CN203689298U - Liquid cooling device - Google Patents

Abstract

A liquid cooling heat sink is used for being installed on a computer shell and pumping cooling liquid to cool a heat source in the computer shell; the computer casing comprises at least one slot. The liquid cooling heat dissipation device comprises at least one liquid cooling head, a heat dissipation row assembly, a plurality of connecting pipes and a baffle. The liquid cooling head is used for contacting a heat source, the heat dissipation bar assembly is arranged outside the computer shell and comprises at least one heat dissipation bar. The connecting pipe is used for connecting the liquid cooling head and the heat dissipation bar to form a cooling circulation channel for the flowing of cooling liquid. The baffle is detachably arranged in the slotted hole of the computer shell, is fixed on the computer shell and closes the slotted hole, and is provided with at least one through hole, and the connecting pipe penetrates through the through hole so as to enable the liquid cooling head and the heat dissipation bar assembly to be respectively arranged inside and outside the computer shell.

Description

Liquid cooling device

technical field

The utility model relates to liquid cooling and heat dissipation technology, in particular to a liquid cooling heat dissipation device applied to computer devices.

Background technique

A water-cooling device used for a computer mainframe usually includes a radiator, a pump and a water-cooling head, and a circulation pipeline is formed through connecting pipes. In the case of multiple water-cooling devices, individual water-cooling heads and radiators are connected in series. In the case of series connection, the water pressure provided by the pump may be insufficient due to too many heat sinks, or the noise may increase due to the excessive power of the pump. At the same time, when multiple radiators are installed at the same time, limited by the layout of parts inside the case, multiple radiators are mostly arranged in parallel or stacked; is better, but the pump or fan power must be increased, which further exacerbates the problem of increased noise.

Commercially available water-cooling devices mainly include modular water-cooling devices and combined water-cooling devices.

The modular water-cooling device is completed in the factory by connecting the water-cooling head, pump and radiator with connecting pipes, and filling it with coolant. Usually, the water block and the pump are combined into a single module to facilitate subsequent assembly. When assembling a computer, consumers only need to fix the water cooling head to the heat source, and fix the heat sink to a designated position inside the computer case. However, since the length of the connecting pipe is fixed, the relative position between the water cooling head and the radiator is limited. In addition, the heat sink will also occupy the internal space of the computer case, and the installation position is limited, so it may not be applicable to every case layout.

Combined water cooling device is also called DIY water cooling kit. The combined water-cooling device provides connecting pipes, water-cooling heads, pumps and radiators to consumers individually. Consumers can place water-cooling heads, pumps, and radiators according to their needs and the layout of the cabinet, and then connect the aforementioned components with connecting pipes. However, the pipelines connected by users themselves are prone to water leakage. Similarly, most of the fixing brackets and keyholes that can be used for fixing the radiator are located inside the casing, and there is also the problem that the radiator will occupy the internal space of the casing.

Utility model content

The liquid-cooled heat dissipation device in the known technology has the problem of not being able to adapt to the layout of the computer case, or the leakage of the pipeline caused by the user's subsequent self-assembly. At the same time, when the radiators are arranged in parallel or stacked, the problem of poor heat dissipation efficiency will also occur.

Based on the above problems, the utility model provides a liquid cooling heat dissipation device, which can solve the problem that the radiator occupies the inner space of the casing. In addition, in at least one specific embodiment, the present invention also proposes a new fan configuration, so as to improve the heat dissipation efficiency when the radiators are arranged in parallel or stacked.

At least one embodiment of the present invention provides a liquid cooling heat dissipation device, which is installed in a computer casing and pumps a cooling liquid to cool a heat source in the computer casing. The computer casing includes at least one slot; the liquid-cooling heat dissipation device includes at least one liquid cooling head, a radiator assembly, several connecting pipes and at least one baffle.

The liquid cooling head is used to contact the heat source; the heat sink assembly is used to be arranged outside the computer case, and the heat sink assembly includes at least one heat sink; several connecting pipes are used to connect the liquid cold head and the heat sink to form A cooling circulation channel for cooling liquid to flow; and the baffle is detachably installed in the slot hole of the computer casing, and fixed to the computer casing and closes the slot hole, and the baffle has at least one through hole through which the connecting pipe passes perforation.

In at least one specific embodiment of the present invention, the liquid cooling device further includes a pump disposed on the cooling circulation channel for pumping the cooling liquid to circulate in the cooling circulation channel.

In at least one specific embodiment of the present invention, the pump is combined with the liquid cooling head to form a single module.

In at least one specific embodiment of the present invention, the liquid cooling device further includes two fans disposed on the radiator assembly to perform forced air cooling on the radiator assembly.

The radiator assembly includes a ventilation surface for airflow to pass through. Two fans are respectively installed on each ventilation surface, and the wind direction of the two fans is arranged in the forward direction, so that the airflow enters the radiator assembly from one ventilation surface and leaves from the other ventilation surface. Radiator assembly.

The two fans change the wind direction regularly and repeatedly change the flow direction of the airflow.

In at least one specific embodiment of the present invention, the liquid cooling heat dissipation device includes three liquid cooling heads and corresponding three heat sinks, and the three heat sinks are arranged side by side.

In at least one specific embodiment of the present invention, the liquid-cooled heat dissipation device includes several radiators and several fans, each radiator is equipped with a fan, and the radiator is surrounded to form a tunnel-shaped ventilation area.

The fan simultaneously drives the airflow in a direction away from the tunnel-like ventilation zone.

In at least one specific embodiment of the present invention, the baffle further includes a plurality of fasteners extending from the edge of the baffle and used for being locked to the computer case to fix the baffle to the computer case.

In at least one specific embodiment of the present invention, the baffle is combined with the radiator assembly, thereby fixing the radiator assembly to the computer case.

With the liquid cooling heat dissipation device disclosed in the utility model, the liquid cooling head and the radiator assembly are respectively arranged inside and outside the computer casing, so that the radiator assembly is not restricted by the internal layout of the computer casing. In addition, in at least one specific embodiment, the utility model can quickly fix the radiator assembly on the outside of the computer casing through the baffle plate and the inherent slot holes of the computer casing. Moreover, in at least one specific embodiment, the utility model proposes a new fan configuration to solve the problem of heat dissipation when multiple radiators are configured at the same time.

Description of drawings

Fig. 1 is an exploded perspective view of the first embodiment of the utility model.

FIG. 2 is an exploded perspective view of the first embodiment of the present invention installed in a computer case.

FIG. 3 is a perspective view of the first embodiment of the present invention disposed on a computer case.

FIG. 4 and FIG. 5 are schematic diagrams showing the relative positions of the fan and the radiator in the first embodiment of the present invention.

FIG. 6 is an exploded perspective view of a second embodiment of the present invention installed in a computer case.

FIG. 7 is a perspective view of a second embodiment of the present invention disposed on a computer case.

Fig. 8 is a schematic diagram of relative positions of another fan and radiator in the present invention.

Detailed ways

Please refer to Fig. 1, Fig. 2 and Fig. 3, which is a liquid cooling heat dissipation device 100 disclosed in the first embodiment of the present invention, which is used to be installed in a computer case 900 to pump a cooling liquid for cooling A heat source 910 in the computer case 900 provides cooling. The aforementioned heat source 910 includes but is not limited to a high-power integrated circuit chip (such as a central processing unit or a graphics chip). The computer case 900 is used for accommodating parts of the computer device to form the computer device. The computer case 900 includes at least one slot 920 . The slot 920 may be an entrance for a storage device (such as a slot for installing an optical drive or a slot for installing a hard disk drive), or an opening reserved for installing an I/O baffle.

As shown in FIG. 1, FIG. 2 and FIG. 3, the liquid cooling heat dissipation device 100 includes at least one liquid cooling head 110, a radiator assembly 120, several connecting pipes 130, a baffle plate 140, at least one pump 150 and at least Two fans 160.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the liquid cooling head 110 is usually a metal block or other blocks with thermal conductivity to quickly conduct heat. The liquid cooling head 110 is used to contact the heat source 910 to absorb the heat generated by the heat source 910; therefore, the number of the liquid cooling head 110 depends on the number of the heat source 910; as in the first embodiment, three heat sources are arranged in the computer case 900 of the computer device At 910 , the liquid cooling heat dissipation device 100 includes three liquid cooling heads 110 . The liquid cooling head 110 has at least one heat exchanging area for cooling liquid to exchange heat. The heat exchange area can be a passage through the liquid cooling head 110 , or a cavity formed by covering the surface of the liquid cooling head 110 with a cover or a pump 150 .

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the heat sink assembly 120 includes at least one heat sink 122 , and the inside of the heat sink 122 has a liquid channel, for example, a liquid channel formed by metal tubes passing through several fins. The number of radiators 122 is usually matched with the liquid cooling head 110. As shown in FIG. It is not ruled out that one liquid cooling head 110 cooperates with several radiators 122 .

As shown in FIG. 1, FIG. 2 and FIG. 3, the connecting pipe 130 connects the liquid cooling head 110 and the radiator 122, especially connects the heat exchange area of the liquid cooling head 110 and the liquid channel of the radiator 122 to form a cooling circulation channel. . The cooling liquid flows in the cooling circulation channel so as to transfer the heat absorbed by the liquid cooling head 110 to the radiator 122 , and the radiator 122 dissipates heat after receiving forced air cooling.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the baffle 140 is detachably installed in the slot 920 of the computer case 900 , and is fixed to the computer case 900 to close the slot 920 . The baffle plate 140 has a plurality of through holes 142 for passing the connecting tubes 130 , so that the radiator assembly 120 and the liquid cooling head 110 can be respectively disposed inside and outside the computer case 900 .

Referring again to FIG. 1 , the baffle 140 further includes a plurality of fasteners 144 extending vertically from the edge of the baffle 140 . When the baffle 140 closes the slot 920 , the plurality of fasteners 144 are located in the computer case 900 , and are locked to the computer case 900 to fix the baffle 140 to the computer case 900 .

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the pump 150 is disposed on the cooling circulation channel to pump the cooling liquid to circulate in the cooling circulation channel. In a specific embodiment, the pump 150 is combined with the liquid cooling head 110 to form a single module.

Referring to FIG. 1 , FIG. 2 and FIG. 3 , the fan 160 is fixed on the radiator assembly 120 for blowing or sucking air to the radiator assembly 120 to perform forced air cooling on the radiator assembly 120 .

Referring to FIG. 4 and FIG. 5 , the radiators 122 are combined in parallel to form a radiator assembly 120 . The radiator assembly 120 includes two ventilation surfaces 120a, 120b for passing air. The two fans 160 are respectively disposed on the ventilation surfaces 120a, 120b. The wind direction of the two fans 160 is arranged in the forward direction, so that the airflow passing through the two ventilation surfaces 120a, 120b forms the following state: the airflow enters the heat radiator assembly 120 from one ventilation surface 120a, and leaves the other ventilation surface 120b. The radiator assembly 120 is described above. In addition, in order to avoid poor air-cooling efficiency of the radiator 122 at the end of the airflow, the fan 160 changes the wind direction regularly, and repeatedly changes the flow direction of the airflow, so that the radiator 122 located on the ventilation surface 120a, 120b will not be overheated for a long time. Located at the end of the airflow to improve heat dissipation efficiency. In addition, the airflow repeatedly changes the direction of flow, and the dust accumulated on the ventilation surfaces 120a, 120b (especially the windward side) can be blown off to form a dust removal effect.

Please refer to FIG. 6 and FIG. 7 , which is a liquid cooling device 100 disclosed in the second embodiment of the present invention, which is roughly the same as the first embodiment, and only the differences will be described below.

As shown in FIG. 6 , the baffle plate 140 is combined with the radiator assembly 120 , and the connecting pipe 130 passes through the through hole (not shown in FIGS. 6 and 7 ).

As shown in FIG. 7 , when the baffle plate 140 closes the slot 920 and is fixed to the computer case 900 , the heat sink assembly 120 is fixed to the computer case 900 , thereby simplifying the fixing method of the heat sink assembly 120 .

As shown in FIGS. 6 and 7 , the liquid cooling device 100 further includes an input interface 190 and a display interface 200 . The input interface 190 is used for the user to operate to input the set value of the rotational speed; a specific embodiment of the input interface 190 is a rotary knob. The display interface 200 is used to display the temperature of the liquid cooling head and the flow rate of the cooling liquid.

Please refer to FIG. 8 , which is another layout of the radiator 122 and the fan 160 disclosed in the present invention.

The plurality of cooling rows 122 surround and form a tunnel-shaped ventilation area T, and each cooling row 122 is equipped with a fan 160 . Wherein, the fan 160 drives the airflow in a direction away from the tunnel-shaped ventilation area T at the same time, so that a chimney effect is generated in the ventilation area T, and the outside air is sucked in from both ends of the ventilation area T, and the heat dissipation rows 122 are forced on average. cool down.

Through the liquid-cooled heat dissipation device 100 disclosed in the present invention, the liquid-cooled head 110 , the radiator assembly 120 , the connecting pipe 130 , the pump 150 and the fan 160 can firstly form a module, which is convenient for users to assemble by themselves. In addition, the radiator assembly 120 can be disposed outside the computer case 900 , such as the top of the computer case 900 , and the connecting pipe 130 can pass through the through hole 142 provided by the baffle 140 . Consumers only need to fix the liquid cooling head 110 to the heat source 910, and the radiator assembly 120 located outside the computer case 900 will not be restricted by the internal layout of the computer case 900; thus, the radiator assembly 120 will not occupy the The inner space of the shell 900 has a better air cooling environment, so as to improve the heat dissipation and cooling efficiency of the heat source 910 .

In addition, through the adjustment of the position of the fan 160 and the wind direction, the present invention can ensure that the plurality of radiators 122 can maintain an average air cooling effect, and avoid the problem of poor cooling efficiency of a single radiator 122 .

The above-mentioned embodiments are intended to disclose the technical characteristics of the present utility model, but they are not intended to limit the present utility model. Therefore, the patent protection scope of the utility model must be defined by the appended claims of this specification.

Claims (11)

1. a liquid-cooling heat radiator, in order to be installed on a computer housing, cooling so that the thermal source in described computer housing is carried out with pumping one liquid coolant, and described computer housing comprises at least one slotted eye; It is characterized in that, described liquid-cooling heat radiator comprises:

At least one liquid cooling head, in order to contact described thermal source;

One heat radiation row assembly, in order to be arranged at outside described computer housing, and described heat radiation row assembly comprises at least one heat radiation row;

Several connecting pipes, in order to connect described liquid cooling head and described heat radiation row, to form a cool cycles passage for described coolant flow; And

One baffle plate, is removably installed in the slotted eye of described computer housing, and is fixed on described computer housing and seals described slotted eye, and described baffle plate has at least one perforation, and described several connecting pipes are through described perforation.

2. liquid-cooling heat radiator according to claim 1, is characterized in that, also comprises a pumping, is arranged on described cool cycles passage, circulates in described cool cycles passage in order to liquid coolant described in pumping.

3. liquid-cooling heat radiator according to claim 2, is characterized in that, described pumping is incorporated into described liquid cooling head, and forms single module.

4. liquid-cooling heat radiator according to claim 1, is characterized in that, also comprises two fans, is arranged on described heat radiation row assembly, and described heat radiation row assembly is carried out to forced air cooling.

5. liquid-cooling heat radiator according to claim 4, it is characterized in that, described heat radiation row assembly comprises the ventilating surface that air feed stream passes through, described two fans are arranged at respectively ventilating surface described in each, and the wind direction of described two fans is forward configuration, make air-flow enter described heat radiation row assembly by a ventilating surface, and leave described heat radiation row assembly by another ventilating surface.

6. liquid-cooling heat radiator according to claim 5, is characterized in that, described two fans periodically change wind direction, and repeatedly change the flow direction of air-flow.

7. liquid-cooling heat radiator according to claim 4, is characterized in that, described liquid-cooling heat radiator comprises three liquid cooling heads and three corresponding heat radiation rows, and described three heat radiation rows are configuration side by side.

8. liquid-cooling heat radiator according to claim 1, it is characterized in that, described liquid-cooling heat radiator comprise several heat radiation rows and and several fans, the upper configuration of heat radiation row one fan described in each, and described several heat radiations row is around forming a tunnel-like plenum area.

9. liquid-cooling heat radiator according to claim 8, is characterized in that, described several fans are simultaneously with the direction band moving air flow away from described tunnel-like plenum area.

10. liquid-cooling heat radiator according to claim 1, is characterized in that, described baffle plate also comprises several fasteners, extends the edge of described baffle plate, for clip in described computer housing, to fix described baffle plate in described computer housing.

11. liquid-cooling heat radiators according to claim 1, is characterized in that, described baffle plate is incorporated into described heat radiation row assembly, thereby fixing described heat radiation is arranged total city in described computer housing.

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