JP6768411B2 - Board inspection equipment - Google Patents

Description

The present invention relates to a substrate inspection apparatus having a probe unit in which a plurality of probes are arranged.

As a substrate inspection apparatus of this type, the substrate inspection apparatus proposed by the applicant of the present application in Patent Document 1 below is already known. This substrate inspection device includes a probe unit, a moving mechanism for moving the probe unit, a mounting table, a measuring unit, an inspection unit, a storage unit, and a processing unit, and is configured to be capable of inspecting a substrate. Further, the probe unit is configured to include a plurality of probes, a support portion, and an electrode plate. Each probe is used for inputting and outputting electrical signals by contacting a conductor part such as a conductor pattern on a substrate during inspection, and is formed into a rod shape having a circular cross section that can be elastically deformed by a conductive metal material. ing.

Japanese Unexamined Patent Publication No. 2015-21726 (pages 5-6, 1-5)

However, the conventional substrate inspection device has the following problems to be improved. That is, in this type of substrate inspection device, when doubts arise in the inspection results for the substrate (for example, when the inspection results for a specific inspection location among a plurality of inspection locations on the substrate are not stable, or when a specific inspection is performed. If the inspection result for a location frequently results in a defect), the probe used for inspection at this specific inspection location may be defective. Therefore, the probe unit is moved. It is removed from the camera and transported to the work place for inspection, and the state of the probe is checked by enlarging the corresponding probe with a high-magnification camera.

However, since it is necessary to remove the probe unit from the moving mechanism every time the probe is inspected, this substrate inspection apparatus has a problem to be improved that the probe inspection work is troublesome.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a substrate inspection apparatus capable of inspecting a probe without removing the probe unit.

In order to achieve the above object, the substrate inspection apparatus according to claim 1 is a probe unit in which a plurality of probes for bringing the tip into contact with a corresponding inspection location on the substrate to be inspected, and a moving mechanism for moving the probe unit. , A measuring unit that measures the electrical characteristics of the inspection point in contact with the tip of the probe via a probe selected from the plurality of probes, and a movement control process for the moving mechanism and the measurement. It is a substrate inspection device provided with a processing unit that executes an inspection process for the inspection location based on the electrical characteristics, and is an imaging unit capable of capturing an image of the arrangement surface of the plurality of probes in the probe unit as an image. A storage unit that stores position information indicating the arrangement positions of the plurality of probes on the arrangement surface, a display unit, and an operation unit are provided, and the processing unit is described when the inspection process is not executed. Based on the position information read from the storage unit, a probe arrangement image showing the arrangement positions of the plurality of probes on the arrangement surface is displayed on the screen of the display unit, and specific coordinates in the probe arrangement image are displayed. When input from the operation unit, the imaging unit is made to image the captured image of the arrangement surface within a predetermined range including the specific coordinates, and the captured image is displayed on the screen together with the probe arrangement image. The probe image processing to be displayed is executed , and based on the result of the inspection processing executed on the plurality of the substrates, it is used for the inspection location where the result of the inspection processing among the plurality of probes is abnormal with a high probability. In a manner in which a specific process for identifying the probe to be used as a specific probe that may have a problem is executed, and the position of the specific probe can be distinguished from the position of another probe in the probe imaging process. The probe arrangement image is displayed .

Further, the substrate inspection device according to claim 2 is the substrate inspection device according to claim 1, wherein the image pickup unit is composed of a camera that magnifies and images a part of the arrangement surface, and moves the image pickup unit. The processing unit includes an imaging unit moving mechanism, and in the probe imaging process, the processing unit executes movement control for the imaging unit moving mechanism based on the specific coordinates to bring the imaging position within the predetermined range. The imaging unit is moved to perform imaging.

In the substrate inspection apparatus according to claim 1, the processing unit executes a probe imaging process and displays a probe arrangement image showing the arrangement positions of a plurality of probes on the arrangement surface based on the position information stored in the storage unit. When a specific coordinate in the probe placement image is input from the operation unit, the image pickup unit is made to capture an image of the placement surface within a predetermined range including the specific coordinate. This captured image is displayed on the screen together with the probe arrangement image.

Therefore, according to this substrate inspection apparatus, the operator can display an inspection on the probe placed at a desired position on the placement surface of the probe unit on the screen without removing the probe unit from the moving mechanism. Since it can be performed based on the captured image, the labor required for the probe inspection work can be greatly reduced. Further, according to this substrate inspection device, in order for the processing unit to display the probe arrangement image on the screen of the display unit based on the position information stored in the storage unit, for example, the above-mentioned predetermined range is imaged. In addition to the imaging unit, an imaging unit for capturing an image (alternative image of the probe placement image) in a wider area (for example, the entire placement surface) than the image captured by the imaging unit and its moving mechanism are provided. The configuration of the substrate inspection device can be significantly simplified as compared with the configuration provided.
Further, in this substrate inspection device, when the probe imaging process is executed, the process is performed when the inspection process for a plurality of substrates has already been executed, that is, when the inspection results for the plurality of substrates are stored in the storage unit. Based on this inspection result, the part may have a problem with the probe used in the inspection location where the inspection processing result of a plurality of probes becomes abnormal with a high probability as a preprocessing of the probe imaging process. An embodiment in which a specific process for identifying a suitable probe (specific probe) is executed, and in the probe imaging process, the arrangement position (indicating image) of this specific probe can be distinguished from the arrangement position (indicating image) of another probe. Generate and display the probe placement image with.
Therefore, according to this substrate inspection device, the operator can identify a probe (specific probe) having a high possibility of having a defect only by looking at the probe arrangement image displayed on the screen. Therefore, the operator can operate the operation unit and immediately output the coordinates (specific coordinates) about the specific probe to the processing unit to quickly display the image including the specific probe on the screen. , The inspection for this particular probe can be performed in a shorter time.

Further, according to the substrate inspection apparatus according to claim 2, since the image pickup unit is composed of a camera that enlarges a part of the arrangement surface to take an image , for example, the image pickup unit is configured by a camera having a normal magnification and this Unlike the configuration in which an image in a predetermined range including specific coordinates is cut out and displayed (enlarged display) in the image captured by the camera, the image in a predetermined range including specific coordinates is clearer. As a result of being able to display the state on the screen of the display unit, the probe inspection work can be performed more accurately.

It is a block diagram which shows the structure of the substrate inspection apparatus 1. It is a top view of the probe 21. It is a perspective view of the probe unit 2 seen from the support plate 41 side (the contact surface 41a side as an arrangement surface). Front view of the probe unit 2 and the mounting table 4 in a state where the tip end side support portion 31 is most separated from the spacer 33 fixed to the base end portion side support portion 32 (a state in which a gap G1 is generated between them). Is. It is a front view of the probe unit 2 and the mounting base 4 in a state where the tip end side support portion 31 is in contact with the spacer 33 fixed to the base end portion side support portion 32 (the state where the gap G1 is zero). .. It is a partial cross-sectional view of the probe unit 2 cut along the plane parallel to the paper surface in FIG. 4 for explaining the support structure of the probe 21 in the probe unit 2. It is sectional drawing of the probe unit 2 cut along the plane parallel to the paper surface in FIG. 5 for explaining the support structure of the probe 21 in the probe unit 2. It is a display state diagram of the screen 11a in the display part 11 for demonstrating the operation of the substrate inspection apparatus 1. It is another display state diagram of the screen 11a in the display part 11 for demonstrating the operation of the substrate inspection apparatus 1.

Hereinafter, embodiments of the substrate inspection apparatus will be described with reference to the drawings.

First, the configuration of the substrate inspection device 1 as an example of the substrate inspection device will be described. The substrate inspection device 1 shown in FIG. 1 includes a probe unit 2, a moving mechanism 3, a mounting table 4, a measuring unit 5, an imaging unit 6, an imaging unit moving mechanism 7, a storage unit 8, a processing unit 9, an operation unit 10, and a display unit. 11 is provided so that the substrate 100 can be inspected.

As an example, the probe unit 2 is configured in a jig shape in the same manner as the probe unit of the conventional substrate inspection apparatus (the substrate inspection apparatus disclosed in Patent Document 1), and is configured as a jig, as shown in FIGS. 3 to 7. It includes a plurality of probes 21, a support portion 22, and an electrode plate 23.

The probe 21 is used for inputting and outputting an electric signal by contacting a conductor portion such as a conductor pattern on the substrate 100 during inspection. As an example, the probe 21 has a circular cross section that can be elastically deformed by a conductive metal material. It is formed in a rod shape (see FIG. 2). Further, an insulating layer formed of an insulating coating material is formed on the peripheral surface of the intermediate portion 21a of the probe 21. Therefore, as shown in the figure, the diameter L2 of the intermediate portion 21a is larger than the diameter L1 of the tip portion 21b and the diameter L3 of the base end portion 21c. That is, in the probe 21, the tip portion 21b and the proximal end portion 21c are formed to have a smaller diameter than the intermediate portion 21a.

As shown in FIGS. 3 to 7, the support portion 22 includes a tip end side support portion 31, a base end side support portion 32, and a spacer 33, and is configured to be able to support the probe 21.

The tip end side support portion 31 is a member that supports the tip end portion 21b side of the probe 21, and is configured to include support plates 41 and 42.

As an example, the support plate 41 is formed in a plate shape by a non-conductive resin material. Further, as shown in FIGS. 3, 6 and 7, the support plate 41 is formed with a plurality of support holes 51 having a circular shape in a plan view (the same number as the number of probes 21). The support hole 51 is a hole for inserting the tip portion 21b of the probe 21 to support the tip portion 21b, and has a diameter slightly larger than the diameter L1 of the tip portion 21b of the probe 21 and of the probe 21. It is formed to have a diameter slightly smaller than the diameter L2 of the intermediate portion 21a, and it is possible to insert only the tip portion 21b without inserting the intermediate portion 21a.

The support plate 42 is formed in a plate shape by the same material as the support plate 41 (in this example, a non-conductive resin material). Further, the support plate 42 is formed with a plurality of support holes 52 (see FIGS. 6 and 7) having a circular shape in a plan view (the same number as the number of probes 21). The support hole 52 is a hole for inserting the tip portion 21b of the probe 21 to support the tip portion 21b, and the diameter is formed to be the same as the diameter of the support hole 51 of the support plate 41, and the intermediate portion 21a is formed. It is possible to insert only the tip portion 21b without inserting the tip portion 21b.

The base end side support portion 32 is a member that supports the base end portion 21c side of the probe 21, and is configured to include support plates 43 and 44 as shown in FIGS. 6 and 7.

As an example, the support plate 43 is formed in a plate shape by a non-conductive resin material. Further, as shown in FIGS. 6 and 7, the support plate 43 is formed with a plurality of support holes 53 having a circular shape in a plan view (the same number as the number of probes 21). The support hole 53 is a hole for inserting the base end portion 21c of the probe 21 to support the base end portion 21c, and allows the probe 21 to be inserted in a state where the electrode plate 23 is removed when the probe 21 is replaced. It is also a hole for the purpose, and its diameter is formed to be slightly larger than the diameter L2 of the intermediate portion 21a of the probe 21, so that the intermediate portion 21a can be inserted therethrough.

The support plate 44 is formed in a plate shape by the same material as the support plate 43 (in this example, a non-conductive resin material). Further, as shown in FIGS. 6 and 7, the support plate 44 is formed with a plurality of support holes 54 having a circular shape in a plan view (the same number as the number of probes 21). The support hole 54 is a hole for inserting the base end portion 21c of the probe 21 to support the base end portion 21c, and is also a hole for inserting the probe 21 when the probe 21 is replaced. The diameter is formed to be the same as the diameter of the support hole 53 of the support plate 43, and the intermediate portion 21a can be inserted therethrough.

The spacer 33 is arranged between the tip end side support portion 31 and the base end side support portion 32 (specifically, between the support plate 42 and the support plate 43) in a state of being fixed to the support plate 43. Has been done. Although not shown, the spacer 33 is a region where the support hole 52 is formed in the support plate 42 and a region where the support hole 53 is formed in the support plate 43 (both are regions where the support hole 51 is formed in the support plate 41 shown in FIG. 3). Surrounding a forming region having the same shape and the same size as (in this example, a forming region of a rectangular shape in a plan view), that is, as shown in FIGS. 6 and 7, the tip end side support portion 31 and the base end portion It is formed in a U-shape (or a square shape) in a plan view surrounding a plurality of probes 21 supported by the side support portion 32.

As shown in FIGS. 3 to 7, the electrode plate 23 is formed in a plate shape by a non-conductive resin material or the like. Further, as shown in FIGS. 6 and 7, the electrode plate 23 is in contact with each base end portion 21c of each probe 21 to input and output an electric signal to and from the measuring unit 5 (an example of an external device). A plurality of electrodes 81 for performing the operation are fitted, and a cable (not shown) is connected to each of these electrodes 81.

In this probe unit 2, as shown in FIGS. 3, 4 and 5, the support plates 41 and 42 are in contact with each other and all the support holes 51 communicate with the corresponding support holes 52, which are not shown. It is fixed by a pin. Further, the electrode plate 23, the support plates 44, 43, and the spacer 33 are also laminated in this order, and all the support holes 53 of the support plate 43 communicate with the support holes 54 of the corresponding support plate 44. It is fixed by a fixing pin (not shown).

Further, in the probe unit 2, as shown in FIG. 4, the tip end side support portion 31 is attached to the spacer 33 via a plurality of rod-shaped members (plungers) 34 erected on the lower surface of the spacer 33, and the base end portion side. It is attached to the support portion 32 (specifically, the spacer 33) so as to be movable in contact with and detached from it. Further, the probe unit 2 is in a state where the tip end side support portion 31 is most separated from the spacer 33 fixed to the base end end side support portion 32 shown in FIGS. 4 and 6 (the tip end side support portion 31 is formed). When the support plate 41 is not in contact with the substrate 100 (hereinafter, also referred to as “non-contact state”), a predetermined distance is provided between the spacer 33 (lower surface) and the support plate 42 of the tip end side support portion 31. It is configured so that the gap G1 of the above is generated. Further, in the probe unit 2, the tip end side support portion 31 is closest to the spacer 33 shown in FIGS. 5 and 7 (the support plate 41 is in contact with the substrate 100 and is pressed against the substrate 100 by the spacer 33). In the present state (hereinafter, also referred to as “pressing state”), the gap G1 disappears and the spacer 33 and the support plate 42 of the tip end side support portion 31 are in contact with each other.

Further, in the probe unit 2, each probe 21 has a tip portion during a period of transition from the non-contact state shown in FIGS. 4 and 6 to the pressed state shown in FIGS. 5 and 7 and a period of transition from the pressed state to the non-contact state. 21b is inserted through the support holes 51 and 52, the base end portion 21c is inserted through the support holes 53 and 54, and the end portion of the support hole 52 in the intermediate portion 21a comes into contact with the mouth edge of the support hole 52 in the support plate 42. In addition, the base end portion 21c is supported between the tip end side support portion 31 and the base end portion side support portion 32 in a state of being in contact with the electrode 81 of the electrode plate 23.

Further, in the probe unit 2, in the pressed state shown in FIG. 7, the intermediate portion 21a of the probe 21 is curved by the amount that the distance between the support plate 42 and the support plate 43 is shortened (the gap G1). The elastic force of the probe 21 generated at that time ensures that the tip portion 21b comes into contact with the substrate 100.

The moving mechanism 3 executes probing to move the probe unit 2 in the direction closer to and away from the mounting table 4 (the substrate 100 mounted on the mounting table 4) under the control of the processing unit 9. The mounting table 4 is configured so that the substrate 100 can be mounted and the mounted substrate 100 can be fixed. The measuring unit 5 is connected to each electrode 81 arranged on the electrode plate 23 via a cable (not shown), and is an inspection location on the substrate 100 based on the probe 21, the electrode 81, and an electric signal input via the cable. (For example, an inspection location located between the tips 21b of a pair of probes 21 selected by the processing unit 9 from a plurality of probes 21) (for example, resistance value, capacitance value, inductance value, etc.) Is measured and output to the processing unit 9 is executed.

The image pickup unit 6 is configured to include, for example, a camera, and under the control of the processing unit 9, the arrangement surface of a plurality of probes 21 in the probe unit 2 (in this example, the tip portion 21b of each probe 21 is inserted through the imaging unit 6). The support plate 41 in which the support hole 51 is formed is configured to be capable of capturing an image of the contact surface 41a) with the substrate 100. In this example, as an example, the imaging unit 6 is composed of a high-magnification camera, and is not an entire image of the contact surface 41a, but a part of the image of the contact surface 41a (for example, only a few support holes 51). An image of a narrow range including the image (hereinafter, also referred to as a "narrow range"): a predetermined range) is imaged (that is, a part of the contact surface 41a is magnified and imaged). Further, the image capturing unit 6 outputs an image data dim indicating the captured image to the processing unit 9.

As shown in FIG. 1, the image pickup unit moving mechanism 7 moves the image pickup unit 6 on a virtual plane PL1 parallel to the contact surface 41a of the support plate 41 with the substrate 100 under the control of the processing unit 9. The storage unit 8 stores in advance the position information Dp (which is also the position information of the plurality of support holes 51 in the support plate 41) indicating the arrangement positions of the plurality of probes 21 on the contact surface 41a and the operation program for the processing unit 9. Has been done. Further, the storage unit 8 stores the resistance value measured by the measuring unit 5 and the result of the inspection performed by the processing unit 9 under the control of the processing unit 9.

The processing unit 9 is composed of, for example, a computer, and executes control for each unit (moving mechanism 3, imaging unit 6, image capturing unit moving mechanism 7, etc.) constituting the substrate inspection device 1. Further, the processing unit 9 performs inspection processing for each inspection location based on the electrical characteristics of a plurality of predetermined inspection locations on the substrate 100 measured by the measurement unit 5, and displays the display unit 11 on the screen 11a described later. The probe imaging process for displaying the probe placement image IM1 and the captured image IM2 (see FIGS. 8 and 9) is executed.

The operation unit 10 is composed of, for example, a touch panel (not shown) arranged on the screen 11a (see FIGS. 8 and 9) of the display unit 11 and an input device such as a mouse, and is a screen as shown in FIGS. A specific coordinate CO in the arrangement image display area AR1 defined on 11a (for example, a pointer PT that moves in the arrangement image display area AR1 in response to an operation on the operation unit 10 (in this example, a cross-shaped pointer as an example). The coordinates (two-dimensional coordinates) indicated by (2) are output to the processing unit 9. As shown in FIGS. 8 and 9, in the arrangement image display area AR1, the processing unit 9 arranges the probe arrangement image IM1 (a plurality of probes 21 on the contact surface 41a defined based on the position information Dp). An image showing the position) is displayed at a predetermined position. Therefore, the above coordinate CO can be said to be the coordinates of the pointer PT in the probe arrangement image IM1. Further, the operation unit 10 includes an instruction key (not shown) for instructing the processing unit 9 to execute either the inspection process or the probe imaging process.

The display unit 11 is composed of a display device such as an LCD (liquid crystal display), and under the control of the processing unit 9, the probe arrangement image IM1 and the pointer PT are placed in the arrangement image display area AR1 predetermined on the screen 11a. At the same time as displaying (see FIGS. 8 and 9), the captured image IM2 is displayed in the captured image display area AR2.

Next, the operation of the substrate inspection device 1 in the inspection process and the operation in the probe imaging process will be described with reference to the drawings.

First, the operation in the inspection process will be described. As shown in FIG. 1, the probe unit 2 is fixed to the moving mechanism 3 with the support plate 41 facing the mounting table 4, and the substrate 100 to be inspected is placed on the mounting surface of the mounting table 4. It is assumed that it has been done.

In this state, when an operation is performed on the instruction key of the operation unit 10 and an instruction to execute the inspection process is output from the operation unit 10 to the processing unit 9, the processing unit 9 executes the inspection process. In this inspection process, the processing unit 9 first controls the imaging unit moving mechanism 7 to move the imaging unit 6 to a shunting position (a position on the virtual plane PL1 that does not interfere with the probe unit 2). Next, the processing unit 9 controls the moving mechanism 3 so that the probe unit 2 is oriented toward the substrate 100 (mounting surface of the mounting table 4) from the positions shown in FIGS. 1 and 4 (downward in FIG. 1). ) To move (descent) to the pressed state shown in FIGS. 5 and 7, and then stop the movement (descent) of the probe unit 2. As a result, in the probe unit 2, the tip portion 21b of each probe 21 comes into contact with the substrate 100.

Subsequently, the processing unit 9 executes the inspection process. In this inspection process, the processing unit 9 specifies a plurality of inspection points specified on the substrate 100 one by one in a predetermined order based on the operation program, and is used for inspection of the specified one inspection point. A pair of probes 21 are specified. Further, the processing unit 9 causes the measuring unit 5 to measure the electrical characteristics of the one inspection point via the specified pair of probes 21. Further, the processing unit 9 inspects this one inspection point based on the electrical characteristics measured by the measuring unit 5 (for example, whether or not the measured electrical measurement is included in the reference range indicating normality. (Inspection to determine normality / abnormality based on electricity) is executed. Further, the processing unit 9 stores the inspection result in the storage unit 8 in association with the identification information about the current one inspection location. Therefore, when the processing unit 9 executes this inspection process, the inspection results for the plurality of inspection points defined on one substrate 100 are stored in the storage unit 8 in association with the identification information for each inspection point. To.

As a result, when a plurality of boards 100 (boards having the same specifications) are inspected using the board inspection device 1, a plurality of boards 100 specified in the board 100 are stored in the storage unit 8 of the board inspection device 1. The inspection result for each substrate 100 for the inspection location is stored in association with the identification information for each inspection location.

Further, in the substrate inspection device 1, when the inspection process is not executed, the instruction key of the operation unit 10 is operated, and the operation unit 10 outputs an instruction to the processing unit 9 to execute the probe imaging process. At that time, the processing unit 9 executes the probe imaging process. In this probe imaging process, the processing unit 9 first controls the moving mechanism 3 to move the probe unit 2 to the positions shown in FIGS. 1 and 4 and stop the probe unit 2.

Next, the processing unit 9 displays an image showing the arrangement positions of the plurality of probes 21 on the contact surface 41a based on the position information Dp stored in the storage unit 8 (probe 21 when the contact surface 41a is viewed from the front). The probe arrangement image IM1 which is an image equivalent to the image showing the arrangement position of the above is generated and displayed in the arrangement image display area AR1 defined on the screen 11a of the display unit 11 as shown in FIG. In this case, the processing unit 9 uses, for example, an image in which dots of a single color (a color that can be distinguished from the background color) and the same planar shape (for example, a circle) are arranged at the arrangement positions of the probes 21 as the probe arrangement image IM1. Generate.

Subsequently, the processing unit 9 acquires the coordinate CO output from the operation unit 10 and displays the pointer PT at a position in the arrangement image display area AR1 indicated by the coordinate CO. Further, the processing unit 9 controls the imaging unit moving mechanism 7 so that the imaging center position indicated by the coordinate CO on the actual contact surface 41a coincides with the optical axis of the camera constituting the imaging unit 6. The imaging unit 6 is moved on the virtual plane PL1. The image pickup unit 6 has a narrow range described above on the contact surface 41a centered on the optical axis (as an example in this example, a narrow range including several probes 21 as shown by broken lines in FIGS. 8 and 9). Therefore, an image included in a square range (a circular range or the like) is captured in real time, and an image data dim indicating this image is output to the processing unit 9.

While executing the movement of the imaging unit 6 based on the coordinate CO, the processing unit 9 acquires the image data dim output from the imaging unit 6 at a fixed cycle, for example, and the above-mentioned hit indicated by the image data dim. As shown in FIG. 8, the image of the narrow range on the contact surface 41a is updated and displayed as the captured image IM2 in the captured image display area AR2 defined on the screen 11a of the display unit 11. Since the captured image IM2 is a narrow range image including only a part of the contact surface 41a captured by the imaging unit 6 as described above, an enlarged image of this part of the contact surface 41a is enlarged. It has become.

As a result, the operator of the substrate inspection device 1 attaches the probe unit 2 to the moving mechanism 3 when inspecting the desired probe 21 among the plurality of probes 21 arranged in the probe unit 2. In the same state, the operation unit 10 is operated while looking at the probe arrangement image IM1 and the pointer PT displayed in the arrangement image display area AR1 on the screen 11a of the display unit 11, and the above desired desired in the probe arrangement image IM1. The pointer PT is moved to the position where the probe 21 is arranged. In this case, in the substrate inspection device 1, an enlarged image (imaging unit) of the vicinity including the arrangement position of the desired probe 21 in the arrangement region (formation region of the support hole 51) of the probe 21 on the actual contact surface 41a. The captured image IM2) captured by 6 is displayed in real time in the captured image display area AR2 on the screen 11a. The operator performs an inspection on the desired probe 21 based on the magnified image displayed in the captured image display area AR2. The inspection of the probe 21 includes, for example, the tip of the probe 21 from inside the support hole 51 due to abnormal wear of the tip 21b of the probe 21 or deformation of the intermediate portion 21a of the probe 21. It is visually determined whether or not the amount of protrusion of the portion 21b is reduced as compared with the amount of protrusion of the tip portion 21b of the other probe 21, and whether or not the shape of the end face of the tip portion 21b is abnormal. It is an inspection.

As described above, in the substrate inspection device 1, when the inspection process is not executed, the processing unit 9 of the plurality of probes 21 on the contact surface 41a (arrangement surface) based on the position information Dp read from the storage unit 8. When the probe placement image IM1 indicating the placement position is displayed on the screen 11a of the display unit 11 and the coordinate CO of the pointer PT, which is a specific coordinate in the probe placement image IM1, is input from the operation unit 10, this specific A probe imaging process is executed in which the imaging unit 6 captures the captured image IM2, which is an image of the contact surface 41a within the narrow range including the coordinate CO, and displays the captured image IM2 together with the probe arrangement image IM1 on the screen 11a. ..

Therefore, according to the substrate inspection device 1, the operator is arranged at a desired position in the arrangement region of the probe 21 on the contact surface 41a of the probe unit 2 without removing the probe unit 2 from the moving mechanism 3. Since the inspection of the probe 21 can be performed based on the captured image IM2 displayed on the screen 11a, the labor required for the inspection work of the probe 21 can be significantly reduced. Further, according to the substrate inspection device 1, the processing unit 9 displays the probe arrangement image IM1 on the screen 11a of the display unit 11 based on the position information Dp read from the storage unit 8 in the probe imaging process as described above. Therefore, for example, apart from the imaging unit 6 that captures the captured image IM2, an image (an alternative image of the probe arrangement image IM1) of a region wider than the captured image IM2 (for example, the entire region of the contact surface 41a) is captured. The configuration of the substrate inspection device 1 can be significantly simplified as compared with the configuration in which the imaging unit and the moving mechanism thereof are provided.

Further, in the substrate inspection device 1, the image pickup unit 6 may be a camera having a normal magnification, but in this example, the image pickup unit 6 is particularly composed of a high magnification camera, and the processing unit 9 takes an image based on a specific coordinate CO in the probe imaging process. By executing the movement control for the unit moving mechanism 7, the imaging unit 6 is moved to an imaging position in a narrow range including the specific coordinate CO (an imaging position capable of imaging a narrow range) to perform imaging. Therefore, according to the substrate inspection device 1, for example, the imaging unit 6 is configured by a camera having a normal magnification, and an image in a narrow range including the specific coordinate CO in the image captured by the camera is cut out and the captured image IM2. As a result of being able to display the captured image IM2 on the screen 11a of the display unit 11 in a clearer state, unlike the configuration of displaying (enlarged display), the inspection work of the probe 21 can be performed more accurately. it can.

The substrate inspection device 1 is not limited to the above configuration. For example, even in a configuration in which the imaging unit 6 is configured by a camera having a normal magnification, an image in a narrow range including the specific coordinate CO in the image captured by this camera is cut out and enlarged and displayed as the captured image IM2, the inspection accuracy is high. Of course, when it can be secured, the image pickup unit 6 may be configured by a camera having a normal magnification. Further, for example, in the substrate inspection device 1, when the inspection process for the plurality of substrates 100 is already executed when the probe imaging process is executed, that is, the inspection results for the plurality of substrates 100 are stored in the storage unit 8. May be. In this case, the processing unit 9 uses the probe 21 (also referred to as a specific probe) which may have a defect among the plurality of probes 21 based on the inspection result as a preprocessing for the probe imaging process. The specific process to be specified is executed, and in the probe imaging process, the probe arrangement image IM1 is generated in such a manner that the arrangement position (indicating image) of the specific probe 21 can be distinguished from the arrangement position (indicating image) of another probe 21. It can also be displayed.

For example, the actual substrate 100 is manufactured so that the inspection results of all the inspection points can be normal in the inspection process. Therefore, in the actual inspection of the substrate 100, the inspection result is that all the inspection points are normal for most of the substrate 100, and the inspection result that the inspection result is abnormal is small, and the substrate 100 is abnormal. In general, the inspection points are not constant. However, when a defect occurs in a specific probe 21 (for example, the tip portion 21b is significantly worn as compared with other probes 21), the specific inspection location inspected using this probe 21 There is a high probability that the test result will be abnormal. Therefore, when the processing unit 9 examines the inspection results of the plurality of substrates 100 read from the storage unit 8 in the specific processing and can detect the inspection location where the inspection result becomes abnormal with a high probability, this The probe 21 (usually a pair of probes 21) used for inspecting the inspection site is specified as the above-mentioned specific probe 21, and the probe arrangement image IM1 is generated in a manner that can be distinguished from the other probes 21 on the screen 11a. To display. As a distinguishable aspect, the image showing the placement position of the specific probe 21 (in this example, as described above, a single color and a circular dot) is set to a color different from the color of the image showing the placement position of the other probe. A mode or a mode in which a mark capable of identifying the position of the specific probe 21 is attached only to the image of the specific probe 21 (for example, as shown in FIG. 9, a square frame-shaped mark M is attached to the image (dot) of the specific probe 21. Various modes can be adopted, such as a mode (enclosed by a mark M).

According to the substrate inspection device 1 adopting this configuration, the operator can identify the probe 21 having a high possibility of having a defect only by looking at the probe arrangement image IM1 displayed on the screen 11a. it can. Therefore, according to the substrate inspection device 1, the operator operates the operation unit 10 and immediately moves the pointer PT to the specific probe 21 to display the captured image IM2 including the specific probe 21 on the screen 11a. Since the display can be performed quickly, the inspection for the specific probe 21 can be performed in a shorter time.

Further, the probe unit is not limited to the probe unit 2 having the above-described configuration. For example, although not shown, a plurality of needle-shaped probes stand up in a state of being exposed on the contact surface with the substrate. Various known configurations can be adopted, such as a jig-type probe unit arranged in a state.

1 Board inspection device 2 Probe unit 3 Moving mechanism 5 Measuring unit 6 Imaging unit 8 Storage unit 9 Processing unit 10 Operation unit 11 Display unit 11a Screen 21 Probe 100 Board Dp Position information IM1 Probe placement image IM2 Captured image

Claims (2)

The probe unit is provided with a plurality of probes that bring the tip into contact with the corresponding inspection location on the substrate to be inspected, the moving mechanism for moving the probe unit, and the probe selected from the plurality of probes. A measuring unit for measuring the electrical characteristics of the inspection point in contact with the tip of the probe, and a process for executing a movement control process for the moving mechanism and an inspection process for the inspection point based on the measured electrical characteristics. It is a board inspection device equipped with a part.
An image pickup unit capable of capturing an image of the arrangement surface of the plurality of probes in the probe unit as an image capture image ,
A storage unit that stores position information indicating the placement positions of the plurality of probes on the placement surface, and
Display and
Equipped with an operation unit
When the inspection process is not executed, the processing unit displays a probe arrangement image showing the arrangement positions of the plurality of probes on the arrangement surface on the screen of the display unit based on the position information read from the storage unit. At the same time, when the specific coordinates in the probe arrangement image are input from the operation unit, the image pickup unit is made to image the image of the arrangement surface within a predetermined range including the specific coordinates. and executes the probe imaging process of displaying the captured image on the screen together with the probe aligned image, based on a result of the inspection processing executed for a plurality of said substrate, said one of said plurality of probes A specific process is performed to identify the probe used in the inspection site where the result of the inspection process is abnormal with a high probability as a specific probe that may have a defect, and in the probe imaging process, the specific probe of the specific probe is executed. A substrate inspection device that displays the probe placement image in a manner that allows the placement position to be distinguished from the placement positions of other probes . The image pickup unit is composed of a camera that magnifies and captures a part of the arrangement surface .
The imaging unit moving mechanism for moving the imaging unit is provided.
In the probe imaging process, the processing unit moves the imaging unit to an imaging position in a predetermined range by executing movement control for the imaging unit moving mechanism based on the specific coordinates to perform imaging. The substrate inspection apparatus according to claim 1.

Images