CN206674407U - Cooling system and electronic equipment - Google Patents

Abstract

The utility model discloses a heat dissipation system and electronic equipment. The heat dissipation system comprises: an outer shell, an inner shell located inside the outer shell and used to support a heating component, a heat dissipation device, and a fan; wherein, a first The airflow channel, the inner shell has a second airflow channel that communicates with the first airflow channel and forms a circulating air channel, the fan is used to drive the air to flow along the circulating air channel, the circulating air channel is used to pass through the heating component and the heat dissipation device, and the heat dissipation device is used to Cools the air in the recirculation duct. The heat dissipation system disclosed in the utility model realizes the cooling of the heating components; at the same time, the inner shell is used to realize the division of the internal structure of the equipment, so that the first air flow channel between the outer shell and the inner shell and the second air flow channel of the inner shell form a cycle The air duct simplifies the formation of the circulating air duct, reduces the assembly difficulty and improves the assembly efficiency.

Description

Cooling systems and electronics

technical field

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation system and electronic equipment.

Background technique

Electronic equipment usually has heat-generating components that generate heat during operation, such as chips of projectors, control boards of hosts, and the like. In order to ensure the normal use of electronic equipment, it is necessary to cool the heating components.

Currently, fans are used to directly cool heat-generating components. In order to meet the dust-proof requirements of the heating components and improve the cooling effect, a circulating air duct is usually set up. The heating components are located in the circulating air duct, and the air in the circulating air duct is driven by a fan to circulate, and the radiator cools the air in the circulating air duct. Thermal cooling of heat-generating components.

The above-mentioned circulating air duct includes a cavity structure for installing components in the housing and some auxiliary pipes connecting the cavity structure. In order to ensure the formation of a circulating air duct, the assembly of the entire device is difficult and the assembly efficiency is low.

To sum up, how to set up a circulating air duct to reduce the difficulty of assembly while cooling the heat-generating components is an urgent problem to be solved by those skilled in the art.

Utility model content

In view of this, the purpose of the present invention is to provide a heat dissipation system to reduce the difficulty of assembly while cooling the heat-generating components. Another object of the present utility model is to provide an electronic device with the above heat dissipation system.

In order to achieve the above object, the utility model provides the following technical solutions:

A cooling system comprising:

an outer shell, an inner shell located in the outer shell and used to support a heating component, a cooling device, and a fan;

Wherein, there is a first air flow channel between the outer shell and the inner shell, the inner shell has a second air flow channel communicating with the first air flow channel and forming a circulating air channel, and the fan is used to drive air along the The circulating air channel flows, and the circulating air channel is used to pass through the heating component and the heat dissipation device, and the heat dissipation device is used to cool the air in the circulating air channel.

Preferably, there are at least two circulating air passages and the heating components, and the circulating air passages correspond to the heating components one by one.

Preferably, the fan is located between the heat sink and the inner shell.

Preferably, the fan is fixedly connected with the heat dissipation device, or the fan is fixedly connected with the inner casing.

Preferably, the fan is fixedly connected to the heat dissipation device, and the fan and the heat dissipation device are integrally structured.

Preferably, the heat dissipation device is located inside the housing, and the cooling medium inlet pipe and cooling medium outlet pipe of the heat dissipation device protrude from the housing.

Preferably, the heat dissipation device includes: a first radiator located inside the housing, and a second radiator located outside the housing and capable of exchanging heat with the first radiator.

Preferably, the first radiator and the second radiator perform heat exchange through thermoelectric cooling fins.

Preferably, the thermoelectric cooling sheet is located inside or outside the casing.

Preferably, the first heat sink is connected to the housing through a heat insulating member.

Preferably, the first heat sink and the second heat sink are of an integrated structure.

Preferably, the first heat sink and/or the second heat sink includes: a heat dissipation plate, and heat dissipation fins arranged on the heat dissipation plate.

Preferably, the first radiator and/or the second radiator includes: a housing, and a cooling channel located in the housing and used for a cooling medium to flow.

Preferably, the outer shell is fixedly connected with the inner shell.

Preferably, the outer shell and the inner shell are integrally structured.

Preferably, the housing is an airtight housing, or the housing and the heat sink form an airtight cavity.

Based on the heat dissipation system provided above, the present utility model also provides an electronic device, which includes a heat dissipation system, and the heat dissipation system is the heat dissipation system described in any one of the above.

The heat dissipation system provided by the utility model has a circulating air duct passing through the heating component and the cooling device. The fan drives the air to flow along the circulating air duct, and the air drives the heat of the heating component, and the air with heat is cooled by the cooling device. The reciprocating cycle realizes the cooling of the heating components; at the same time, by adding an inner shell to support the heating components in the outer shell, the inner shell is used to divide the internal structure of the equipment, so that the first airflow channel between the outer shell and the inner shell And the second airflow channel of the inner shell forms a circulating air duct, which simplifies the formation of the circulating air duct, reduces assembly difficulty, and improves assembly efficiency. Therefore, the heat dissipation system reduces the difficulty of assembly while cooling the heat-generating components.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description It is only an embodiment of the utility model, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

Fig. 1 is a schematic structural diagram of a heat dissipation system provided by Embodiment 1 of the present invention;

Fig. 2 is a schematic structural diagram of the heat dissipation system provided by Embodiment 2 of the present invention;

Fig. 3 is a structural schematic diagram of the heat dissipation system provided by the third embodiment of the utility model;

Fig. 4 is a schematic structural diagram of the heat dissipation system provided by Embodiment 4 of the present utility model;

Fig. 5 is a schematic structural view of the first radiator and/or the second radiator in the heat dissipation system provided by the embodiment of the present invention;

Fig. 6 is another schematic diagram of the structure of the first radiator and/or the second radiator in the heat dissipation system provided by the embodiment of the present invention;

Fig. 7 is the front view of Fig. 6;

Fig. 8 is a schematic diagram of the installation of the fan and the first radiator in the heat dissipation system provided by the embodiment of the present invention;

Figure 9 is a top view of Figure 8;

Fig. 10 is another structural schematic diagram of the first radiator and the second radiator in the heat dissipation system provided by the embodiment of the present utility model;

Fig. 11 is another structural schematic diagram of the first radiator and/or the second radiator in the heat dissipation system provided by the embodiment of the present utility model;

Figure 12 is a perspective view of the radiator in Figure 11;

FIG. 13 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

As shown in Figures 1-4, the heat dissipation system provided by the embodiment of the utility model includes: an outer shell 1, an inner shell 2, a cooling device 7 and a fan 6; wherein, the inner shell 2 is located in the outer shell 1 and is used to support heating components, and the outer shell There is a first airflow channel between 1 and the inner shell 2, and the inner shell 2 has a second airflow channel that communicates with the first airflow channel and forms a circulating air channel. It is used to cool the air in the circulating air duct, and the fan 6 is used to drive the air to flow along the circulating air duct.

It can be understood that the heat-generating component can be any component that needs to be cooled, a module, or even a FRU (Field Replaceable Unit), and is not limited to the form shown in the figure. The circulating air duct is used to pass through the heating components and the cooling device 7. It can be seen that the heating components can be partially or completely located in the circulating air duct; the cooling device 7 can be partially located in the circulating air duct, or can be completely located in the circulating air duct.

The heat dissipation system provided by the utility model has a circulating air duct passing through the heating component and the cooling device 7. The fan 6 drives the air to flow along the circulating air duct, and the air drives the heat of the heating component, and the air with heat is cooled by the cooling device 7. , so that the reciprocating cycle realizes the cooling of the heating components; at the same time, by adding the inner shell 2 for supporting the heating components in the outer shell 1, the inner shell 2 is used to realize the division of the internal structure of the equipment, so that the outer shell 1 and the inner shell The first airflow passage between 2 and the second airflow passage of the inner shell 2 form a circulating air passage, which simplifies the formation of the circulating air passage, reduces assembly difficulty, and improves assembly efficiency. Therefore, the heat dissipation system reduces the difficulty of assembly while cooling the heat-generating components.

When there are more than two heating components, it can be understood that all the heating components are installed on the inner casing 2 . In order to cool each heat-generating component and improve cooling uniformity, there are at least two circulation air passages, and the circulation air passages correspond to the heat-generating components one-to-one.

It can be understood that a circulating air duct flows through a heating component. Of course, one circulating air duct can also be selected to flow through two heating components, or only one circulating air duct can be selected, which is not limited to the above-mentioned embodiment.

In the above heat dissipation system, the specific position of the fan 6 is designed according to actual needs. In order to facilitate air circulation, the fan 6 is located between the heat sink 7 and the inner shell 2 . Of course, the inner casing 2 can also be selected to be located between the fan 6 and the heat dissipation device 7, and it is not limited to the above-mentioned embodiment.

The above-mentioned fan 6 can be fixed to the outer casing 1 , and can also be fixed to the heat sink 7 or the inner casing 2 . In order to facilitate installation, it is preferable to select the fan 6 to be fixedly connected to the cooling device 7 , or the fan 6 to be fixedly connected to the inner shell 2 .

Further, when the fan 6 is fixedly connected with the heat dissipation device 7, and the fan 6 and the heat dissipation device 7 are integrally structured.

Of course, the fan 6 can also be selected to be fixedly connected to the inner casing 2 or the heat dissipation device 7 through a connecting piece, and is not limited to the above-mentioned embodiment.

The type of the fan 6 is selected according to the relative positions of the fan 6 , the inner shell 2 and the cooling device 7 . Preferably, the fan 6 is an axial fan or a centrifugal fan. Certainly, the fan 6 can also be selected as a mixed flow fan, and is not limited to the above-mentioned embodiment.

In the above heat dissipation system, the type and position of the heat dissipation device 7 are designed according to actual needs. For detailed description, this paper provides the following four examples:

Implementation one

As shown in FIG. 1 , the heat dissipation device 7 is located inside the casing 1 , and the cooling medium inlet pipe 703 and the cooling medium outlet pipe 704 of the heat dissipation device 7 protrude from the casing 1 .

In the above heat dissipation system, the housing of the heat dissipation device 7 is cooled through the cooling medium, so as to cool the air and further cool the heat-generating components. The structure of the heat sink 7 is shown in Fig. 11 and Fig. 12 .

In the above heat dissipation system, the heat dissipation device 7 is placed inside the casing 1, which effectively reduces the space occupied by the heat dissipation system, thereby reducing the space occupied by the electronic equipment.

The type, material and type of cooling medium of the heat sink 7 are designed according to actual needs. For example, the heat sink 7 is a fluorine-cooled heat exchanger or a water-cooled heat exchanger, which is not limited in the embodiment of the present invention.

Implementation two

As shown in FIG. 2 , the heat dissipation device 7 includes: a first radiator 71 located inside the housing 1 , and a second radiator 72 located outside the housing 1 and capable of exchanging heat with the first radiator 71 .

In the heat dissipation system provided by this embodiment, the fan 6 sucks in cold air, drives the cold air to flow through the heat-generating components, the heat-generating components are cooled and the air is heated, and the heated air is driven by the fan 6 and flows through the first heat sink 71 to be heated. The heated first radiator 71 is in contact with the second radiator 72 outside the casing 1, and after the heat is taken away by the second radiator 72, it goes on and on like this, as shown by the arrow line in the figure.

Implementation three

As shown in FIG. 3 , the above-mentioned heat dissipation device 7 includes: a first radiator 71 located in the casing 1, a second radiator 72 located outside the casing 1 and capable of exchanging heat with the first radiator 71; wherein, the first radiator The radiator 71 and the second heat sink 72 perform heat exchange through the thermoelectric cooling sheet 73 , and the thermoelectric cooling sheet 73 is located outside the casing 1 .

It should be noted that the cold end of the thermoelectric cooling fin 73 is connected to the first radiator 71 , and the hot end of the thermoelectric cooling fin 73 is connected to the second radiator 72 . The second radiator 72 takes away the heat from the hot end of the thermoelectric cooling sheet 73 .

In this embodiment, the first heat sink 71 can be selected to be fixedly connected to the shell 1. In order to prevent the cold end of the thermoelectric cooling sheet 73 from cooling the shell 1, the first heat sink 71 is preferably connected to the shell 1 through a heat insulating member, so as to avoid The heat exchange between the first heat sink 71 and the shell 1 is prevented, and the cold end of the thermoelectric cooling sheet 73 is prevented from cooling the shell 1, thereby avoiding the influence on the cooling of the heating components and improving the heat dissipation efficiency.

Implementation four

As shown in FIG. 4 , the heat dissipation device 7 includes: a first radiator 71 located inside the casing 1, a second radiator 72 located outside the casing 1 and capable of exchanging heat with the first radiator 71; The radiator 71 and the second heat sink 72 perform heat exchange through the thermoelectric cooling sheet 73 , and the thermoelectric cooling sheet 73 is located inside the housing 1 .

The cold end of the thermoelectric cooling fin 73 is connected to the first radiator 71 , the hot end of the thermoelectric cooling fin 73 is connected to the casing 1 , and the second radiator 72 is connected to the casing 1 . The heat of the hot end of the thermoelectric cooling sheet 73 is transferred to the second radiator 72 through the casing 1 , so that the second radiator 72 takes away the heat of the hot end of the thermoelectric cooling sheet 73 .

Of course, the hot end of the thermoelectric cooling sheet 73 can be selected to be directly connected to the second heat sink 72 , and the second heat sink 72 is fixed to the casing 1 .

In this embodiment, if the first heat sink 71 is also connected to the housing 1 , it is preferred that the first heat sink 71 be connected to the housing 1 through a heat insulating member.

In the above-mentioned second embodiment, third embodiment and fourth embodiment, the fan 6 may be preferably fixed to the first heat sink 71 . Further, the first heat sink 71 is integrated with the fan 6 , as shown in FIG. 8 and FIG. 9 . In order to ensure stability, on the basis of the integral structure of the first radiator 71 and the fan 6 , a connecting piece can also be used to connect the first radiator 71 and the fan 6 .

In the second embodiment, the third embodiment and the fourth embodiment above, in order to simplify the installation, the first heat sink 71 and the second heat sink 72 can be selected as an integrated structure, as shown in FIG. 10 . Certainly, the first heat sink 71 and the second heat sink 72 may also be selected as split structures, and are not limited to the above structures.

In the above-mentioned second embodiment, third embodiment and fourth embodiment, the specific structures of the first heat sink 71 and the second heat sink 72 are selected according to actual needs. Preferably, the first heat sink 71 and/or the second heat sink 72 include: a heat dissipation plate 701 , and heat dissipation fins 702 disposed on the heat dissipation plate 701 , as shown in FIGS. 5-7 .

Of course, the first radiator 71 and/or the second radiator 72 may also optionally include: a housing, a cooling channel 705 located in the housing and used for the flow of cooling medium. It can be understood that the housing has a cooling medium inlet pipe 703 and a cooling medium outlet pipe 704 communicating with the cooling channel 705 , as shown in FIGS. 11 and 12 .

When both the first radiator 71 and the second radiator 72 have the above-mentioned structures, the cooling medium in the first radiator 71 exchanges heat with the air in the circulating air duct through the casing to realize cooling of the air. At the same time, the cooling medium The temperature rises; the cooling medium flowing through the second radiator 72 cools the first radiator 71 through the shell, thereby cooling the cooling medium in the first radiator 71, ensuring that the first radiator 71 can always cool and circulate air in the duct.

It can be understood that the cooling medium in the first radiator 71 can be circulated through the cooling medium inlet pipe 703 and the cooling medium outlet pipe 704, and the cooling medium inlet pipe 703 and the cooling medium outlet pipe 704 can also be blocked to allow cooling The medium is stored in the housing. As the usage time increases, the cooling medium in the first radiator 71 can be replaced regularly.

The above-mentioned first heat sink 71 and the second heat sink 72 may have the same structure or different structures.

When the first radiator 71 includes: a heat dissipation plate 701, the heat dissipation fins 702 arranged on the heat dissipation plate 701, and the second radiator 72 includes: a housing, a cooling channel 705 located in the housing and used for the flow of the cooling medium , using the cooling medium flowing through the second radiator 72 to cool the heat dissipation plate 701 and the heat dissipation fins 702, so as to ensure that the heat dissipation plate 701 and the heat dissipation fins 702 cool the air in the circulating air duct.

When the second radiator 72 includes: a heat dissipation plate 701, a heat dissipation fin 702 arranged on the heat dissipation plate 701, and the first radiator 71 includes: a housing, a cooling channel 705 located in the housing and used for the flow of the cooling medium , the cooling medium flowing through the first radiator 71 passes through the casing to cool the air in the circulating air duct, and at the same time, the second radiator 72 cools the casing of the first radiator 71, thereby realizing the cooling of the cooling medium in the casing and ensuring the first A radiator 71 continuously cools the air in the circulating air duct.

If the first radiator 71 and the second radiator 72 all include: a radiator plate 701, a radiator fin 702 arranged on the radiator plate 701, the second radiator 72 is beneficial to its own structure to dissipate heat to the first radiator 71, to ensure The first radiator 71 cools the air in the circulating air duct.

The type and distribution of the cooling fins 702 are designed according to actual needs. Preferably, the heat dissipation fins 702 are straight plate fins, as shown in FIGS. 5-10 . Of course, the cooling fins 702 can also be selected as other types of fins such as pin fins, such as window fins.

Preferably, the heat dissipation fins 702 are distributed along the length direction of the heat dissipation plate 701 , as shown in FIG. 5 ; the heat dissipation fins 702 can also be distributed along the circumferential direction of the heat dissipation plate 701 , as shown in FIGS. 6 and 7 .

In the above heat dissipation system, in order to prevent the inner shell 2 from shifting, the outer shell 1 and the inner shell 2 are fixedly connected.

Specifically, the outer shell 1 and the inner shell 2 are fixedly connected through threaded connectors, or the outer shell 1 and the inner shell 2 are fixedly connected through welding. Of course, the outer shell 1 and the inner shell 2 can also be fixedly connected through other connecting pieces, and are not limited to the above-mentioned embodiments.

In order to simplify the installation and further reduce the difficulty of assembly, the outer shell 1 and the inner shell 2 are integrally constructed.

Because the heat-generating components are cooled and dissipated through the air, when the heat-generating components are required to be dust-proof, the circulating air duct is required to be in a closed space. Specifically, the housing 1 is an airtight housing, or the housing 1 and the heat sink 7 form an airtight cavity.

The heat dissipation system described above performs heat dissipation in a sealed condition, meeting the requirements of dustproof, waterproof, and good heat dissipation.

It can be understood that, when the housing 1 is a closed casing, the cooling device 7 is located inside the housing 1, and the circulating air duct is located inside the housing 1; when the housing 1 and the cooling device 7 form a closed cavity, the circulating air duct is located in a closed In the cavity, the cooling device 7 can be located in the housing 1 , or part of the cooling device 7 can be located inside the housing 1 .

The heat dissipation system provided by the above embodiments is suitable for the situation where the heat generating component cannot be in direct contact with the heat sink or the casing 1 .

Based on the heat dissipation system provided by the above embodiments, the embodiment of the present invention also provides an electronic device, the electronic device includes a heat dissipation system, and the heat dissipation system is the heat dissipation system described in the above embodiments.

Since the heat dissipation system provided by the above embodiments has the above technical effects, and the electronic equipment provided by the embodiments of the present invention has the above heat dissipation system, the electronic equipment provided by the embodiments of the present invention also has corresponding technical effects, which will not be repeated here.

The type of the electronic device can be selected according to actual needs. For example, the electronic device is a projector or other display device, host device, etc. The embodiment of the present invention does not limit the type of the electronic device.

Preferably, the above-mentioned electronic device is a projector. Further, the above projector is a 3LCD projector. The English spelling of LCD is Liquid Crystal Display.

As shown in Figure 13, the principle of the 3LCD projector is: the three-color light respectively passes through the first convex mirror 51, the second convex mirror 52 and the third convex mirror 43 to irradiate the corresponding first heating element 41 (liquid crystal display), the second On the heating component 42 and the third heating component 43 , the processed light passes through the condenser prism 3 to guide the light signals of the three light emitting components to the lens to form an image. At this time, the heating component is a liquid crystal display.

It should be noted that the figure shown in FIG. 13 is a top view of the projector, and the figures shown in FIGS. 1-4 are schematic diagrams of the heat dissipation system in the rear view of the projector.

The above description of the disclosed embodiments enables those skilled in the art to realize or use the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims (17)

1. A cooling system, characterized in that, comprising: an outer shell, an inner shell located in the outer shell and used to support a heating component, a cooling device, and a fan; Wherein, there is a first air flow channel between the outer shell and the inner shell, the inner shell has a second air flow channel communicating with the first air flow channel and forming a circulating air channel, and the fan is used to drive air along the The circulating air channel flows, and the circulating air channel is used to pass through the heating component and the heat dissipation device, and the heat dissipation device is used to cool the air in the circulating air channel. 2 . The heat dissipation system according to claim 1 , wherein there are at least two circulating air ducts and the heating components, and the circulating air ducts correspond to the heating components one by one. 3 . 3. The heat dissipation system according to claim 1, wherein the fan is located between the heat dissipation device and the inner casing. 4. The heat dissipation system according to claim 1, wherein the fan is fixedly connected to the heat dissipation device, or the fan is fixedly connected to the inner shell. 5 . The heat dissipation system according to claim 4 , wherein the fan is fixedly connected to the heat dissipation device, and the fan and the heat dissipation device are integrated. 6 . The heat dissipation system according to claim 1 , wherein the heat dissipation device is located inside the housing, and a cooling medium inlet pipe and a cooling medium outlet pipe of the heat dissipation device protrude from the housing. 7. The heat dissipation system according to claim 1, wherein the heat dissipation device comprises: a first radiator located inside the housing, located outside the housing and capable of exchanging heat with the first radiator the second radiator. 8. The heat dissipation system according to claim 7, wherein the first heat sink and the second heat sink perform heat exchange through thermoelectric cooling fins. 9. The heat dissipation system according to claim 8, wherein the thermoelectric cooling fin is located inside or outside the casing. 10 . The heat dissipation system according to claim 8 , wherein the first heat sink is connected to the casing through a heat insulating member. 11 . 11. The heat dissipation system according to claim 7, wherein the first heat sink and the second heat sink are of an integrated structure. 12 . The heat dissipation system according to claim 7 , wherein the first heat sink and/or the second heat sink comprise: a heat dissipation plate, and heat dissipation fins disposed on the heat dissipation plate. 13 . 13. The heat dissipation system according to claim 7, characterized in that, the first radiator and/or the second radiator comprises: a housing, and a radiator located in the housing and used for cooling medium to flow Cooling runner. 14. The heat dissipation system according to claim 1, wherein the outer shell is fixedly connected to the inner shell. 15. The cooling system according to claim 14, characterized in that, the outer shell and the inner shell are integrally formed. 16 . The heat dissipation system according to claim 1 , wherein the casing is a closed casing, or the casing and the heat dissipation device form a closed cavity. 17. An electronic device, comprising a heat dissipation system, wherein the heat dissipation system is the heat dissipation system according to any one of claims 1-16.