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DE3780564D1 - Oberflaechenmontierungsdiode. - Google Patents

Oberflaechenmontierungsdiode.

Info

Publication number
DE3780564D1
DE3780564D1 DE8787903501T DE3780564T DE3780564D1 DE 3780564 D1 DE3780564 D1 DE 3780564D1 DE 8787903501 T DE8787903501 T DE 8787903501T DE 3780564 T DE3780564 T DE 3780564T DE 3780564 D1 DE3780564 D1 DE 3780564D1
Authority
DE
Germany
Prior art keywords
surface mounting
mounting diode
diode
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787903501T
Other languages
English (en)
Other versions
DE3780564T2 (de
Inventor
Kent Walters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of DE3780564D1 publication Critical patent/DE3780564D1/de
Application granted granted Critical
Publication of DE3780564T2 publication Critical patent/DE3780564T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Rectifiers (AREA)
DE8787903501T 1986-05-02 1987-04-22 Oberflaechenmontierungsdiode. Expired - Fee Related DE3780564T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/859,126 US4709253A (en) 1986-05-02 1986-05-02 Surface mountable diode
PCT/US1987/000894 WO1987006767A1 (en) 1986-05-02 1987-04-22 Surface mountable diode

Publications (2)

Publication Number Publication Date
DE3780564D1 true DE3780564D1 (de) 1992-08-27
DE3780564T2 DE3780564T2 (de) 1993-03-11

Family

ID=25330112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787903501T Expired - Fee Related DE3780564T2 (de) 1986-05-02 1987-04-22 Oberflaechenmontierungsdiode.

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US (1) US4709253A (de)
EP (1) EP0266412B1 (de)
JP (1) JPH0666409B2 (de)
KR (1) KR960003856B1 (de)
DE (1) DE3780564T2 (de)
WO (1) WO1987006767A1 (de)

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Also Published As

Publication number Publication date
JPH0666409B2 (ja) 1994-08-24
EP0266412B1 (de) 1992-07-22
KR880701464A (ko) 1988-07-27
WO1987006767A1 (en) 1987-11-05
EP0266412A1 (de) 1988-05-11
US4709253A (en) 1987-11-24
JPH01500154A (ja) 1989-01-19
KR960003856B1 (ko) 1996-03-23
DE3780564T2 (de) 1993-03-11

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