DE3784247D1 - Halbleiter-zusammenbau. - Google Patents

Halbleiter-zusammenbau.

Info

Publication number: DE3784247D1
Authority: DE; Germany
Prior art keywords: semiconductor assembly; semiconductor; assembly
Prior art date: 1986-09-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE8787906329T

Other languages

English (en)

Other versions

DE3784247T2 (de

Inventor

Graham Calver

Wayne Pearce

Erich Zielinski

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Eastman Kodak Co

Original Assignee

Eastman Kodak Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-09-10

Filing date

1987-08-31

Publication date

1993-03-25

1987-08-31 Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co

1993-03-25 Publication of DE3784247D1 publication Critical patent/DE3784247D1/de

1993-08-26 Application granted granted Critical

1993-08-26 Publication of DE3784247T2 publication Critical patent/DE3784247T2/de

2007-09-01 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Thermal Sciences (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

DE8787906329T 1986-09-10 1987-08-31 Halbleiter-zusammenbau. Expired - Fee Related DE3784247T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US06/905,903 US4691265A (en)	1986-09-10	1986-09-10	Semiconductor mounting assembly
PCT/US1987/002118 WO1988002184A1 (en)	1986-09-10	1987-08-31	Semiconducteur mounting assembly

Publications (2)

Publication Number	Publication Date
DE3784247D1 true DE3784247D1 (de)	1993-03-25
DE3784247T2 DE3784247T2 (de)	1993-08-26

Family

ID=25421663

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE8787906329T Expired - Fee Related DE3784247T2 (de)	1986-09-10	1987-08-31	Halbleiter-zusammenbau.

Country Status (5)

Country	Link
US (1)	US4691265A (de)
EP (1)	EP0324766B1 (de)
JP (1)	JPH0447962Y2 (de)
DE (1)	DE3784247T2 (de)
WO (1)	WO1988002184A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0652831B2 (ja) *	1987-09-30	1994-07-06	株式会社日立製作所	自動車用電子回路装置の密封構造
US5057903A (en) *	1989-07-17	1991-10-15	Microelectronics And Computer Technology Corporation	Thermal heat sink encapsulated integrated circuit
DE9007439U1 (de) *	1990-06-29	1991-11-14	IXYS Semiconductor GmbH, 68623 Lampertheim	Leistungshalbleitermodul mit integrierter Ansteuerungs- und Fehlerschutzplatine
EP0702509B1 (de) *	1992-07-17	2000-01-19	Vlt Corporation	Verpackung für elektronische Komponenten
US5728600A (en) *	1994-11-15	1998-03-17	Vlt Corporation	Circuit encapsulation process
US5945130A (en)	1994-11-15	1999-08-31	Vlt Corporation	Apparatus for circuit encapsulation
US6316737B1 (en)	1999-09-09	2001-11-13	Vlt Corporation	Making a connection between a component and a circuit board
US6262512B1 (en) *	1999-11-08	2001-07-17	Jds Uniphase Inc.	Thermally actuated microelectromechanical systems including thermal isolation structures
US6549409B1 (en)	2000-08-21	2003-04-15	Vlt Corporation	Power converter assembly
US6985341B2 (en) *	2001-04-24	2006-01-10	Vlt, Inc.	Components having actively controlled circuit elements
US7443229B1 (en)	2001-04-24	2008-10-28	Picor Corporation	Active filtering
US7511967B2 (en) *	2007-02-20	2009-03-31	United Technologies Corporation	Avionics enclosure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3895267A (en) *	1974-03-11	1975-07-15	Analogic Corp	Electronic circuit module with printed circuit board and grounding means
US4069497A (en) *	1975-08-13	1978-01-17	Emc Technology, Inc.	High heat dissipation mounting for solid state devices and circuits
US4342068A (en) *	1980-11-10	1982-07-27	Teknational Industries Inc.	Mounting assembly for semiconductor devices and particularly power transistors
US4484381A (en) *	1981-07-24	1984-11-27	Marconi Avionics Limited	Clamp arrangements
DE3335377A1 (de) *	1983-09-29	1985-04-11	Siemens AG, 1000 Berlin und 8000 München	Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
IT1213139B (it) *	1984-02-17	1989-12-14	Ates Componenti Elettron	Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
DE3409037A1 (de) *	1984-03-13	1985-09-19	Robert Bosch Gmbh, 7000 Stuttgart	Elektrisches schaltgeraet

1986
- 1986-09-10 US US06/905,903 patent/US4691265A/en not_active Expired - Fee Related
1987
- 1987-08-31 JP JP1989600020U patent/JPH0447962Y2/ja not_active Expired
- 1987-08-31 WO PCT/US1987/002118 patent/WO1988002184A1/en active IP Right Grant
- 1987-08-31 DE DE8787906329T patent/DE3784247T2/de not_active Expired - Fee Related
- 1987-08-31 EP EP87906329A patent/EP0324766B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US4691265A (en)	1987-09-01
DE3784247T2 (de)	1993-08-26
JPH02500005U (de)	1990-03-01
EP0324766B1 (de)	1993-02-17
EP0324766A1 (de)	1989-07-26
WO1988002184A1 (en)	1988-03-24
JPH0447962Y2 (de)	1992-11-12

Publication	Publication Date	Title
DE3684557D1 (de)	1992-04-30	Waferintegrierte halbleiteranordnung.
DE3481957D1 (de)	1990-05-17	Halbleiteranordnung.
DE3768742D1 (de)	1991-04-25	Kryostatzusammenbau.
DE3583302D1 (de)	1991-08-01	Halbleiteranordnung.
DE3683316D1 (de)	1992-02-20	Halbleiteranordnung.
ATE70057T1 (de)	1991-12-15	Antitumormittel.
DE3767169D1 (de)	1991-02-14	Sportschuh.
DE3764043D1 (de)	1990-09-06	Alkylendiamine.
DE3780242D1 (de)	1992-08-13	Halbleiterbeschleunigungsmesser.
DE3679108D1 (de)	1991-06-13	Halbleiteranordnungen.
ATE63533T1 (de)	1991-06-15	Xylolisomerisierung.
DE3786070D1 (de)	1993-07-08	Umhuellte halbleiteranordnung.
DE3667879D1 (de)	1990-02-01	Halbleiteranordnung.
DE3582653D1 (de)	1991-05-29	Halbleiteranordnung.
FI875247A0 (fi)	1987-11-27	Framkallningsvaetska foer litografiska tryckplaotar.
FI873581A0 (fi)	1987-08-19	Fast stoedanordning.
DE3680774D1 (de)	1991-09-12	Integriertes halbleiterbauelement.
NO872933D0 (no)	1987-07-14	Sanitaerprodukter.
DE3787548D1 (de)	1993-11-04	Makrolid-verbindungen.
DE3686490D1 (de)	1992-10-01	Halbleiterstruktur.
DE3767005D1 (de)	1991-02-07	Montage-element.
DE3783507D1 (de)	1993-02-25	Zusammengesetztes halbleiterbauelement.
DE3786025D1 (de)	1993-07-08	Makrolid-verbindungen.
DE3784247D1 (de)	1993-03-25	Halbleiter-zusammenbau.
KR880701024A (ko)	1988-04-13	웨이퍼 조립체

Legal Events

Date	Code	Title	Description
1994-03-24	8364	No opposition during term of opposition
1994-08-11	8339	Ceased/non-payment of the annual fee