DE60045755D1 - Halbleiterbauelement und dessen Herstellungsverfahren - Google Patents
Halbleiterbauelement und dessen HerstellungsverfahrenInfo
- Publication number
- DE60045755D1 DE60045755D1 DE60045755T DE60045755T DE60045755D1 DE 60045755 D1 DE60045755 D1 DE 60045755D1 DE 60045755 T DE60045755 T DE 60045755T DE 60045755 T DE60045755 T DE 60045755T DE 60045755 D1 DE60045755 D1 DE 60045755D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor component
- semiconductor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/40—Arrangements for improving the aperture ratio
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27258399A JP4700156B2 (ja) | 1999-09-27 | 1999-09-27 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60045755D1 true DE60045755D1 (de) | 2011-05-05 |
Family
ID=17515952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60045755T Expired - Lifetime DE60045755D1 (de) | 1999-09-27 | 2000-09-27 | Halbleiterbauelement und dessen Herstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (5) | US6392255B1 (de) |
EP (1) | EP1087438B1 (de) |
JP (1) | JP4700156B2 (de) |
KR (2) | KR100663879B1 (de) |
CN (3) | CN1163968C (de) |
DE (1) | DE60045755D1 (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW478014B (en) * | 1999-08-31 | 2002-03-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing thereof |
JP4700156B2 (ja) * | 1999-09-27 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2001177103A (ja) * | 1999-12-20 | 2001-06-29 | Sony Corp | 薄膜半導体装置及び表示装置とその製造方法 |
US7023021B2 (en) | 2000-02-22 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
TW521303B (en) * | 2000-02-28 | 2003-02-21 | Semiconductor Energy Lab | Electronic device |
JP3767305B2 (ja) * | 2000-03-01 | 2006-04-19 | ソニー株式会社 | 表示装置およびその製造方法 |
TW513753B (en) | 2000-03-27 | 2002-12-11 | Semiconductor Energy Lab | Semiconductor display device and manufacturing method thereof |
US6789910B2 (en) | 2000-04-12 | 2004-09-14 | Semiconductor Energy Laboratory, Co., Ltd. | Illumination apparatus |
TW504846B (en) * | 2000-06-28 | 2002-10-01 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
US7456911B2 (en) * | 2000-08-14 | 2008-11-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6509616B2 (en) * | 2000-09-29 | 2003-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
SG111923A1 (en) | 2000-12-21 | 2005-06-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
JP4210041B2 (ja) * | 2001-03-30 | 2009-01-14 | 東京エレクトロン株式会社 | 熱処理装置 |
JP2002319679A (ja) | 2001-04-20 | 2002-10-31 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP4831885B2 (ja) | 2001-04-27 | 2011-12-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6897477B2 (en) * | 2001-06-01 | 2005-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and display device |
JP2003045874A (ja) | 2001-07-27 | 2003-02-14 | Semiconductor Energy Lab Co Ltd | 金属配線およびその作製方法、並びに金属配線基板およびその作製方法 |
JP3445585B2 (ja) | 2001-08-31 | 2003-09-08 | 沖電気工業株式会社 | 半導体装置の製造方法 |
JP4798907B2 (ja) * | 2001-09-26 | 2011-10-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR100840318B1 (ko) | 2001-12-10 | 2008-06-20 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그의 제조 방법과 액정 표시 장치 |
WO2003036374A1 (en) | 2001-09-26 | 2003-05-01 | Samsung Electronics Co., Ltd. | Thin film transistor array panel for liquid crystal display and method for manufacturing the same |
JP4202012B2 (ja) * | 2001-11-09 | 2008-12-24 | 株式会社半導体エネルギー研究所 | 発光装置及び電流記憶回路 |
JP3800404B2 (ja) * | 2001-12-19 | 2006-07-26 | 株式会社日立製作所 | 画像表示装置 |
KR100484591B1 (ko) * | 2001-12-29 | 2005-04-20 | 엘지.필립스 엘시디 주식회사 | 능동행렬 유기전기발광소자 및 그의 제조 방법 |
JP4101533B2 (ja) * | 2002-03-01 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 半透過型の液晶表示装置の作製方法 |
US7148508B2 (en) * | 2002-03-20 | 2006-12-12 | Seiko Epson Corporation | Wiring substrate, electronic device, electro-optical device, and electronic apparatus |
US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
WO2004063799A1 (fr) * | 2002-12-03 | 2004-07-29 | Quanta Display Inc. | Procede de fabrication d'un reseau de transistors en couches minces |
JP2005045017A (ja) * | 2003-07-22 | 2005-02-17 | Sharp Corp | アクティブマトリクス基板およびそれを備えた表示装置 |
JP4099672B2 (ja) * | 2004-12-21 | 2008-06-11 | セイコーエプソン株式会社 | 半導体装置 |
KR101251993B1 (ko) * | 2005-02-25 | 2013-04-08 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 |
US8305507B2 (en) * | 2005-02-25 | 2012-11-06 | Samsung Display Co., Ltd. | Thin film transistor array panel having improved storage capacitance and manufacturing method thereof |
JP4341570B2 (ja) * | 2005-03-25 | 2009-10-07 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
CN100485470C (zh) * | 2005-09-13 | 2009-05-06 | 爱普生映像元器件有限公司 | 液晶显示器及其制造方法 |
JP4301259B2 (ja) | 2005-09-13 | 2009-07-22 | エプソンイメージングデバイス株式会社 | 液晶表示装置及びその製造方法 |
EP3614442A3 (de) * | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Halbleiterbauelement mit halbleiteroxidschicht und herstellungsverfahren dafür |
KR101204365B1 (ko) * | 2006-01-16 | 2012-11-26 | 삼성디스플레이 주식회사 | 액정 표시 패널 및 그 제조 방법 |
US7863612B2 (en) * | 2006-07-21 | 2011-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and semiconductor device |
CN101140938B (zh) * | 2006-09-07 | 2010-05-12 | 中华映管股份有限公司 | 薄膜晶体管阵列基板及其制造方法 |
JP2008112136A (ja) * | 2006-10-04 | 2008-05-15 | Mitsubishi Electric Corp | 表示装置及びその製造方法 |
JP5258277B2 (ja) * | 2006-12-26 | 2013-08-07 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
KR101318753B1 (ko) * | 2008-06-05 | 2013-10-16 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 |
US8022621B2 (en) * | 2008-07-31 | 2011-09-20 | Lg Display Co., Ltd. | Organic light emitting display device |
JP6019329B2 (ja) * | 2011-03-31 | 2016-11-02 | 株式会社Joled | 表示装置および電子機器 |
US9012993B2 (en) * | 2011-07-22 | 2015-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN103582952B (zh) * | 2011-11-30 | 2016-08-03 | 株式会社日本有机雷特显示器 | 半导体器件和显示装置 |
JP2012142571A (ja) * | 2011-12-26 | 2012-07-26 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
CN103268878B (zh) * | 2012-11-07 | 2016-02-24 | 厦门天马微电子有限公司 | Tft阵列基板、tft阵列基板的制作方法及显示装置 |
US8928829B2 (en) * | 2013-05-31 | 2015-01-06 | Innolux Corporation | Display device |
JP6486660B2 (ja) * | 2013-11-27 | 2019-03-20 | 株式会社半導体エネルギー研究所 | 表示装置 |
TWI552322B (zh) * | 2015-08-06 | 2016-10-01 | 友達光電股份有限公司 | 畫素結構 |
KR102433316B1 (ko) * | 2015-08-06 | 2022-08-17 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
WO2017086116A1 (ja) * | 2015-11-18 | 2017-05-26 | ソニー株式会社 | 半導体装置および投射型表示装置 |
JP6068767B2 (ja) * | 2016-02-03 | 2017-01-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP6154976B1 (ja) * | 2017-03-10 | 2017-06-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR20200110573A (ko) * | 2019-03-15 | 2020-09-24 | 삼성디스플레이 주식회사 | 표시 장치 |
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US5889302A (en) * | 1997-04-21 | 1999-03-30 | Advanced Micro Devices, Inc. | Multilayer floating gate field effect transistor structure for use in integrated circuit devices |
JP3980178B2 (ja) * | 1997-08-29 | 2007-09-26 | 株式会社半導体エネルギー研究所 | 不揮発性メモリおよび半導体装置 |
JP4312851B2 (ja) | 1998-04-27 | 2009-08-12 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP3702096B2 (ja) | 1998-06-08 | 2005-10-05 | 三洋電機株式会社 | 薄膜トランジスタ及び表示装置 |
JP3141860B2 (ja) | 1998-10-28 | 2001-03-07 | ソニー株式会社 | 液晶表示装置の製造方法 |
DE69942442D1 (de) | 1999-01-11 | 2010-07-15 | Semiconductor Energy Lab | Halbleiteranordnung mit Treiber-TFT und Pixel-TFT auf einem Substrat |
EP2284605A3 (de) | 1999-02-23 | 2017-10-18 | Semiconductor Energy Laboratory Co, Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
TW478014B (en) | 1999-08-31 | 2002-03-01 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing thereof |
JP4700156B2 (ja) * | 1999-09-27 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
-
1999
- 1999-09-27 JP JP27258399A patent/JP4700156B2/ja not_active Expired - Fee Related
-
2000
- 2000-09-26 CN CNB001288644A patent/CN1163968C/zh not_active Expired - Lifetime
- 2000-09-26 KR KR1020000056358A patent/KR100663879B1/ko active IP Right Grant
- 2000-09-26 CN CNB2004100446998A patent/CN1276468C/zh not_active Expired - Fee Related
- 2000-09-26 CN CNB200610100169XA patent/CN100426489C/zh not_active Expired - Fee Related
- 2000-09-27 EP EP00121021A patent/EP1087438B1/de not_active Expired - Lifetime
- 2000-09-27 DE DE60045755T patent/DE60045755D1/de not_active Expired - Lifetime
- 2000-09-27 US US09/671,780 patent/US6392255B1/en not_active Expired - Lifetime
-
2002
- 2002-04-12 US US10/120,384 patent/US6624012B2/en not_active Expired - Lifetime
-
2003
- 2003-09-22 US US10/664,876 patent/US6998299B2/en not_active Expired - Fee Related
-
2005
- 2005-09-26 KR KR1020050089201A patent/KR100661850B1/ko not_active IP Right Cessation
- 2005-12-30 US US11/321,642 patent/US7282737B2/en not_active Expired - Fee Related
-
2007
- 2007-10-15 US US11/872,402 patent/US7541618B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1163968C (zh) | 2004-08-25 |
EP1087438A3 (de) | 2007-05-23 |
US6624012B2 (en) | 2003-09-23 |
KR100661850B1 (ko) | 2006-12-28 |
CN1290039A (zh) | 2001-04-04 |
CN1901167A (zh) | 2007-01-24 |
EP1087438A2 (de) | 2001-03-28 |
JP4700156B2 (ja) | 2011-06-15 |
KR20010039920A (ko) | 2001-05-15 |
US6998299B2 (en) | 2006-02-14 |
CN100426489C (zh) | 2008-10-15 |
US20060194375A1 (en) | 2006-08-31 |
US7282737B2 (en) | 2007-10-16 |
EP1087438B1 (de) | 2011-03-23 |
US20080036935A1 (en) | 2008-02-14 |
US7541618B2 (en) | 2009-06-02 |
KR20050105113A (ko) | 2005-11-03 |
US6392255B1 (en) | 2002-05-21 |
KR100663879B1 (ko) | 2007-01-03 |
US20020132399A1 (en) | 2002-09-19 |
JP2001094112A (ja) | 2001-04-06 |
US20040058483A1 (en) | 2004-03-25 |
CN1276468C (zh) | 2006-09-20 |
CN1540716A (zh) | 2004-10-27 |
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