201004849 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶圓盒，特別是關於一種具有晶圓限制件 (wafer constraint)之晶圓盒，上述晶圓限制件係具有複數個接觸端 用以穩固地限制晶圓的移動。 【先前技術】201004849 IX. The invention relates to a wafer cassette, and more particularly to a wafer cassette having a wafer constraint, the wafer restriction having a plurality of contacts The end is used to firmly limit the movement of the wafer. [Prior Art]
半導體晶圓由於需經過各種不同流程的處理且需配合製程 設備’因此會被搬運到不同的工作站。為了方便晶圓的搬運且避 免受到外界的污染，常會利用一密封容器以供自動化設備輸送。 請參考第1圖所示，係習知技術之晶圓盒示意圖。此晶圓盒是一 種前開式晶圓盒(Front Opening unified Pod，F0UP)，係具有一盒 體10及一門體20，盒體10内部係設有複數個插槽u可水平容 置複數個晶圓，且在盒體10的一側面係具有一開口 12可供晶圓 的載出及載入，而門體2〇具有一個外表面21及一個内表面22, 門艘20係藉由内表面22與盒體1G的開口 12相結合用以保護 盒體ίο内部的複數個晶圓。此外’在門體2〇的外表面21上配置 至少-個門問裝置23，用以開啟或是封閉前開式晶圓盒。在上述 前開式晶圓盒中，由於半導體晶圓係水平地置於盒體ig内部，因 此’在前開式晶圓盒搬運過程中需有一晶圓限 命 C〇=_’以避免晶圓因震動而產生異位或往盒體W的開 向移動。 凊參考第2圖所示，係習知一種晶 剖面示意圖。晶圓限制件1〇〇係設置於 件於限制晶圓時之 穿孔(Opening)^中，俾利用複數個左=其内表面22二排 彈力臂11〇個別頂持於各個晶圓片上，晶圓限制件⑽之 从避免晶圓在傳送過程中 5 201004849 因震動而異位或往念體i。之開口方向移動。然:而，上述 & 門體20内表面22上開設二排穿孔〇且又在晶圓限料咖 汉插拴11GP與圓形環以料的方式固定於穿孔〇心如二 在製造、組裝均顯複雜且挖設複數個穿孔〇易造成氣 成為門體2〇清洗㈣時之死^此外，上述前案的每 t = = 點於晶圓，顯得一 晶_2:::=;::處’這些都會造成晶圓與 之間產生摩擦而產生微粒粉塵、污染晶圓。 【發明内容】 ，縣前技術之晶圓盒其晶圓限制件結構複雜且容易造 及微粒粉塵等問題，本發明之一主 Ο ==之晶圓*，此晶圓盒其晶圓限制件係置：内= 吟了〜A兩旁’其中每—個晶圓限制件係具有複數個接觸端， 也能Li圓因震動而產生異位或往開口方向正中央移動外， 夕1在開Π較兩側邊的方向移動，可避免晶圓與晶圓限制件 之„而產生微粒粉塵、污染晶圓。 令，本發明之另—主要目的在於提供一種具晶圓限制件之晶圓 日日圓盒其晶圓限制件係置於門體内表面接近中央處兩旁， '母個晶圓限制件係具有複數個接觸端，上述複數個接觸端 係依序與晶圓產生接觸藉此提供較穩定的支推避免晶圓與晶 圓限制件之間產生摩擦而產生微粒粉塵 、污染晶圓。 本發明之又另一主要目的在於提供一種具晶圓限制件之晶 圓瓜’此晶圓盒其晶圓限制件係置於門體内表面接近中央處兩 旁其中晶圓限制件係與門體内表面一體成形，除了結構簡單外， 製作所需的成本也較低》 為達上述之各項目的，本發明揭露一種具晶圓限制件之晶圓 201004849 盒，包括一盒體及一門體，在盒體的内部係設有複數個插槽以容 置複數個晶圓，且在盒體的其中一側面係有一開口可供晶圓的輸 入及輸出，而在門體的内表面接近中央處係配置有兩排形成間隔 排列並對齊的複數個晶圓限制件，其中每一個晶圓限制件係具有 一基部，基部之一端係固定於門體的内表面上，而其另一端與一 曲臂連接，其中曲臂具有一第一接觸端及一第二接觸端使晶圓限 制件可依序利用上述第一接觸端及第二接觸端來限制晶圓往開口 方向正中央及開口較兩側邊的方向移動。 【實施方式】 為令本發明所運用之技術内容、發明目的及其達成之功效有 更完整且清楚的揭露，茲於下詳細說明之，並請一併參閱所揭之 圖不及圖號. 首先，請參閱第3圖所示，係本發明之第一種晶圓盒之示意 圖。此晶圓盒係一種前開式晶圓盒，主要係包括一盒體10及一門 體20，在盒體10的内部係設有複數個插槽11以容置複數個晶 圓，且在盒體10的其中一個側面係有一開口 12可提供晶圓的輸 ® 入以及輸出，而門體20則是具有一外表面21及一内表面22，門 體20的外表面21係配置至少一個門閂裝置（未顯示於圖中），用 以開啟或是封閉前開式晶圓盒，而在門體20内表面22約中間處 配置有兩排晶圓限制件模組400，每一排晶圓限制件模組400由 複數個間隔排列之晶圓限制件40所組成，且每一該晶圓限制件 40與相鄰之晶圓限制件模組400上之每一晶圓限制件40對齊。 如第4A圖所示，上述複數個晶圓限制件40其中的每一個晶 圓限制件40皆係具有一基部41，基部41的一端係固定於門體20 的内表面22上，而其另一端與一曲臂42連接，其中曲臂42具有 一第一接觸端43及一第二接觸端44。而每一個晶圓限制件40可 201004849 以係一體成形的彈性結構(例如：熱塑性彈性結構），當門體20與 盒體10未結合或剛要結合時，晶圓限制件40的第一接觸端43 及第二接觸端44的連線(43-44)跟門體20的内表面22互相平行。 此時，晶圓係先跟第一接觸端43接觸，當晶圓接觸第一接觸端 43時，會使基部41產生形變且槓桿帶動曲臂42，使曲臂42上的 另一接觸端即第二接觸端44依序地接觸晶圓。此時，如第4B圖 所示，門體20係與盒體10密合且晶圓限制件40的第一接觸端 43及第二接觸端44的連線(43-44)跟門體20的内表面22形成一 夾角。很清楚的，每一個晶圓限制件40係以兩個接觸端與晶圓產 生接觸，除了能限制晶圓往開口方向正中央移動外，也能提供晶 圓往開口較兩旁的方向移動。 上述晶圓限制件40其基部41與曲臂42也可以係兩種不同 的材質或彈性結構（例如：熱塑性彈性結構），像是不同硬度的塑 膠，使基部41可以產生較大的形變而曲臂42係較不容易形變， 藉此晶圓限制件40下半部可提供良好的形變而上半部則提供穩 定的槓桿曲臂。而將晶圓限制件40或晶圓限制件40其基部41 安排為彈性結構（例如：熱塑性彈性結構），除了可達到形變以使 第一接觸端43及第二接觸端44依序與晶圓接觸外，此彈性結構 亦有吸震的功效，可避免晶圓因突然的震動而產生異位或往盒體 10的開口方向移動。又，基部41係至少具有一彎曲部，因此， 當晶圓一接觸第一接觸端43時，基部41的彎曲部其角度會改變 進而帶動曲臂42，可使第二接觸端44依序地接觸晶圓。而第一 接觸端43及第二接觸端44亦可以係具有一凹陷，可以使晶圓陷 入凹陷中，避免晶圓上下移動。而上述複數個晶圓限制件40可 以係形成於一底座，且此底座係固定於門體20的内表面22。當 然，複數個晶圓限制件40也可以係跟門體20的内表面22直接一 201004849 體成形，如此可降低生產所需的成本。 其次，請參閱第5圖所示，係本發明之第二種晶圓盒之示意 圖。此前開式晶圓盒與上述第一種晶圓盒相同，係包含一盒體10 及一門體20,不同的是固定於門體20内表面22中間處兩旁的晶 圓限制件模組500其晶圓限制件50係具有三個接觸端。 如第6A圖所示，每一個晶圓限制件50係具有一基部51，基 部51的一端係固定於門體20的内表面22上，而其另一端係與一 第一曲臂52連接，此第一曲臂52具有二自由端，其中較接近中 央處的自由端形成一第一接觸端54,而較遠離中央處的另一自由 端係更進一步與一第二曲臂53連接，第二曲臂53則係具有一第 二接觸端55及一第三接觸端56。此實施例與上一個實施例的材 質、結構及動作原理類似，當門體20與盒體10未結合或剛要結 合時，晶圓限制件50的第一接觸端54、第二接觸端55及第三接 觸端56的連線（54-55-56)係跟門體20的内侧面22互相平行。此 時，晶圓係先跟第一接觸端54接觸，當晶圓接觸第一接觸端54 時，會使基部51產生形變且槓桿帶動第一曲臂52及第二曲臂 53,使第二曲臂53上的第二接觸端55及第三接觸端56依序地接 觸晶圓。此時，如第6B圖所示，門體20係與盒體10密合且晶 圓限制件50的第一接觸端54、第二接觸端55及第三接觸端56 的連線（54-55-56)跟門體20的内表面22形成一夾角。很明顯的， 由於每一個晶圓限制件50係提供三個接觸端於晶圓，係可較穩固 地限制晶圓往開口方向正中央移動或開口較兩旁的方向移動。當 然，本實施例亦可以在第一曲臂52的二個自由端之間並且靠近門 體20内表面22的一側邊上配置有一樞紐57，此樞紐57係固定 於門體20内表面22，如此當基部51形變時可較穩固地槓桿帶動 第一曲臂52及第二曲臂53，使第一接觸端54、第二接觸端55 201004849 之實個二觸端 飞弟一曲；I 53亦可以係不同材質或 如:熱塑性彈性結構)’像是不同硬度的塑膠，可使基彈 ^的形變μ臂龜不容㈣變m 觸…第三接觸端56亦可以具有一凹陷， = 陷中，避免晶圓上下移動。m之曰曰圓陷入凹 ❹ ❹ 係、先形成於-底座，心係 數個：=二係跟門趙2。的内表面…^ :::參閱第7圖所示’係本發明之第三 圖，此則開式晶園盒其門體2〇之内表面22接近中 :意 :其叫個·制件 =有::此=，:限： 接觸晶圓限制件60時（第8A議 =開始 觸，而當門體20與盒體10密合時（第8B;微的曰面積有跟晶圓接 生形變使晶圓與晶圓限制件6〇 積=限制件6〇產 如第9圖及第1〇圖所示，複數個^面積變大或變多。 於一底座61上，以形成一晶圓限制‘ 件60係間隔排列 有複數個安裝^3,而内表面22上相===底錢係具 有突出柱24,使晶圓限制件模組_ 、二女裝孔63處則 於門體20的内表面22中央處。而 :a㈣的方式固定 個晶圓限制件60 ,相鄰的晶圓限制件61的中央處係具有複數 圓限制件60可以對應盒體1〇内相 之間係具有間隙’使晶 制件㈣一的中央處向兩側各：二每:個：: 201004849 延部62其自由端係形成近似半圓形的凸出部62C，以藉由此半圓 形的凸出部62C之中央導槽62G與晶圓接觸。中央導槽62G與晶 圓接觸的地方可以表面包覆一種耐磨耗材（例如：PEEK材質），以 減少摩擦及微粒粉塵的產生。此外，中央導槽62G的寬度可以跟 晶圓的厚度相同，可讓晶圓陷入此中央導槽62G中，以避免晶圓 的上下移動。很明顯的，上述底座61跟彎延部62係形成一角度 0，此角度可以係10〜60度，當角度越小，左右兩中央導槽62G 的距離會越遠，可提供較開口往外侧方向的限制，而角度越大時， 限制的方向係集中於開口方向的正中央。 雖然本發明以前述之較佳實施例揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍 内，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視 本說明書所附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係習知一種晶圓盒之示意圖； 第2圖係習知一種晶圓限制件於限制晶圓時之剖面示意圖； 第3圖係本發明之第一種晶圓盒之示意圖； 第4A圖係本發明之第一種晶圓盒其晶圓限制件剛接觸晶圓之示 意圖， 第4B圖係本發明之第一種晶圓盒其晶圓限制件於限制晶圓之示 圃， 第5圖係本發明之第二種晶圓盒之示意圖； 第6A圖係本發明之第二種晶圓盒其晶圓限制件剛接觸晶圓之示 ttsi · 圃， 第6B圖係本發明之第二種晶圓盒其晶圓限制件於限制晶圓之示 意圖； 11 201004849 第7圖係本發明之第三種晶圓盒之示意圖； 第8A圖係本發明之第三種晶圓盒其晶圓限制件剛接觸晶圓之示 意圖； 第8B圖係本發明之第三種晶圓盒其晶圓限制件於限制晶圓之示 意圖； 第9圖係本發明之第三種晶圓盒其晶圓限制件固定於門體之示意 圖，及 第10圖係本發明之第三種晶圓盒其晶圓限制件之示意圖。Semiconductor wafers are handled by a variety of different processes and need to be matched with process equipment, so they are transported to different workstations. In order to facilitate wafer handling and avoid external pollution, a sealed container is often used for automated equipment delivery. Please refer to Figure 1 for a schematic view of a wafer cassette of the prior art. The wafer cassette is a Front Opening Unified Pod (F0UP) having a box body 10 and a door body 20. The box body 10 is internally provided with a plurality of slots u for horizontally accommodating a plurality of crystals. Round, and one side of the casing 10 has an opening 12 for carrying and loading the wafer, and the door body 2 has an outer surface 21 and an inner surface 22, and the door 20 is supported by the inner surface 22 is combined with the opening 12 of the casing 1G to protect a plurality of wafers inside the casing. Further, at least one door device 23 is disposed on the outer surface 21 of the door body 2 to open or close the front opening wafer cassette. In the above-mentioned front-opening wafer cassette, since the semiconductor wafer is horizontally placed inside the casing ig, 'the wafer opening life of the front opening wafer cassette must be limited to C〇=_' to avoid the wafer The vibration generates an eccentricity or moves toward the opening of the casing W. Referring to Fig. 2, a schematic diagram of a crystal cross section is known. The wafer limiting member 1 is disposed in the opening of the limiting wafer, and is singly held on each of the wafers by using a plurality of left=the inner surface 22 of the two rows of elastic arms 11 The circular limiter (10) prevents the wafer from being ectopic or moving toward the body during the transmission process. The direction of the opening moves. However, the inner surface 22 of the above & door body 20 is provided with two rows of perforated cymbals, and is fixed on the wafer by the 11GP and the circular ring in the form of a material. It is complicated and it is easy to dig a plurality of perforations, causing the gas to become the door 2 cleaning (4). In addition, each t = = point of the above case is on the wafer, which appears to be a crystal _2:::=; At the location, these will cause friction between the wafer and generate particulate dust and contaminate the wafer. SUMMARY OF THE INVENTION The pre-county technology wafer cassette has a complicated wafer structure and is easy to make particles and dust. One of the main defects of the present invention is the wafer of the wafer. The system: inner = 吟 〜 ~ A sides of the 'each of the wafer limiter has a plurality of contact ends, can also Li position due to vibration ectopic or moving in the direction of the center of the opening, eve 1 is open Moving in the direction of the sides, the wafer and the wafer limiter can be avoided to generate particulate dust and contaminate the wafer. Therefore, another main object of the present invention is to provide a wafer day yen with a wafer limiter. The wafer restriction member is placed on both sides of the inner surface of the door near the center, and the 'mother wafer restriction member has a plurality of contact ends, and the plurality of contact ends are sequentially brought into contact with the wafer to thereby provide stability. The push is to avoid friction between the wafer and the wafer restriction member to generate particulate dust and contaminate the wafer. Another main object of the present invention is to provide a wafer with a wafer restriction member. Wafer restrictions are placed on the inside of the door Close to the center, the wafer restraint is integrally formed with the inner surface of the door, and the cost required for fabrication is low except for the simple structure. For the above purposes, the present invention discloses a wafer restraint. The wafer 201004849 box includes a box body and a door body. The inside of the box body is provided with a plurality of slots for accommodating a plurality of wafers, and an opening is provided on one side of the box body for inputting the wafer. And output, and the inner surface of the door body is disposed near the center with two rows of spacers arranged and aligned, wherein each of the wafer limiting members has a base, and one end of the base is fixed to the door The other end of the body is connected to a crank arm, wherein the crank arm has a first contact end and a second contact end, so that the wafer limiting member can sequentially utilize the first contact end and the second contact end To limit the movement of the wafer in the center of the opening direction and the direction of the opening from both sides. [Embodiment] In order to make the technical content, the purpose of the invention and the effect achieved by the invention more complete and clear Dew, as explained in detail below, please refer to the figure shown in the figure below. First, please refer to Figure 3, which is a schematic diagram of the first type of wafer cassette of the present invention. A front open type wafer cassette mainly includes a box body 10 and a door body 20, and a plurality of slots 11 are disposed inside the box body 10 for accommodating a plurality of wafers, and one side of the box body 10 There is an opening 12 for providing wafer input and output, and the door body 20 has an outer surface 21 and an inner surface 22, and the outer surface 21 of the door body 20 is provided with at least one latch device (not shown) In order to open or close the front open wafer cassette, two rows of wafer limiter modules 400 are disposed in the middle of the inner surface 22 of the door body 20, and each row of wafer limiter modules 400 is plural A plurality of spaced-apart wafer limit members 40 are formed, and each of the wafer limit members 40 is aligned with each of the wafer limit members 40 on the adjacent wafer limiter module 400. As shown in FIG. 4A, each of the plurality of wafer restriction members 40 has a base portion 41, and one end of the base portion 41 is fixed to the inner surface 22 of the door body 20, and the other One end is connected to a curved arm 42 , wherein the curved arm 42 has a first contact end 43 and a second contact end 44 . And each of the wafer restriction members 40 201004849 is an integrally formed elastic structure (for example, a thermoplastic elastic structure). When the door body 20 and the casing 10 are not bonded or just joined, the first contact of the wafer restriction member 40 The wires (43-44) of the end 43 and the second contact end 44 are parallel to the inner surface 22 of the door body 20. At this time, the wafer is first in contact with the first contact end 43. When the wafer contacts the first contact end 43, the base 41 is deformed and the lever drives the curved arm 42 so that the other contact end on the curved arm 42 is The second contact end 44 sequentially contacts the wafer. At this time, as shown in FIG. 4B, the door body 20 is in close contact with the casing 10, and the connection (43-44) of the first contact end 43 and the second contact end 44 of the wafer restriction member 40 is followed by the door body 20. The inner surface 22 forms an angle. It is clear that each of the wafer restriction members 40 is in contact with the wafer by two contact ends, and in addition to restricting the wafer from moving in the center of the opening direction, it is also possible to provide a movement in which the crystal is moved toward the opening. The base portion 41 and the curved arm 42 of the above-mentioned wafer limiting member 40 can also be made of two different materials or elastic structures (for example, a thermoplastic elastic structure), such as plastics of different hardness, so that the base portion 41 can generate a large deformation and bend. The arm 42 is less susceptible to deformation, whereby the lower half of the wafer restraint 40 provides good deformation and the upper half provides a stable lever crank. The base portion 41 of the wafer restriction member 40 or the wafer restriction member 40 is arranged as an elastic structure (for example, a thermoplastic elastic structure), except that the deformation can be achieved such that the first contact end 43 and the second contact end 44 are sequentially aligned with the wafer. In addition to the contact, the elastic structure also has the function of shock absorption, which can prevent the wafer from being ectopic due to sudden vibration or moving toward the opening of the casing 10. Moreover, the base portion 41 has at least one bent portion. Therefore, when the wafer contacts the first contact end 43, the angle of the bent portion of the base portion 41 changes to drive the crank arm 42, so that the second contact end 44 can be sequentially Contact the wafer. The first contact end 43 and the second contact end 44 may also have a recess to trap the wafer into the recess to prevent the wafer from moving up and down. The plurality of wafer restriction members 40 may be formed on a base, and the base is fixed to the inner surface 22 of the door body 20. Of course, the plurality of wafer restraints 40 can also be formed directly from the inner surface 22 of the door body 20, thereby reducing the cost of production. Next, referring to Fig. 5, there is shown a schematic view of a second type of wafer cassette of the present invention. The open wafer cassette is the same as the first type of wafer cassette, and comprises a box body 10 and a door body 20, except that the wafer limiter module 500 is fixed on both sides of the inner surface 22 of the door body 20. The wafer limiter 50 has three contact ends. As shown in FIG. 6A, each of the wafer restricting members 50 has a base portion 51. One end of the base portion 51 is fixed to the inner surface 22 of the door body 20, and the other end thereof is connected to a first curved arm 52. The first curved arm 52 has two free ends, wherein the free end closer to the center forms a first contact end 54, and the other free end that is further away from the center is further connected to a second curved arm 53. The second curved arm 53 has a second contact end 55 and a third contact end 56. This embodiment is similar to the material, structure and operation principle of the previous embodiment. When the door body 20 and the casing 10 are not bonded or just joined, the first contact end 54 and the second contact end 55 of the wafer limiting member 50 are similar. The line (54-55-56) of the third contact end 56 is parallel to the inner side 22 of the door body 20. At this time, the wafer first contacts the first contact end 54. When the wafer contacts the first contact end 54, the base 51 is deformed and the lever drives the first crank arm 52 and the second crank arm 53 to make the second The second contact end 55 and the third contact end 56 on the curved arm 53 sequentially contact the wafer. At this time, as shown in FIG. 6B, the door body 20 is in close contact with the casing 10 and the first contact end 54, the second contact end 55 and the third contact end 56 of the wafer restriction member 50 are connected (54- 55-56) forms an angle with the inner surface 22 of the door body 20. Obviously, since each of the wafer limiting members 50 provides three contact ends on the wafer, the wafer can be more stably restrained from moving in the center of the opening direction or moving in the direction of the opening. Of course, in this embodiment, a hinge 57 can be disposed between the two free ends of the first crank arm 52 and adjacent to the inner surface 22 of the door body 20, and the hinge 57 is fixed to the inner surface 22 of the door body 20. Therefore, when the base portion 51 is deformed, the first crank arm 52 and the second crank arm 53 can be driven by the lever relatively stably, so that the first contact end 54 and the second contact end 55 201004849 are the two touch ends of the companion; 53 can also be of different materials or such as: thermoplastic elastic structure) 'like plastics of different hardness, can make the deformation of the base bomb ^ not tolerate (four) change m touch... the third contact end 56 can also have a depression, = trap In the middle, avoid the wafer moving up and down. The circle of m is trapped in the concave ❹ ❹ system, first formed in the base, the heart is several: = two lines with the door Zhao 2. The inner surface...^ ::: Refer to the third figure of the present invention as shown in Fig. 7. The open inner crystal box has the inner surface 22 of the door body 2 close to the middle: meaning: it is called a piece = Yes:: This =,: Limit: When contacting the wafer limiter 60 (Section 8A = Start touch, and when the door body 20 is in close contact with the case 10 (8B; the micro-area area is connected to the wafer) The deformation causes the wafer to be entangled with the wafer restriction member = the restriction member 6 is produced as shown in Fig. 9 and Fig. 1 , and the plurality of areas become larger or larger. On a base 61, a crystal is formed. The circular limit 'piece 60 is arranged with a plurality of mountings ^3 at intervals, and the inner surface 22 has a protruding column 24 on the inner surface 22, so that the wafer limiting member module _ and the second female hole 63 are at the door The inner surface 22 of the body 20 is at the center. And: a (d) means fixing the wafer restriction member 60, and the center of the adjacent wafer restriction member 61 has a plurality of circular restriction members 60 which can correspond to the inner phase of the casing 1 There is a gap 'to make the center of the crystal piece (four) one to the sides: two: one:: 201004849 The extension 62 has its free end forming an approximately semi-circular projection 62C by means of the semicircle Among the projections 62C The central guiding groove 62G is in contact with the wafer, and the central guiding groove 62G is in contact with the wafer at a surface coated with a wear-resistant consumable (for example, PEEK material) to reduce friction and generation of particulate dust. In addition, the central guiding groove 62G The width can be the same as the thickness of the wafer, so that the wafer can be trapped in the central guiding groove 62G to avoid the vertical movement of the wafer. It is obvious that the base 61 forms an angle with the curved portion 62, and the angle can be The system is 10 to 60 degrees. When the angle is smaller, the distance between the left and right central guide grooves 62G is longer, which can provide a limit to the outer direction of the opening. When the angle is larger, the direction of the restriction is concentrated in the center of the opening direction. Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and it is obvious that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The patent protection scope of the present invention is subject to the definition of the patent application scope attached to the specification. [Simplified description of the drawings] Fig. 1 is a schematic diagram of a conventional wafer cassette; A schematic view of a wafer restriction member when the wafer is restricted; FIG. 3 is a schematic view of the first wafer cassette of the present invention; and FIG. 4A is a first wafer cassette of the present invention, the wafer restriction member is just in contact Schematic diagram of the wafer, FIG. 4B is a schematic view of the first wafer cassette of the present invention, the wafer restriction member is used for limiting the wafer, and FIG. 5 is a schematic diagram of the second wafer cassette of the present invention; FIG. In the second type of wafer cassette of the present invention, the wafer restriction member is in contact with the wafer, and the sixth wafer is a schematic diagram of the second wafer cassette of the present invention. 11 201004849 FIG. 7 is a schematic view of a third type of wafer cassette of the present invention; FIG. 8A is a schematic view of the third wafer cassette of the present invention, the wafer restriction member is just in contact with the wafer; FIG. 8B is a view of the present invention The third type of wafer cassette has a wafer restriction member for limiting the wafer; FIG. 9 is a schematic view of the third wafer cassette of the present invention, wherein the wafer restriction member is fixed to the door body, and FIG. 10 is the present invention. A schematic diagram of a wafer holder of a third type of wafer cassette.
【主要元件符號說明】 10 盒體 11 插槽 12 開口 20 門體 21 外表面 22 内表面 24 突出柱 400 限制件模組 40 限制件 41 基部 42 曲臂 43 第一接觸端 44 第二接觸端 12 201004849[Main component symbol description] 10 Box 11 Slot 12 Opening 20 Door body 21 External surface 22 Inner surface 24 Projection column 400 Restrictor module 40 Restricting member 41 Base portion 42 Arm 43 First contact end 44 Second contact end 12 201004849
500 限制件模組 50 限制件 51 基部 52 第一曲臂 53 第二曲臂 54 第一接觸端 55 第二接觸端 56 第三接觸端 57 樞纽 600 限制件模組 60 限制件 61 底座 62 彎延部 62C 半圓形的凸出部 62G 中央導槽 63 安裝孔 W 晶圓 13500 Restriction Module 50 Restriction 51 Base 52 First Crank Arm 53 Second Boom 54 First Contact End 55 Second Contact End 56 Third Contact End 57 Hub 600 Restrictor Module 60 Restriction 61 Base 62 Bend Extension 62C semi-circular projection 62G central guide groove 63 mounting hole W wafer 13