1337162 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶圓盒，特別是關於一種具有晶圓限制件 (wafer constraint)之晶圓盒，上述晶圓限制件係具有複數個接觸端 用以穩固地限制晶圓的移動。 【先前技術】 半導體晶圓由於需經過各種不同流程的處理且需配合製程 设備，因此會被搬運到不同的工作站。為了方便晶圓的搬運且避 免受到外界的污染，常會利用一密封容器以供自動化設備輸送。 請參考第1圖所示，係習知技術之晶圓盒示意圖。此晶圓盒是一 種前開式晶圓盒(Front Opening Unified Pod, FOUP)，係具有一盒 體10及一門體20，盒體1〇内部係設有複數個插槽n可水平容 置複數個晶圓，且在盒體1 〇的一側面係具有一開口 i 2可供晶圓 的載出及載入’而門趙20具有一個外表面21及一個内表面22, 門雜20係藉由内表面22與盒體1 〇的開口 12相結合，用以保護 盒體10内部的複數個晶圓。此外，在門體2〇的外表面21上配置 至少一個門閂裝置23，用以開啟或是封閉前開式晶圓盒。在上述 前開式晶圓盒中’由於半導體晶圓係水平地置於盒體1〇内部，因 此’在前開式晶圓盒搬運過程中需有一晶圓限制件（wafer constraint) ’以避免晶圓因震動而產生異位或往盒體的開口方 向移動》 請參考第2圖所示’係習知一種晶圓限制件於限制晶圓時之 剖面示意圖》晶圓限制件丨〇〇係設置於門體2〇其内表面22二排 穿孔(0Pening)0中，俾利用複數個左右對稱的晶圓限制件100之 彈力臂110個別頂持於各個晶圓片上，以避免晶圓在傳送過程中 5 1337162 因震動而異位或往盒體10之開口方向移動。然而，上述結構需在 門體20内表面22上開設二排穿孔0且又在晶圓限制件丨〇〇上增 ό又插栓110P與圓形環以插設的方式固定於穿孔〇内。如此構造 在製造、組裝均顯複雜且挖設複數個穿孔〇易造成氣密不良以及 成為門體20清洗烘乾時之死角。此外，上述前案的每一個晶圓限 制件100僅忐&供一支樓點於晶圓，顯得較不穩固且其限制晶圓 的方向主要係集中於開口方向的正中央處，這些都會造成晶圓與 晶圓限制件100之間產生摩擦而產生微粒粉塵、污染晶圓。 【發明内容】 依據先刚技術之晶圓盒其晶圓限制件結構複雜且容易造成氣 在、不良及微粒粉塵等問題，本發明之一主要目的在於提供一種具 晶圓限制件之晶圓盒，此晶圓盒其晶圓限制件係置於門體内表面 接近中央處兩旁，其中每一個晶圓限制件係具有複數個接觸端， 除了能避免晶圓因震動而產生異位或往開口方向正中央移動外， 也能限制往開口較兩側邊的方向移動，可避免晶圓與晶圓限制件 之間產生摩擦而產生微粒粉塵、污染晶圓。 本發明之另一主要目的在於提供一種具晶圓限制件之晶圓 益，此晶圓盒其晶圓限制件係置於門體内表面接近中央處兩旁， 其令每一個晶圓限制件係具有複數個接觸端，上述複數個接觸端 係依序與晶圓產生接觸，藉此提供較穩定的支撐，避免晶圓與晶 圓限制件之間產生摩擦而產生微粒粉塵、污染晶圓。 本發明之又另一主要目的在於提供一種具晶圓限制件之晶 圓盒，此晶圓盒其晶圓限制件係置於門體内表面接近中央處兩 旁，其中晶圓限制件係與門體内表面一體成形，除了結構簡單外， 製作所需的成本也較低。 為達上述之各項目的，本發明揭露一種具晶圓限制件之晶圓 6 1337162 盒，包括一盒體及一門體，在盒體的内部係設有複數個插槽以容 置複數個晶圓，且在盒體的其中一侧面係有一開口可供晶圓的輸 入及輸出，而在Η體的内表面接近中央處係配置有兩排形成間隔 排列並對齊的複數個晶圓限制件，其中每一個晶圓限制件係具有 一基部，基部之一端係固定於門體的内表面上，而其另一端與— 曲臂連接，其中曲臂具有-第—接觸端及—第二接觸端使晶圓限 制件可依序利用上述第—接觸端及第二接觸端來限制晶圓往開口 方向正中央及開口較兩側邊的方向移動。1337162 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer cassette, and more particularly to a wafer cassette having a wafer constraint, the wafer restriction having a plurality of contacts The end is used to firmly limit the movement of the wafer. [Prior Art] Semiconductor wafers are transported to different workstations because they need to be processed through various processes and need to be matched with process equipment. In order to facilitate wafer handling and avoid external pollution, a sealed container is often used for automated equipment delivery. Please refer to Figure 1 for a schematic view of a wafer cassette of the prior art. The wafer cassette is a Front Opening Unified Pod (FOUP) having a box body 10 and a door body 20, and the box body 1 is internally provided with a plurality of slots n for horizontally accommodating a plurality of The wafer has an opening i 2 on one side of the casing 1 for the loading and loading of the wafer. The door 20 has an outer surface 21 and an inner surface 22, and the door 20 is The inner surface 22 is combined with the opening 12 of the casing 1 to protect a plurality of wafers inside the casing 10. Further, at least one latch device 23 is disposed on the outer surface 21 of the door body 2 to open or close the front opening wafer cassette. In the above-mentioned front-opening wafer cassette, 'because the semiconductor wafer is horizontally placed inside the casing 1', it is necessary to have a wafer constraint during the front opening wafer cassette handling process to avoid wafers. Eccentricity due to vibration or movement in the direction of the opening of the case" Please refer to Figure 2 for a schematic view of a wafer restriction member for limiting the wafer. The door body 2 has two rows of perforations (0Pening) 0 on its inner surface 22, and the elastic arms 110 of the plurality of symmetrical wafer restriction members 100 are individually supported on the respective wafers to prevent the wafers from being transferred during the process. 5 1337162 Eccentric due to vibration or moving toward the opening of the casing 10. However, the above structure requires two rows of perforations 0 to be formed on the inner surface 22 of the door body 20, and is further enlarged on the wafer restriction member, and the plug 110P and the circular ring are fixedly inserted into the perforated crucible. Such a structure is complicated in manufacturing and assembly, and a plurality of perforations are excavated to cause airtightness and a dead angle when the door body 20 is cleaned and dried. In addition, each of the wafer restriction members 100 of the above-mentioned prior case is only 忐& for a building to be located on the wafer, which is less stable and restricts the direction of the wafer mainly in the center of the opening direction, which will be This causes friction between the wafer and the wafer limiter 100 to generate particulate dust and contaminate the wafer. SUMMARY OF THE INVENTION According to the prior art wafer cassette, the wafer restriction member has a complicated structure and is prone to cause problems such as gas, defects, and particulate dust. One of the main objects of the present invention is to provide a wafer cassette with a wafer restriction member. The wafer cassette has its wafer limiting member placed on the inner surface of the door near the center, wherein each wafer limiting member has a plurality of contact ends, in addition to avoiding the wafer from being ectopic or opening due to vibration. In addition to the central movement of the direction, it is also possible to restrict the movement toward the sides of the opening, thereby avoiding friction between the wafer and the wafer restriction member to generate particulate dust and contaminate the wafer. Another main object of the present invention is to provide a wafer defect having a wafer restriction member placed on the inner surface of the door near the center, which makes each wafer restriction member The plurality of contact ends are sequentially brought into contact with the wafer, thereby providing relatively stable support, preventing friction between the wafer and the wafer restriction member to generate particulate dust and contaminating the wafer. Still another main object of the present invention is to provide a wafer cassette having a wafer restriction member, the wafer restriction member being disposed on both sides of the inner surface of the door near the center, wherein the wafer restriction member and the door are The inner surface of the body is integrally formed, and in addition to the simple structure, the cost required for production is also low. In order to achieve the above objects, the present invention discloses a wafer 6 1337162 cartridge having a wafer restriction member, comprising a casing and a door body, and a plurality of slots are arranged inside the casing to accommodate a plurality of crystals. Round, and one of the sides of the casing has an opening for the input and output of the wafer, and the inner surface of the body is disposed near the center with two rows of spacers arranged and aligned. Each of the wafer limiting members has a base, one end of the base is fixed to the inner surface of the door body, and the other end is connected to the crank arm, wherein the crank arm has a - contact end and a second contact end The wafer limiting member can sequentially use the first contact end and the second contact end to restrict the movement of the wafer in the center of the opening direction and the opening in the direction of the two sides.
【實施方式】 為令本發明所運用之技術内容、發明目的及其達成之功效有 更完整且清楚的揭露，茲於下詳細說明之，並請__併參閱所揭之 圖示及圖號：[Embodiment] For a more complete and clear disclosure of the technical content, the object of the invention and the effects thereof achieved by the present invention, the following is a detailed description, and please refer to the illustrated figure and figure number. :
首先，請參閱第3圖所示，係本發明之第—種晶圓盒之示意 圖。此晶圓盒係-種前開式晶圓盒，主要係包括一盒體1〇及_^ 體 纟里體10的内部係設有複數個插槽11以容置複數個晶 圓且在Α體10的其中一個側面係有一開口 12可提供晶圓的輸 入以及輸出’而門體20則是具有一外表面21及一内表面22，門 體20的外表面21係配置至少一個門閃裝置（未顯示於圖中），用 以開啟或是封閉前開式晶圓盒，而在門體20内表面22約中間處 配置有兩排晶圓限制件模組彻，每一排晶圓限制件模組彻由 間隔排列之晶圓限制件4()所組成，且每—該晶圓限制件 與相鄰之晶圓限制件模組働上之每一晶圓限制件切對齊。 圓2ΓΑ圖所示’上述複數個晶圓限制件4G其中的每一個晶 的:矣4〇白係具有一基部41 ’基部41的一端係固定於門體20 一笛一面22上’而其另一端與-曲臂42連接’其中曲臂42具有 接觸端43及一第二接觸端44。而每一個晶圓限制件40可 7 以係-體成形的彈性結構（例如：执塑 2第二T則連線⑷，門體2。 =3 此時’晶圓係先跟第一垃艇以 z立相十仃。 43時，會使基部41產 =接觸’當晶圓接觸第—接觸端 另一接觸端即第二接觸H横桿帶動曲臂42’使曲臂42上的 所示，門體20係與盒體1〇 ^地接觸晶圓。此時’如第4B圖 ：4； 生:觸H:::個晶圓限制件4。係以兩個接觸端與晶圓產 觸除了犯限制晶圓往開口方向正中央移 圓往開口較兩旁的方向移動。 乜此挺t、日曰 上述晶圓限制件40其基部41與曲臂42也可 ^材質或祕結構（例如：_轉性結構），像是不同硬度的^ 膠’使基部41可以產生較大的形變而曲f 42係較不容易形變， 错此晶圓限制件4G下半部可提供良好的形變而上半部則提供穩 ，的槓桿曲臂。而將晶圓限制件4〇或晶圓限制件4〇其基部W 女排為彈性結構（例如：熱塑性彈性結構），除了可達到形變以使 第-接觸端43及第二接觸端44依序與晶圓接觸外，此彈性結構 亦有吸震的功效，可避免晶圓因突然的震動而產生異位或往盒體 =的開口方向移動…基部41係至少具有一 f曲部因此， 當晶圓-接觸第-接觸端43時’基部41的.f曲部其角度會改變 進而帶動曲臂42’可使第二接觸端44依序地接觸晶圓。而第一 接觸端43及第二接觸端44亦可以係具有一凹陷，可以使晶圓陷 入凹陷中，避免晶圓上下移動。而上述複數個晶圓限制件4〇可 以係形成於一底座，且此底座係固定於門體2〇的内表面22。當 然，複數個晶圓限制件40也可以係跟門體2〇的内表面22直接一 8 1337162 體成形’如此可降低生產所需的成本β 其次，請參閱第5圖所示，係本發明之第二種晶圓盒之示意 圖。此前開式晶圓盒與上述第一種晶圓盒相同，係包含一盒體i 〇 及一門體20,不同的是固定於門體2〇内表面22 _間處兩旁的晶 圓限制件模組500其晶圓限制件50係具有三個接觸端。First, referring to Fig. 3, there is shown a schematic view of a first type of wafer cassette of the present invention. The wafer cassette is a front opening type wafer cassette, which mainly comprises a box body 1 and a body lining body 10 is internally provided with a plurality of slots 11 for accommodating a plurality of wafers and in the body One of the sides of the 10 has an opening 12 for providing input and output of the wafer. The door 20 has an outer surface 21 and an inner surface 22. The outer surface 21 of the door 20 is provided with at least one door flash device. Not shown in the figure), used to open or close the front open wafer cassette, and two rows of wafer limiter modules are arranged in the middle of the inner surface 22 of the door body 20, and each row of wafer limiter molds The assembly consists of spaced-apart wafer limit members 4 (), and each of the wafer limit members is aligned with each of the wafer limit members on the adjacent wafer limiter module. Each of the above plurality of wafer restriction members 4G is shown in a circle: FIG. 4A has a base portion 41' and one end of the base portion 41 is fixed to the door body 20 on one side 22 of the flute. One end is connected to the -bend arm 42' wherein the crank arm 42 has a contact end 43 and a second contact end 44. And each of the wafer restriction members 40 can be formed into a body-formed elastic structure (for example, plastic 2, second T, and wire (4), door body 2. = 3 at this time, the wafer system is first with the first boat. At z ́s time, the base 41 is produced = contact 'when the wafer contacts the other end of the contact end, that is, the second contact H cross-bar drives the curved arm 42' to make the curved arm 42 The door body 20 is in contact with the wafer 1 to the wafer. At this time, as shown in FIG. 4B: 4; the raw: touch H::: one wafer restriction member 4. The two contact ends are formed by the wafer. In addition, the wafer is moved in the direction of the opening in the direction of the opening, and the opening is moved in the direction of the opening. In this case, the base portion 41 and the curved arm 42 of the above-mentioned wafer restriction member 40 can also be made of materials or secret structures (for example, :_Transitive structure), such as rubber of different hardness, so that the base 41 can produce a large deformation and the curved portion 42 is less susceptible to deformation, and the lower half of the wafer limiting member 4G can provide a good deformation. The upper part provides a stable lever arm, and the wafer restriction member 4 or the wafer restriction member 4 has its base portion W female body as an elastic structure (for example, a thermoplastic elastic structure). In addition to the deformation so that the first contact end 43 and the second contact end 44 are sequentially in contact with the wafer, the elastic structure also has the shock absorbing effect, which can prevent the wafer from being ectopic or moving toward the box due to sudden vibration. The opening direction of the body=the base 41 has at least one f-curve. Therefore, when the wafer-contacts the first-contact end 43, the angle of the .f curvature of the base 41 changes, thereby driving the curved arm 42'. The two contact terminals 44 sequentially contact the wafer, and the first contact end 43 and the second contact end 44 may also have a recess to trap the wafer in the recess to prevent the wafer from moving up and down. The limiting member 4 can be formed on a base, and the base is fixed to the inner surface 22 of the door body 2. Of course, the plurality of wafer limiting members 40 can also be directly connected to the inner surface 22 of the door body 2 1337162 Body Forming 'This can reduce the cost required for production. Next, please refer to Figure 5, which is a schematic view of a second type of wafer cassette of the present invention. The previously opened wafer cassette and the above first wafer cassette The same, including a box i 〇 and a door 20, the difference is solid _ 22 between the inner surface of the door body 2〇 both sides of the circular crystal wafer limiting member which limits module 500 based member 50 having three contact end.
如第6A圖所示，每一個晶圓限制件5〇係具有一基部5丨，基 部51的一端係固定於門體2〇的内表面22上，而其另一端係與一 第曲孑52連接，此第一曲臂52具有二自由端，其中較接近中 央處的自由端形成一第一接觸端54，而較遠離中央處的另一自由 知係更進一步與一第二曲臂53連接，第二曲臂53則係具有一第 二接觸端55及-第三接觸端56。此實施例與上一個實施例的材 質、結構及動作原理類似，當門體2〇與盒體1〇未結合或剛要結 合時’晶圓限制件50的第一接觸端54、第二接觸端乃及第三接 觸端56的連線（54_55·56)係跟門體2〇的内側面22互相平行。此 時’晶圓係先跟第一接觸端54接觸’當晶圓接觸第一接觸端Μ 時，會使基部51產生形變且槓桿帶動第一曲臂52及第二曲臂 53’使第二曲臂53上的第二接觸端55及第三接觸端“依序地接 觸晶圓。此時’如第6Β圖所示’門體2〇係與盒體1〇密合且晶 圓限制件5〇的第-接觸端54、第二接觸端55及第三接觸端56 的連線(54 55·56)跟門體2G的内表面22形成-夾角。很明顯的， 由於每一個晶圓限制件50係提供三個接觸端於晶圓，係可較穩固 也限制ΒΒ圓往開〇方向正中央移動或開口較兩旁的方向移動。當 然’本實施例亦可以在第—曲f 52的二個自由端之間並且靠近門 、内表面22的一侧邊上配置有一拖紐57，此樞紐57係固定 笾二體:〇内表面22,如此當基部51形變時可較穩固地槓桿帶動 煮2及第一曲臂53,使第一接觸端54、第二接觸端55 9 1337162 及第-接觸4 56 H緊密的與晶圓接觸。而如同前述兩個接觸端 之實施例，此複數個晶圓限制件5G其中的每_個晶圓限制件5〇 可以係一體成形的彈性結構（例如··熱塑性彈性結構），其基部51 與第一曲臂52或第二曲臂53亦可以係不同材質或彈性結構（例 如.熱塑性彈性結構）’像是不同硬度的塑膠，可使基部51有較 大的形變而曲臂係較不容易形變。當然，第一接觸端M、第二接 觸鈿55及第二接觸端56亦可以具有一凹陷，可以使晶圓陷入凹 陷t，避免晶圓上下移動。而上述複數個晶圓限制件5〇亦可以 係先形成於一底座，而此底座係固定於門體2〇的内表面22或複 數個晶圓限制件50直接係跟門體20的内表面22直接一體成形。 接著，請參閲第7圖所示，係本發明之第三種晶圓盒之示意 圖，此前開式晶圓盒其門體20之内表面22接近中央處配置有一 限制件模組600，限制件模組6〇〇係由複數個晶圓限制件6〇間隔 排列形成。如第8 A圖及8B圖所示，由於此複數個晶圓限制件 60其中的每一個晶圓限制件60係具有彈性，因此當晶圓一開始 接觸晶圓限制件60時（第8A圖）係僅有些微的面積有跟晶圓接 觸，而當門體20與盒體1 〇密合時（第8B圖），晶圓限制件60產 生形變使晶圓與晶圓限制件60之間的接觸面積變大或變多。 如第9圖及第10圖所示，複數個晶圓限制件6〇係間隔排列 於一底座61上’以形成一晶圓限制件模組6〇(^此底座61係具 有複數個安裝孔63 ’而内表面22上相對於這些個安裝孔63處則 有突出柱24，使晶圓限制件模組600以卡入（snap on)的方式固定 於門體20的内表面22中央處。而在底座61的中央處係具有複數 個晶圓限制件60，相鄰的晶圓限制件60之間係具有間隙，使晶 圓限制件60可以對應盒體10内相對的晶圓。上述每一個晶圓限 制件60係由底座61的中央處向兩側各形成一贊延部62且每一寶 1337162 延部62其自由端係形成近似半圓形的凸出部62C，以藉由此半圓 形的凸出4 62C之中央導槽62G與晶圓接觸。中央導槽62G與晶 圓接觸的地方可以表面包覆一種财磨耗材（例如：ρΕΕκ材質），以 減少摩擦及微粒粉塵的產生。此外，中央導槽62G的寬度可以跟 晶圓的厚度相同，可讓晶圓陷入此中央導槽62G中，以避免晶圓 的上下移動。很明顯的’上述底座61跟彎延部Μ係形成一角度 Θ，此角度可則系10〜60度，當角度越小，左右兩中央導槽62g 的距離會越遠，可提供較開σ往外側方向的限制，而角度越大時， 限制的方向係集中於開口方向的正中央。 雖然本發明以前述之較佳實施例揭露如上，然、其並非用以限 =發明’任何熟習相像技藝者，在不脫離本發明之精神和範圍 ，當可作些許之更動與潤飾’因此本發明之專利保護範圍須視 本說明書所狀中請專職圍所界定者為準。 【圖式簡單說明】 第1圖係習知-種晶圓盒之示意囷；As shown in FIG. 6A, each of the wafer restricting members 5 has a base portion 5, one end of the base portion 51 is fixed to the inner surface 22 of the door body 2, and the other end is coupled to a first curve 52. Connected, the first curved arm 52 has two free ends, wherein the free end closer to the center forms a first contact end 54, and the other freely known center is further connected to a second curved arm 53. The second crank arm 53 has a second contact end 55 and a third contact end 56. This embodiment is similar to the material, structure and operation principle of the previous embodiment. When the door body 2 is not bonded or just combined with the case 1 'the first contact end 54 and the second contact of the wafer limiter 50 The connection between the end and the third contact end 56 (54_55·56) is parallel to the inner side 22 of the door body 2〇. At this time, the 'wafer system first contacts the first contact end 54'. When the wafer contacts the first contact end Μ, the base portion 51 is deformed and the lever drives the first crank arm 52 and the second crank arm 53' to make the second The second contact end 55 and the third contact end on the crank arm 53 "contact the wafer sequentially. At this time, as shown in FIG. 6 'the door body 2 is closely adhered to the case body 1 and the wafer restriction member The line connecting the first contact end 54, the second contact end 55 and the third contact end 56 (54 55·56) forms an angle with the inner surface 22 of the door 2G. Obviously, because of each wafer The limiting member 50 is provided with three contact ends on the wafer, which can be relatively stable and also restricts the movement of the circle in the direction of the center of the opening direction or the movement of the opening in both directions. Of course, this embodiment can also be in the first-curve f 52 A drag 57 is disposed between the two free ends and adjacent to the side of the door and the inner surface 22. The hinge 57 is fixed to the inner surface 22 of the crucible, so that when the base 51 is deformed, the lever can be driven more stably. The second and first curved arms 53 are cooked such that the first contact end 54, the second contact end 55 9 1337162 and the first contact 4 56 H are in close contact with the wafer. As with the two embodiments of the two contact ends, each of the plurality of wafer restriction members 5G may be integrally formed with an elastic structure (for example, a thermoplastic elastic structure), and the base portion 51 and the first portion A curved arm 52 or a second curved arm 53 can also be made of different materials or elastic structures (for example, a thermoplastic elastic structure), such as plastics of different hardness, which can make the base 51 have a large deformation and the curved arm is less susceptible to deformation. Of course, the first contact end M, the second contact 钿 55 and the second contact end 56 may also have a recess to trap the wafer into the recess t to prevent the wafer from moving up and down. The plurality of wafer limiting members 5 上述Alternatively, it may be formed on a base that is fixed to the inner surface 22 of the door body 2 or a plurality of wafer restriction members 50 directly formed integrally with the inner surface 22 of the door body 20. Next, please refer to FIG. 7 is a schematic view of a third type of wafer cassette of the present invention. In the prior open wafer cassette, a restriction module 600 is disposed near the center of the inner surface 22 of the door body 20, and the restriction module 6〇 〇 is made up of a plurality of wafer limiters The spacers are formed. As shown in FIGS. 8A and 8B, since each of the plurality of wafer restriction members 60 has elasticity, when the wafer initially contacts the wafer restriction member 60, (Fig. 8A) is only a slight area with wafer contact, and when the door 20 is in close contact with the case 1 (Fig. 8B), the wafer limiter 60 is deformed to limit wafer and wafer. The contact area between the members 60 becomes larger or larger. As shown in FIGS. 9 and 10, a plurality of wafer restriction members 6 are arranged at intervals on a base 61 to form a wafer restriction member module. 6〇(^This base 61 has a plurality of mounting holes 63' and the inner surface 22 has protruding posts 24 relative to the mounting holes 63, so that the wafer limiter module 600 is snapped on. The manner is fixed to the center of the inner surface 22 of the door body 20. At the center of the base 61, there are a plurality of wafer restraints 60, and adjacent wafer restricting members 60 have gaps therebetween, so that the wafer restricting members 60 can correspond to the opposite wafers in the casing 10. Each of the above-mentioned wafer limiting members 60 is formed with a tributary portion 62 from the center of the base 61 to the two sides, and each of the jewels 13371 162 extends to form a substantially semi-circular projection 62C. The central guide groove 62G of the semicircular projection 4 62C is in contact with the wafer. The central guide groove 62G is in contact with the crystal circle to cover a surface of a consumable material (for example, ρΕΕκ material) to reduce friction and particulate dust. In addition, the width of the central guide groove 62G can be the same as the thickness of the wafer, so that the wafer can be trapped in the central guide groove 62G to prevent the wafer from moving up and down. Obviously, the above-mentioned base 61 forms an angle 跟 with the curved portion, and the angle may be 10 to 60 degrees. When the angle is smaller, the distance between the left and right central guide grooves 62g will be longer, and the opening σ can be provided. The restriction to the outer direction, and the larger the angle, the direction of the restriction is concentrated in the center of the opening direction. While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to be limited to the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection of the invention shall be subject to the definition of full-time enclosure in the context of this specification. [Simple description of the drawing] Fig. 1 is a schematic diagram of a conventional wafer cassette;
制晶圓時之剖面示意圖； 货a之第一種晶圓盒之示意圖； 意圖；圖係'本發明之第—種晶圓盒其晶圓限制件剛接觸晶圓之示Schematic diagram of the wafer forming process; schematic diagram of the first type of wafer cassette of the product; intention; diagram of the first type of wafer cassette of the invention, the wafer restriction member just touches the wafer
第5圖係本發明之第_ 之示 種曰a圓盒其晶圓限制件於限制晶圓 弟一種日日圓盒之示意圖； 第6A圖係本發明之笛a 意圖； —種曰曰圓盒其晶圓限制件剛接觸晶圓之亓 第6B圖係本發明之 意圖； 一日日圓益其晶圓限制件於限制晶圓之亓 1337162 第7圖係本發明之第三種晶圓盒之示意圖； 第8 A圖係本發明之第三種晶圓盒其晶圓限制件剛接觸晶圓之示 意圖； 第8B圖係本發明之第三種晶圓盒其晶圓限制件於限制晶圓之示 意圖； 第9圖係本發明之第三種晶圓盒其晶圓限制件固定於門體之示意 圖；及 第10圖係本發明之第三種晶圓盒其晶圓限制件之示意圖。 【主要元件符號說明】 10 盒體 11 插槽 12 開口 20 門體 21 外表面 22 内表面 24 突出柱 400 限制件模組 40 限制件 41 基部 42 曲臂 43 第一接觸端 44 第二接觸端 12 1337162Figure 5 is a schematic view of the first embodiment of the present invention, wherein the wafer restriction member is used to limit the wafer holder of a Japanese yen box; the sixth embodiment is the intent of the present invention; The invention is intended to be in contact with the wafer. Figure 6B is the intention of the present invention; one day the wafer is limited to the wafer after the restriction of the wafer 1371162 Figure 7 is the third wafer cassette of the present invention Figure 8A is a schematic view of a third type of wafer cassette of the present invention, the wafer restriction member is just in contact with the wafer; and Figure 8B is a third type of wafer cassette of the present invention, the wafer restriction member is limited to the wafer FIG. 9 is a schematic view showing a third wafer cassette of the present invention in which a wafer restriction member is fixed to a door; and FIG. 10 is a schematic view showing a wafer restriction member of a third wafer cassette of the present invention. [Main component symbol description] 10 Box 11 Slot 12 Opening 20 Door body 21 External surface 22 Inner surface 24 Projection column 400 Restrictor module 40 Restricting member 41 Base portion 42 Arm 43 First contact end 44 Second contact end 12 1337162
500 限制件模組 50 限制件 51 基部 52 第一曲臂 53 第二曲臂 54 第一接觸端 55 第二接觸端 56 第三接觸端 57 極紐 600 限制件模組 60 限制件 61 底座 62 彎延部 62C 半圓形的凸出部 62G 中央導槽 63 安裝孔 W 晶圓 13500 Restriction Module 50 Restriction 51 Base 52 First Crank Arm 53 Second Boom 54 First Contact End 55 Second Contact End 56 Third Contact End 57 Pole 600 Restrictor Module 60 Restriction 61 Base 62 Bend Extension 62C semi-circular projection 62G central guide groove 63 mounting hole W wafer 13