JP2017042875A - 研削装置 - Google Patents
研削装置 Download PDFInfo
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- JP2017042875A JP2017042875A JP2015167610A JP2015167610A JP2017042875A JP 2017042875 A JP2017042875 A JP 2017042875A JP 2015167610 A JP2015167610 A JP 2015167610A JP 2015167610 A JP2015167610 A JP 2015167610A JP 2017042875 A JP2017042875 A JP 2017042875A
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- grinding
- turntable
- motor
- wafer
- chuck table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
【解決手段】研削装置1は、チャックテーブル50a,50bを回転させるモータ54を有する2以上の保持手段5a,5bと、保持手段5a,5bが均等間隔に配設され回転するターンテーブル3と、ターンテーブル3の上に配設され2以上のチャックテーブル50a,50bの間を仕切る仕切り部6とを備え、モータ54は、ターンテーブル3の上に配設され、仕切り部6は、ターンテーブル3の上に配設されるモータ54を内側に収容する凹部60を有し、仕切り部6の外側面61に研削水22を当てることにより、仕切り部6とモータ54とを冷却するため、モータ54の発熱による熱がターンテーブル3に及ばない。よって、ターンテーブル3が熱変形するのを防ぎ、ウエーハWを所定の研削厚みに加工することができる。
【選択図】図1
Description
また、仕切り部は、ターンテーブルの上に配設されるモータを内側に収容する凹部を有するため、この凹部にモータを収容した状態で、研削水を仕切り部の外側に当てることにより、仕切り部とモータとを冷却してターンテーブルに熱影響を及ぼさないようにすることができる。
これにより、ウエーハの研削中にターンテーブルが熱変形するのを防ぎ、ウエーハに加工不良が発生することはない。
51:保持面 52:回転軸 53:ロータリージョイント 54:モータ
55:駆動プーリ 56:従動プーリ 57:ベルト
6:仕切り部 60:凹部 61:外側面 7:吸引源 8:エアー供給源 9:コラム
10:研削手段 100:接触部分 11:スピンドル 12:スピンドルハウジング
13:モータ 14:マウンタ 15:研削ホイール 16:研削砥石
20:研削水供給手段 21:研削水供給源 22:研削水
30:研削送り手段 31:ボールネジ 32:モータ 33:ガイドレール
34:昇降部
40:研削装置 41:ターンテーブル 42:チャックテーブル
420:回転軸 4:モータ 44:駆動プーリ 45:従動プーリ 46:ベルト
Claims (1)
- ウエーハを保持するチャックテーブルを回転させるモータを有する2以上の保持手段と、2以上の該保持手段が均等間隔に配設され回転するターンテーブルと、該ターンテーブルの上に配設され2以上のチャックテーブルの間を仕切る仕切り部と、該チャックテーブルに保持されるウエーハを研削する研削砥石を有する研削手段と、ウエーハと該研削砥石とに研削水を供給する研削水供給手段と、を備える研削装置であって、
該モータは、該ターンテーブルの上に配設され、
該仕切り部は、該ターンテーブルの上に配設される該モータを内側に収容する凹部を有し、
該仕切り部の外側に該研削水を当てることにより、該仕切り部と該仕切り部に収容される該モータとを冷却することを特徴とする研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015167610A JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
TW105122231A TWI700149B (zh) | 2015-08-27 | 2016-07-14 | 研磨裝置 |
KR1020160103469A KR102343155B1 (ko) | 2015-08-27 | 2016-08-16 | 연삭 장치 |
CN201610729978.0A CN106475899B (zh) | 2015-08-27 | 2016-08-25 | 磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015167610A JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017042875A true JP2017042875A (ja) | 2017-03-02 |
JP6523872B2 JP6523872B2 (ja) | 2019-06-05 |
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ID=58209238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015167610A Active JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6523872B2 (ja) |
KR (1) | KR102343155B1 (ja) |
CN (1) | CN106475899B (ja) |
TW (1) | TWI700149B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190033423A (ko) * | 2017-09-21 | 2019-03-29 | 가부시기가이샤 디스코 | 가공 장치 |
JP2020026012A (ja) * | 2018-08-15 | 2020-02-20 | 株式会社ディスコ | 研削装置 |
KR20230041612A (ko) | 2021-09-17 | 2023-03-24 | 가부시기가이샤 디스코 | 가공 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107309725B (zh) * | 2017-06-23 | 2023-11-21 | 浙江登亿自动化设备股份有限公司 | 双联结构卧轴圆台平面磨床 |
Citations (7)
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JP2000254857A (ja) * | 1999-01-06 | 2000-09-19 | Tokyo Seimitsu Co Ltd | 平面加工装置及び平面加工方法 |
JP2005153090A (ja) * | 2003-11-27 | 2005-06-16 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
JP2010162665A (ja) * | 2009-01-19 | 2010-07-29 | Disco Abrasive Syst Ltd | 加工装置 |
JP2011136398A (ja) * | 2009-12-28 | 2011-07-14 | Disco Abrasive Syst Ltd | 加工装置 |
US20130102227A1 (en) * | 2011-10-21 | 2013-04-25 | Strasbaugh | Systems and methods of wafer grinding |
JP2013255952A (ja) * | 2012-06-11 | 2013-12-26 | Disco Corp | 研削装置 |
JP2015132538A (ja) * | 2014-01-14 | 2015-07-23 | 株式会社ディスコ | 研削装置 |
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JP2002283183A (ja) * | 2001-03-26 | 2002-10-03 | Nidek Co Ltd | 眼鏡レンズ加工装置 |
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US8574028B2 (en) * | 2008-06-20 | 2013-11-05 | Illinois Tool Works Inc. | Grinder/polisher |
JP2010000590A (ja) * | 2008-06-23 | 2010-01-07 | Tsudakoma Corp | 工作機械用の割出し装置における発熱体の冷却回路 |
CN102067216B (zh) * | 2009-08-31 | 2013-03-13 | 株式会社Elm | 光盘的修复方法以及修复装置 |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
TWM389601U (en) * | 2010-04-01 | 2010-10-01 | Prec Machinery Res & Dev Ct | Motor fixing plate with heat dissipating features |
JP5822647B2 (ja) | 2011-10-21 | 2015-11-24 | 株式会社ディスコ | 研削装置 |
JP5389889B2 (ja) * | 2011-10-31 | 2014-01-15 | コマツNtc株式会社 | 工作機械の冷却装置 |
CN202592201U (zh) * | 2012-05-17 | 2012-12-12 | 特新电子机械设备(东莞)有限公司 | 双盘式研磨机 |
TWI526274B (zh) * | 2013-11-28 | 2016-03-21 | Rotating table device |
-
2015
- 2015-08-27 JP JP2015167610A patent/JP6523872B2/ja active Active
-
2016
- 2016-07-14 TW TW105122231A patent/TWI700149B/zh active
- 2016-08-16 KR KR1020160103469A patent/KR102343155B1/ko active Active
- 2016-08-25 CN CN201610729978.0A patent/CN106475899B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000254857A (ja) * | 1999-01-06 | 2000-09-19 | Tokyo Seimitsu Co Ltd | 平面加工装置及び平面加工方法 |
JP2005153090A (ja) * | 2003-11-27 | 2005-06-16 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
JP2010162665A (ja) * | 2009-01-19 | 2010-07-29 | Disco Abrasive Syst Ltd | 加工装置 |
JP2011136398A (ja) * | 2009-12-28 | 2011-07-14 | Disco Abrasive Syst Ltd | 加工装置 |
US20130102227A1 (en) * | 2011-10-21 | 2013-04-25 | Strasbaugh | Systems and methods of wafer grinding |
JP2013255952A (ja) * | 2012-06-11 | 2013-12-26 | Disco Corp | 研削装置 |
JP2015132538A (ja) * | 2014-01-14 | 2015-07-23 | 株式会社ディスコ | 研削装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190033423A (ko) * | 2017-09-21 | 2019-03-29 | 가부시기가이샤 디스코 | 가공 장치 |
JP2019055450A (ja) * | 2017-09-21 | 2019-04-11 | 株式会社ディスコ | 加工装置 |
JP6994334B2 (ja) | 2017-09-21 | 2022-01-14 | 株式会社ディスコ | 加工装置 |
KR102541671B1 (ko) * | 2017-09-21 | 2023-06-08 | 가부시기가이샤 디스코 | 가공 장치 |
JP2020026012A (ja) * | 2018-08-15 | 2020-02-20 | 株式会社ディスコ | 研削装置 |
KR20230041612A (ko) | 2021-09-17 | 2023-03-24 | 가부시기가이샤 디스코 | 가공 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN106475899A (zh) | 2017-03-08 |
TW201711799A (zh) | 2017-04-01 |
KR102343155B1 (ko) | 2021-12-23 |
JP6523872B2 (ja) | 2019-06-05 |
CN106475899B (zh) | 2020-11-24 |
TWI700149B (zh) | 2020-08-01 |
KR20170026137A (ko) | 2017-03-08 |
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