FR2884646B1 - Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnel - Google Patents
Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnelInfo
- Publication number
- FR2884646B1 FR2884646B1 FR0503894A FR0503894A FR2884646B1 FR 2884646 B1 FR2884646 B1 FR 2884646B1 FR 0503894 A FR0503894 A FR 0503894A FR 0503894 A FR0503894 A FR 0503894A FR 2884646 B1 FR2884646 B1 FR 2884646B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- integrated circuit
- dimensional capacitor
- capacitor
- dimensional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/041—Manufacture or treatment of capacitors having no potential barriers
- H10D1/042—Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/045—Manufacture or treatment of capacitors having potential barriers, e.g. varactors
- H10D1/047—Manufacture or treatment of capacitors having potential barriers, e.g. varactors of conductor-insulator-semiconductor capacitors, e.g. trench capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0503894A FR2884646B1 (fr) | 2005-04-19 | 2005-04-19 | Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnel |
US11/405,680 US7479424B2 (en) | 2005-04-19 | 2006-04-17 | Method for fabricating an integrated circuit comprising a three-dimensional capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0503894A FR2884646B1 (fr) | 2005-04-19 | 2005-04-19 | Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnel |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2884646A1 FR2884646A1 (fr) | 2006-10-20 |
FR2884646B1 true FR2884646B1 (fr) | 2007-09-14 |
Family
ID=35406272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0503894A Expired - Fee Related FR2884646B1 (fr) | 2005-04-19 | 2005-04-19 | Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnel |
Country Status (2)
Country | Link |
---|---|
US (1) | US7479424B2 (fr) |
FR (1) | FR2884646B1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005038219B4 (de) * | 2005-08-12 | 2008-11-13 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit Kondensator in einer Leitbahnlage und Verfahren zum Herstellen derselben |
US7608538B2 (en) * | 2007-01-05 | 2009-10-27 | International Business Machines Corporation | Formation of vertical devices by electroplating |
FR2911993A1 (fr) | 2007-01-31 | 2008-08-01 | St Microelectronics Sa | Condensateur dans un circuit monolithique |
FR2914498A1 (fr) * | 2007-04-02 | 2008-10-03 | St Microelectronics Sa | Realisation de condensateurs mim a 3 dimensions dans le dernier niveau de metal d'un circuit integre |
FR2917231B1 (fr) | 2007-06-07 | 2009-10-02 | St Microelectronics Sa | Realisation de condensateurs dotes de moyens pour diminuer les contraintes du materiau metallique de son armature inferieure |
US8242551B2 (en) * | 2009-03-04 | 2012-08-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal-insulator-metal structure for system-on-chip technology |
US8716100B2 (en) | 2011-08-18 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers |
FR3053156B1 (fr) * | 2016-06-28 | 2018-11-16 | Stmicroelectronics (Rousset) Sas | Composant a faible dispersion dans une puce electronique |
US11139367B2 (en) * | 2018-10-30 | 2021-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | High density MIM capacitor structure |
US11626475B2 (en) * | 2019-06-14 | 2023-04-11 | Intel Corporation | Trench capacitor with extended dielectric layer |
US11581254B2 (en) | 2020-10-13 | 2023-02-14 | Taiwan Semiconductor Manufacturing Company Limited | Three dimensional MIM capacitor having a comb structure and methods of making the same |
FR3122415B1 (fr) | 2021-04-29 | 2024-05-31 | Thales Sa | Micro-commutateur RF à capacité structurée |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2956482B2 (ja) * | 1994-07-29 | 1999-10-04 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
US5576240A (en) * | 1994-12-09 | 1996-11-19 | Lucent Technologies Inc. | Method for making a metal to metal capacitor |
US5708559A (en) * | 1995-10-27 | 1998-01-13 | International Business Machines Corporation | Precision analog metal-metal capacitor |
US6441419B1 (en) * | 1998-03-31 | 2002-08-27 | Lsi Logic Corporation | Encapsulated-metal vertical-interdigitated capacitor and damascene method of manufacturing same |
US6251740B1 (en) * | 1998-12-23 | 2001-06-26 | Lsi Logic Corporation | Method of forming and electrically connecting a vertical interdigitated metal-insulator-metal capacitor extending between interconnect layers in an integrated circuit |
US6249014B1 (en) * | 1998-10-01 | 2001-06-19 | Ramtron International Corporation | Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices |
US6180976B1 (en) * | 1999-02-02 | 2001-01-30 | Conexant Systems, Inc. | Thin-film capacitors and methods for forming the same |
US6611014B1 (en) * | 1999-05-14 | 2003-08-26 | Kabushiki Kaisha Toshiba | Semiconductor device having ferroelectric capacitor and hydrogen barrier film and manufacturing method thereof |
JP2001313379A (ja) * | 2000-04-28 | 2001-11-09 | Nec Corp | 半導体メモリの製造方法及び容量素子の製造方法 |
US6344964B1 (en) * | 2000-07-14 | 2002-02-05 | International Business Machines Corporation | Capacitor having sidewall spacer protecting the dielectric layer |
US6750113B2 (en) * | 2001-01-17 | 2004-06-15 | International Business Machines Corporation | Metal-insulator-metal capacitor in copper |
US6646323B2 (en) * | 2001-05-04 | 2003-11-11 | Texas Instruments Incorporated | Zero mask high density metal/insulator/metal capacitor |
KR100420122B1 (ko) * | 2001-07-21 | 2004-03-02 | 삼성전자주식회사 | 강유전체 메모리 장치 및 그 제조방법 |
US6452779B1 (en) * | 2002-03-25 | 2002-09-17 | International Business Machines Corporation | One-mask metal-insulator-metal capacitor and method for forming same |
KR100471164B1 (ko) * | 2002-03-26 | 2005-03-09 | 삼성전자주식회사 | 금속-절연체-금속 캐패시터를 갖는 반도체장치 및 그제조방법 |
US6573587B1 (en) * | 2002-05-28 | 2003-06-03 | Oki Electric Industry Co., Ltd. | Metal oxide capacitor with hydrogen diffusion blocking covering |
JP2004152796A (ja) * | 2002-10-28 | 2004-05-27 | Toshiba Corp | 半導体装置及びその製造方法 |
US6713840B1 (en) * | 2003-02-27 | 2004-03-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal-insulator-metal device structure inserted into a low k material and the method for making same |
US6897501B2 (en) * | 2003-02-28 | 2005-05-24 | Infineon Technologies Aktiengesellschaft | Avoiding shorting in capacitors |
US6876027B2 (en) * | 2003-04-10 | 2005-04-05 | Taiwan Semiconductor Manufacturing Company | Method of forming a metal-insulator-metal capacitor structure in a copper damascene process sequence |
US6936539B2 (en) * | 2003-09-24 | 2005-08-30 | Micron Technology, Inc. | Antireflective coating for use during the manufacture of a semiconductor device |
US20050116276A1 (en) * | 2003-11-28 | 2005-06-02 | Jing-Horng Gau | Metal-insulator-metal (MIM) capacitor and fabrication method for making the same |
-
2005
- 2005-04-19 FR FR0503894A patent/FR2884646B1/fr not_active Expired - Fee Related
-
2006
- 2006-04-17 US US11/405,680 patent/US7479424B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20060234464A1 (en) | 2006-10-19 |
FR2884646A1 (fr) | 2006-10-20 |
US7479424B2 (en) | 2009-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2892196B1 (fr) | Procede de fabrication d'un biocapteur a detection integree | |
EP1592054A4 (fr) | Procede de fabrication d'un ecran | |
FR2924270B1 (fr) | Procede de fabrication d'un dispositif electronique | |
FI20041524A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
FR2872342B1 (fr) | Procede de fabrication d'un dispositif semiconducteur | |
FR2865731B1 (fr) | Procede de fabrication d'un hydrofluoroalcane | |
FI20040827A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
FI20031341A (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi | |
EP1950571A4 (fr) | Procede de fabrication d'un support de contact conducteur et support de contact conducteur | |
FR2851373B1 (fr) | Procede de fabrication d'un circuit electronique integre incorporant des cavites | |
FR2897795B1 (fr) | Procede de fabrication d'un film multicouche | |
EP1922749A4 (fr) | Procede de fabrication d'un dispositif semi-conducteur | |
EP1592052A4 (fr) | Procede de fabrication d'un affichage | |
FR2871398B1 (fr) | Procede de fabrication d'un carter de stator de turbine | |
FR2913816B1 (fr) | Procede de fabrication d'une structure d'interconnexions a cavites pour circuit integre | |
EP1928218A4 (fr) | Carte imprimee flexible et son procede de fabrication | |
FR2858714B1 (fr) | Procede de fabrication d'un dispositif a semi-conducteur | |
FR2884646B1 (fr) | Procede de fabrication d'un circuit integre comprenant un condensateur tridimensionnel | |
EP1725496A4 (fr) | Procede de fabrication d`un dispositif semi-conducteur | |
FR2891281B1 (fr) | Procede de fabrication d'un element en couches minces. | |
FR2893768B1 (fr) | Procede de fabrication d'un contact electrique | |
EP1950572A4 (fr) | Procede de fabrication d'un support de contact conducteur | |
EP1920459A4 (fr) | Procede de fabrication d'un composant a semiconducteur | |
FR2884645B1 (fr) | Procede de realisation d'un circuit integre comprenant un condensateur | |
FR2891663B1 (fr) | Procede de fabrication d'un dispositif a semi-conducteur. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20131231 |