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DE3877438D1 - Halbleiter-kuehlungsapparat. - Google Patents

Halbleiter-kuehlungsapparat.

Info

Publication number
DE3877438D1
DE3877438D1 DE8888110467T DE3877438T DE3877438D1 DE 3877438 D1 DE3877438 D1 DE 3877438D1 DE 8888110467 T DE8888110467 T DE 8888110467T DE 3877438 T DE3877438 T DE 3877438T DE 3877438 D1 DE3877438 D1 DE 3877438D1
Authority
DE
Germany
Prior art keywords
semiconductor refrigerator
refrigerator
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888110467T
Other languages
English (en)
Other versions
DE3877438T2 (de
Inventor
Shigeo Ohashi
Heikichi Kuwabara
Tadakatsu Nakajima
Wataru Nakayama
Motohiro Sato
Kenichi Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3877438D1 publication Critical patent/DE3877438D1/de
Publication of DE3877438T2 publication Critical patent/DE3877438T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8888110467T 1987-07-10 1988-06-30 Halbleiter-kuehlungsapparat. Expired - Fee Related DE3877438T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17240387 1987-07-10

Publications (2)

Publication Number Publication Date
DE3877438D1 true DE3877438D1 (de) 1993-02-25
DE3877438T2 DE3877438T2 (de) 1993-06-03

Family

ID=15941303

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888110467T Expired - Fee Related DE3877438T2 (de) 1987-07-10 1988-06-30 Halbleiter-kuehlungsapparat.

Country Status (3)

Country Link
US (1) US4949164A (de)
EP (1) EP0298372B1 (de)
DE (1) DE3877438T2 (de)

Families Citing this family (70)

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US4966226A (en) * 1989-12-29 1990-10-30 Digital Equipment Corporation Composite graphite heat pipe apparatus and method
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JP2626326B2 (ja) * 1991-07-31 1997-07-02 三菱電機株式会社 モータ制御ユニット
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
FR2699365B1 (fr) * 1992-12-16 1995-02-10 Alcatel Telspace Système de dissipation de l'énergie calorifique dégagée par un composant électronique.
FR2701625B1 (fr) * 1993-02-15 1995-05-24 Advanced Computer Assemblage de cartes d'un système informatique rapide.
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5448108A (en) * 1993-11-02 1995-09-05 Hughes Aircraft Company Cooling of semiconductor power modules by flushing with dielectric liquid
US5544696A (en) * 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US5864466A (en) * 1994-07-19 1999-01-26 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
JP3451737B2 (ja) * 1994-09-06 2003-09-29 株式会社デンソー 沸騰冷却装置
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
US6073683A (en) * 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US6064572A (en) * 1996-11-27 2000-05-16 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5844777A (en) * 1997-01-27 1998-12-01 At&T Corp. Apparatus for heat removal from a PC card array
DE19744281A1 (de) * 1997-10-07 1999-06-02 Fraunhofer Ges Forschung Vorrichtung zum Kühlen von Halbleiterbauelementen und ihre Verwendung
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US5884693A (en) * 1997-12-31 1999-03-23 Dsc Telecom L.P. Integral heat pipe enclosure
US6223810B1 (en) * 1998-03-31 2001-05-01 International Business Machines Extended air cooling with heat loop for dense or compact configurations of electronic components
US6279649B1 (en) * 1998-04-27 2001-08-28 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
JP4275806B2 (ja) * 1999-06-01 2009-06-10 株式会社ルネサステクノロジ 半導体素子の実装方法
JP3964580B2 (ja) 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
KR100338810B1 (ko) * 1999-11-08 2002-05-31 윤종용 냉각장치
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
US6657121B2 (en) 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
KR100438825B1 (ko) * 2001-10-29 2004-07-05 삼성전자주식회사 단열 수단을 구비하는 열 전달 장치
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
DE10158387B4 (de) * 2001-11-28 2017-01-19 Modine Manufacturing Co. Anordnung zur Kühlung von elektrischen Komponenten
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
US7331377B1 (en) * 2004-01-30 2008-02-19 Isothermal Systems Research, Inc. Diamond foam spray cooling system
TW200527185A (en) * 2004-02-05 2005-08-16 Wincomm Corp Heat dissipating device
US8061414B2 (en) * 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
US20060274502A1 (en) * 2005-06-01 2006-12-07 Rapp Robert J Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe
US7656025B2 (en) * 2006-11-21 2010-02-02 The Boeing Company Direct semiconductor contact ebullient cooling package
EP2119994A1 (de) * 2008-05-14 2009-11-18 Abb Research Ltd. Verdampfer für einen Kühlkreislauf
ATE554361T1 (de) * 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2246654B1 (de) * 2009-04-29 2013-12-11 ABB Research Ltd. Mehrreihiger Thermosyphon-Wärmetauscher
US8081461B2 (en) * 2009-06-25 2011-12-20 International Business Machines Corporation Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
DE102010009762A1 (de) 2010-03-01 2011-09-01 Lewin Industries Gmbh Verdampfungskühlkörper
US8797739B2 (en) * 2011-06-23 2014-08-05 Delphi Technologies, Inc. Self circulating heat exchanger
JP6024665B2 (ja) * 2011-10-04 2016-11-16 日本電気株式会社 平板型冷却装置及びその使用方法
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
US9328964B2 (en) * 2013-02-01 2016-05-03 Dell Products, L.P. Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system
DE102013209719B4 (de) * 2013-05-24 2016-07-07 Infineon Technologies Ag Leistungshalbleitermodul mit Flüssigkeitskühlung
US10113808B2 (en) * 2013-06-26 2018-10-30 Tai-Her Yang Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus
EP3186574B1 (de) * 2014-08-28 2019-08-21 Aavid Thermalloy, LLC Thermosiphon mit integrierten komponenten
US10512192B2 (en) * 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
DE112016004166B4 (de) * 2015-09-14 2024-01-18 Mitsubishi Electric Corporation Kühlvorrichtung, energieumwandlungs-vorrichtung und kühlsystem
JP2020106949A (ja) 2018-12-26 2020-07-09 富士通株式会社 電子機器、及び電子機器の筐体ユニット
TWI718485B (zh) * 2019-02-27 2021-02-11 雙鴻科技股份有限公司 熱交換裝置
WO2021119390A1 (en) 2019-12-13 2021-06-17 Magna International Inc. Porous spreader assisted jet and spray impingement cooling systems
TWI756618B (zh) * 2020-01-15 2022-03-01 緯穎科技服務股份有限公司 浸沒式冷卻設備
CN111863740A (zh) * 2020-04-10 2020-10-30 上海交通大学 用于浸没式液冷系统的自诱导射流无源沸腾散热强化方法及装置
US11357130B2 (en) 2020-06-29 2022-06-07 Microsoft Technology Licensing, Llc Scalable thermal ride-through for immersion-cooled server systems
CN111857281A (zh) * 2020-08-07 2020-10-30 深圳比特微电子科技有限公司 一种电子设备及用于该电子设备的液体冷却装置
CN112888266A (zh) * 2021-02-04 2021-06-01 陈元友 一种散热抗干扰的电器仪器仪表
US20220408587A1 (en) * 2021-06-21 2022-12-22 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled computers
US11744043B2 (en) * 2021-06-22 2023-08-29 Baidu Usa Llc Electronics packaging for phase change cooling systems
US11968803B2 (en) * 2021-12-22 2024-04-23 Baidu Usa Llc Two phase immersion system with local fluid accelerations
TWI804372B (zh) * 2022-06-30 2023-06-01 緯穎科技服務股份有限公司 分流裝置、具該分流裝置的浸潤式冷卻系統及浸潤式冷卻系統之流體分離方法
CN115666068A (zh) * 2022-09-28 2023-01-31 华为数字能源技术有限公司 一种散热装置、功率设备及光伏系统
US20240130078A1 (en) * 2022-10-18 2024-04-18 Microsoft Technology Licensing, Llc Devices, systems, and methods for a cooling system
CN115666077A (zh) * 2022-10-21 2023-01-31 华为数字能源技术有限公司 散热装置和功率变换器

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US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3586101A (en) * 1969-12-22 1971-06-22 Ibm Cooling system for data processing equipment
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module
US4050507A (en) * 1975-06-27 1977-09-27 International Business Machines Corporation Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
US4182412A (en) * 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
JPS57204156A (en) * 1981-06-09 1982-12-14 Mitsubishi Electric Corp Ebullition type cooling device
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPS60240146A (ja) * 1984-05-14 1985-11-29 Mitsubishi Electric Corp 電子素子冷却用パツケ−ジ
US4694378A (en) * 1984-12-21 1987-09-15 Hitachi, Ltd. Apparatus for cooling integrated circuit chips
JPS6285448A (ja) * 1985-10-09 1987-04-18 Fujitsu Ltd 半導体装置の冷却構造

Also Published As

Publication number Publication date
DE3877438T2 (de) 1993-06-03
EP0298372A3 (en) 1989-03-08
US4949164A (en) 1990-08-14
EP0298372B1 (de) 1993-01-13
EP0298372A2 (de) 1989-01-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee