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USD557425S1 - Cover ring for a plasma processing apparatus - Google Patents

Cover ring for a plasma processing apparatus Download PDF

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Publication number
USD557425S1
USD557425S1 US29/236,933 US23693305F USD557425S US D557425 S1 USD557425 S1 US D557425S1 US 23693305 F US23693305 F US 23693305F US D557425 S USD557425 S US D557425S
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US
United States
Prior art keywords
processing apparatus
plasma processing
cover ring
elevational view
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/236,933
Inventor
Tsutomu Nakamura
Susumu Tauchi
Akitaka Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to US29/236,933 priority Critical patent/USD557425S1/en
Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAKINO, AKITAKA, NAKAMURA, TSUTOMU, TAUCHI, SUSUMU
Application granted granted Critical
Publication of USD557425S1 publication Critical patent/USD557425S1/en
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of cover ring for a plasma processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a top plan elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan elevational view thereof.

Claims (1)

    CLAIM
  1. We claim the ornamental design for cover ring for a plasma processing apparatus, as shown.
US29/236,933 2005-08-25 2005-08-25 Cover ring for a plasma processing apparatus Expired - Lifetime USD557425S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/236,933 USD557425S1 (en) 2005-08-25 2005-08-25 Cover ring for a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/236,933 USD557425S1 (en) 2005-08-25 2005-08-25 Cover ring for a plasma processing apparatus

Publications (1)

Publication Number Publication Date
USD557425S1 true USD557425S1 (en) 2007-12-11

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US29/236,933 Expired - Lifetime USD557425S1 (en) 2005-08-25 2005-08-25 Cover ring for a plasma processing apparatus

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100240124A1 (en) * 2005-07-05 2010-09-23 3M Innovative Properties Company Sample processing device compression systems and methods
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
US8092759B2 (en) 2005-07-05 2012-01-10 3M Innovative Properties Company Compliant microfluidic sample processing device
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD667561S1 (en) 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD672467S1 (en) 2011-05-18 2012-12-11 3M Innovative Properties Company Rotatable sample processing disk
US8834792B2 (en) 2009-11-13 2014-09-16 3M Innovative Properties Company Systems for processing sample processing devices
US8931331B2 (en) 2011-05-18 2015-01-13 3M Innovative Properties Company Systems and methods for volumetric metering on a sample processing device
US9067205B2 (en) 2011-05-18 2015-06-30 3M Innovative Properties Company Systems and methods for valving on a sample processing device
US9168523B2 (en) 2011-05-18 2015-10-27 3M Innovative Properties Company Systems and methods for detecting the presence of a selected volume of material in a sample processing device
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1030091S1 (en) * 2021-12-07 2024-06-04 Ginrei Lab Inc. Dish for laboratory use
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068441A (en) * 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6423175B1 (en) * 1999-10-06 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
US20030146084A1 (en) * 2002-02-05 2003-08-07 Jianming Fu Sputtering of aligned magnetic materials and magnetic dipole ring used therefor
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
US20070007660A1 (en) * 2003-10-21 2007-01-11 Khiem Nguyen Mask etch processing apparatus
US20070166819A1 (en) * 2006-01-16 2007-07-19 Reliance Life Sciences Pvt. Ltd. Device for culturing and transporting cells

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068441A (en) * 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6423175B1 (en) * 1999-10-06 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
US20030146084A1 (en) * 2002-02-05 2003-08-07 Jianming Fu Sputtering of aligned magnetic materials and magnetic dipole ring used therefor
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20070007660A1 (en) * 2003-10-21 2007-01-11 Khiem Nguyen Mask etch processing apparatus
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
US20050258280A1 (en) * 2004-05-24 2005-11-24 Shin-Etsu Chemical Co., Ltd. Shower plate for plasma processing apparatus and plasma processing apparatus
US20070166819A1 (en) * 2006-01-16 2007-07-19 Reliance Life Sciences Pvt. Ltd. Device for culturing and transporting cells

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8080409B2 (en) 2005-07-05 2011-12-20 3M Innovative Properties Company Sample processing device compression systems and methods
US8092759B2 (en) 2005-07-05 2012-01-10 3M Innovative Properties Company Compliant microfluidic sample processing device
US20100240124A1 (en) * 2005-07-05 2010-09-23 3M Innovative Properties Company Sample processing device compression systems and methods
US8834792B2 (en) 2009-11-13 2014-09-16 3M Innovative Properties Company Systems for processing sample processing devices
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US9168523B2 (en) 2011-05-18 2015-10-27 3M Innovative Properties Company Systems and methods for detecting the presence of a selected volume of material in a sample processing device
USD677395S1 (en) 2011-05-18 2013-03-05 3M Innovative Properties Company Rotatable sample processing disk
US8931331B2 (en) 2011-05-18 2015-01-13 3M Innovative Properties Company Systems and methods for volumetric metering on a sample processing device
US9067205B2 (en) 2011-05-18 2015-06-30 3M Innovative Properties Company Systems and methods for valving on a sample processing device
USD672467S1 (en) 2011-05-18 2012-12-11 3M Innovative Properties Company Rotatable sample processing disk
US9725762B2 (en) 2011-05-18 2017-08-08 Diasorin S.P.A. Systems and methods for detecting the presence of a selected volume of material in a sample processing device
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD1030091S1 (en) * 2021-12-07 2024-06-04 Ginrei Lab Inc. Dish for laboratory use
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

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