JP1638504S - - Google Patents

Info

Publication number: JP1638504S
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JPD2018-26606F

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-12-06

Filing date

2018-12-06

Publication date

2019-08-05

2018-12-06 Application filed filed Critical

2018-12-06 Priority to JPD2018-26606F priority Critical patent/JP1638504S/ja

2019-05-31 Priority to TW108303245F priority patent/TWD203479S/zh

2019-06-04 Priority to US29/693,715 priority patent/USD925481S1/en

2019-08-05 Application granted granted Critical

2019-08-05 Publication of JP1638504S publication Critical patent/JP1638504S/ja

Status Active legal-status Critical Current

2039-08-05 Anticipated expiration legal-status Critical

Links

JPD2018-26606F 2018-12-06 2018-12-06 Active JP1638504S (ja)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
JPD2018-26606F JP1638504S (ja)	2018-12-06	2018-12-06
TW108303245F TWD203479S (zh)	2018-12-06	2019-05-31	基板處理裝置用入口蓋
US29/693,715 USD925481S1 (en)	2018-12-06	2019-06-04	Inlet liner for substrate processing apparatus

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JPD2018-26606F JP1638504S (ja)	2018-12-06	2018-12-06

Publications (1)

Publication Number	Publication Date
JP1638504S true JP1638504S (ja)	2019-08-05

Family

ID=67474416

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JPD2018-26606F Active JP1638504S (ja)	2018-12-06	2018-12-06

Country Status (3)

Country	Link
US (1)	USD925481S1 (ja)
JP (1)	JP1638504S (ja)
TW (1)	TWD203479S (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP1700778S (ja)	2021-03-15	2021-11-29		基板処理装置用遮蔽具
USD1064005S1 (en) *	2022-08-04	2025-02-25	Applied Materials, Inc.	Grounding ring of a process kit for semiconductor substrate processing

Family Cites Families (39)

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USD404369S (en) *	1997-08-20	1999-01-19	Tokyo Electron Limited	Manifold cover for use in a semiconductor wafer heat processing apparatus
US6258170B1 (en) *	1997-09-11	2001-07-10	Applied Materials, Inc.	Vaporization and deposition apparatus
US6170429B1 (en) *	1998-09-30	2001-01-09	Lam Research Corporation	Chamber liner for semiconductor process chambers
US6234219B1 (en) *	1999-05-25	2001-05-22	Micron Technology, Inc.	Liner for use in processing chamber
US20020069970A1 (en) *	2000-03-07	2002-06-13	Applied Materials, Inc.	Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) *	2000-07-07	2006-03-14	Applied Materials, Inc.	Multi-purpose processing chamber with removable chamber liner
US6613587B1 (en) *	2002-04-11	2003-09-02	Micron Technology, Inc.	Method of replacing at least a portion of a semiconductor substrate deposition chamber liner
US20040069223A1 (en) *	2002-10-10	2004-04-15	Taiwan Semiconductor Manufacturing Co., Ltd.	Wall liner and slot liner for process chamber
AU2003300375A1 (en) *	2002-10-11	2004-05-04	Semplastics, L.L.C.	Retaining ring for use on a carrier of a polishing apparatus
USD491963S1 (en) *	2002-11-20	2004-06-22	Tokyo Electron Limited	Inner wall shield for a process chamber for manufacturing semiconductors
US6911093B2 (en) *	2003-06-02	2005-06-28	Lsi Logic Corporation	Lid liner for chemical vapor deposition chamber
US20050150452A1 (en) *	2004-01-14	2005-07-14	Soovo Sen	Process kit design for deposition chamber
USD559993S1 (en) *	2005-03-30	2008-01-15	Tokyo Electron Limited	Cover ring
TWD121115S1 (zh) *	2005-03-30	2008-01-21	東京威力科創股份有限公司	遮護環
US8617672B2 (en) *	2005-07-13	2013-12-31	Applied Materials, Inc.	Localized surface annealing of components for substrate processing chambers
USD557425S1 (en) *	2005-08-25	2007-12-11	Hitachi High-Technologies Corporation	Cover ring for a plasma processing apparatus
US20070113783A1 (en) *	2005-11-19	2007-05-24	Applied Materials, Inc.	Band shield for substrate processing chamber
US7987814B2 (en) *	2008-04-07	2011-08-02	Applied Materials, Inc.	Lower liner with integrated flow equalizer and improved conductance
US8298046B2 (en) *	2009-10-21	2012-10-30	SPM Technology, Inc.	Retaining rings
USD655262S1 (en) *	2010-10-21	2012-03-06	Tokyo Electron Limited	Side wall for reactor for manufacturing semiconductor
USD655258S1 (en) *	2010-10-21	2012-03-06	Tokyo Electron Limited	Side wall for reactor for manufacturing semiconductor
USD658692S1 (en)	2011-03-30	2012-05-01	Tokyo Electron Limited	Liner for plasma processing apparatus
USD658693S1 (en) *	2011-03-30	2012-05-01	Tokyo Electron Limited	Liner for plasma processing apparatus
USD658691S1 (en) *	2011-03-30	2012-05-01	Tokyo Electron Limited	Liner for plasma processing apparatus
USD716239S1 (en) *	2013-11-06	2014-10-28	Applied Materials, Inc.	Upper chamber liner
USD717746S1 (en) *	2013-11-06	2014-11-18	Applied Materials, Inc.	Lower chamber liner
USD716240S1 (en) *	2013-11-07	2014-10-28	Applied Materials, Inc.	Lower chamber liner
USD711331S1 (en) *	2013-11-07	2014-08-19	Applied Materials, Inc.	Upper chamber liner
KR101854768B1 (ko)	2014-03-26	2018-05-04	가부시키가이샤 히다치 고쿠사이 덴키	기판 처리 장치, 반도체 장치의 제조 방법
JP1546799S (ja) *	2015-06-12	2016-03-28
JP1551512S (ja) *	2015-06-12	2016-06-13
JP1546801S (ja) *	2015-06-12	2016-03-28
JP1564934S (ja) *	2016-02-26	2016-12-05
JP1584146S (ja) *	2017-01-31	2017-08-21
USD838681S1 (en) *	2017-04-28	2019-01-22	Applied Materials, Inc.	Plasma chamber liner
USD837754S1 (en) *	2017-04-28	2019-01-08	Applied Materials, Inc.	Plasma chamber liner
USD842259S1 (en) *	2017-04-28	2019-03-05	Applied Materials, Inc.	Plasma chamber liner
JP1598442S (ja)	2017-08-09	2018-02-26

2018
- 2018-12-06 JP JPD2018-26606F patent/JP1638504S/ja active Active
2019
- 2019-05-31 TW TW108303245F patent/TWD203479S/zh unknown
- 2019-06-04 US US29/693,715 patent/USD925481S1/en active Active

Also Published As

Publication number	Publication date
USD925481S1 (en)	2021-07-20
TWD203479S (zh)	2020-03-21

Publication	Publication Date	Title
AT524834A2 (ja)	2022-09-15
AT524874A5 (ja)	2022-10-15
AU2018438767B1 (ja)	2023-07-13
AT521543A3 (ja)	2020-09-15
JP1638504S (ja)	2019-08-05
AT524266A2 (ja)	2022-03-15
AT524961A5 (ja)	2022-11-15
BR212020012832U2 (ja)	2021-12-07
BR202018071071U8 (ja)	2019-10-29
BR102018070765A2 (ja)	2020-04-28
BR102018016915A2 (ja)	2020-02-27
BE2018C025I2 (ja)	2023-11-13
BR202018008879U2 (ja)	2019-11-05
BR202018007669U2 (ja)	2019-10-29
BR102018007062A2 (ja)	2019-10-08
BR202018006247U2 (ja)	2019-10-15
BR202018004136U2 (ja)	2019-09-17
BR202018002487U2 (ja)	2019-08-27
CN304441742S (ja)	2018-01-05
CN304433999S (ja)	2018-01-02
CN304434164S (ja)	2018-01-02
CN304434165S (ja)	2018-01-02
CN304434276S (ja)	2018-01-02
CN304434277S (ja)	2018-01-02
CN304434161S (ja)	2018-01-02