HK1097901A1 - Print-soldering inspection apparatus - Google Patents

Print-soldering inspection apparatus

Info

Publication number: HK1097901A1
Authority: HK; Hong Kong
Prior art keywords: print; inspection apparatus; soldering inspection; soldering; inspection
Prior art date: 2005-06-07

Application number

HK07104152.9A

Other languages

English (en)

Inventor

Tsuyoshi Kimura

Eiji Tsujimura

Original Assignee

Anritsu Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-06-07

Filing date

2007-04-20

Publication date

2007-07-06

2007-04-20 Application filed by Anritsu Corp filed Critical Anritsu Corp

2007-07-06 Publication of HK1097901A1 publication Critical patent/HK1097901A1/xx

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder

Landscapes

Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Immunology (AREA)
Health & Medical Sciences (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
Chemical & Material Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Pathology (AREA)
Analytical Chemistry (AREA)
Quality & Reliability (AREA)
Computer Vision & Pattern Recognition (AREA)
Theoretical Computer Science (AREA)
Length Measuring Devices By Optical Means (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Length Measuring Devices With Unspecified Measuring Means (AREA)

HK07104152.9A 2005-06-07 2007-04-20 Print-soldering inspection apparatus HK1097901A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005167287A JP4694272B2 (ja)	2005-06-07	2005-06-07	印刷はんだ検査装置及び印刷はんだ検査方法

Publications (1)

Publication Number	Publication Date
HK1097901A1 true HK1097901A1 (en)	2007-07-06

Family

ID=37509750

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK07104152.9A HK1097901A1 (en)	2005-06-07	2007-04-20	Print-soldering inspection apparatus

Country Status (5)

Country	Link
JP (1)	JP4694272B2 (zh)
KR (1)	KR100728457B1 (zh)
CN (1)	CN100432622C (zh)
HK (1)	HK1097901A1 (zh)
TW (1)	TWI320098B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5411439B2 (ja) *	2008-03-19	2014-02-12	アンリツ株式会社	印刷はんだ検査装置
CN101583249A (zh) *	2008-05-15	2009-11-18	松下电器产业株式会社	印刷的软钎膏的检查方法以及装置
JP5182122B2 (ja)	2009-01-27	2013-04-10	オムロン株式会社	部品実装基板の品質管理用の情報表示システムおよび情報表示方法
JP5353790B2 (ja) *	2010-03-30	2013-11-27	コニカミノルタ株式会社	生体情報測定装置および該方法
WO2012124260A1 (ja) *	2011-03-14	2012-09-20	パナソニック株式会社	はんだ高さ検出方法およびはんだ高さ検出装置
JP5418542B2 (ja) *	2011-06-14	2014-02-19	パナソニック株式会社	印刷状態計測結果の表示装置および表示方法
CN103185736B (zh) *	2012-01-03	2015-05-27	宏恒胜电子科技（淮安）有限公司	电路板孔内焊锡的测试方法
JP5907429B2 (ja) *	2012-07-24	2016-04-26	日本電気硝子株式会社	板状体の反り検査装置及びその反り検査方法
KR20180054063A (ko) *	2016-11-14	2018-05-24	주식회사 고영테크놀러지	검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
JP2018112533A (ja) *	2017-01-13	2018-07-19	キヤノン株式会社	計測装置、情報処理装置、情報処理方法、およびプログラム
JP2019152486A (ja) *	2018-03-01	2019-09-12	株式会社東京精密	設計公差の補正方法及び補正装置
CN109000560B (zh) *	2018-06-11	2021-07-06	广东工业大学	基于三维相机检测包裹尺寸的方法、装置以及设备
CN109444587B (zh) *	2018-11-15	2020-10-16	国网江苏省电力有限公司电力科学研究院	基于频数分布的不停电检测技术可靠性计算方法及系统
CN111421954B (zh) *	2019-01-10	2022-02-18	鸿富锦精密电子(天津)有限公司	智能判定回馈方法及装置
CN115516382A (zh) *	2020-05-04	2022-12-23	Asml荷兰有限公司	用于产生衬底的表面的水平数据的系统和方法
CN111660674A (zh) *	2020-06-15	2020-09-15	蔡怀峰	墨盒头配板装置
CN111645424A (zh) *	2020-06-15	2020-09-11	蔡怀峰	墨盒头配板方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63196980A (ja)	1987-02-10	1988-08-15	Toshiba Corp	プリント基板の半田付外観検査装置
CN1055997A (zh) *	1990-04-25	1991-11-06	哈尔滨工业大学	印刷电路板焊点激光全息检测法及装置
US5178965A (en) *	1992-02-14	1993-01-12	Rockwell International Corporation	Uniform solder coating on roughened substrate
JPH0612377A (ja) *	1992-06-29	1994-01-21	Sharp Corp	工程能力指数計算機能付き小型電子計算機
JPH0658736A (ja) *	1992-08-07	1994-03-04	Matsushita Electric Ind Co Ltd	３次元形状検査方法と３次元形状検査装置
JP3033413B2 (ja) *	1992-12-11	2000-04-17	トヨタ自動車株式会社	はんだ付検査装置
JP3250309B2 (ja) *	1993-03-02	2002-01-28	オムロン株式会社	実装部品検査用データの教示方法
JPH0765968B2 (ja) *	1993-04-02	1995-07-19	日本電気株式会社	実装基板検査装置
KR100261970B1 (ko) *	1994-04-08	2000-07-15	이헌일	X선을 이용한 납땜 상태 검사장치 및 방법
JPH11298200A (ja) *	1998-04-10	1999-10-29	Nagoya Denki Kogyo Kk	プリント基板の部品実装プロセスにおける自動品質管理方法およびその装置
JP2001109733A (ja) *	1999-10-12	2001-04-20	Hitachi Ltd	識別モデルの評価方法及び閾値調整方法
JP2002368412A (ja) *	2001-06-04	2002-12-20	Ibiden Co Ltd	プリント配線板の検査方法
JP2005135954A (ja) *	2003-10-28	2005-05-26	Matsushita Electric Ind Co Ltd	プリント基板検査装置

2005
- 2005-06-07 JP JP2005167287A patent/JP4694272B2/ja not_active Expired - Fee Related
2006
- 2006-06-01 KR KR1020060049338A patent/KR100728457B1/ko not_active IP Right Cessation
- 2006-06-07 CN CNB2006100831759A patent/CN100432622C/zh not_active Expired - Fee Related
- 2006-06-07 TW TW095120180A patent/TWI320098B/zh not_active IP Right Cessation
2007
- 2007-04-20 HK HK07104152.9A patent/HK1097901A1/xx not_active IP Right Cessation

Also Published As

Publication number	Publication date
JP2006343152A (ja)	2006-12-21
TWI320098B (en)	2010-02-01
JP4694272B2 (ja)	2011-06-08
KR20060127753A (ko)	2006-12-13
CN1877251A (zh)	2006-12-13
KR100728457B1 (ko)	2007-06-13
CN100432622C (zh)	2008-11-12
TW200643405A (en)	2006-12-16

Publication	Publication Date	Title
HK1097901A1 (en)	2007-07-06	Print-soldering inspection apparatus
TWI365630B (en)	2012-06-01	Intermediate apparatus
ZA200802399B (en)	2009-02-25	Apparatus
GB0514921D0 (en)	2005-08-24	An inspection device
GB2428762B (en)	2007-11-28	Nutmount Apparatus
GB2431424B (en)	2010-09-22	Overdrilling apparatus
GB0514920D0 (en)	2005-08-24	An inspection device
EP1909109A4 (en)	2010-11-03	TEST DEVICE
EP1826529A4 (en)	2010-11-17	DEVICE FOR STUDYING THE EXTERNAL APPEARANCE
GB0500480D0 (en)	2005-02-16	Apparatus
GB0509800D0 (en)	2005-06-22	Apparatus
GB0519753D0 (en)	2005-11-09	Apparatus
GB2426369B (en)	2009-09-23	Coin-dispensing apparatus
GB0514660D0 (en)	2005-08-24	Apparatus
TWI370246B (en)	2012-08-11	Inspection apparatus
TWI370237B (en)	2012-08-11	Inspection apparatus
GB0505173D0 (en)	2005-04-20	Apparatus
GB0507408D0 (en)	2005-05-18	Apparatus
EP1963827A4 (en)	2013-01-23	ANALYSIS DEVICE
GB0507984D0 (en)	2005-05-25	Headware apparatus
GB0514081D0 (en)	2005-08-17	Measurement apparatus
TWM291811U (en)	2006-06-11	Bacteria-killer apparatus
TWM291528U (en)	2006-06-01	Testing apparatus
GB0522332D0 (en)	2005-12-07	Apparatus
GB0518950D0 (en)	2005-10-26	Apparatus

Legal Events

Date	Code	Title	Description
2015-12-31	PC	Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)	Effective date: 20150607