[go: up one dir, main page]

DE60236931D1 - Präzisions-substratspeicherbehälter und halteglied dafür - Google Patents

Präzisions-substratspeicherbehälter und halteglied dafür

Info

Publication number
DE60236931D1
DE60236931D1 DE60236931T DE60236931T DE60236931D1 DE 60236931 D1 DE60236931 D1 DE 60236931D1 DE 60236931 T DE60236931 T DE 60236931T DE 60236931 T DE60236931 T DE 60236931T DE 60236931 D1 DE60236931 D1 DE 60236931D1
Authority
DE
Germany
Prior art keywords
contacting part
shaped
parts
holding member
storage container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60236931T
Other languages
English (en)
Inventor
Toshitsugu Yajima
Masato Hosoi
Hideo Kudo
Takashi Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Application granted granted Critical
Publication of DE60236931D1 publication Critical patent/DE60236931D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Manipulator (AREA)
DE60236931T 2001-05-30 2002-05-30 Präzisions-substratspeicherbehälter und halteglied dafür Expired - Lifetime DE60236931D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001161773A JP3938293B2 (ja) 2001-05-30 2001-05-30 精密基板収納容器及びその押さえ部材
PCT/JP2002/005274 WO2002097879A1 (fr) 2001-05-30 2002-05-30 Recipient de stockage de substrat de precision et son element de retenue

Publications (1)

Publication Number Publication Date
DE60236931D1 true DE60236931D1 (de) 2010-08-19

Family

ID=19004998

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60236931T Expired - Lifetime DE60236931D1 (de) 2001-05-30 2002-05-30 Präzisions-substratspeicherbehälter und halteglied dafür

Country Status (8)

Country Link
US (1) US7017749B2 (de)
EP (1) EP1394850B1 (de)
JP (1) JP3938293B2 (de)
KR (1) KR100890884B1 (de)
AT (1) ATE473517T1 (de)
DE (1) DE60236931D1 (de)
TW (1) TWI272690B (de)
WO (1) WO2002097879A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283621B (en) 2002-12-02 2007-07-11 Miraial Co Ltd Thin plate storage container
JP4133407B2 (ja) 2003-02-13 2008-08-13 ミライアル株式会社 薄板収納容器
JP4146718B2 (ja) 2002-12-27 2008-09-10 ミライアル株式会社 薄板支持容器
JP4681221B2 (ja) * 2003-12-02 2011-05-11 ミライアル株式会社 薄板支持容器
WO2005112535A1 (ja) * 2004-05-13 2005-11-24 Matsushita Electric Industrial Co., Ltd. 部品供給用プレート収容体及び部品供給装置
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
WO2006035894A1 (ja) * 2004-09-29 2006-04-06 Hoya Corporation 薄膜付基板の支持部材、薄膜付基板の収納容器、マスクブランク収納体、転写マスク収納体、及び薄膜付基板の輸送方法
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
JP2006269771A (ja) * 2005-03-24 2006-10-05 Miraial Kk 気密容器
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
KR100693937B1 (ko) * 2005-10-13 2007-03-12 정자훈 멀티미디어 기능 강의대용 커버개폐레일장치
JP4827500B2 (ja) * 2005-11-16 2011-11-30 信越ポリマー株式会社 梱包体
US8528738B2 (en) * 2006-06-13 2013-09-10 Entegris, Inc. Reusable resilient cushion for wafer container
US7967147B2 (en) * 2006-11-07 2011-06-28 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20080157455A1 (en) * 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
TWM356220U (en) 2007-08-08 2009-05-01 E Pak International Inc Container
US7967146B2 (en) * 2007-08-08 2011-06-28 E.Pak International, Inc. Container
US8356713B2 (en) 2007-11-09 2013-01-22 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
JP4764865B2 (ja) * 2007-11-13 2011-09-07 信越ポリマー株式会社 リテーナ及び基板収納容器
JP4852023B2 (ja) * 2007-11-19 2012-01-11 信越ポリマー株式会社 リテーナ及び基板収納容器
JP5153399B2 (ja) * 2008-03-19 2013-02-27 三洋電機株式会社 基板ケース及び処理方法
EP2270847A4 (de) 2008-04-25 2012-12-19 Shinetsu Polymer Co Halter und substratspeicherungsbehälter mit diesem halter
JP5160298B2 (ja) * 2008-05-08 2013-03-13 信越ポリマー株式会社 基板収納容器
JP2009283537A (ja) * 2008-05-20 2009-12-03 Shin Etsu Polymer Co Ltd 基板収納容器
JP5279372B2 (ja) * 2008-07-07 2013-09-04 信越ポリマー株式会社 処理治具用の収納ケース
TWI337162B (en) * 2008-07-31 2011-02-11 Gudeng Prec Industral Co Ltd A wafer container with constraints
TWI384577B (zh) * 2008-07-31 2013-02-01 Gudeng Prec Industral Co Ltd 門上凹陷區域兩旁配置有晶圓限制件模組之前開式晶圓盒
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
TWI400766B (zh) * 2008-08-27 2013-07-01 Gudeng Prec Industral Co Ltd 具一體成形晶圓限制件模組之前開式晶圓盒
TWI343353B (en) * 2008-11-04 2011-06-11 Gudeng Prec Industral Co Ltd A wafer container having the snap-fitting constraint module
US20100282695A1 (en) * 2008-11-05 2010-11-11 Mark Sandifer High strength camfer on quartzware
JP2011018771A (ja) * 2009-07-09 2011-01-27 Shin Etsu Polymer Co Ltd 基板収納容器
US9472431B2 (en) 2010-03-11 2016-10-18 Entegris, Inc. Thin wafer shipper
JP5441797B2 (ja) * 2010-04-05 2014-03-12 信越ポリマー株式会社 リテーナ及び基板収納容器
JP5483351B2 (ja) * 2010-06-17 2014-05-07 信越ポリマー株式会社 基板収納容器
WO2012054627A2 (en) * 2010-10-19 2012-04-26 Entegris, Inc. Front opening wafer container with wafer cushion
KR101411367B1 (ko) 2012-01-17 2014-06-27 비아이 이엠티 주식회사 웨이퍼 카세트용 쿠션
US9099514B2 (en) 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
EP2837024B1 (de) * 2012-04-09 2020-06-17 Entegris, Inc. Waferträger
US9633877B2 (en) 2012-05-04 2017-04-25 Entegris, Inc. Wafer container with door mounted shipping cushions
JP6177248B2 (ja) * 2012-10-12 2017-08-09 ミライアル株式会社 基板収納容器
WO2014057573A1 (ja) * 2012-10-12 2014-04-17 ミライアル株式会社 蓋体側基板支持部の汚染を抑制する基板収納容器
TWM453240U (zh) * 2013-01-10 2013-05-11 Gudeng Prec Ind Co Ltd 具有保護套的限制件
US9304690B2 (en) 2014-05-07 2016-04-05 HGST Netherlands B.V. System and method for peer-to-peer PCIe storage transfers
JP6391333B2 (ja) * 2014-07-10 2018-09-19 ミライアル株式会社 基板収納容器及びリテーナ
KR20160033910A (ko) * 2014-09-19 2016-03-29 삼성전자주식회사 리테이너 및 이를 포함하는 웨이퍼 캐리어
JP6430195B2 (ja) * 2014-09-29 2018-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器
KR101986924B1 (ko) 2014-12-18 2019-06-07 엔테그리스, 아이엔씨. 충격 상태 보호부를 갖는 웨이퍼 용기
JP6369687B2 (ja) * 2015-01-07 2018-08-08 信越ポリマー株式会社 基板収納容器
JP2016149492A (ja) * 2015-02-13 2016-08-18 ミライアル株式会社 基板収納容器
TWM510539U (zh) * 2015-03-13 2015-10-11 Entegris Inc 使用於膜架傳送裝置的修改彈簧墊
WO2016154536A1 (en) * 2015-03-25 2016-09-29 Entegris, Inc. Wafer container with cross-slotting protection
SG11201707411QA (en) * 2015-04-10 2017-10-30 Shinetsu Polymer Co Substrate storage container
US11222800B2 (en) * 2017-08-09 2022-01-11 Mtraial Co., Ltd. Substrate storage container
CN107521807B (zh) * 2017-08-31 2019-02-05 重庆旭永科技发展有限公司 一种多用托盘
CN114287055A (zh) * 2019-07-19 2022-04-05 恩特格里斯公司 晶片缓冲器
JP7313975B2 (ja) * 2019-08-27 2023-07-25 信越ポリマー株式会社 基板収納容器
CN115605412A (zh) * 2020-05-19 2023-01-13 未来儿股份有限公司（Jp） 基板收纳容器
WO2024252672A1 (ja) * 2023-06-09 2024-12-12 ミライアル株式会社 基板収納容器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5273159A (en) * 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
JP2908985B2 (ja) * 1994-07-19 1999-06-23 信越ポリマー株式会社 ウェーハ収納容器のウェーハ抑え
JPH08204356A (ja) * 1995-01-27 1996-08-09 Mitsubishi Electric Corp 電子機器筺体の防水構造
JP2779143B2 (ja) 1995-03-17 1998-07-23 信越ポリマー株式会社 半導体ウェーハ収納容器
JP3968142B2 (ja) * 1997-02-20 2007-08-29 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 包装容器における半導体ウェハの支持溝構造
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
EP0998177B1 (de) * 1998-10-30 2007-04-18 Bridgestone Corporation Abgedichtete Deckel und deren Herstellungsverfahren
JP3556519B2 (ja) * 1999-04-30 2004-08-18 信越ポリマー株式会社 基板収納容器の識別構造及び基板収納容器の識別方法

Also Published As

Publication number Publication date
JP3938293B2 (ja) 2007-06-27
WO2002097879A1 (fr) 2002-12-05
JP2002353301A (ja) 2002-12-06
EP1394850A1 (de) 2004-03-03
KR20030022279A (ko) 2003-03-15
TWI272690B (en) 2007-02-01
US20030221985A1 (en) 2003-12-04
EP1394850A4 (de) 2006-03-08
KR100890884B1 (ko) 2009-03-31
ATE473517T1 (de) 2010-07-15
EP1394850B1 (de) 2010-07-07
US7017749B2 (en) 2006-03-28

Similar Documents

Publication Publication Date Title
DE60236931D1 (de) Präzisions-substratspeicherbehälter und halteglied dafür
ATE533186T1 (de) Halbleiteranordnung und optische vorrichtung
FI972213A0 (fi) Displayarrangemang och terminal med tvao displayn
BR9815561A (pt) Dispositivo pegador e processo de fabricar o mesmo
ATE327311T1 (de) Photobleichsprenkel und es enthaltende waschmittel
DE60236397D1 (de) Enzym-Biosensor
DE60324869D1 (de) Verstärkungsbauteil
ATE260389T1 (de) Bausatz mit platten- oder leistenförmigen bauteilen und klammer hierfür
NO302026B1 (no) Funksjonaliserte fotoinitiatorer, fremgangsmåte for fremstilling av disse, makromerer derav, materiale omfattende fotoinitiatoren, fremgangsmåte for modifisering av overflater av substrater samt kontaktlinser omfattende fotoinitiatoren
DE50212494D1 (de) Werkstoff aus einem Polyurethan-Gel, Herstellungsverfahren und Verwendungen
TW200709406A (en) Light receiving optical device
WO2003087206A8 (en) Patterned polymeric structures, particularly microstructures, and methods for making same
BR0115098A (pt) Artigo polimérico, e, composição
BR9904412A (pt) Hidrogéis oticamente transparentes e processos para suas produções
ATE498142T1 (de) Optischer film und polarisierendes element
DE60216007D1 (de) Werkstückhalter für eine Augenoptik
DE69806628D1 (de) Herstellung von quarzglasgegenständen mit grosser oberflächenreinheit
FR2819897B1 (fr) Preforme de lentille ophtalmique
DE60008825D1 (de) Ventil für hydroelastisches Lager
HU0201837D0 (de)
EP1231624A3 (de) Kathodenstrahlröhre mit Schwingungsdämpfer für eine gespannte Maske
EA200300370A1 (ru) Оптический диск
FR2797264B1 (fr) Compositions polymerisables pour la fabrication de substrats polymeres transparents, substrats polymeres transparents obtenus et leurs applications dans l'optique
EP1310682A3 (de) Halterung für sphärische und flache Gegenstände
FR2810331B1 (fr) Solution concentree a base de polyamide, son utilisation dans des procedes de fabrication de compositions a base de polyamide et compositions obtenues