JP2018189458A - Electrical connection device and manufacturing method thereof - Google Patents

Abstract

An electrical connection device and a method for manufacturing the same are provided that can suppress a contact failure between a probe and a wiring substrate due to bending of a probe head or a wiring substrate.
The wiring board includes a wiring board, a first main surface facing the object to be inspected, and a second main surface facing the wiring board, and penetrates from the first main surface to the second main surface. The probe head 20 in which the measurement hole 200 is formed, the probe 10 held by the probe head 20 and having the base end connected to the wiring board 30, and the interval information obtained by measurement in the measurement hole 200 were used. Interval adjustment means 40 for adjusting the interval between the wiring board 30 and the probe head 20 is provided.
[Selection] Figure 1

Description

  The present invention relates to an electrical connection device used for measuring electrical characteristics of an object to be inspected and a method for manufacturing the electrical connection device.

  In order to measure the electrical characteristics of an object to be inspected such as an integrated circuit without being separated from the wafer, an electrical connection device having a probe that is brought into contact with the object to be inspected is used. As the electrical connection device, a configuration in which a probe head for holding a probe is attached to a wiring board is used (for example, see Patent Document 1). The proximal end portion of the probe is connected to the wiring board, and the distal end portion of the probe contacts the object to be inspected when measuring the object to be inspected.

JP 2013-138157 A

  For accurate measurement of the object to be inspected, the electrical connection between the probe and the wiring board needs to be stable. However, the probe head and the wiring board may be bent or distorted (hereinafter referred to as “bending”). If bending occurs in one or both of the probe head and the wiring board, the electrical connection between the probe and the wiring board may cause a contact failure that is not stable.

  In view of the above problems, an object of the present invention is to provide an electrical connection device and a method for manufacturing the same that can suppress a contact failure between the probe and the wiring substrate due to bending of the probe head or the wiring substrate.

  According to one aspect of the present invention, a measurement has a wiring substrate, a first main surface facing the object to be inspected, and a second main surface facing the wiring substrate, and penetrating from the first main surface to the second main surface. A probe head formed with a hole, a probe held by the probe head and having a base end connected to the wiring board, and a distance between the wiring board and the probe head using the distance information obtained by measurement in the measurement hole. An electrical connection device is provided that includes an interval adjustment means for performing adjustment.

  According to another aspect of the present invention, the measurement hole having the first main surface facing the object to be inspected and the second main surface facing the wiring board and penetrating from the first main surface to the second main surface is provided. The step of preparing the formed probe head, the step of attaching the probe head to the wiring board, and the measurement through the measurement hole, the interval information, which is the distance information from the second main surface of the probe head to the wiring board, is obtained. There is provided a method for manufacturing an electrical connection device, including an obtaining step and a step of adjusting the interval between the wiring board and the probe head using the interval information.

  ADVANTAGE OF THE INVENTION According to this invention, the electrical connection apparatus which can suppress the contact defect of the probe and wiring board resulting from bending of a probe head or a wiring board, and its manufacturing method can be provided.

It is a schematic diagram which shows the structure of the electrical connection apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the state in which bending has not generate | occur | produced in any of a probe head and a wiring board. It is a schematic diagram which shows the state which the bending generate | occur | produced in the probe head. It is a schematic diagram which shows the state which the bending has generate | occur | produced in the wiring board. It is a flowchart for demonstrating the adjustment method of the object space | interval by the electrical connection apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the example of the state which the bending has generate | occur | produced in the wiring board. It is a schematic diagram which shows the example which adjusts object space | interval with the electrical connection apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the other example of the state which the bending has generate | occur | produced in the wiring board. It is a schematic diagram which shows the other example which adjusts object space | interval with the electrical connection apparatus which concerns on embodiment of this invention. It is a schematic diagram for demonstrating the usage method of the block for parallel adjustment of the electrical connection apparatus which concerns on embodiment of this invention (the 1). It is a schematic diagram for demonstrating the usage method of the block for parallel adjustment of the electrical connection apparatus which concerns on embodiment of this invention (the 2). It is a flowchart for demonstrating the manufacturing method of the electrical connection apparatus which concerns on embodiment of this invention. FIGS. 13A and 13B are schematic process diagrams for explaining a manufacturing method of an electrical connection device according to an embodiment of the present invention (No. 1), FIG. 13A is a plan view, FIG. 13B is a bottom view, and FIG. 13 (c) is a side view. FIGS. 14A and 14B are schematic process diagrams for explaining a manufacturing method of an electrical connection device according to an embodiment of the present invention (No. 2), FIG. 14A is a plan view, FIG. 14B is a bottom view, and FIG. 14 (c) is a side view. FIGS. 15A and 15B are schematic process diagrams for explaining a method of manufacturing an electrical connection device according to an embodiment of the present invention (No. 3), FIG. 15A is a plan view, FIG. 15B is a bottom view, and FIG. 15 (c) is a side view. FIG. 16 is a schematic process diagram for explaining the manufacturing method of the electrical connection device according to the embodiment of the present invention (No. 4), FIG. 16 (a) is a plan view, FIG. 16 (b) is a bottom view, FIG. 16 (c) is a side view. FIGS. 17A and 17B are schematic process diagrams for explaining a method of manufacturing an electrical connection device according to an embodiment of the present invention (No. 5), FIG. 17A is a plan view, FIG. 17B is a bottom view, and FIG. 17 (c) is a side view. FIG. 18 is a schematic process diagram for explaining the method of manufacturing the electrical connection device according to the embodiment of the present invention (No. 6), FIG. 18 (a) is a plan view, FIG. 18 (b) is a bottom view, and FIG. 18 (c) is a side view. FIG. 19 is a schematic process diagram for explaining the method of manufacturing the electrical connection device according to the embodiment of the present invention (No. 7), FIG. 19A is a plan view, FIG. 19B is a bottom view, FIG. 19 (c) is a side view. It is a schematic diagram which shows the structure of the electrical connection apparatus which concerns on the modification of embodiment of this invention. It is a schematic diagram which shows the structure of the electrical connection apparatus which concerns on other embodiment of this invention.

  Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratio of each part is different from the actual one. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings. The following embodiments exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention describe the material, shape, structure, arrangement, etc. of components as follows. It is not something specific.

  An electrical connection device 1 according to the embodiment of the present invention shown in FIG. 1 is used for measuring electrical characteristics of a device under test 2. The electrical connection device 1 is a vertical operation type probe card, and the tip portion of the probe 10 contacts an inspection pad (not shown) of the inspection object 2 when measuring the inspection object 2. FIG. 1 shows a state where the probe 10 is not in contact with the object 2 to be inspected. At the time of measurement, for example, the chuck 3 on which the object to be inspected 2 is mounted rises, and the tip of the probe 10 contacts the object to be inspected 2.

  The electrical connection device 1 includes a probe 10, a probe head 20 that holds the probe 10, a wiring board 30 to which a proximal end portion of the probe 10 is connected, and an interval for adjusting an interval between the probe head 20 and the wiring board 30. Adjustment means 40 is provided. The probe head 20 is attached to the wiring board 30 so as to be overlapped, and has a first main surface 201 facing the object to be inspected 2 and a second main surface 202 facing the wiring board 30. The probe 10 passes through guide holes (not shown) formed in the first main surface 201 and the second main surface 202, respectively. A proximal end portion of the probe 10 protruding from the second main surface 202 of the probe head 20 is connected to an electrode terminal (not shown) formed on the lower surface of the wiring board 30.

  The probe head 20 is formed with a measurement hole 200 penetrating from the first main surface 201 to the second main surface 202 in the remaining region of the region through which the probe 10 penetrates. Information on the distance from the second main surface 202 of the probe head 20 to the wiring board 30 (hereinafter referred to as “interval information”) is obtained by measurement through the measurement hole 200. Although details will be described later, the interval adjusting means 40 adjusts the interval between the wiring board 30 and the probe head 20 using the interval information.

  The electrical connection device 1 further includes a printed circuit board 50 disposed above the wiring board 30 and a reinforcing plate 60 disposed on the upper surface of the printed circuit board 50. The reinforcing plate 60 improves the mechanical strength of the electrical connecting device 1.

  A wiring pattern (not shown) is formed on the printed board 50. The electrode terminals arranged on the lower surface of the wiring board 30 and the wiring pattern formed on the printed board 50 are electrically connected through electrode wirings formed inside the wiring board 30. The wiring pattern formed on the printed circuit board 50 is electrically connected to an inspection device such as an IC tester (not shown).

  As described above, the probe 10 is electrically connected to the inspection apparatus via the wiring board 30 and the printed board 50. A predetermined voltage or current is applied to the object 2 via the probe 10 by the inspection device. And the signal output from the to-be-inspected object 2 is sent to an inspection apparatus via the probe 10, and the characteristic of the to-be-inspected object 2 is test | inspected.

  In the electrical connection device 1, the probe 10 is held by the probe head 20 while being elastically deformed between the probe head 20 and the wiring board 30. That is, a preload structure in which preload is applied to the contact point between the probe 10 and the wiring board 30 is employed. Thereby, the electrical connection at the contact point of the probe 10 and the wiring board 30 is ensured.

  FIG. 2 shows a connection state between the probe 10 and the wiring board 30 when no bending occurs in either the probe head 20 or the wiring board 30. In this state, the preload size is uniform in all the probes 10. The position of the probe 10 is fixed on the second main surface 202 of the probe head 20 by the stopper 21.

  Bending may occur in either or both of the probe head 20 and the wiring board 30 due to assembly tolerances, processing tolerances, member deflection, and the like during manufacture of the probe head 20 and the wiring board 30. FIG. 3 shows a state in which bending occurs in the probe head 20 and a part of the probe head 20 is bent downward. As shown in FIG. 3, a gap is generated between the base end portion of the probe 10 held in the bent region of the probe head 20 and the wiring board 30. The preload of the probe 10 in which the gap is generated becomes small, and the preload size varies among the probes 10. As a result, the preload is not performed as designed, the contact between the proximal end portion of the probe 10 and the wiring board 30 is not stable, and a contact failure occurs.

  FIG. 4 shows a state where bending occurs in the wiring board 30 and a part of the wiring board 30 is bent upward. Also in this case, a gap is generated between the base end portion of the probe 10 and the wiring board 30, and the preload size varies.

  On the other hand, in the electrical connection device 1, the wiring board 30 and the probe head 20 that use the distance information by the distance adjusting means 40 are formed so that no gap is generated between the base end portion of the probe 10 and the wiring board 30. The interval (hereinafter referred to as “target interval”) is adjusted. Below, with reference to FIG. 5, the adjustment method of the object space | interval by the space | interval adjustment means 40 is demonstrated.

  In step S11 of FIG. 5, the probe head 20 in which the measurement hole 200 penetrating from the first main surface 201 to the second main surface 202 is formed is prepared.

  In step S <b> 12, the probe head 20 is attached to the wiring board 30 so that the first main surface 201 faces the device under test 2 and the second main surface 202 faces the wiring board 30. As shown in FIG. 1, the lower end of the distance adjusting means 40 attached to the wiring board 30 protrudes from the lower surface of the wiring board 30 facing the probe head 20. The lower end of the interval adjusting unit 40 is bonded to the second main surface 202 of the probe head 20. That is, the distance adjusting means 40 also functions to fix the probe head 20 below the wiring board 30. For example, a block of pillars that penetrates the wiring board 30 and has a lower end connected to the second main surface 202 of the probe head 20 is used as the interval adjusting unit 40.

  After attaching the probe head 20 to the wiring board 30, in step S <b> 13, interval information about the target interval is acquired by measurement in the measurement hole 200. For example, image data between the lower surface of the wiring board 30 and the second main surface 202 of the probe head 20 is acquired by an imaging device such as a camera. And interval information is acquired by analyzing image data.

  Note that any means other than the imaging device can be used as the means for acquiring the interval information. For example, the interval information can be acquired by various measurement methods for measuring the distance between two points such as laser measurement. Further, the size of the measurement hole 200 on the first main surface 201 may be larger than the size on the second main surface 202 so that the space between the wiring board 30 and the probe head 20 can be easily measured.

  Next, in step S <b> 14, it is determined whether bending has occurred in the probe head 20 and the wiring board 30 using the interval information. For example, it is determined whether the target interval is a designed predetermined interval. At this time, as shown in FIG. 1, it is preferable to connect the plurality of interval adjusting means 40 to the second main surface 202 of the probe head 20 so as to be separated from each other and determine the target interval for a plurality of locations. The measurement hole 200 is formed around each of the interval adjusting means 40. A portion where the target interval is different from a predetermined interval is specified as a bending occurrence portion. Alternatively, the target interval can be measured at a plurality of locations, and a location where the target interval is different from other locations can be specified as a bending occurrence location from these measurement results.

  After identifying the bending occurrence location, in step S15, the interval adjustment unit 40 adjusts the target interval using the interval information. That is, the target interval is adjusted to a predetermined interval at the bending occurrence location based on the bending occurrence location and the bending size obtained from the interval information. For example, the interval adjusting means 40 arranged near the bending occurrence place is replaced with a new interval adjusting means 40 having a different length in the thickness direction of the wiring board 30. Thereby, the length of the part exposed between the wiring board 30 of the space | interval adjustment means 40 and the probe head 20 is changed, and object space | interval is adjusted.

  Specifically, for example, as shown in FIG. 6, when bending occurs in which the central portion of the wiring board 30 is bent upward and the distance from the probe head 20 is increased, the following measures are taken. That is, of the interval adjusting units 40A1 to 40A3, the interval adjusting unit 40A2 close to the bending occurrence location is replaced with a new interval adjusting unit 40B having a short length in the thickness direction as shown in FIG. As described above, by using the distance adjusting means 40B in which the length of the exposed portion between the wiring board 30 and the probe head 20 is shortened, the target distance can be narrowed to a predetermined distance. As a result, the preload is applied as designed, and the contact between the proximal end portion of the probe 10 and the wiring board 30 is stabilized. Whether or not the target interval is adjusted to a predetermined interval can be confirmed by measurement in the measurement hole 200.

  Further, as shown in FIG. 8, when bending occurs in which the central portion of the wiring board 30 bends downward and the distance from the probe head 20 becomes narrow, the distance adjusting means 40A2 close to the bending occurrence position is set in the thickness direction. It replaces | exchanges for the new space | interval adjustment means 40C which lengthened length. In this way, by using the gap adjusting means 40C in which the length of the exposed portion between the wiring board 30 and the probe head 20 is increased, the target gap is widened to a predetermined gap as shown in FIG. it can. As a result, the contact between the proximal end portion of the probe 10 and the wiring board 30 is stabilized.

  As described above, in the electrical connection device 1, the gap adjusting means 40 that is attached to the wiring board 30 and has the lower end connected to the second main surface 202 of the probe head 20 is disposed between the wiring board 30 and the probe head 20. Adjust the length of the exposed part. As a result, the target interval is adjusted. In addition, when variation occurs in the height of the tip portion of the probe 10 after adjusting the target interval, the variation can be eliminated by polishing the tip portion of the probe 10.

  In order to pinpoint the occurrence of bending and to confirm the state in which the target interval is adjusted, a measurement hole around the position where the interval adjusting means 40 of the second main surface 202 of the probe head 20 is connected. 200 is preferably formed. Moreover, it is preferable to arrange the plurality of interval adjusting means 40 so that the target interval is uniform over the entire surface of the second main surface 202. For example, a plurality of interval adjustment means 40 are arranged over the entire second main surface 202 of the probe head 20, and the measurement holes 200 are formed around the positions where the interval adjustment means 40 are arranged. Thereby, contact with the wiring board 30 is stabilized for all the probes 10.

  For this reason, it is preferable to arrange the plurality of interval adjusting means 40 evenly on the second main surface 202 of the probe head 20. For example, the interval adjusting means 40 is arranged in a matrix. Alternatively, the interval adjusting means 40 may be placed on a point where bending is likely to occur by past measurement data or experiments.

  Incidentally, the electrical connecting device 1 shown in FIG. 1 includes a parallel adjustment block 70 that penetrates the outer edge of the reinforcing plate 60, the printed board 50, and the wiring board 30. The upper end of the fixing ring 80 disposed around the outer edge of the wiring board 30 is disposed at a part of the lower end of the parallel adjustment block 70 protruding downward from the wiring board 30. The lower end of the fixing ring 80 has a portion protruding below the outer edge of the wiring board 30. The fixing ring 80 is in contact with the outer edge portion of the lower surface of the wiring board 30. On the other hand, the outer edge of the upper surface of the wiring board 30 is in contact with the remaining area of the area where the fixing ring 80 at the lower end of the parallel adjustment block 70 is disposed. Thus, the outer edge of the wiring board 30 is sandwiched from above and below by the parallel adjustment block 70 and the fixing ring 80, and the wiring board 30 is fixed below the printed board 50.

  The parallel adjustment block 70 adjusts the angle of the lower surface of the wiring board 30 with respect to the second main surface 202 of the probe head 20. Thereby, the lower surface of the wiring board 30 and the second main surface 202 of the probe head 20 can be made parallel. For example, as shown in FIG. 10, a case is considered where the thickness of the wiring board 30 decreases from the left side to the right side of the drawing. At this time, the distance between the lower surface of the wiring board 30 and the second main surface 202 of the probe head 20 gradually increases from the left side to the right side of the drawing.

  In this case, the parallel adjustment block 70 on the right side of the drawing is moved downward. That is, the portion of the parallel adjustment block 70 that protrudes below the printed circuit board 50 is lengthened. As a result, as shown in FIG. 11, the gap between the lower surface of the wiring board 30 and the second main surface 202 of the probe head 20 can be made uniform over the entire surface. Therefore, contact failure between the probe 10 and the wiring board 30 in the region on the right side of the page can be prevented.

  The adjustment by the parallel adjustment block 70 is effective when the amount to be adjusted can be confirmed by observing the electrical connecting device 1 from the outside. However, when bending occurs in the probe head 20 or the wiring board 30, it is often impossible to confirm the position and size of the bending from the outside. For this reason, it is difficult to adjust the target interval.

  However, in the electrical connection device 1 according to the embodiment of the present invention, the measurement hole 200 penetrating from the first main surface 201 to the second main surface 202 is formed in the probe head 20. For this reason, it is possible to confirm the position and size of bending generated in the probe head 20 and the wiring board 30 by the measurement in the measurement hole 200, and to obtain interval information. Then, the target interval can be adjusted using the interval information. Therefore, according to the electrical connection device 1, it is possible to suppress contact failure between the probe 10 and the wiring board 30 due to bending of the probe head 20 and the wiring board 30.

  In the case of a preload structure, the size of the preload varies by the amount of bending. On the other hand, according to the electrical connection device 1, it is possible to suppress variations in the size of the preload by adjusting the target interval.

  Below, with reference to the flowchart shown in FIG. 12, and the process drawing shown in FIGS. 13-19, the manufacturing method of the electrical connection apparatus 1 which concerns on embodiment of this invention is demonstrated. In addition, the manufacturing method of the electrical connection apparatus 1 described below is an example, and it is needless to say that it can be realized by various other manufacturing methods including this modification. 13 to 19, the figure (a) is a plan view, the figure (b) is a bottom view, and a figure (c) is a side view.

  First, in step S201 of FIG. 12, the reinforcing plate 60 shown in FIGS. 13A to 13C is prepared. The reinforcing plate 60 is formed with a through hole 601 that penetrates the interval adjusting means 40 and a through hole 602 that penetrates the parallel adjustment block 70. As shown in FIG. 13A, a plurality of through holes 601 are arranged along the outer edge of the reinforcing plate 60. The through holes 602 are arranged in a matrix inside the through holes 601.

  Next, in step S202, the printed circuit board 50 is attached to the reinforcing plate 60 as shown in FIGS. 14 (a) to 14 (c). The printed circuit board 50 is formed with a through hole 501 that penetrates the interval adjusting means 40 and a through hole 502 that penetrates the parallel adjustment block 70.

  In step S203, as shown in FIGS. 15A to 15C, the parallel adjustment block 70 is attached. That is, the parallel adjustment block 70 is attached to the reinforcing plate 60 and the printed board 50 so that the lower end is exposed below the printed board 50 through the through hole 602 of the reinforcing board 60 and the through hole 502 of the printed board 50. In step S204, it is determined whether or not the exposed portion of the lower end of the parallel adjustment block 70 has a predetermined height. If the height of the parallel adjustment block 70 is not appropriate, the process returns to step S203. If the height of the parallel adjustment block 70 is appropriate, the process proceeds to step S205.

  In step S205, as shown in FIGS. 16A to 16C, the wiring board 30 is attached to the lower end of the parallel adjustment block. The wiring board 30 is formed with a through hole 301 through which the interval adjusting means 40 passes.

  Next, in step S206, as shown in FIGS. 17 (a) to 17 (c), the fixing ring 80 is attached. Thereby, the outer edge portion of the wiring board 30 is sandwiched between the parallel adjustment block 70 and the fixing ring 80, and the wiring board 30 is fixed below the printed board 50. At this time, the electrode terminal of the wiring board 30 and the wiring pattern of the printed board 50 are connected.

  In step S207, it is determined whether or not the position of the wiring board 30 is appropriate. If the position of the wiring board 30 is not appropriate, the process returns to step S203. If the position of the wiring board 30 is appropriate, the process proceeds to step S208.

  In step S208, as shown in FIGS. 18 (a) to 18 (c), the column spacing adjusting means 40 is attached. That is, the interval adjusting means 40 is arranged on the wiring board 30 so that the lower end is exposed below the wiring board 30 through the through hole 601 of the reinforcing plate 60, the through hole 501 of the printed board 50 and the through hole 301 of the wiring board 30. Attach to. The interval adjusting means 40 penetrates the reinforcing plate 60, the printed board 50 and the wiring board 30, and the upper end of the interval adjusting means 40 is disposed on the upper surface of the reinforcing plate 60.

  In step S209, it is determined whether or not the exposed portion of the lower end of the interval adjusting unit 40 has a predetermined height. If the height of the interval adjusting means 40 is not appropriate, the process returns to step S208. If the height of the interval adjusting unit 40 is appropriate, the process proceeds to step S210.

  In step S210, as shown in FIGS. 19A to 19C, the probe head 20 is attached to the wiring board 30. At this time, the lower end of the interval adjusting means 40 is connected to the second main surface 202 of the probe head 20. In FIG. 19B, the position where the distance adjusting means 40 is connected to the probe head 20 is indicated by a broken line. The probe head 20 has a measurement hole 200 penetrating from the first main surface 201 to the second main surface 202. As shown in FIG. 19B, the measurement hole 200 is formed around the position where the interval adjusting means 40 is connected. In addition, illustration of the probe 10 is abbreviate | omitted in FIG.19 (b).

  In step S211, the target interval is adjusted by the method described with reference to FIG. Thereafter, in step S212, the tip of the probe 10 is polished as necessary. Thereby, the height of the front-end | tip part of the probe 10 after adjusting an object space | interval is arrange | equalized.

  According to the manufacturing method of the electrical connection device 1 described above, the target interval can be adjusted using the interval information obtained by the measurement in the measurement hole 200. For this reason, the contact failure of the probe 10 and the wiring board 30 resulting from the bending of the probe head 20 or the wiring board 30 can be suppressed. Note that after adjusting the target interval, the measurement hole 200 may be closed with a lid or the like.

<Modification>
In the modification shown in FIG. 20, a measurement through hole 300 is formed in the wiring board 30 so as to be continuous with the measurement hole 200 formed in the probe head 20. According to the electrical connection device 1 shown in FIG. 20, the state of the upper surface of the wiring board 30 can be measured by the measurement at the measurement hole 200 and the through hole 300. Thereby, when bending has occurred in the wiring substrate 30, it is possible to confirm the bending occurrence location and the bending size. For this reason, the space | interval of the probe head 20 and the wiring board 30 can be adjusted so that the contact failure of the probe 10 and the wiring board 30 may be suppressed.

(Other embodiments)
As described above, the present invention has been described according to the embodiments. However, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, in the above description, the case of adjusting the length of the exposed portion between the wiring board 30 and the probe head 20 by exchanging the interval adjusting means 40 has been described. However, the target interval can be adjusted by other methods. You may go. For example, the interval adjusting means 40 is a screw. Then, the portion provided with the spiral groove is inserted into the wiring board 30, and the interval adjusting means 40 is moved along the thickness direction of the wiring board 30 while rotating. Thereby, the length of the part exposed between the wiring board 30 of the space | interval adjustment means 40 and the probe head 20 is adjusted. Thus, the target interval may be adjusted by the interval adjusting means 40.

  In the above description, an example of a preload structure in which the probe 10 is curved between the wiring board 30 and the probe head 20 has been described. However, the probe 10 may be linear as shown in FIG. Also in the electrical connection apparatus 1 shown in FIG. 21, the contact failure between the probe 10 and the wiring board 30 can be suppressed by adjusting the target interval by the interval adjusting means 40.

  As described above, the present invention naturally includes various embodiments that are not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... Electrical connection apparatus 2 ... Test object 10 ... Probe 20 ... Probe head 30 ... Wiring board 40 ... Space | interval adjustment means 50 ... Printed circuit board 60 ... Reinforcement board 70 ... Parallel adjustment block 80 ... Fixing ring 200 ... Measurement hole 201 ... 1st main surface 202 ... 2nd main surface

Claims (14)

An electrical connection device used for measuring the electrical characteristics of a device under test,
A wiring board;
A probe head having a first main surface facing the object to be inspected and a second main surface facing the wiring board, and having a measurement hole penetrating from the first main surface to the second main surface; ,
A probe held by the probe head and having a base end connected to the wiring board;
An electrical connection device comprising: interval adjusting means for adjusting an interval between the wiring board and the probe head using interval information obtained by measurement at the measurement hole.   The electrical connection device according to claim 1, wherein the distance information is a distance from the second main surface of the probe head to the wiring board, which is measured through the measurement hole. The spacing adjusting means is a column that penetrates the wiring board and has a lower end connected to the second main surface of the probe head;
The distance between the wiring board and the probe head is adjusted by adjusting a length of a portion exposed between the wiring board and the probe head of the spacing adjusting means. 3. The electrical connection device according to 2. A reinforcing plate disposed above the wiring board;
The electrical connection device according to claim 3, wherein the interval adjusting unit penetrates the reinforcing plate, and an upper end of the interval adjusting unit is disposed on an upper surface of the reinforcing plate.   The wiring board and the probe head can be replaced by replacing the gap adjusting means with a new spacing adjusting means having a different length of a portion exposed between the wiring board and the second main surface of the probe head. The electrical connection device according to claim 3 or 4, wherein the distance between the two is adjusted.   6. The electrical connection device according to claim 1, wherein the measurement hole is formed around a position of the second main surface where the distance adjusting unit is connected.   7. The electrical connection device according to claim 1, wherein a plurality of the interval adjusting means are arranged over the entire surface of the second main surface of the probe head.   The electrical connection device according to claim 1, wherein a size of the measurement hole on the first main surface is larger than a size on the second main surface.   2. The probe is held by the probe head in an elastically deformed state between the probe head and the wiring board, and a preload is applied to a contact point between the probe and the wiring board. The electrical connection device according to any one of 1 to 8.   The electrical connection device according to claim 1, wherein a through hole that is continuous with the measurement hole is formed in the wiring board. A method of manufacturing an electrical connection device used for measuring electrical characteristics of an object to be inspected,
Preparing a probe head in which a measurement hole penetrating from the first main surface to the second main surface is formed;
Attaching the probe head to the wiring board such that the first main surface faces the object to be inspected and the second main surface faces the wiring board;
Obtaining interval information which is information on the distance from the second main surface of the probe head to the wiring board by measurement through the measurement hole;
Adjusting the distance between the wiring board and the probe head using the distance information. A method for manufacturing an electrical connection apparatus, comprising:   Adjusting the length of the portion of the column space adjusting means that penetrates the wiring board and whose lower end is connected to the second main surface of the probe head, and is exposed between the wiring board and the probe head; The method of manufacturing an electrical connection device according to claim 11, wherein the distance between the wiring board and the probe head is adjusted by the step.   By exchanging the distance adjusting means with the new distance adjusting means having a different length in the thickness direction of the wiring board, the length of the portion exposed between the wiring board and the probe head of the distance adjusting means The method for manufacturing an electrical connection device according to claim 12, wherein the distance between the wiring board and the probe head is adjusted by changing the distance between the wiring board and the probe head.   14. The electrical connection according to claim 12, wherein a plurality of the interval adjusting means are connected to be separated from the second main surface, and the measurement hole is formed around each of the interval adjusting means. Device manufacturing method.

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