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FI20040629A0 - Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi - Google Patents

Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi

Info

Publication number
FI20040629A0
FI20040629A0 FI20040629A FI20040629A FI20040629A0 FI 20040629 A0 FI20040629 A0 FI 20040629A0 FI 20040629 A FI20040629 A FI 20040629A FI 20040629 A FI20040629 A FI 20040629A FI 20040629 A0 FI20040629 A0 FI 20040629A0
Authority
FI
Finland
Prior art keywords
pressure sensor
capacitive pressure
producing
capacitive
producing capacitive
Prior art date
Application number
FI20040629A
Other languages
English (en)
Swedish (sv)
Other versions
FI115487B (fi
Inventor
Jaakko Ruohio
Riikka Aastroem
Original Assignee
Vti Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vti Technologies Oy filed Critical Vti Technologies Oy
Priority to FI20040629A priority Critical patent/FI115487B/fi
Publication of FI20040629A0 publication Critical patent/FI20040629A0/fi
Priority to US11/114,215 priority patent/US7252007B2/en
Priority to EP05103506.1A priority patent/EP1593949B1/en
Application granted granted Critical
Publication of FI115487B publication Critical patent/FI115487B/fi

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
FI20040629A 2004-05-03 2004-05-03 Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi FI115487B (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20040629A FI115487B (fi) 2004-05-03 2004-05-03 Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi
US11/114,215 US7252007B2 (en) 2004-05-03 2005-04-26 Method for the manufacturing of a capacitive pressure sensor, and a capacitive pressure sensor
EP05103506.1A EP1593949B1 (en) 2004-05-03 2005-04-28 Method of manufacturing a capacitive pressure sensor and a capacitive pressure sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040629A FI115487B (fi) 2004-05-03 2004-05-03 Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi
FI20040629 2004-05-03

Publications (2)

Publication Number Publication Date
FI20040629A0 true FI20040629A0 (fi) 2004-05-03
FI115487B FI115487B (fi) 2005-05-13

Family

ID=32338350

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040629A FI115487B (fi) 2004-05-03 2004-05-03 Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi

Country Status (3)

Country Link
US (1) US7252007B2 (fi)
EP (1) EP1593949B1 (fi)
FI (1) FI115487B (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080124528A1 (en) * 2006-11-29 2008-05-29 Motorola, Inc. Printed electronic device and methods of determining the electrical value thereof
US8297125B2 (en) * 2008-05-23 2012-10-30 Honeywell International Inc. Media isolated differential pressure sensor with cap
US8230745B2 (en) * 2008-11-19 2012-07-31 Honeywell International Inc. Wet/wet differential pressure sensor based on microelectronic packaging process
RU2465681C2 (ru) * 2009-02-19 2012-10-27 Государственное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ изготовления чувствительного элемента датчика давления жидких и газообразных сред
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
US8754504B2 (en) * 2012-05-23 2014-06-17 United Microelectronics Corporation Thinned wafer and fabricating method thereof
CN111279023A (zh) * 2017-08-30 2020-06-12 洛桑联邦理工学院 单晶金刚石衍射光学元件及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE272737C (fi)
US3986200A (en) 1974-01-02 1976-10-12 Signetics Corporation Semiconductor structure and method
JPS5524423A (en) * 1978-08-10 1980-02-21 Nissan Motor Co Ltd Semiconductor pressure sensor
JPS60138977A (ja) 1983-12-27 1985-07-23 Fuji Electric Co Ltd 半導体形静電容量式圧力センサ
JPH07101743B2 (ja) 1988-04-05 1995-11-01 横河電機株式会社 半導体圧力センサの製造方法
JPH01261872A (ja) 1988-04-12 1989-10-18 Yokogawa Electric Corp 半導体圧力センサの製造方法
JPH06232423A (ja) * 1993-02-04 1994-08-19 Mitsubishi Electric Corp 半導体圧力センサ
JPH11135806A (ja) 1997-10-28 1999-05-21 Denso Corp 半導体圧力センサおよびその製造方法
US6156585A (en) * 1998-02-02 2000-12-05 Motorola, Inc. Semiconductor component and method of manufacture
US6089099A (en) 1998-09-08 2000-07-18 Smi Corporation Method for forming a bonded silicon-glass pressure sensor with strengthened corners
EP1223420A3 (en) * 2001-01-16 2003-07-09 Fujikura Ltd. Pressure sensor and manufacturing method thereof
DE102004018408A1 (de) * 2004-04-16 2005-11-03 Robert Bosch Gmbh Kapazitiver Drucksensor und Verfahren zur Herstellung

Also Published As

Publication number Publication date
FI115487B (fi) 2005-05-13
US20050248905A1 (en) 2005-11-10
US7252007B2 (en) 2007-08-07
EP1593949A1 (en) 2005-11-09
EP1593949B1 (en) 2015-01-21

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