second camera module in a plurality of axial directions; a second driving member for moving the second probe and the second camera module in a plurality of axial directions; The captured first probe images are combined to generate an entire substrate image including the front surface of the reference inspection substrate, and position coordinates are set for each electrical element included in the entire substrate image. A control module for controlling the movement of each of the first and second driving members to move to the positional coordinates, and attached to either one of the first and second probes to irradiate the electrical element of the reference inspection substrate with laser, , a laser module for generating height information by receiving a reflected laser and measuring a height of each of the electric elements on a substrate, wherein the control module proceeds the inspection in the order of the first electric element to be inspected and the adjacent electric element. A first inspection sequence may be set according to movement paths of the first and second probes, and the first inspection sequence may be corrected based on the height information to generate a second inspection sequence.

According to an embodiment, the control module determines a contactable area in which the first and second probes in the reference inspection substrate can contact and measure an electrical signal based on the height information, and an electrical signal cannot be contacted to measure an electrical signal. It can be stored by dividing it into non-contact areas that cannot be touched.

According to an embodiment, the control module analyzes the height information, and when there is a first electric element of a reference height or higher among the electronic elements, the control module excludes an inspection of the first electric element from the first inspection sequence to determine the height of the first electric element. You can create 2 inspection sequences.

According to an embodiment, the control module may generate the second inspection sequence by excluding the inspection of the second electric element located within a certain area corresponding to the height of the first electric element on the substrate.

According to an embodiment, the control module controls the first and second driving members so that the first and second probes are moved in a plurality of axial directions at a first height above the substrate when inspecting the substrate, and when inspecting the substrate, the first and second probes are moved in a plurality of axial directions. A first height of the first and second probes above the substrate may be different from a second height of the first and second probes above the substrate in standby mode.

According to an embodiment, the control module may determine the first height by analyzing the height information, selecting an electric element having the highest height among the electric elements, and adding a reference inspection height to the highest height.

According to the PCBA inspection apparatus according to an embodiment of the present invention, it is possible to accurately select errors due to defects or damage of a board by automatically determining whether an electronic element is defective based on an electrical signal measured from a probe.

1 is a schematic block diagram of a PCBA inspection device according to an embodiment of the present invention.
2a and 2b are conceptual diagrams of a PCBA inspection device according to an embodiment of the present invention.
3 is a diagram for explaining an entire substrate image according to an embodiment of the present invention.
4 is a diagram for explaining a method of setting location coordinates by a control module according to an embodiment of the present invention.
5 is a view for explaining a method of measuring a height of an electric element on a substrate by a laser module according to an embodiment of the present invention.
6 is a diagram for explaining a method of setting the heights of first and second probes above a substrate by a control module according to an embodiment of the present invention.
7A and 7B are diagrams for explaining a method of setting an inspection order of electric elements by a control module according to an embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only illustrated for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention It can be embodied in various forms and is not limited to the embodiments described herein. In the embodiments described in this specification, a 'module' or 'unit' refers to a functional part that performs at least one function or operation, and may be implemented with hardware or software or a combination of hardware and software.

1 is a schematic block diagram of a PCBA inspection device according to an embodiment of the present invention, and FIGS. 2a and 2b are conceptual diagrams of a PCBA inspection device according to an embodiment of the present invention.

1, 2a, and 2b, the PCBA (Printed Circuit Board Assembly) inspection apparatus 100 according to an embodiment of the present invention contacts a probe to an inspection substrate (SUB), which is a type of PCBA, to detect electrical elements. As a test device for measuring electrical characteristics, it may be implemented as a flying probe tester.

The PCBA inspection device 100 includes a control module 102, a first probe 104, a second probe 106, an aligner 108, a display module 110, a first driving member 112, and a second drive. It includes a member 114, a first camera module 116, a second camera module 118, a laser module 120, and a power module 122.

The control module 102 may read board design data including design information of the reference inspection board SUB_RF to determine positional information of electric elements disposed on the inspection board SUB, based on the board design data. Positions where the first and second probes 104 and 106 should contact may be set as x coordinate values and y coordinate values. Accordingly, the electric elements disposed on the inspection substrate SUB have different x-coordinates and y-coordinates depending on their positions. Meanwhile, the board design data may include not only positional information of the electric element, but also reference position coordinates set based on the origin coordinates, body area, type, name, and the like of each electric element.

However, when the board design data is not separately provided, the PCBA inspection apparatus 100 directly displays the board image displayed on the display unit 110 through an input means from the user, that is, the body area of the electric device, The position of the terminal to be contacted by the first and second probes 104 and 106 and the type and name of each electric element may be directly input. In this case, the control module 102 may calculate the body region and the terminal position as x coordinate values and y coordinate values and store them as contact points of the first and second probes 104 and 106 .

After the control module 102 sets the positional coordinates of each electric element, the set positional coordinates may be used to inspect the first inspection substrate SUB1 having the same structure as the reference inspection substrate SUB_RF. Here, the reference inspection substrate SUB_RF means an inspection substrate SUB that provides a standard for inspecting whether or not the plurality of first inspection substrates SUB1 having the same structure are defective.

In order to equally apply the positional coordinates set based on the reference inspection substrate (SUB_RF) to the first inspection substrate (SUB1), the reference inspection substrate (SUB_RF) and the first inspection substrate (SUB1) are located at the same position on the aligner 108. should be seated in

Specifically, the PCBA inspection device 100 converts and stores the position of each electric element, wiring, etc. into x coordinates and y coordinates based on the reference inspection substrate (SUB_RF), and the first and second The two probes 104 and 106 inspect the first inspection substrate SUB1 using the coordinate information generated based on the reference inspection substrate SUB_RF. If the first inspection substrate SUB1 is the reference inspection substrate ( SUB_RF), the first and second probes 104 and 106 cannot contact desired positions when they are seated on the aligner 108 .

Therefore, the control module 102 is configured to reflect the positional difference between the reference inspection substrate SUB_RF and the first inspection substrate SUB1 on the aligner 108 when the first inspection substrate SUB1 is inspected, the reference inspection substrate ( SUB_RF) can be used to correct the set coordinate information.

To this end, the control module 102 stores the probe image of the first inspection substrate SUB1 disposed on the aligner 108 centered on the reference position coordinates as a positional coordinate image, and converts the reference coordinate image and positional coordinates It is possible to correct the positional coordinates set in the electric element of the first inspection substrate SUB1 by comparing the images with each other.

In addition, the control module 102 controls the movement of the first and second driving members 112 and 114 according to the order of testing the electrical elements to move the first and second probes 104 and 106 to the inspection substrate SUB. , and a test signal can be applied to the electrical element through the first and second probes 104 and 106 . The control module 102 may analyze an electrical signal output from an electrical device in response to the inspection signal, and determine whether the electrical device is defective based on the analysis result.

The first and second probes 104 and 106 may receive electrical signals by directly contacting terminals of electrical elements. Each of the first and second probes 104 and 106 includes an elastic member therein so that shock is absorbed by an elastic action when contacting an electric element, thereby preventing damage to the electric element. The first probe 104 is fixedly mounted to the first driving member 112 and the second probe 106 is fixedly mounted to the first driving member 112 . According to embodiments, the first and second probes may be implemented as flying probes.

The aligner 108 may fix the inspection substrate SUB for inspection, and fixed coupling may be performed according to the size of the inspection substrate SUB by adjusting a coupling member of the aligner 108 .

The first camera module 116 may capture a direction in which an end of the first probe 104 faces, and may capture a shape of a terminal of an electrical element contacting the first probe 104 in detail. Since the first camera module 116 is fixedly mounted to one side of the first driving member 112 together with the first probe 104, an area to be photographed is changed in response to the movement of the first driving member 112. That is, the area to be captured is changed corresponding to the moving path of the first probe 104 .

The second camera module 118 may capture a direction in which the end of the second probe 106 faces, and may capture a shape of a terminal of an electric element to which the second probe 106 is in contact. Since the second camera module 118 is fixedly mounted to one side of the first driving member 112 together with the second probe 106, the area to be photographed is changed in response to the movement of the first driving member 112. That is, the area to be photographed is changed corresponding to the moving path of the second probe 106 .

Here, the captured image of the inspection substrate SUB generated by the first camera module 116 is referred to as a first probe image, and the captured image of the inspection substrate SUB generated by the second camera module 118 is referred to as a first probe image. It is called 2-probe image.

In addition, the reference coordinate image is an image obtained by photographing the reference inspection substrate (SUB_RF) disposed on the aligner 108 with the first camera module 116 or the second camera module 118 as the center of the reference position coordinates. The module 102 may store a probe image obtained by capturing the reference position coordinates by the first camera module 116 or the second camera module 118 as a reference coordinate image.

When the reference inspection substrate SUB_RF is fixedly disposed on the aligner 108, one of the first and second camera modules 116 and 118 photographs each region of the reference inspection substrate SUB_RF to form a divided substrate. images can be created. The control module 102 may generate an entire substrate image by combining the divided substrate images, and the entire substrate image includes all electrical elements disposed on one surface of the inspection substrate SUB. Here, the divided substrate images may be created to have the same area and shape in order to prevent errors such as image distortion and asymmetry.

According to an embodiment, the control module 102 may extract and store a reference coordinate image from an entire substrate image of the reference inspection substrate SUB_RF for coordinate correction when inspecting the first inspection substrate SUB1.

Each of the first and second driving members 112 and 114 is controlled by the control module 102 to position each of the first and second probes 104 and 106 at the determined position coordinates in the x-axis direction, y It can move in the axial direction and the z-axis direction. Since the height of the inspection substrate SUB is fixed by the aligner 108, the movement path in the z-axis direction can maintain a constant value whenever the electric device is inspected.

The display unit 110 displays an image of the entire substrate, and displays a first probe image and a second probe image together in a partial area of the entire substrate image to provide the user with the terminal state of the electric element in real time.

The laser module 120 may irradiate the laser onto the inspection substrate SUB. A first time when the laser is reflected on the inspection substrate SUB and returned is measured and a second time when the laser is reflected and returned from the center of the electric element is measured. Height information of each electrical element may be generated, and the height of each electrical element may be used by the control module 102 to determine an inspection order of each electrical element.

The power supply unit 122 may provide rated power to the inspection board SUB when the inspection board SUB is tested in the power input mode according to the second inspection method.

The input means 124 may mean a series of means capable of receiving input information from a user, such as a mouse, keyboard, and touch panel, and providing it to the control module 102 .

3 is a diagram for explaining an entire substrate image according to an embodiment of the present invention, and FIG. 4 is a diagram for explaining a method for setting position coordinates by a control module according to an embodiment of the present invention.

Referring to FIG. 3 , in the PCBA inspection device 100 according to an embodiment of the present invention, when the reference inspection substrate SUB_RF is fixed to the aligner 108, the first and second camera modules 116 and 118 Divided substrate images DI may be generated by photographing each region of the reference inspection substrate SUB_RF using any one of the modules.

Divided substrate images (DI) may be generated to have the same area and shape to prevent errors such as image distortion and asymmetry. SUB_RF) may be set, and divided substrate images DI may be generated by moving one of the first and second camera modules 116 and 118 to the center of each of the imaging areas.

The control module 102 may generate an entire substrate image (IM_REF) by combining the divided substrate images (DI), and the entire substrate image (IM_REF) includes all electrical elements disposed on one side of the reference inspection substrate (SUB_RF), , Position coordinates may be set for each electric element.

The entire substrate image (IM_REF) is displayed on the display unit 110 and can be used to inspect the first inspection substrate (SUB1). Displayed as , it is possible to provide a function of confirming to the user the electric element currently being inspected.

Referring to FIG. 4 , the control module 102 may set position coordinates at each position of the entire substrate image IM_REF. Position coordinates may be set at regular intervals along the x-axis and the y-axis based on the origin coordinates Po. can

The origin coordinates (Po) may be set to the vertex of the upper left corner of the entire substrate image (IM_REF), but are not limited thereto, and may be set to the center of the entire substrate image (IM_REF) or other positions.

In addition, in FIG. 4, the rectangular first vertex Po is set to the origin coordinates (0,0) based on the rectangular entire substrate image IM_REF, and the second vertex Pn is set to the end point coordinates (n, m). ), but the entire substrate image (IM_REF) can be implemented as a polygon including a circle, semicircle, or curved surface, and in this case, the origin coordinates (Po) can be set at an arbitrary position by the user.

The control module 102 sets positional coordinates at each position in the whole board image (IM_REF), and then, when the user inputs the body region and terminal position of the electric element, the positional coordinates corresponding to the body region and terminal position can be set

5 is a view for explaining a method of measuring a height of an electric element on a substrate by a laser module according to an embodiment of the present invention.

Referring to FIG. 5 , the laser module 120 may irradiate the laser onto the inspection substrate SUB, and the laser irradiation location may be determined based on the location coordinates of the electrical elements set by the control module 102 .

First, the laser module 120 measures the time taken for the laser to be reflected and returned after radiating the laser to the test substrate SUB, and multiplies the measured time by the laser speed to obtain a first distance between the laser module 120 and the test substrate SUB. (D1) can be calculated.

Then, the laser module 120 radiates a laser to the center of each of the electrical elements ED1, ED2, ED3, and ED4 using the positional coordinates of the electrical elements, and multiplies the time the laser returns from the electrical element by the laser speed to obtain , the distance between the laser module 120 and the electric element can be calculated.

For example, the laser module 120 may be positioned at the center of the first electric element ED1 in response to the control of the control module 102 and may irradiate the laser to the center of the first electric element ED1. The laser module 120 may calculate the distance between the laser module 120 and the first electric element ED1 by measuring the time when the irradiated laser is reflected from the first electric element ED1 and returns.

Also, the control module 102 may determine a difference between the first distance D1 and the distance between the laser module 120 and the electric element as the height of the electric element on the substrate. For example, the control module 102 may determine the third distance D3, which is the difference between the first distance D1 and the second distance D2, as the height of the first electric element ED1 above the substrate.

In this way, the control module 102 may determine the heights of all electric elements in the inspection board SUB above the board.

6 is a diagram for explaining a method of setting the heights of first and second probes above a substrate by a control module according to an embodiment of the present invention.

Referring to FIG. 6 , the control module 102 controls the first and second driving members 112 and 114 to move the first and second probes 104 and 106 in a plurality of axial directions when inspecting a substrate. However, when the first and second probes 104 and 106 move in a plurality of axial directions, they maintain a constant height on the substrate.

When inspecting a substrate, the first height Ds of the first and second probes 104 and 106 located on the substrate may be determined by the control module 102, which controls the laser module 120. The first height Ds may be determined by determining the height of each electric element based on the height information generated by, and selecting an electric element having the highest height Dh among the electric elements.

At this time, the control module 102 may determine the first height Ds by adding the reference inspection height Dm to the height of the electric element having the highest height Dh on the board, and the reference inspection height Dm is 10 mm. to 40 mm.

For example, when the third electric element among the electric elements has a height of 50 mm as the electric element having the highest height Dh and the reference inspection height Dm is set to about 10 mm, the control module 102 operates the first and the first height Ds of the second probes 104 and 106 may be determined to be 60 mm.

According to an embodiment, when the first and second probes 104 and 106 stand by without performing a separate inspection, the height of the first and second probes 104 and 106 above the substrate during standby is the second The height may be set to be different from the first height Ds. That is, the second height may be set higher than the first height Ds.

On the other hand, when the first and second driving members 112 and 114 move to inspect the electric element, if the height of the electric element is equal to or greater than the reference height, the first and second driving members 112 and 114 move the corresponding electric element. It may be caught or blocked by the body of the device, preventing proper inspection.

Accordingly, the control module 102 analyzes the height information, and if there is an electric element higher than the reference height among the electronic elements, the control module 102 may exclude the inspection of the corresponding electric element from the inspection sequence. For example, if the height of the third electric element ED3 above the substrate is equal to or greater than the reference height, the control module 102 may exclude the third electric element ED3 from the inspection sequence.

In addition, the control module 102 analyzes the height information, and if there is an electric element higher than the reference height among the electronic elements, it is possible to exclude electric elements located within a certain area corresponding to the height of the corresponding electric element on the board from being inspected. there is. For example, if the height of the third electric element ED3 above the substrate is equal to or greater than the reference height, the control module 102 controls the height of the second electric element ED2 and the fourth electric element ED4 adjacent to the third electric element ED3. Checks can be excluded from the check order.

According to the embodiment, the control module 102 includes a contactable area where the first and second probes 104 and 106 in the inspection substrate SUB contact each other to measure an electrical signal based on the height information, and contact Since this is not possible, it can be classified as a non-contactable area in which electrical signals cannot be measured. Accordingly, the control module 102 may exclude the inspection of the electric element located in the non-touch area from the inspection sequence.

7A and 7B are diagrams for explaining a method of setting an inspection order of electric elements by a control module according to an embodiment of the present invention.

Referring to FIG. 7A, the first movement path PA1 of the first and second probes 104 and 106 according to the first inspection order set by the control module 102 is shown in the entire substrate image IM_REF. there is. The control module 102 may set an electric device closest to the reference origin PO' as an inspection start position, and may determine a first inspection order such that the inspection proceeds in the order of electric elements adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 follow the first movement path PA1. can be moved along.

For example, if the electric element closest to the reference origin PO' is the first electric element ED1, the control module 102 sets the inspection start position to the first electric element ED1, and sets the electric element to be inspected to the first electric element ED1. The first movement path PA1 to the second electric element ED2 may be set by determining the first inspection order in an adjacent order.

Referring to FIG. 7B, the second movement path PA2 of the first and second probes 104 and 106 according to the second inspection order set by the control module 102 is shown in the entire substrate image IM_REF. there is.

The control module 102 may determine the height of each electric element on the substrate based on the height information generated by the laser module 120, correct the first inspection sequence based on the height information, and perform the second inspection sequence. can create

When the first and second driving members 112 and 114 move to inspect the electric element and the height of the electric element is equal to or greater than the reference height, the first and second driving members 112 and 114 move the corresponding electric element. It may become caught or blocked in the body, preventing proper inspection. Accordingly, the control module 102 analyzes the height information, and if there is an electric element higher than the reference height among the electronic elements, the control module 102 may exclude the inspection of the corresponding electric element from the inspection sequence.

For example, if the heights of the fourth and fifth electric elements ED4 and ED5 on the substrate are equal to or greater than the reference height, the control module 102 performs the inspection of the fourth and fifth electric elements ED4 and ED5 in the order of inspection. can be excluded.

In addition, the control module 102 analyzes the height information, and if there is an electric element higher than the reference height among the electronic elements, it is possible to exclude the inspection of electric elements located within a certain area corresponding to the height of the corresponding electric element on the board. there is.

For example, if the heights of the fourth and fifth electrical elements ED4 and ED5 above the substrate are equal to or greater than the reference height, the control module 102 controls the third electrical element ED3 adjacent to the fourth and fifth electrical elements ED4 and ED5. ) can be excluded from the test order.

As such, the control module 102 may determine a second inspection sequence by excluding some electrical elements from the first inspection sequence, and the second movement path PA2 may be set corresponding to the second inspection sequence.

The control module 102 may set an electric device closest to the reference origin PO' as an inspection start position, and may determine a first inspection order such that the inspection proceeds in the order of electric elements adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 follow the first movement path PA1. can be moved along.

Although the embodiments of the present invention have been described above, it is understood that those skilled in the art can make various modifications without departing from the scope of the claims of the present invention.

100: PCBA inspection device
102: control module
104: first probe
106: second probe
108: aligner
110: display unit
112: first driving member
114: second driving member
116: first camera module
118: second camera module
120: laser module
122: power supply

Claims (6)

A PCBA inspection device for inspecting a reference inspection board to obtain information, and based on the information, inspecting a plurality of first inspection boards having the same structure as the reference inspection board to determine whether or not there is a defect,
first and second probes contacting both terminals of the electronic elements of the reference inspection board to measure electrical signals;
a first camera module generating a first probe image by capturing a direction in which an end of the first probe faces;
a second camera module generating a second probe image by capturing a direction in which an end of the second probe faces;
a first driving member for moving the first probe and the first camera module in a plurality of axial directions;
a second driving member for moving the second probe and the second camera module in a plurality of axial directions;
The first camera module generates an entire substrate image including the front surface of the reference inspection substrate by summing the first probe images of each region of the reference inspection substrate, and positions each electrical element included in the entire substrate image. a control module that sets coordinates and controls movements of the first and second driving members so that the first and second probes move to the position coordinates; and
Attached to either of the first and second probes, laser is irradiated to each of the electrical elements of the reference inspection substrate, and the reflected laser is received to measure the height of each of the electrical elements on the substrate to generate height information. Including a laser module to
The control module sets a first inspection order according to the moving path of the first and second probes so that the inspection proceeds in the order of an electrical element first inspected and an adjacent electric element, and the first inspection sequence based on the height information. A PCBA inspection device for generating a second inspection sequence by correcting the sequence. According to claim 1,
The control module determines a contactable area in which the first and second probes in the reference inspection substrate can contact and measure an electrical signal based on the height information, and a non-contactable area in which an electrical signal cannot be measured because the contact is not possible. A PCBA inspection device that is divided into areas and stored. According to claim 1,
The control module analyzes the height information to generate the second inspection sequence by excluding an inspection of the first electric element from the first inspection sequence when a first electric element having a height equal to or greater than a reference height exists among the electronic elements. A PCBA inspection device that does. According to claim 3,
The control module generates the second inspection sequence by excluding inspection of other electrical elements adjacent to the first electrical element. According to claim 1,
The control module controls the first and second driving members to move the first and second probes in a plurality of axial directions at a first height above the substrate when inspecting the reference inspection substrate;
The PCBA inspection apparatus of According to claim 5,
The control module analyzes the height information to select an electric element having the highest height among the electric elements, and determines the first height by adding a reference inspection height to the highest height.

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