GB2482479B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- GB2482479B GB2482479B GB1012951.8A GB201012951A GB2482479B GB 2482479 B GB2482479 B GB 2482479B GB 201012951 A GB201012951 A GB 201012951A GB 2482479 B GB2482479 B GB 2482479B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/491—Vertical IGBTs having both emitter contacts and collector contacts in the same substrate side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/109—Reduced surface field [RESURF] PN junction structures
- H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/146—VDMOS having built-in components the built-in components being Schottky barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1012951.8A GB2482479B (en) | 2010-08-02 | 2010-08-02 | Semiconductor device |
GBGB1107979.5A GB201107979D0 (en) | 2010-08-02 | 2011-05-13 | Semiconductor device |
PCT/GB2011/051413 WO2012017227A1 (en) | 2010-08-02 | 2011-07-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1012951.8A GB2482479B (en) | 2010-08-02 | 2010-08-02 | Semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201012951D0 GB201012951D0 (en) | 2010-09-15 |
GB2482479A GB2482479A (en) | 2012-02-08 |
GB2482479B true GB2482479B (en) | 2015-02-18 |
Family
ID=42799452
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1012951.8A Expired - Fee Related GB2482479B (en) | 2010-08-02 | 2010-08-02 | Semiconductor device |
GBGB1107979.5A Ceased GB201107979D0 (en) | 2010-08-02 | 2011-05-13 | Semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB1107979.5A Ceased GB201107979D0 (en) | 2010-08-02 | 2011-05-13 | Semiconductor device |
Country Status (2)
Country | Link |
---|---|
GB (2) | GB2482479B (en) |
WO (1) | WO2012017227A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6362925B2 (en) * | 2014-05-30 | 2018-07-25 | 三菱電機株式会社 | Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor device |
JP6406021B2 (en) * | 2015-01-09 | 2018-10-17 | 株式会社デンソー | Semiconductor device |
CN104810283B (en) * | 2015-05-13 | 2019-03-12 | 国网智能电网研究院 | An IGBT chip manufacturing method suitable for press-fit packaging |
CN111403385B (en) * | 2020-03-02 | 2022-10-14 | 电子科技大学 | RC-LIGBT device with embedded Schottky diode |
TW202137333A (en) * | 2020-03-24 | 2021-10-01 | 立錡科技股份有限公司 | Power device having lateral insulated gate bipolar transistor (ligbt) and manufacturing method thereof |
GB202019454D0 (en) | 2020-12-10 | 2021-01-27 | Chancellor Masters And Scholars Of The Univ Of Oxford | Method for purifying virus |
CN113270476A (en) * | 2021-04-08 | 2021-08-17 | 西安电子科技大学 | Lateral insulated gate bipolar transistor with electronic control gate region and Schottky anode and manufacturing method thereof |
CN117556761B (en) * | 2022-08-03 | 2025-01-21 | 无锡华润上华科技有限公司 | Anode short-circuited lateral insulated gate bipolar transistor simulation circuit and simulation method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4901127A (en) * | 1988-10-07 | 1990-02-13 | General Electric Company | Circuit including a combined insulated gate bipolar transistor/MOSFET |
EP0372391A2 (en) * | 1988-12-02 | 1990-06-13 | Hitachi, Ltd. | Lateral insulated gate bipolar transistor |
US4989058A (en) * | 1985-11-27 | 1991-01-29 | North American Philips Corp. | Fast switching lateral insulated gate transistors |
JPH042169A (en) * | 1990-04-19 | 1992-01-07 | Fuji Electric Co Ltd | Horizontal type conductivity modulation semiconductor device |
JPH06104443A (en) * | 1992-09-22 | 1994-04-15 | Fuji Electric Co Ltd | Semiconductor device |
US5796126A (en) * | 1995-06-14 | 1998-08-18 | Samsung Electronics Co., Ltd. | Hybrid schottky injection field effect transistor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10132136C1 (en) * | 2001-07-03 | 2003-02-13 | Infineon Technologies Ag | Semiconductor component with charge compensation structure and associated manufacturing process |
US6979863B2 (en) * | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
DE102005009020B4 (en) * | 2005-02-28 | 2012-04-26 | Infineon Technologies Austria Ag | Method for generating a power transistor and thus generated integrated circuit arrangement |
US7462909B2 (en) * | 2005-06-20 | 2008-12-09 | Kabushiki Kaisha Toshiba | Semiconductor device and method of fabricating the same |
CN101512738B (en) * | 2006-09-22 | 2013-03-27 | 飞思卡尔半导体公司 | Semiconductor device and method of forming the same |
-
2010
- 2010-08-02 GB GB1012951.8A patent/GB2482479B/en not_active Expired - Fee Related
-
2011
- 2011-05-13 GB GBGB1107979.5A patent/GB201107979D0/en not_active Ceased
- 2011-07-25 WO PCT/GB2011/051413 patent/WO2012017227A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4989058A (en) * | 1985-11-27 | 1991-01-29 | North American Philips Corp. | Fast switching lateral insulated gate transistors |
US4901127A (en) * | 1988-10-07 | 1990-02-13 | General Electric Company | Circuit including a combined insulated gate bipolar transistor/MOSFET |
EP0372391A2 (en) * | 1988-12-02 | 1990-06-13 | Hitachi, Ltd. | Lateral insulated gate bipolar transistor |
JPH042169A (en) * | 1990-04-19 | 1992-01-07 | Fuji Electric Co Ltd | Horizontal type conductivity modulation semiconductor device |
JPH06104443A (en) * | 1992-09-22 | 1994-04-15 | Fuji Electric Co Ltd | Semiconductor device |
US5796126A (en) * | 1995-06-14 | 1998-08-18 | Samsung Electronics Co., Ltd. | Hybrid schottky injection field effect transistor |
Also Published As
Publication number | Publication date |
---|---|
GB2482479A (en) | 2012-02-08 |
GB201107979D0 (en) | 2011-06-29 |
GB201012951D0 (en) | 2010-09-15 |
WO2012017227A1 (en) | 2012-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20190802 |