DE60136134D1 - Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren - Google Patents

Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren

Info

Publication number: DE60136134D1
Authority: DE; Germany
Prior art keywords: manufacturing; flat cable; associated apparatus; cable; flat
Prior art date: 2000-07-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE60136134T

Other languages

English (en)

Inventor

Tomonori Inagaki

Yoshiaki Yamano

Koji Fukumoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Wiring Systems Ltd

Original Assignee

Sumitomo Wiring Systems Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-07-11

Filing date

2001-07-10

Publication date

2008-11-27

2000-07-11 Priority claimed from JP2000209759A external-priority patent/JP3752973B2/ja

2000-08-11 Priority claimed from JP2000244711A external-priority patent/JP3893859B2/ja

2001-07-10 Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd

2008-11-27 Application granted granted Critical

2008-11-27 Publication of DE60136134D1 publication Critical patent/DE60136134D1/de

2021-07-11 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0838—Parallel wires, sandwiched between two insulating layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Insulated Conductors (AREA)

DE60136134T 2000-07-11 2001-07-10 Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren Expired - Fee Related DE60136134D1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000209759A JP3752973B2 (ja)	2000-07-11	2000-07-11	フラットケーブルの製造方法及びフラットケーブル
JP2000244711A JP3893859B2 (ja)	2000-08-11	2000-08-11	フラットケーブルの製造装置

Publications (1)

Publication Number	Publication Date
DE60136134D1 true DE60136134D1 (de)	2008-11-27

Family

ID=26595794

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60136134T Expired - Fee Related DE60136134D1 (de)	2000-07-11	2001-07-10	Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren

Country Status (3)

Country	Link
US (2)	US6585836B2 (de)
EP (1)	EP1172826B1 (de)
DE (1)	DE60136134D1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6841735B1 (en) *	1996-04-03	2005-01-11	Methode Electronics, Inc.	Flat cable and modular rotary anvil to make same
JP4013691B2 (ja) *	2002-07-31	2007-11-28	住友電装株式会社	フレキシブルフラットケーブルの接続方法および超音波溶接機
US6905000B1 (en) *	2003-01-31	2005-06-14	Plantronics, Inc.	Faceplate cover
US7247822B2 (en) *	2004-02-05	2007-07-24	Methode Electronics, Inc.	Carbon fiber heating element assembly and methods for making
US7223919B2 (en) *	2004-05-11	2007-05-29	Gagne Norman P	Flat flexible cable with integrated stiffener
US7332677B2 (en) *	2004-12-17	2008-02-19	General Electric Company	Multiconductor cable assemblies and methods of making multiconductor cable assemblies
US7776441B2 (en) *	2004-12-17	2010-08-17	Sabic Innovative Plastics Ip B.V.	Flexible poly(arylene ether) composition and articles thereof
US7091422B1 (en) *	2005-01-28	2006-08-15	Multek Flexible Circuits, Inc.	Flexible flat cable with insulating layer having distinct adhesives on opposing faces
US7989701B2 (en) *	2007-11-27	2011-08-02	Sabic Innovative Plastics Ip B.V.	Multiconductor cable assembly and fabrication method therefor
US8221567B2 (en) *	2009-06-08	2012-07-17	Wix Filtration Corp Llc	Filter media and system and method of manufacturing the same
WO2012030299A1 (en)	2010-09-03	2012-03-08	Jsb Tech Private Limited	A rigid-flex circuit board and manufacturing method
JP5644716B2 (ja) *	2011-08-17	2014-12-24	日立金属株式会社	接着フィルム及びフラットケーブル
US20130125396A1 (en) *	2011-11-18	2013-05-23	Remy Technologies, L.L.C.	Wrapped wire for electric machine
DE102012109576A1 (de) *	2012-10-09	2014-04-10	Sumida Flexible Connections Gmbh	Flachleiter-Bandkabel
JP2014091382A (ja) *	2012-11-01	2014-05-19	Shimano Inc	自転車用ケーブルおよびその製造方法
US9852828B2 (en)	2013-05-01	2017-12-26	3M Innovative Properties Company	Edge insulation structure for electrical cable
JP5737323B2 (ja) *	2013-05-01	2015-06-17	住友電気工業株式会社	電気絶縁ケーブル
US10561539B2 (en)	2016-09-15	2020-02-18	Curt G. Joa, Inc.	Dual bonder
WO2018053307A1 (en) *	2016-09-15	2018-03-22	Curt G. Joa, Inc.	Dual bonder
JP6798471B2 (ja) *	2017-06-19	2020-12-09	株式会社オートネットワーク技術研究所	ワイヤーハーネスおよびワイヤーハーネスの製造方法
JP2021535013A (ja) *	2018-10-26	2021-12-16	カートジー．ジョア、インコーポレイテッド	デュアルボンダ
US20220028585A1 (en) *	2018-12-13	2022-01-27	Autonetworks Technologies, Ltd.	Wiring member
US11192310B2 (en)	2019-07-11	2021-12-07	Curt G. Joa, Inc.	Method and apparatus for improved ultrasonic bonding
US11677171B2 (en) *	2020-04-08	2023-06-13	Te Connectivity Solutions Gmbh	System and method for sealing electrical terminals

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2524691A1 (fr) *	1982-04-06	1983-10-07	Filotex Sa	Element de cable electrique plat, et procede et dispositif de fabrication de cet element
DE3537167C1 (de) *	1985-10-18	1990-05-10	Janisch Erich Kunststoffe	Verfahren zur elektrisch isolierenden Umhuellung der Verbindungsstelle zwischen elektrisch leitenden Elementen,Vorrichtung zur Durchfuehrung dieses Verfahrens sowie Umhuellungsmaterial zur Verwendung bei diesem Verfahren
JPH0828139B2 (ja) *	1988-09-20	1996-03-21	株式会社フジクラ	テープ電線の製造方法
JP3433438B2 (ja) *	1995-05-12	2003-08-04	矢崎総業株式会社	フラットケーブルの製造方法
JPH09185912A (ja) *	1995-11-02	1997-07-15	Mitsubishi Cable Ind Ltd	フラットケーブルおよびその製造方法
JPH09245541A (ja) *	1996-03-14	1997-09-19	Matsushita Electric Ind Co Ltd	フラットケーブルの製造方法およびその製造装置
US6026563A (en)	1996-04-03	2000-02-22	Methode Electronics, Inc.	Method of making flat cable
JP3901280B2 (ja) *	1997-05-01	2007-04-04	矢崎総業株式会社	フレキシブル導電体の固定方法及び固定構造
JP2000030552A (ja) *	1998-07-10	2000-01-28	Sony Chem Corp	フラットケーブル製造装置
JP3959946B2 (ja) *	2000-10-04	2007-08-15	住友電装株式会社	フラットケーブルの製造方法およびフラットケーブル

2001
- 2001-07-10 DE DE60136134T patent/DE60136134D1/de not_active Expired - Fee Related
- 2001-07-10 US US09/901,112 patent/US6585836B2/en not_active Expired - Fee Related
- 2001-07-10 EP EP01401846A patent/EP1172826B1/de not_active Expired - Lifetime
2003
- 2003-01-23 US US10/348,974 patent/US6737586B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP1172826A3 (de)	2003-01-29
US20020017366A1 (en)	2002-02-14
US6737586B2 (en)	2004-05-18
US6585836B2 (en)	2003-07-01
US20030106706A1 (en)	2003-06-12
EP1172826A2 (de)	2002-01-16
EP1172826B1 (de)	2008-10-15

Publication	Publication Date	Title
DE60136134D1 (de)	2008-11-27	Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren
DE60040995D1 (de)	2009-01-15	Kavität-emittierende elektrolumineszente vorrichtung und herstellungsverfahren
DE60233840D1 (de)	2009-11-12	Elektrooptische Vorrichtung und zugehöriges Herstellungsverfahren
DE60009819D1 (de)	2004-05-19	Netzwerkgerätskonfigurationsverfahren und Vorrichtung
DE60125913D1 (de)	2007-02-22	Datenübertragungsverfahren und vorrichtung
GB0111413D0 (en)	2001-07-04	Apparatus and method
EP1407114A4 (de)	2006-06-28	Vorrichtung und verfahren zum setzen von gebirgsankern
FI20031814A (fi)	2004-01-26	Menetelmä ja laite taajuusselektiiviseen keilanmuodostukseen
GB0129669D0 (en)	2002-01-30	Apparatus and method
GB0119977D0 (en)	2001-10-10	Apparatus and method
GB0201138D0 (en)	2002-03-06	Apparatus and method
DE69941200D1 (de)	2009-09-17	Elektrolumineszente Vorrichtung und Herstellungsverfahren
DE60234299D1 (de)	2009-12-24	FFS-Verfahren und Vorrichtung
GB0105688D0 (en)	2001-04-25	Apparatus and method
GB0110732D0 (en)	2001-06-27	Apparatus and method
DE60130478D1 (de)	2007-10-25	Gerätesteuerungsverfahren und vorrichtung
DE60140982D1 (de)	2010-02-25	Polierverfahren und Vorrichtung
AU2000239097A8 (en)	2008-05-08	Manufacturing apparatus and method
DE60218267D1 (de)	2007-04-05	Wiedergabeverfahren und Vorrichtung
GB0130891D0 (en)	2002-02-06	Apparatus and method
GB0217574D0 (en)	2002-09-11	Apparatus and method
GB0101084D0 (en)	2001-02-28	Apparatus and method
GB0111411D0 (en)	2001-07-04	Apparatus and method
GB0114342D0 (en)	2001-08-01	Apparatus and method
DE60106828D1 (de)	2004-12-09	Beschichtungsverfahren und Vorrichtung

Legal Events

Date	Code	Title	Description
2009-11-05	8364	No opposition during term of opposition
2011-05-19	8339	Ceased/non-payment of the annual fee