[go: up one dir, main page]

DE69806515D1 - Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung - Google Patents

Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung

Info

Publication number
DE69806515D1
DE69806515D1 DE69806515T DE69806515T DE69806515D1 DE 69806515 D1 DE69806515 D1 DE 69806515D1 DE 69806515 T DE69806515 T DE 69806515T DE 69806515 T DE69806515 T DE 69806515T DE 69806515 D1 DE69806515 D1 DE 69806515D1
Authority
DE
Germany
Prior art keywords
support film
interface
mum
microcircuit
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69806515T
Other languages
English (en)
Other versions
DE69806515T2 (de
Inventor
Rene-Paul Blanc
Isabelle Desoutter
Pierre Garnier
Philippe Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26233849&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69806515(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR9712444A external-priority patent/FR2769108B3/fr
Application filed by Gemplus SA filed Critical Gemplus SA
Application granted granted Critical
Publication of DE69806515D1 publication Critical patent/DE69806515D1/de
Publication of DE69806515T2 publication Critical patent/DE69806515T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
DE69806515T 1997-09-26 1998-09-23 Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung Expired - Lifetime DE69806515T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9712444A FR2769108B3 (fr) 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication
FR9714582A FR2769109B1 (fr) 1997-09-26 1997-11-14 Dispositif electronique a puce jetable et procede de fabrication
PCT/FR1998/002051 WO1999017252A1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication

Publications (2)

Publication Number Publication Date
DE69806515D1 true DE69806515D1 (de) 2002-08-14
DE69806515T2 DE69806515T2 (de) 2003-03-27

Family

ID=26233849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69806515T Expired - Lifetime DE69806515T2 (de) 1997-09-26 1998-09-23 Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung

Country Status (11)

Country Link
US (2) US6437985B1 (de)
EP (1) EP1060457B1 (de)
JP (2) JP4692863B2 (de)
CN (1) CN1214345C (de)
AT (1) ATE220468T1 (de)
AU (1) AU748452B2 (de)
CA (1) CA2304844A1 (de)
DE (1) DE69806515T2 (de)
ES (1) ES2180199T3 (de)
FR (1) FR2769109B1 (de)
WO (1) WO1999017252A1 (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
DE19850353C1 (de) * 1998-11-02 2000-03-16 David Finn Identifikationslabel sowie Verfahren zur Herstellung eines Indentifikationslabels
DE69934715T2 (de) * 1998-11-30 2007-10-18 Hitachi, Ltd. Verfahren zur montage einer elektronischen schaltung
DE19942932C2 (de) * 1999-09-08 2002-01-24 Giesecke & Devrient Gmbh Verfahren zum Herstellen von Chipkarten
JP2003529163A (ja) * 2000-03-28 2003-09-30 ルカトロン アーゲー 共振周波数を調整する部材を有するｒｆｉｄラベル
ATE339740T1 (de) * 2000-05-12 2006-10-15 Dainippon Printing Co Ltd Kontaktloser datenträger
US6588098B1 (en) * 2000-11-13 2003-07-08 Semiconductor Components Industries Llc Method for manufacturing an electronic device package
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
AU2002320403A1 (en) * 2001-07-13 2003-01-29 Pittsfield Weaving Co., Inc. Method and apparatus for bonding an additional layer of fabric to a label
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
DE10196786D2 (de) * 2001-08-29 2004-07-22 Tesa Ag Maschinell erkennbares Klebeband
JP2003099746A (ja) * 2001-09-25 2003-04-04 Nec Tokin Corp 非接触通信媒体
JP2003108961A (ja) * 2001-09-28 2003-04-11 Hitachi Ltd 電子タグおよびその製造方法
ATE285664T1 (de) * 2001-10-01 2005-01-15 Nagraid Sa Elektronische schaltung mit leitfähigen brücken und verfahren zur herstellung solcher brücken
FR2841023B1 (fr) * 2002-06-14 2005-10-21 Store Electronic Systems Techn Antenne pour etiquette electronique
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
FR2855637B1 (fr) 2003-05-26 2005-11-18 A S K Procede de fabrication d'un ticket sans contact et ticket obtenu a partir de ce procede
US20050183990A1 (en) * 2004-01-12 2005-08-25 Corbett Bradford G.Jr. Textile identification system with RFID tracking
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US20060108674A1 (en) * 2004-11-24 2006-05-25 Jhyy-Cheng Liou Package structure of memory card and packaging method for the structure
US7196626B2 (en) * 2005-01-28 2007-03-27 Wha Yu Industrial Co., Ltd. Radio frequency identification RFID tag
EP1864266A2 (de) * 2005-03-29 2007-12-12 Symbol Technologies, Inc. Intelligente hochfrequenzidentifikationselemente (rfid)
US7523546B2 (en) * 2005-05-04 2009-04-28 Nokia Corporation Method for manufacturing a composite layer for an electronic device
JP4768379B2 (ja) * 2005-09-28 2011-09-07 富士通株式会社 Ｒｆｉｄタグ
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
EP1887497B1 (de) * 2006-08-10 2015-05-27 Fujitsu Limited RFID-Etikett
DE112007002024B4 (de) * 2006-09-26 2010-06-10 Murata Mfg. Co., Ltd., Nagaokakyo-shi Induktiv gekoppeltes Modul und Element mit induktiv gekoppeltem Modul
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
WO2008103870A1 (en) * 2007-02-23 2008-08-28 Newpage Wisconsin System Inc. Multifunctional paper identification label
EP2053544A1 (de) * 2007-10-23 2009-04-29 F. Hoffman-la Roche AG Verfahren zur Herstellung eines Smart Labels mit laserbeschriftbarem Klebeetikett
US8966749B2 (en) * 2008-10-28 2015-03-03 Samsung Sdi Co., Ltd. Manufacturing method for protection circuit module of secondary battery
DE102009019378A1 (de) * 2009-04-29 2010-11-11 Giesecke & Devrient Gmbh Einbettung elektronischer Bauteile durch Extrusionsbeschichtung
DE102009023405A1 (de) 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
JP4637969B1 (ja) 2009-12-31 2011-02-23 株式会社Ｔａｇｇｙ ウェブページの主意，およびユーザの嗜好を適切に把握して，最善の情報をリアルタイムに推奨する方法
WO2012014005A1 (en) * 2010-07-26 2012-02-02 Fci Rfid tag and method for manufacturing such a rfid tag
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
WO2015131185A1 (en) * 2014-02-28 2015-09-03 Intellipaper, Llc Integrated circuitry and methods for manufacturing same
USD776070S1 (en) * 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
JP6801370B2 (ja) 2016-10-28 2020-12-16 富士通株式会社 センサ装置
JP6780578B2 (ja) * 2017-05-12 2020-11-04 株式会社村田製作所 テーピング電子部品連
CN109310010B (zh) * 2018-10-29 2019-12-20 南京溧航仿生产业研究院有限公司 一种具有自动清理及防误碰功能的智能蚀刻机
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
US11895777B2 (en) 2021-09-24 2024-02-06 Idex Biometrics Asa Flexible inlay and manufacturing method thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0655554B2 (ja) * 1984-12-13 1994-07-27 松下電器産業株式会社 Ｉｃカードおよびその製造方法
US4977441A (en) * 1985-12-25 1990-12-11 Hitachi, Ltd. Semiconductor device and tape carrier
JPH0530874U (ja) * 1991-10-02 1993-04-23 三菱重工業株式会社 フレキシブルｉｃタグ
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JPH0890966A (ja) * 1994-09-22 1996-04-09 Rohm Co Ltd 非接触型ｉｃカードの構造
US5852289A (en) * 1994-09-22 1998-12-22 Rohm Co., Ltd. Non-contact type IC card and method of producing the same
JP3144455B2 (ja) * 1994-12-27 2001-03-12 ローム株式会社 非接触型ｉｃカード
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
JP3505238B2 (ja) * 1994-10-26 2004-03-08 日立マクセル株式会社 情報記憶担体及びその製造方法
JP3521586B2 (ja) * 1995-01-19 2004-04-19 株式会社デンソー Ｉｃカードの製造方法
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
JPH08310172A (ja) * 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
JPH09131987A (ja) * 1995-11-10 1997-05-20 Toshiba Corp Ｉｃカードの製造方法および製造装置
DE69819299T2 (de) * 1997-06-23 2004-07-29 Rohm Co. Ltd. Ic modul und ic karte
US6037879A (en) * 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
US6095416A (en) * 1998-02-24 2000-08-01 Privicom, Inc. Method and device for preventing unauthorized use of credit cards

Also Published As

Publication number Publication date
DE69806515T2 (de) 2003-03-27
JP2002517807A (ja) 2002-06-18
ATE220468T1 (de) 2002-07-15
CN1280692A (zh) 2001-01-17
AU748452B2 (en) 2002-06-06
US6437985B1 (en) 2002-08-20
JP4692863B2 (ja) 2011-06-01
EP1060457A1 (de) 2000-12-20
EP1060457B1 (de) 2002-07-10
ES2180199T3 (es) 2003-02-01
CN1214345C (zh) 2005-08-10
JP4618462B2 (ja) 2011-01-26
WO1999017252A1 (fr) 1999-04-08
US20020148110A1 (en) 2002-10-17
FR2769109A1 (fr) 1999-04-02
FR2769109B1 (fr) 1999-11-19
AU9353398A (en) 1999-04-23
JP2009259258A (ja) 2009-11-05
CA2304844A1 (fr) 1999-04-08

Similar Documents

Publication Publication Date Title
DE69806515D1 (de) Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung
DE69107690D1 (de) Dünnfilmelektrode für Vorrichtungen und elektrolumineszente Vorrichtung damit und Verfahren zur Herstellung derselben.
DE58903230D1 (de) Verfahren zum entfernen von verunreinigungen aus polymeren kunststoffen und vorrichtung zur durchfuehrung des verfahrens.
DE3874177D1 (de) Verfahren und vorrichtung zum querschneiden von streifen aus deformierbarem material.
DE69123508D1 (de) Vorrichtung zur Bearbeitung von Halbleiterscheiben
DE3782646D1 (de) Vorrichtung und verfahren zur verbindung von schaltungspackungen.
TR200101887T2 (tr) Sıvı faz içindeki bir maddenin plastik taneleri içerisine sürekli olarak içeri zerk edilmesine mahsus metod ve alet.
DE69314320D1 (de) Vorrichtung und Verfahren zur Aufnahme und Plazierung von Briefumschlägen mit aufgeschlagener Klappe
DE69824991D1 (de) Vorrichtung zur Herstellung von Verpackungsbehältern und Verfahren zu deren Herstellung
DE3484091D1 (de) Verstrecktes produkt aus kristallinischem polymer mit hoher festigkeit und hohem modul und verfahren zur herstellung desselben.
DE59201538D1 (de) Verfahren und Vorrichtung zur Herstellung von mit Zusatzstoffen gefüllten Kunststoffen.
DE69824666D1 (de) Vorrichtung zur Herstellung von Verpackungsbehältern und Verfahren zu deren Herstellung-I
ATE280660T1 (de) Vorrichtung zum schneiden von kunststoffen
DE68919256D1 (de) Verfahren und Vorrichtung zur Ermittlung von Zelleigenschaften.
DE68916157D1 (de) Vorrichtung und Verfahren zur Züchtung von Kristallen aus Halbleitermaterialien.
DE69102868D1 (de) Verfahren und vorrichtung zur fütterung von kühen.
DE69909212D1 (de) Vorrichtung zur Verkapselung von einem Substrat mit empfindlichen, elektronischen Bauelementen und einem Druckmesser
DE3860326D1 (de) Vorrichtung zum abscheiden von feststoffen aus fluessigkeiten in zahnaerztlichen einrichtungen.
NL1000317C2 (nl) Werkwijze en inrichting voor het sorteren van batterijen.
DE58906862D1 (de) Vorrichtung zur ultraschallkontaktierenden Drahtverbindung an elektronischen Komponenten.
DE3881575D1 (de) Vorrichtung zum sterilisieren von folienbahnen und solchem verpackungsmaterial.
DE59202197D1 (de) Verfahren und Vorrichtung zur Herstellung von Papiertragetaschen.
DE69604718D1 (de) Vorrichtung zum automatischen Verpacken von Gegenständen in aus schlauchförmigen Zuschnitten hergestellten Verpackungen
DE69104559D1 (de) Verfahren und Vorrichtung zum Verpacken von elastisch verformbaren Gegenständen.
DE59000656D1 (de) Abfuellstutzen oder spund fuer folienbehaelter oder -beutel aus polyethylen oder dgl.

Legal Events

Date Code Title Description
R082 Change of representative

Ref document number: 1060457

Country of ref document: EP

Representative=s name: HOFFMANN - EITLE, DE