CN216210435U - Laser projection heat abstractor and laser projector - Google Patents
Laser projection heat abstractor and laser projector Download PDFInfo
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- CN216210435U CN216210435U CN202122905584.5U CN202122905584U CN216210435U CN 216210435 U CN216210435 U CN 216210435U CN 202122905584 U CN202122905584 U CN 202122905584U CN 216210435 U CN216210435 U CN 216210435U
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Abstract
A laser projection heat dissipation device and a laser projector relate to the technical field of heat dissipation. The laser projection heat dissipation device comprises a first laser heat dissipation assembly used for dissipating heat of a first laser and a second laser heat dissipation assembly used for dissipating heat of a second laser; the first laser heat dissipation assembly comprises a heat conduction piece and a water-cooling heat radiator; the heat conducting piece is used for transferring the heat of the first laser to the water-cooling radiator; the second laser heat dissipation assembly comprises a heat pipe, a heat dissipation fin and a substrate used for being connected with the second laser; one end of the heat pipe is fixedly connected with the base plate, and the other end of the heat pipe is fixedly connected with the radiating fins. The laser projector comprises a laser projection heat dissipation device. The utility model aims to provide a laser projection heat dissipation device and a laser projector, and aims to solve the technical problem of cooling and heat dissipation of a laser in the prior art to a certain extent.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a laser projection heat dissipation device and a laser projector.
Background
The existing color laser projector mainly comprises a lamp body, wherein a control box, a laser, a scanning galvanometer, an optical lens group and other parts are arranged in the lamp body, the laser and the scanning galvanometer are respectively and electrically connected with the control box, when the color laser projector is used, the laser can emit colorful laser by matching with the optical lens group according to the light superposition principle, and the control box can control the time and the space of the colorful laser through the scanning galvanometer, so that the laser projector can emit various wonderful characters, patterns or special laser effects, and is synchronous with music, thereby showing very shocking laser art.
Currently, there are two general types of color laser projectors used in the market: the first is RGB (red, green and blue) lamp body, three lasers of red laser, green laser and blue laser are arranged in the lamp body, when in use, the three lasers can emit colorful laser by matching with an optical lens group according to the principle of light superposition; the other is a lamp body formed by randomly reducing one color laser from an RGB lamp body, such as: the red, green and yellow lamp body is composed of a red laser and a green laser, and actually, the lamp body belongs to an extension product of the RGB lamp body.
The laser in the lamp body can produce a large amount of heat at the during operation, needs in time to cool off the heat dissipation to the laser, otherwise influences the normal projection work of laser.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a laser projection heat dissipation device and a laser projector, and aims to solve the technical problem of cooling and heat dissipation of a laser in the prior art to a certain extent.
In order to achieve the purpose, the utility model provides the following technical scheme:
a laser projection heat dissipation device comprises a first laser heat dissipation assembly and a second laser heat dissipation assembly, wherein the first laser heat dissipation assembly is used for dissipating heat of a first laser, and the second laser heat dissipation assembly is used for dissipating heat of a second laser;
the first laser heat dissipation assembly comprises a heat conduction piece and a water-cooling heat radiator; the heat conducting piece is used for transferring the heat of the first laser to the water-cooling radiator;
the second laser heat dissipation assembly comprises a heat pipe, a heat dissipation fin and a substrate used for being connected with the second laser; one end of the heat pipe is fixedly connected with the base plate, and the other end of the heat pipe is fixedly connected with the radiating fins.
In any of the above technical solutions, optionally, the water-cooled radiator includes a water-cooled head, a water pump, a water inlet pipe, a water outlet pipe, and a cold row;
one surface of the water cooling head is fixedly connected with the heat conducting piece, and the other surface of the water cooling head is fixedly connected with the water pump;
the water pump is communicated with the cold row through the water inlet pipe and the water outlet pipe.
In any of the above technical solutions, optionally, the first laser heat dissipation assembly further includes a first heat dissipation fan; the first cooling fan is connected with the cold row.
In any of the above technical solutions, optionally, the number of the base plates is one or more, and each of the base plates is connected to the heat dissipation fin through a plurality of heat pipes arranged in parallel.
In any of the above technical solutions, optionally, the second laser heat dissipation assembly further includes a sub-heat sink; the auxiliary cooling fin is connected with one surface of the substrate, which is far away from the second laser;
and/or the second laser heat dissipation assembly further comprises a second heat dissipation fan; the second heat radiation fan is connected with the heat radiation fins.
In any of the above technical solutions, optionally, the secondary heat dissipation fins are made of extruded aluminum, stamped fastening fins or relieved teeth;
the heat conducting piece is a semiconductor refrigerator; the cold surface of the semiconductor refrigerator is used for being connected with the first laser, and the hot surface of the semiconductor refrigerator is connected with the water-cooling radiator.
In any of the above technical solutions, optionally, the substrate includes a first substrate portion and a second substrate portion; the first substrate part is provided with a first substrate groove, the second substrate part is provided with a second substrate groove, and one end of the heat pipe is fixed in the first substrate groove and the second substrate groove;
the material of the first substrate portion is the same as or different from the material of the second substrate portion.
In any of the above technical solutions, optionally, the first substrate portion and the second substrate portion are both copper blocks;
or, the first substrate part is a copper block, and the second substrate part is an aluminum block.
A laser projector comprises a first laser, a second laser and a laser projection heat dissipation device;
the first laser is connected with the heat conducting piece of the first laser heat dissipation assembly;
the second laser is connected with the substrate of the second laser heat dissipation assembly.
In any of the above solutions, optionally, the first laser includes a red laser; the second laser comprises a green laser and a blue laser;
the number of the red lasers is one;
the number of the blue lasers is one;
the number of the green lasers is two;
the second laser connected with the green laser comprises two substrates.
The utility model has the following beneficial effects:
the utility model provides a laser projection heat dissipation device and a laser projector, which comprise a first laser heat dissipation component for dissipating heat of a first laser and a second laser heat dissipation component for dissipating heat of a second laser; the heat of the first laser is transferred to the water-cooling radiator through the heat conducting piece, so that the first laser is cooled and radiated in time; the heat is transferred to the heat pipe through the substrate and then transferred to the radiating fins through the heat pipe so as to cool and radiate the second laser in time; the laser projection heat dissipation device can solve the cooling and heat dissipation problems of different lasers of a laser projector, and ensures the normal work of the lasers to a certain extent.
In order to make the aforementioned and other objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a laser projection heat dissipation apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view of another perspective structure of a laser projection heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a first laser heat sink assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first laser heat dissipation assembly according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a second laser heat sink assembly according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a second laser heat dissipation assembly according to an embodiment of the present invention;
fig. 7 is another view-angle structural diagram of the second laser heat sink assembly shown in fig. 6;
fig. 8 is another schematic structural diagram of a second laser heat sink assembly according to an embodiment of the present invention;
fig. 9 is a simulated temperature cloud of the first laser heat sink assembly according to the embodiment of the present invention;
fig. 10 is a simulated temperature cloud of the second laser heat sink assembly according to the embodiment of the present invention.
Icon: 110-a first laser; 120-a second laser; 121-green laser; 122-blue laser;
210-a first laser heat sink assembly; 211-a thermally conductive member; 212-Water-cooled radiator; 2121-water cooling head; 2122-water pump; 2123-water inlet pipe; 2124-water outlet pipe; 2125-cold discharging; 213-first heat dissipation fan;
220-a second laser heat sink assembly; 221-a heat pipe; 222-heat dissipating fins; 223-a substrate; 2231-a first substrate portion; 2232-a second substrate portion; 224-minor fins; 225-second heat dissipation fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the utility model are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Examples
The embodiment provides a laser projection heat dissipation device and a laser projector; referring to fig. 1 to 10, fig. 1 is a perspective view of a laser projection heat sink according to the present embodiment, and fig. 2 is a front view of the laser projection heat sink according to the present embodiment, in which positions of respective lasers are shown by dashed lines; fig. 3 is a schematic diagram illustrating a principle of a first laser heat sink provided in this embodiment, and fig. 4 is a schematic diagram illustrating a structure of the first laser heat sink provided in this embodiment; fig. 5 is a schematic diagram of a principle of a second laser heat sink provided in this embodiment, fig. 6 is a schematic diagram of a structure of the second laser heat sink provided in this embodiment, fig. 7 is a schematic diagram of another view angle structure of the second laser heat sink shown in fig. 6, and fig. 8 is a schematic diagram of another structure of the second laser heat sink provided in this embodiment. The first heat dissipation fan in fig. 1 and 4 does not show the fan blades. Fig. 9 is a simulated temperature cloud of the first laser heat sink assembly provided in this embodiment; fig. 10 is a simulated temperature cloud diagram of the second laser heat sink assembly provided in this embodiment.
Referring to fig. 1 to 8, the present embodiment provides a heat dissipation device for laser projection, which is used in a laser projector, especially a color laser projector.
The laser projection heat dissipation device comprises a first laser heat dissipation component 210 for dissipating heat of a first laser 110 and a second laser heat dissipation component 220 for dissipating heat of a second laser 120; for example, a first laser heat sink assembly 210 may be used to dissipate heat for the red laser and a second laser heat sink assembly 220 may be used to dissipate heat for the green and blue lasers.
The first laser heat sink assembly 210 includes a heat conducting member 211 and a water-cooled heat sink 212; the heat conducting member 211 is used for transferring heat of the first laser 110 to the water-cooling heat sink 212, so that the water-cooling heat sink 212 cools and dissipates the heat of the first laser 110.
The second laser heat sink assembly 220 includes a heat pipe 221, a heat sink fin 222, and a substrate 223 for connection with the second laser 120; one end of the heat pipe 221 is fixedly connected to the substrate 223, and the other end of the heat pipe 221 is fixedly connected to the heat dissipation fin 222, so that the heat dissipation fin 222 cools and dissipates the heat of the second laser 120.
Optionally, the thermal conductor 211 is a semiconductor cooler. The semiconductor refrigerator, its english abbreviation is TEC, the english is the Thermo Electric Cooler entirely, utilizes the device of the thermoelectric effect of semiconductor to prepare cold volume, has characteristics such as noiselessness, no vibration, do not need the refrigerant, small, light in weight, and reliable operation, easy to operate, easily carry out cold volume regulation.
Alternatively, the cold side of the semiconductor cooler is used to couple to first laser 110, and the hot side of the semiconductor cooler is coupled to water-cooled heat sink 212, so that the semiconductor cooler can transfer the heat of first laser 110 to water-cooled heat sink 212.
The heat dissipation device for laser projection in this embodiment includes a first laser heat dissipation assembly 210 for dissipating heat of the first laser 110 and a second laser heat dissipation assembly 220 for dissipating heat of the second laser 120; the heat of the first laser 110 is transferred to the water-cooling radiator 212 through the heat conducting piece 211, so as to cool and radiate the first laser 110 in time; heat is transferred to the heat pipe 221 through the substrate 223, and then transferred to the heat dissipation fin 222 through the heat pipe 221, so as to cool and dissipate the second laser 120 in time; the laser projection heat dissipation device can solve the cooling and heat dissipation problems of different lasers of a laser projector, and ensures the normal work of the lasers to a certain extent.
Referring to fig. 3 and 4, in an alternative embodiment of the first laser radiator assembly 210, the water-cooled radiator 212 includes a water-cooled head 2121, a water pump 2122, a water inlet pipe 2123, a water outlet pipe 2124, and a cold row 2125.
One surface of the water cooling head 2121 is fixedly connected to the heat conducting member 211, and the other surface of the water cooling head 2121 is fixedly connected to the water pump 2122.
The water pump 2122 is connected to the cold row 2125 via a water inlet pipe 2123 and a water outlet pipe 2124 to form a circulating water path. The water-cooled heat sink 212 ensures that the heat conducting member 211 can stably work, so that the heat conducting member 211 can transfer the heat of the first laser 110 to the water-cooled heat sink 212.
Referring to fig. 3 and 4, in an alternative of the present embodiment, the first laser heat sink assembly 210 further includes a first heat sink fan 213; the first heat dissipation fan 213 is connected to the cold row 2125. The first heat dissipation fan 213 is used to increase the heat dissipation capability of the cold row 2125, and thus the heat dissipation capability of the water-cooled heat sink 212 is increased.
Alternatively, the first radiator fan 213 is disposed in front of the cold row 2125, or the first radiator fan 213 is disposed behind the cold row 2125.
Referring to fig. 5 to 8, in an alternative of the present embodiment, in the second laser heat sink assembly 220, the number of the substrates 223 is one or more, and each substrate 223 is connected to the heat sink fins 222 through a plurality of heat pipes 221 arranged in parallel.
Alternatively, the number of the substrates 223 is one, as shown in fig. 8.
Alternatively, the number of the substrates 223 is two, as shown in fig. 6 and 7.
Referring to fig. 8, in an alternative of the present embodiment, the second laser heat sink assembly 220 further includes a sub-heat sink 224; the sub-heatsink 224 is connected to a surface of the substrate 223 remote from the second laser 120; the heat dissipation capability of the substrate 223 and thus the second laser 120 is improved by the sub-heat sink 224.
In an alternative embodiment, the secondary fins 224 may be made of extruded aluminum, stamped snap-fins or relieved teeth, or other materials.
Referring to fig. 5, in an alternative of the present embodiment, the second laser heat sink assembly 220 further includes a second heat sink fan 225; the second heat dissipation fan 225 is connected to the heat dissipation fins 222. The second heat dissipation fan 225 is used to increase the heat dissipation capability of the heat dissipation fins 222, thereby increasing the heat dissipation capability of the second laser 120.
Referring to fig. 6 and 7, in an alternative of the present embodiment, substrate 223 includes a first substrate section 2231 and a second substrate section 2232; the first substrate section 2231 is provided with a first substrate groove, and the second substrate section 2232 is provided with a second substrate groove; one end of the heat pipe 221 is fixed in the first substrate groove and the second substrate groove.
Alternatively, the cross-section of the first substrate groove is semicircular, and the cross-section of the second substrate groove is semicircular, so that the first substrate groove and the second substrate groove can form a circular cross-section, so that the heat pipe 221 is fixed in the first substrate groove and the second substrate groove.
Alternatively, the material of the first substrate 2231 may be the same as or different from the material of the second substrate 2232.
Alternatively, the first substrate 2231 and the second substrate 2232 are both copper blocks or other materials.
Alternatively, the first substrate 2231 is a copper block and the second substrate 2232 is an aluminum block. Alternatively, the first substrate 2231 and the second substrate 2232 may be made of different materials.
The embodiment further provides a laser projector, which includes a first laser 110, a second laser 120 and the laser projection heat dissipation device according to any of the above embodiments.
The first laser 110 is connected with the heat conducting member 211 of the first laser heat sink assembly 210;
the second laser 120 is connected to the substrate 223 of the second laser heat sink assembly 220.
The laser projector provided by the embodiment includes the above-mentioned laser projection heat dissipation device, and the technical features of the above-mentioned disclosed laser projection heat dissipation device are also applicable to the laser projector, and the technical features of the above-mentioned disclosed laser projection heat dissipation device are not described repeatedly. The laser projector in the embodiment has the advantages of the laser projection heat dissipation device, and the advantages of the laser projection heat dissipation device disclosed above are not described repeatedly herein.
Referring to fig. 1 and 2, in an alternative to the present embodiment, the first laser 110 comprises a red laser; the second laser 120 includes a green laser 121 and a blue laser 122.
Optionally, the number of red lasers is one.
Optionally, the number of blue lasers 122 is one.
Alternatively, the number of green lasers 121 is two.
Alternatively, the second laser 120, connected to the green laser 121, comprises two substrates 223; one green laser 121 is attached to each substrate 223.
In order to better understand the laser projection heat dissipation device and the laser projector described in this embodiment, the following examples are given in a simulation manner: the thermal power consumption of the red laser is 60w, and the quantity is 1; the heat power consumption of the blue laser is 55.5w, and the number of the blue lasers is 1; thermal power consumption 73.57w of the green laser, 2 in number.
Simulation analysis condition input of the red laser:
1. the thermal power consumption is 60 w;
2. the size of the water-cooled radiator is as follows: L109W 96H 125 mm;
3. ambient temperature: 40 ℃;
4. parameters of the water pump: flow rate is 1 liter per minute, and lift is 1 meter;
5. first cooling fan parameters: air quantity 58CFM, static pressure 60 Pa.
Simulation analysis condition input of the blue laser and the green laser:
1. the heat consumption of the blue laser is 55.5w, and the heat consumption of the green laser is 73.5 w-2;
2. the size of the radiating fin is as follows: L224W 174H 103 mm;
3. ambient temperature: 40 ℃;
4. fan parameters:
109P0612H702 (60x60x15) 2 air volumes 14.12CFM, static pressure 38.36 Pa;
109P0912J402 (92x92x25) 1 air volume 72.04CFM, static pressure 92.24 Pa;
109R0812S402(80x80x25) 1 air volume 42.73CFM, static pressure 48.53 Pa.
FIG. 9 is a simulated temperature cloud of the first laser heatsink assembly illustrating simulated temperature of the first laser heatsink assembly for dissipating heat from the red laser; fig. 10 is a simulated temperature cloud of the second laser heatsink assembly illustrating simulated temperatures of the second laser heatsink assembly for dissipating heat from the blue and green lasers. The data collated in fig. 9 and 10 is shown in table 1, where R is the red laser, G1 and G2 are the green laser, B is the blue laser, Tc is the temperature of the red, blue and green lasers, Ta is the ambient temperature, and Δ T is the difference between Tc and Ta in table 1. As can be seen from the simulated cloud picture, the first laser heat dissipation assembly and the second laser heat dissipation assembly can perform good cooling and heat dissipation on the laser projection heat dissipation device and the laser projector.
TABLE 1
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A laser projection heat dissipation device is characterized by comprising a first laser heat dissipation assembly and a second laser heat dissipation assembly, wherein the first laser heat dissipation assembly is used for dissipating heat of a first laser, and the second laser heat dissipation assembly is used for dissipating heat of a second laser;
the first laser heat dissipation assembly comprises a heat conduction piece and a water-cooling heat radiator; the heat conducting piece is used for transferring the heat of the first laser to the water-cooling radiator;
the second laser heat dissipation assembly comprises a heat pipe, a heat dissipation fin and a substrate used for being connected with the second laser; one end of the heat pipe is fixedly connected with the base plate, and the other end of the heat pipe is fixedly connected with the radiating fins.
2. The laser projection heat dissipation device of claim 1, wherein the water-cooled heat sink comprises a water cooling head, a water pump, a water inlet pipe, a water outlet pipe and a cold row;
one surface of the water cooling head is fixedly connected with the heat conducting piece, and the other surface of the water cooling head is fixedly connected with the water pump;
the water pump is communicated with the cold row through the water inlet pipe and the water outlet pipe.
3. The laser projection heat sink of claim 2, wherein the first laser heat sink assembly further comprises a first heat sink fan; the first cooling fan is connected with the cold row.
4. The heat sink for laser projection according to claim 1, wherein the number of the base plates is one or more, and each of the base plates is connected to the heat sink fins through a plurality of heat pipes arranged in parallel.
5. The laser projection heat sink of claim 1 wherein the second laser heat sink assembly further comprises a sub-heat sink; the auxiliary cooling fin is connected with one surface of the substrate, which is far away from the second laser;
and/or the second laser heat dissipation assembly further comprises a second heat dissipation fan; the second heat radiation fan is connected with the heat radiation fins.
6. The laser projection heat dissipation device of claim 5, wherein the secondary fins are made of extruded aluminum, stamped snap-in fins or relieved teeth;
the heat conducting piece is a semiconductor refrigerator; the cold surface of the semiconductor refrigerator is used for being connected with the first laser, and the hot surface of the semiconductor refrigerator is connected with the water-cooling radiator.
7. The laser projection heat sink of claim 1, wherein the substrate comprises a first substrate portion and a second substrate portion; the first substrate part is provided with a first substrate groove, the second substrate part is provided with a second substrate groove, and one end of the heat pipe is fixed in the first substrate groove and the second substrate groove;
the material of the first substrate portion is the same as or different from the material of the second substrate portion.
8. The laser projection heat sink of claim 7, wherein the first substrate portion and the second substrate portion are both copper blocks;
or, the first substrate part is a copper block, and the second substrate part is an aluminum block.
9. A laser projector comprising a first laser, a second laser, and the laser projection heat sink of any of claims 1-8;
the first laser is connected with the heat conducting piece of the first laser heat dissipation assembly;
the second laser is connected with the substrate of the second laser heat dissipation assembly.
10. The laser projector of claim 9 wherein the first laser comprises a red laser; the second laser comprises a green laser and a blue laser;
the number of the red lasers is one;
the number of the blue lasers is one;
the number of the green lasers is two;
the second laser connected with the green laser comprises two substrates.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122905584.5U CN216210435U (en) | 2021-11-24 | 2021-11-24 | Laser projection heat abstractor and laser projector |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202122905584.5U CN216210435U (en) | 2021-11-24 | 2021-11-24 | Laser projection heat abstractor and laser projector |
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| CN216210435U true CN216210435U (en) | 2022-04-05 |
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| CN202122905584.5U Active CN216210435U (en) | 2021-11-24 | 2021-11-24 | Laser projection heat abstractor and laser projector |
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- 2021-11-24 CN CN202122905584.5U patent/CN216210435U/en active Active
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