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TW200643405A - Print solder inspection device - Google Patents

Print solder inspection device

Info

Publication number
TW200643405A
TW200643405A TW095120180A TW95120180A TW200643405A TW 200643405 A TW200643405 A TW 200643405A TW 095120180 A TW095120180 A TW 095120180A TW 95120180 A TW95120180 A TW 95120180A TW 200643405 A TW200643405 A TW 200643405A
Authority
TW
Taiwan
Prior art keywords
value
distribution range
solder
measured
frequency distributions
Prior art date
Application number
TW095120180A
Other languages
Chinese (zh)
Other versions
TWI320098B (en
Inventor
Tsuyoshi Kimura
Eiji Tsujimura
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Publication of TW200643405A publication Critical patent/TW200643405A/en
Application granted granted Critical
Publication of TWI320098B publication Critical patent/TWI320098B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

A technology is provided for recognizing the shape value distribution which represents the measured solder shapes so that the operator can quantitatively determine and easily set up the determined standard value (allowable value) The solder status of several solder locations printed on the print circuit board is measured by a measurement means (2). The frequency distributions of shape value which represent the solder status as quantity are calculated by a histogram calculation means (5a) according to the measured value. The frequency distributions are shown in a display means (7) by using display control means (6) and the variable input distribution range is shown in a recognizable manner. Furthermore, the defective fraction beyond the distribution range or the yield rate in the distribution range corresponding to the frequency distributions is calculated by NG ratio calculation means (5b) to confirm the expected distribution range (allowable value).
TW095120180A 2005-06-07 2006-06-07 Print solder inspection device and print solder inspection method TWI320098B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167287A JP4694272B2 (en) 2005-06-07 2005-06-07 Printed solder inspection apparatus and printed solder inspection method

Publications (2)

Publication Number Publication Date
TW200643405A true TW200643405A (en) 2006-12-16
TWI320098B TWI320098B (en) 2010-02-01

Family

ID=37509750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120180A TWI320098B (en) 2005-06-07 2006-06-07 Print solder inspection device and print solder inspection method

Country Status (5)

Country Link
JP (1) JP4694272B2 (en)
KR (1) KR100728457B1 (en)
CN (1) CN100432622C (en)
HK (1) HK1097901A1 (en)
TW (1) TWI320098B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5411439B2 (en) * 2008-03-19 2014-02-12 アンリツ株式会社 Printed solder inspection equipment
CN101583249A (en) * 2008-05-15 2009-11-18 松下电器产业株式会社 Method of inspecting solder paste for printing and a device thereof
JP5182122B2 (en) 2009-01-27 2013-04-10 オムロン株式会社 Information display system and information display method for quality control of component mounting board
JP5353790B2 (en) * 2010-03-30 2013-11-27 コニカミノルタ株式会社 Biological information measuring apparatus and method
US8428338B1 (en) * 2011-03-14 2013-04-23 Panasonic Corporation Method of determining solder paste height and device for determining solder paste height
JP5418542B2 (en) * 2011-06-14 2014-02-19 パナソニック株式会社 Display device and display method of print state measurement result
CN103185736B (en) * 2012-01-03 2015-05-27 宏恒胜电子科技（淮安）有限公司 Testing method for circuit board hole solder
JP5907429B2 (en) * 2012-07-24 2016-04-26 日本電気硝子株式会社 Plate-like warpage inspection apparatus and warpage inspection method thereof
KR20180054063A (en) * 2016-11-14 2018-05-24 주식회사 고영테크놀러지 Method and apparatus for adjusting condition of quality decision for inspection target
JP2018112533A (en) * 2017-01-13 2018-07-19 キヤノン株式会社 Measuring device, information processing apparatus, information processing method, and program
JP2019152486A (en) * 2018-03-01 2019-09-12 株式会社東京精密 Method and device for correcting design tolerance
CN109000560B (en) * 2018-06-11 2021-07-06 广东工业大学 Method, Apparatus and Device for Detecting Package Size Based on 3D Camera
CN109444587B (en) * 2018-11-15 2020-10-16 国网江苏省电力有限公司电力科学研究院 Method and system for calculating reliability of uninterrupted power supply detection technology based on frequency distribution
CN111421954B (en) * 2019-01-10 2022-02-18 鸿富锦精密电子(天津)有限公司 Intelligent judgment feedback method and device
JP7443565B2 (en) * 2020-05-04 2024-03-05 エーエスエムエル ネザーランズ ビー．ブイ． System and method for generating level data about the surface of a substrate
CN111645424A (en) * 2020-06-15 2020-09-11 蔡怀峰 Method for assembling ink box head
CN111660674A (en) * 2020-06-15 2020-09-15 蔡怀峰 Ink box head plate-matching device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196980A (en) 1987-02-10 1988-08-15 Toshiba Corp Device for inspecting soldering external appearance for printed circuit board
CN1055997A (en) * 1990-04-25 1991-11-06 哈尔滨工业大学 Printed circuit board solder joint laser hologram detection method and device
US5178965A (en) * 1992-02-14 1993-01-12 Rockwell International Corporation Uniform solder coating on roughened substrate
JPH0612377A (en) * 1992-06-29 1994-01-21 Sharp Corp Small-sized electronic computer with process capacity index calculating function
JPH0658736A (en) * 1992-08-07 1994-03-04 Matsushita Electric Ind Co Ltd Method and device for three dimensional shape inspection
JP3033413B2 (en) * 1992-12-11 2000-04-17 トヨタ自動車株式会社 Soldering inspection equipment
JP3250309B2 (en) * 1993-03-02 2002-01-28 オムロン株式会社 Teaching method of mounted part inspection data
JPH0765968B2 (en) * 1993-04-02 1995-07-19 日本電気株式会社 Mounted board inspection device
KR100261970B1 (en) * 1994-04-08 2000-07-15 이헌일 Soldering status checking device and its method using x-ray
JPH11298200A (en) * 1998-04-10 1999-10-29 Nagoya Denki Kogyo Kk Automatic quality control method and device in printed circuit board component mounting process
JP2001109733A (en) * 1999-10-12 2001-04-20 Hitachi Ltd Method for evaluating identification model and adjusting threshold
JP2002368412A (en) * 2001-06-04 2002-12-20 Ibiden Co Ltd Method for inspecting printed wiring board
JP2005135954A (en) * 2003-10-28 2005-05-26 Matsushita Electric Ind Co Ltd Printed circuit board inspection device

Also Published As

Publication number Publication date
JP4694272B2 (en) 2011-06-08
JP2006343152A (en) 2006-12-21
KR100728457B1 (en) 2007-06-13
CN1877251A (en) 2006-12-13
HK1097901A1 (en) 2007-07-06
TWI320098B (en) 2010-02-01
CN100432622C (en) 2008-11-12
KR20060127753A (en) 2006-12-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees