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DE69702562D1 - Halbleiterlasermodul - Google Patents

Halbleiterlasermodul

Info

Publication number
DE69702562D1
DE69702562D1 DE69702562T DE69702562T DE69702562D1 DE 69702562 D1 DE69702562 D1 DE 69702562D1 DE 69702562 T DE69702562 T DE 69702562T DE 69702562 T DE69702562 T DE 69702562T DE 69702562 D1 DE69702562 D1 DE 69702562D1
Authority
DE
Germany
Prior art keywords
semiconductor laser
laser module
module
semiconductor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69702562T
Other languages
English (en)
Other versions
DE69702562T2 (de
Inventor
Tomonari Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69702562D1 publication Critical patent/DE69702562D1/de
Publication of DE69702562T2 publication Critical patent/DE69702562T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4273—Thermal aspects, temperature control or temperature monitoring with heat insulation means to thermally decouple or restrain the heat from spreading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69702562T 1996-03-29 1997-03-27 Halbleiterlasermodul Expired - Fee Related DE69702562T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8103847A JP2828025B2 (ja) 1996-03-29 1996-03-29 半導体レーザモジュール

Publications (2)

Publication Number Publication Date
DE69702562D1 true DE69702562D1 (de) 2000-08-24
DE69702562T2 DE69702562T2 (de) 2001-03-08

Family

ID=14364839

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702562T Expired - Fee Related DE69702562T2 (de) 1996-03-29 1997-03-27 Halbleiterlasermodul

Country Status (4)

Country Link
US (2) US5995525A (de)
EP (1) EP0800243B1 (de)
JP (1) JP2828025B2 (de)
DE (1) DE69702562T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2943766B2 (ja) * 1997-06-10 1999-08-30 日本電気株式会社 半導体レーザモジュール
JP3226854B2 (ja) * 1997-10-24 2001-11-05 日本電気株式会社 半導体レーザモジュール
EP1603206A3 (de) 1999-02-03 2006-04-26 The Furukawa Electric Co., Ltd. Halbleiterlaservorrichtung und diese verwendende Halbleiterlasermodule
US6810063B1 (en) 1999-06-09 2004-10-26 The Furukawa Electric Co., Ltd. Semiconductor laser device
US6614822B2 (en) 2000-02-03 2003-09-02 The Furukawa Electric Co., Ltd. Semiconductor laser devices, and semiconductor laser modules and optical communication systems using the same
US6870871B2 (en) 2000-02-03 2005-03-22 The Furukawa Electric Co., Ltd. Semiconductor laser devices, and semiconductor laser modules and optical communication systems using the same
JP2002111135A (ja) 2000-10-02 2002-04-12 Furukawa Electric Co Ltd:The 半導体レーザ素子、それを用いた光ファイバ増幅器用励起光源
US6517296B2 (en) * 2001-06-21 2003-02-11 Vernon Devices, Inc. Hole finishing tool
US6712528B2 (en) 2001-06-28 2004-03-30 Corning O.T.I. S.R.L. Optical bench for an opto-electronic device
EP1271209A1 (de) * 2001-06-28 2003-01-02 Corning O.T.I. S.p.A. Optische Bank für opto-elektronische Vorrichtung
EP1389812A1 (de) * 2002-08-13 2004-02-18 Agilent Technologies Inc Montierungsanordnung für hochfrequente Elektrooptische Elemente
DE10258745A1 (de) 2002-12-13 2004-07-08 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co.Kg Halbleiterlaservorrichtung, Halbleiterlaserbaustein für eine derartige Halbleiterlaservorrichtung sowie ein Verfahren zur Herstellung einer derartigen Halbleiterlaservorrichtung
US7856038B2 (en) * 2006-03-27 2010-12-21 Sumitomo Electric Industries, Ltd. Light-emitting module installing thermo-electric controller
US8243963B2 (en) * 2009-06-18 2012-08-14 Gladwin Timothy A Swivel tweeter mechanism for a constant phase coaxial acoustic transducer
JP5809098B2 (ja) * 2012-04-17 2015-11-10 日本電信電話株式会社 光送信モジュール
JP2015225980A (ja) * 2014-05-28 2015-12-14 日立金属株式会社 光通信モジュール及びその製造方法
US10931080B2 (en) 2018-09-17 2021-02-23 Waymo Llc Laser package with high precision lens
JP7431553B2 (ja) * 2019-10-16 2024-02-15 パナソニックホールディングス株式会社 半導体レーザ装置
JP7407602B2 (ja) * 2020-01-16 2024-01-04 古河電気工業株式会社 発光装置、光源ユニット、光源装置、および光ファイバレーザ
US20230110167A1 (en) * 2020-02-03 2023-04-13 Panasonic Holdings Corporation Semiconductor laser device
JP7382871B2 (ja) * 2020-03-24 2023-11-17 新光電気工業株式会社 半導体パッケージ用ステム、半導体パッケージ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228112A (ja) * 1987-03-17 1988-09-22 Matsushita Electric Ind Co Ltd 半導体レ−ザ・光フアイバ結合モジユ−ル
EP0373225B1 (de) * 1988-03-22 1994-12-14 Fujitsu Limited Optische halbleiteranordung und deren herstellung
JPH03100506A (ja) * 1989-09-13 1991-04-25 Hitachi Ltd 光結合装置及び光部品
JPH03120884A (ja) * 1989-10-04 1991-05-23 Hitachi Ltd 半導体レーザモジュール
JPH03228004A (ja) * 1990-02-02 1991-10-09 Hitachi Ltd レーザダイオード結合装置
JP2917413B2 (ja) * 1990-05-23 1999-07-12 ソニー株式会社 固体レーザー発振器
JP3245838B2 (ja) * 1992-02-03 2002-01-15 住友電気工業株式会社 半導体レーザ装置
JPH04355706A (ja) * 1991-06-03 1992-12-09 Oki Electric Ind Co Ltd 半導体レーザモジュール
US5420722A (en) * 1993-10-25 1995-05-30 Creo Products Inc. Self-registering microlens for laser diodes
JPH0810289A (ja) * 1994-07-04 1996-01-16 Mitsubishi Steel Mfg Co Ltd 床ずれ予防用マットレス
JPH0823138A (ja) * 1994-07-07 1996-01-23 Matsushita Electron Corp 半導体レーザモジュール

Also Published As

Publication number Publication date
JP2828025B2 (ja) 1998-11-25
JPH09269439A (ja) 1997-10-14
US6101202A (en) 2000-08-08
EP0800243A2 (de) 1997-10-08
DE69702562T2 (de) 2001-03-08
EP0800243A3 (de) 1998-07-01
US5995525A (en) 1999-11-30
EP0800243B1 (de) 2000-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee