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DE60006016D1 - UV-härtbare Harzzusammensetzung und diese enthaltende Lötstopptinte - Google Patents

UV-härtbare Harzzusammensetzung und diese enthaltende Lötstopptinte

Info

Publication number
DE60006016D1
DE60006016D1 DE60006016T DE60006016T DE60006016D1 DE 60006016 D1 DE60006016 D1 DE 60006016D1 DE 60006016 T DE60006016 T DE 60006016T DE 60006016 T DE60006016 T DE 60006016T DE 60006016 D1 DE60006016 D1 DE 60006016D1
Authority
DE
Germany
Prior art keywords
curable resin
resin composition
ethylenically unsaturated
prepare
ultraviolet curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60006016T
Other languages
English (en)
Other versions
DE60006016T2 (de
Inventor
Tatsuya Kubo
Masatoshi-Shinwa-Ryo Fujimoto
Soichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of DE60006016D1 publication Critical patent/DE60006016D1/de
Application granted granted Critical
Publication of DE60006016T2 publication Critical patent/DE60006016T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
DE2000606016 1999-03-17 2000-03-17 UV-härtbare Harzzusammensetzung und diese enthaltende Lötstopptinte Expired - Lifetime DE60006016T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7280999 1999-03-17
JP7280999 1999-03-17
JP2000055760A JP4081217B2 (ja) 1999-03-17 2000-03-01 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板
JP2000055760 2000-03-01

Publications (2)

Publication Number Publication Date
DE60006016D1 true DE60006016D1 (de) 2003-11-27
DE60006016T2 DE60006016T2 (de) 2004-05-19

Family

ID=26413945

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2000606016 Expired - Lifetime DE60006016T2 (de) 1999-03-17 2000-03-17 UV-härtbare Harzzusammensetzung und diese enthaltende Lötstopptinte

Country Status (10)

Country Link
US (1) US6465540B1 (de)
EP (1) EP1037111B1 (de)
JP (1) JP4081217B2 (de)
KR (1) KR100344933B1 (de)
CN (1) CN1202180C (de)
AT (1) ATE252739T1 (de)
DE (1) DE60006016T2 (de)
ES (1) ES2209706T3 (de)
HK (1) HK1029401A1 (de)
TW (1) TW538309B (de)

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JP2000336298A (ja) * 1999-05-28 2000-12-05 Mitsubishi Pencil Co Ltd 焼成色鉛筆芯の製造方法
WO2001058977A1 (fr) * 2000-02-14 2001-08-16 Taiyo Ink Manufacturing Co., Ltd. Composition photodurcissable/thermodurcissable permettant de produire un film mat
US6485306B1 (en) * 2001-07-10 2002-11-26 Aiptek International Inc. Locus-recordable portable handwriting device
JP4847670B2 (ja) * 2000-09-16 2011-12-28 互応化学工業株式会社 紫外線硬化性樹脂組成物および同組成物を含むフォトソルダーレジストインク
JP4558178B2 (ja) * 2000-11-30 2010-10-06 新日鐵化学株式会社 光又は熱硬化性樹脂組成物及びプリント配線基板
AU2002221064A1 (en) * 2000-12-14 2002-06-24 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition
JP5027357B2 (ja) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板
KR100831825B1 (ko) * 2001-03-30 2008-05-28 디에스엠 아이피 어셋츠 비.브이. 경화성 조성물, 그의 경화 생성물 및 적층 재료
JP2003005365A (ja) * 2001-06-25 2003-01-08 Goo Chemical Co Ltd 紫外線硬化性樹脂組成物及びドライフィルム
JP3425139B2 (ja) * 2001-07-27 2003-07-07 實密科技股▲フン▼有限公司 選択的金属メッキ方法
JP3673967B2 (ja) * 2001-09-21 2005-07-20 タムラ化研株式会社 感光性樹脂組成物及びプリント配線板
US7399574B2 (en) * 2001-09-28 2008-07-15 Dai Nippon Printing Co., Ltd. Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel
AU2002352080A1 (en) * 2001-12-06 2003-06-17 Vantico Ag Heat-curable resin composition
KR20030067168A (ko) * 2002-02-07 2003-08-14 이승구 솔더 레지스트 잉크 조성물
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
EP1413926A3 (de) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Lichtempfindliche Harzzusammensetzung und gedruckte Leiterplatte
EP1455227A3 (de) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Lichtempfindliche Zusammensetzung und Leiterplatte
TWI288142B (en) * 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same
KR100571366B1 (ko) * 2004-01-27 2006-04-14 주식회사 코오롱 액상 포토 솔더 레지스트 조성물
KR100776721B1 (ko) * 2005-10-05 2007-11-28 주식회사 두산 액정표시소자용 실란트 조성물 및 이를 이용한 씰제
CN101371195A (zh) * 2006-01-12 2009-02-18 东丽株式会社 感光性组合物、显示器构件及其制造方法
CN101679792B (zh) * 2007-12-21 2012-09-05 株式会社Lg化学 用于辊式印刷的油墨组合物
JP5788646B2 (ja) * 2009-06-25 2015-10-07 住友化学株式会社 偏光板、複合偏光板および液晶表示装置
TW201113303A (en) * 2009-10-07 2011-04-16 Sumitomo Chemical Co Colored photosensitive resin compositions
CN101797552A (zh) * 2010-03-26 2010-08-11 四川长虹电器股份有限公司 在非金属材料表面实现选择性导电的处理方法
US20120194622A1 (en) * 2011-01-31 2012-08-02 Camtek Ltd. Ultra violet light emitting diode curing of uv reactive ink
CN102827513B (zh) * 2012-09-04 2015-04-22 上海蓝沛新材料科技股份有限公司 一种可光聚合的催化油墨及其应用
EP3054350B1 (de) 2014-12-10 2018-04-11 Goo Chemical Co., Ltd. Flüssige lötstopplackzusammensetzung und beschichtete leiterplatte
JP6740603B2 (ja) * 2014-12-25 2020-08-19 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化型平版印刷インキ、および印刷物
CN105086602B (zh) * 2015-07-02 2017-06-16 深圳市容大感光科技股份有限公司 光固化热固化树脂组合物油墨、用途及使用其的线路板
CN105086605B (zh) * 2015-07-13 2018-07-27 深圳市容大感光科技股份有限公司 一种光固化热固化组合物油墨、用途及含有其的线路板
CN105086604A (zh) * 2015-07-13 2015-11-25 深圳市容大感光科技股份有限公司 一种油墨组合物、其应用及印刷电路板
JP6581200B2 (ja) * 2015-09-30 2019-09-25 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
KR101819110B1 (ko) * 2016-05-17 2018-01-16 마이크로크래프트코리아 주식회사 잉크젯용 수지 조성물 및 이를 이용한 인쇄 배선판

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JPH0720631A (ja) 1993-06-30 1995-01-24 Taiyo Ink Mfg Ltd 感光性・熱硬化性樹脂組成物及びソルダーマスク形成方法
EP0864926A4 (de) 1993-09-02 1999-07-14 Goo Chemical Ind Co Ltd Photoempfindliche harzzusammensetzung und beschichtungsfilm, resisttinte, resist, lötstoppresist und gedruckte leiterplatte, die aus der zusammensetzung hergestellt werden
JP3503910B2 (ja) 1994-08-17 2004-03-08 互応化学工業株式会社 フォトソルダーレジストインク、プリント回路基板及びその製造方法
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JPH08335768A (ja) 1995-06-06 1996-12-17 Taiyo Ink Mfg Ltd アルカリ現像可能な一液型ソルダーレジスト組成物及びそれから得られるソルダーレジスト皮膜
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JP3405632B2 (ja) 1996-02-28 2003-05-12 互応化学工業株式会社 エポキシ樹脂、エポキシ樹脂組成物及びフォトソルダーレジストインク並びにプリント配線板及びその製造方法
JP3405631B2 (ja) 1996-02-28 2003-05-12 互応化学工業株式会社 エポキシ樹脂組成物及びフォトソルダーレジストインク並びにプリント配線板及びその製造方法
JP3662690B2 (ja) 1996-11-13 2005-06-22 互応化学工業株式会社 紫外線硬化性樹脂組成物及びフォトソルダーレジストインク
JP4060962B2 (ja) 1998-02-25 2008-03-12 互応化学工業株式会社 アルカリ現像型フォトソルダーレジストインク

Also Published As

Publication number Publication date
KR100344933B1 (ko) 2002-07-20
ATE252739T1 (de) 2003-11-15
TW538309B (en) 2003-06-21
ES2209706T3 (es) 2004-07-01
US6465540B1 (en) 2002-10-15
EP1037111A1 (de) 2000-09-20
JP2000330276A (ja) 2000-11-30
CN1267688A (zh) 2000-09-27
KR20000062930A (ko) 2000-10-25
EP1037111B1 (de) 2003-10-22
JP4081217B2 (ja) 2008-04-23
HK1029401A1 (en) 2001-08-03
CN1202180C (zh) 2005-05-18
DE60006016T2 (de) 2004-05-19

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