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FR3053834B1 - Structure de transistor - Google Patents

Structure de transistor Download PDF

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Publication number
FR3053834B1
FR3053834B1 FR1657587A FR1657587A FR3053834B1 FR 3053834 B1 FR3053834 B1 FR 3053834B1 FR 1657587 A FR1657587 A FR 1657587A FR 1657587 A FR1657587 A FR 1657587A FR 3053834 B1 FR3053834 B1 FR 3053834B1
Authority
FR
France
Prior art keywords
regions
region
conductivity
type
quasi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1657587A
Other languages
English (en)
Other versions
FR3053834A1 (fr
Inventor
Sotirios Athanasiou
Philippe Galy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to US15/427,656 priority Critical patent/US10367068B2/en
Publication of FR3053834A1 publication Critical patent/FR3053834A1/fr
Priority to US16/434,920 priority patent/US11380766B2/en
Application granted granted Critical
Publication of FR3053834B1 publication Critical patent/FR3053834B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/60Lateral BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6708Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H10D30/6711Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect by using electrodes contacting the supplementary regions or layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30Devices controlled by electric currents or voltages
    • H10D48/32Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H10D48/34Bipolar devices
    • H10D48/345Bipolar transistors having ohmic electrodes on emitter-like, base-like, and collector-like regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/177Base regions of bipolar transistors, e.g. BJTs or IGBTs
    • H10D62/184Base regions of bipolar transistors, e.g. BJTs or IGBTs of lateral BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates

Landscapes

  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

L'invention concerne un transistor comprenant : une région quasi-intrinsèque (7) d'un premier type de conductivité recouverte par une grille (9) isolée et s'étendant entre deux premières régions (18, 19) dopées d'un deuxième type de conductivité, une électrode principale (23, 25) étant disposée sur chacune des premières régions ; et une deuxième région (29) dopée du deuxième type de conductivité en contact avec la région quasi-intrinsèque et à distance des deux premières régions, une électrode de commande (37) étant disposée sur la deuxième région.
FR1657587A 2016-07-05 2016-08-05 Structure de transistor Expired - Fee Related FR3053834B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/427,656 US10367068B2 (en) 2016-07-05 2017-02-08 Transistor structure
US16/434,920 US11380766B2 (en) 2016-07-05 2019-06-07 Transistor structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GR20160100358 2016-07-05
GR20160100358 2016-07-05

Publications (2)

Publication Number Publication Date
FR3053834A1 FR3053834A1 (fr) 2018-01-12
FR3053834B1 true FR3053834B1 (fr) 2020-06-12

Family

ID=60917623

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1657587A Expired - Fee Related FR3053834B1 (fr) 2016-07-05 2016-08-05 Structure de transistor

Country Status (3)

Country Link
US (2) US10367068B2 (fr)
CN (2) CN107579117B (fr)
FR (1) FR3053834B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3053834B1 (fr) * 2016-07-05 2020-06-12 Stmicroelectronics Sa Structure de transistor
US9941301B1 (en) * 2016-12-22 2018-04-10 Globalfoundries Inc. Fully depleted silicon-on-insulator (FDSOI) transistor device and self-aligned active area in FDSOI bulk exposed regions
US11295988B2 (en) 2020-06-11 2022-04-05 International Business Machines Corporation Semiconductor FET device with bottom isolation and high-κ first
US11949004B2 (en) * 2021-08-27 2024-04-02 Globalfoundries U.S. Inc. Lateral bipolar transistors with gate structure aligned to extrinsic base
US20230387208A1 (en) * 2022-05-31 2023-11-30 Stmicroelectronics (Crolles 2) Sas Lateral bipolar transistor

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164805A (en) * 1988-08-22 1992-11-17 Massachusetts Institute Of Technology Near-intrinsic thin-film SOI FETS
JP3364559B2 (ja) * 1995-10-11 2003-01-08 三菱電機株式会社 半導体装置
US5573961A (en) * 1995-11-09 1996-11-12 Taiwan Semiconductor Manufacturing Company Ltd. Method of making a body contact for a MOSFET device fabricated in an SOI layer
US5773862A (en) * 1996-08-27 1998-06-30 Zycad Corporation Floating gate FGPA cell with separated select device
US6387739B1 (en) * 1998-08-07 2002-05-14 International Business Machines Corporation Method and improved SOI body contact structure for transistors
JP2002033484A (ja) * 2000-07-18 2002-01-31 Mitsubishi Electric Corp 半導体装置
US6566682B2 (en) 2001-02-09 2003-05-20 Micron Technology, Inc. Programmable memory address and decode circuits with ultra thin vertical body transistors
JP4227341B2 (ja) * 2002-02-21 2009-02-18 セイコーインスツル株式会社 半導体集積回路の構造及びその製造方法
US6919236B2 (en) * 2002-03-21 2005-07-19 Advanced Micro Devices, Inc. Biased, triple-well fully depleted SOI structure, and various methods of making and operating same
US6833556B2 (en) 2002-08-12 2004-12-21 Acorn Technologies, Inc. Insulated gate field effect transistor having passivated schottky barriers to the channel
US7163851B2 (en) * 2002-08-26 2007-01-16 International Business Machines Corporation Concurrent Fin-FET and thick-body device fabrication
US6800910B2 (en) * 2002-09-30 2004-10-05 Advanced Micro Devices, Inc. FinFET device incorporating strained silicon in the channel region
KR100526887B1 (ko) * 2004-02-10 2005-11-09 삼성전자주식회사 전계효과 트랜지스터 및 그의 제조방법
US7084462B1 (en) * 2005-04-15 2006-08-01 International Business Machines Corporation Parallel field effect transistor structure having a body contact
US20070090416A1 (en) * 2005-09-28 2007-04-26 Doyle Brian S CMOS devices with a single work function gate electrode and method of fabrication
US7391647B2 (en) * 2006-04-11 2008-06-24 Mosys, Inc. Non-volatile memory in CMOS logic process and method of operation thereof
DE102006022126B4 (de) * 2006-05-11 2015-04-09 Infineon Technologies Ag Verfahren zum Herstellen eines elektronischen Bauelementes
US20080290413A1 (en) * 2007-05-21 2008-11-27 International Business Machines Corporation Soi mosfet with a metal semiconductor alloy gate-to-body bridge
JP2009277963A (ja) * 2008-05-16 2009-11-26 Toshiba Corp 半導体装置
JP2011040458A (ja) * 2009-08-07 2011-02-24 Renesas Electronics Corp 半導体装置およびその製造方法
US9577079B2 (en) 2009-12-17 2017-02-21 Infineon Technologies Ag Tunnel field effect transistors
US9019666B2 (en) * 2010-01-22 2015-04-28 Stmicroelectronics S.A. Electronic device, in particular for protection against electrostatic discharges, and method for protecting a component against electrostatic discharges
KR101274719B1 (ko) * 2010-06-11 2013-06-25 엘지디스플레이 주식회사 박막트랜지스터 기판 및 그 제조 방법과 그를 가지는 평판 표시 소자
WO2011162725A1 (fr) 2010-06-25 2011-12-29 Agency For Science, Technology And Research Transistor à nanofils et son procédé de fabrication
US20120205744A1 (en) * 2011-02-10 2012-08-16 O Kenneth K Body contact structure for a semiconductor device
FR2973570A1 (fr) * 2011-04-01 2012-10-05 St Microelectronics Sa Transistor a tension d'alimentation et/ou de seuil ajustables
US8772848B2 (en) * 2011-07-26 2014-07-08 Micron Technology, Inc. Circuit structures, memory circuitry, and methods
US8853776B2 (en) * 2011-09-21 2014-10-07 Infineon Technologies Austria Ag Power transistor with controllable reverse diode
TWI512905B (zh) * 2012-06-13 2015-12-11 Win Semiconductors Corp 化合物半導體元件晶圓整合結構
FR2992469B1 (fr) * 2012-06-25 2014-08-08 Commissariat Energie Atomique Transistor a effet tunnel
JP6100535B2 (ja) * 2013-01-18 2017-03-22 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
JP2014229737A (ja) * 2013-05-22 2014-12-08 株式会社東芝 半導体装置
US9750433B2 (en) * 2013-05-28 2017-09-05 Lark Technologies, Inc. Using health monitor data to detect macro and micro habits with a behavioral model
US9520404B2 (en) * 2013-07-30 2016-12-13 Synopsys, Inc. Asymmetric dense floating gate nonvolatile memory with decoupled capacitor
US9614367B2 (en) 2013-09-13 2017-04-04 Stmicroelectronics Sa Electronic device for ESD protection
US9666717B2 (en) * 2014-03-18 2017-05-30 Global Foundries, Inc. Split well zero threshold voltage field effect transistor for integrated circuits
US9418903B2 (en) * 2014-05-21 2016-08-16 Globalfoundries Inc. Structure and method for effective device width adjustment in finFET devices using gate workfunction shift
US9484270B2 (en) * 2014-09-16 2016-11-01 International Business Machines Corporation Fully-depleted silicon-on-insulator transistors
KR102168302B1 (ko) 2014-11-21 2020-10-22 삼성전자주식회사 3차원 채널을 이용하는 반도체 장치
FR3038775A1 (fr) * 2015-07-09 2017-01-13 St Microelectronics Sa Prise de contact substrat pour un transistor mos dans un substrat soi, en particulier fdsoi
US9935127B2 (en) * 2015-07-29 2018-04-03 Wuhan China Star Optoelectronics Technology Co., Ltd. Control circuit of thin film transistor
US9941300B2 (en) * 2015-12-16 2018-04-10 Globalfoundries Inc. Structure and method for fully depleted silicon on insulator structure for threshold voltage modification
FR3048304B1 (fr) * 2016-02-25 2019-03-15 Stmicroelectronics Sa Puce electronique a transistors a grilles avant et arriere
US9716136B1 (en) * 2016-03-16 2017-07-25 Globalfoundries Inc. Embedded polysilicon resistors with crystallization barriers
US10096708B2 (en) * 2016-03-30 2018-10-09 Stmicroelectronics Sa Enhanced substrate contact for MOS transistor in an SOI substrate, in particular an FDSOI substrate
FR3053834B1 (fr) * 2016-07-05 2020-06-12 Stmicroelectronics Sa Structure de transistor

Also Published As

Publication number Publication date
US11380766B2 (en) 2022-07-05
US20180012965A1 (en) 2018-01-11
CN107579117B (zh) 2021-03-12
CN206878003U (zh) 2018-01-12
US20190288079A1 (en) 2019-09-19
FR3053834A1 (fr) 2018-01-12
CN107579117A (zh) 2018-01-12
US10367068B2 (en) 2019-07-30

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