CN207689818U - DMD heat abstractor - Google Patents

Abstract

The utility model discloses a DMD heat dissipation device, which comprises: a DMD fixing part; a first heat diffusion plate, which is arranged by attaching the DMD fixing part to the back of the DMD, and the heat generated by the DMD is transferred to the first heat diffusion plate ; The second heat diffusion plate is connected to the first heat diffusion plate through the heat conduction device, and is attached to the inner surface of the shell to further transfer heat to the shell for heat dissipation. The heat dissipation device of the DMD is suitable for small projection equipment with tens of watts of optical power; the DMD heat dissipation device provided by the utility model passes the heat generated by the DMD operation through the first heat diffusion plate, the heat conduction device and the second heat diffusion plate through heat conduction. Conducted to the shell for multi-stage heat dissipation, no fan required, reduced noise, and increased product reliability.

Description

A kind of DMD cooling device

technical field

The utility model relates to the technical field of projection display, in particular to a DMD cooling device.

Background technique

With the continuous improvement of projection technology, digital micromirror device (DMD) has been widely used. The principle is that white light is irradiated on DMD, and the reflection angle and time of tens of thousands of small mirrors on the chip are controlled to control The intensity of the pixel points of the screen can be used to obtain a grayscale image, and finally a color image can be obtained by superimposing the grayscale images of the three primary colors.

However, when the white light is irradiated on the DMD, it will cause the temperature of the DMD to rise. At the same time, when the DMD is working, it will also generate heat, which will cause the temperature of the DMD to rise. Excessively high temperature will reduce the life of the DMD and even cause damage. Therefore, it is necessary to carry out effective heat dissipation and temperature control for DMD.

At present, there are many DMD heat dissipation technologies. Small and medium-power projectors generally use air-cooling to dissipate heat, attach a heat sink to the back of the DMD, and use fans to dissipate heat; high-power projectors use water-cooling to dissipate heat. However, the use of fans for heat dissipation will increase the number of moving components, reduce product reliability, and increase noise. Water cooling requires a certain space to be placed, so it is not suitable for small projection equipment, and water cooling also requires fans to dissipate heat. Therefore, there is an urgent need for a heat dissipation system for small projection equipment, which can avoid the use of fans while meeting the heat dissipation requirements, eliminate the impact of noise, and increase product reliability.

Utility model content

In order to achieve the above purpose, the utility model provides a DMD heat dissipation device, which is suitable for small projection equipment with an optical power of tens of watts, and does not need a fan for heat dissipation, so it is more reliable.

The utility model provides technical scheme as follows:

A kind of DMD cooling device, this device comprises: DMD fixture; The first heat diffusion plate, through the DMD fixture and the back of DMD, the heat is transferred to the first heat diffusion plate;

The second heat diffusion plate is connected to the first heat diffusion plate through the heat conduction device, and is arranged in close contact with the inner surface of the casing to further transfer heat to the casing for heat dissipation.

Preferably, indium foil, thermal grease or graphene sheets are filled between the first heat diffusion plate and the DMD to reduce contact thermal resistance.

Preferably, the first heat diffusion plate is copper.

The heat conduction device is a heat conduction device with a high thermal conductivity, one end of which is connected to the first heat diffusion plate, and the other end is connected to the upper surface of the second heat diffusion plate; preferably, the heat conduction device is a heat pipe.

Preferably, indium foil, thermal conductive silicone grease or graphene sheet is filled between the second heat diffusion plate and the housing, so as to reduce contact thermal resistance.

Preferably, the second heat diffusion plate is copper.

The casing is the casing of the projection device, or a part of the casing. Preferably, the material of the housing is metal, such as aluminum, copper and so on.

Preferably, the first heat diffusion plate is connected to the heat conduction device by welding to reduce thermal resistance.

Preferably, the second heat diffusion plate is connected to the heat conduction device by welding.

Preferably, the second heat diffusion plate is fixed on the inner side of the housing by screws.

Its working mode is that the DMD is closely attached to the first heat diffusion plate through the DMD fixing part; the heat generated by the DMD is conducted to the first heat diffusion plate, and the temperature of the first heat diffusion plate rises, and is transferred to the second heat dissipation plate through the heat conduction device. The diffuser plate is finally conducted to the casing. Since the casing has a large area and is made of a material with excellent thermal conductivity, the heat on the casing can be taken away by air circulation.

Beneficial effects of the utility model

The DMD heat dissipation device provided by the utility model conducts the heat generated by the DMD operation through the first heat diffusion plate, the heat conduction device and the second heat diffusion plate to the housing through heat conduction, and performs multi-stage heat dissipation without the need for fans, reducing noise , Increase product reliability.

Description of drawings

Fig. 1 is the structural representation of a kind of DMD cooling device of the utility model

Explanation of reference numerals: 101 - DMD, 102 - DMD fixing part, 103 - first heat diffusion plate, 104 - heat conduction device, 105 - second heat diffusion plate, 106 - housing.

Detailed ways

The utility model is described in detail by the following examples. It is necessary to point out that the present embodiment is only used to further illustrate the utility model, and can not be interpreted as limiting the protection scope of the utility model. Those skilled in the art can according to Some non-essential improvements and adjustments are made to the content of the above invention. In the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

In addition, some orientation words mentioned in the embodiments of the present invention, such as "left", "right", "up", "down", etc., the meaning of these orientation words is related to the installation situation of the heat sink, It should not be understood as limiting the protection scope of the present utility model.

A kind of DMD cooling device, as shown in Figure 1, this device comprises: DMD fixture 102; The first heat diffusion plate 103, by DMD fixture 102 and DMD 101 back lamination setting, the heat that DMD 101 work produces is transferred to all The first heat diffusion plate 103;

The second heat diffusion plate 105 is connected to the first heat diffusion plate 103 through the heat conduction device 104 , and is attached to the inner surface of the housing 106 to further transmit heat to the housing for heat dissipation.

The DMD cooling device of the utility model avoids the use of a fan, eliminates noise influence, and increases product reliability.

The utility model provides a preferred embodiment, indium foil, thermal conductive silicone grease or graphene sheets are filled between the first heat diffusion plate 103 and the DMD 101 to reduce contact thermal resistance.

The first heat spreading plate 103 is preferably made of red copper, which has better heat conduction effect. Likewise, the second heat spreading plate 105 is preferably copper.

The heat conduction device 104 is a heat pipe, one end of which is connected to the first heat diffusion plate 103, and the other end is connected to the upper surface of the second heat diffusion plate 105, increasing the contact area and improving the heat transfer effect.

Indium foil, thermal grease or graphene sheets are filled between the second heat spreading plate 105 and the housing 106 to reduce thermal contact resistance.

The casing 106 is the casing of the projection device, and may also be a part of the casing of the projection device. In order to achieve better heat dissipation effect, the material of the housing 106 is metal, such as aluminum, copper and so on.

The first heat spreading plate 103 is connected to the heat conduction device 104 by welding to reduce thermal resistance.

The second heat spreading plate 105 is connected to the heat conducting device 104 by welding.

The second heat spreading plate 105 is fixed on the inner side of the casing 106 by screws.

The working mode is that when the DMD 101 is working, the temperature rises, and the generated heat is conducted to the first heat diffusion plate 103, wherein the contact thermal resistance is reduced by filling indium foil between the first heat diffusion plate 103 and the DMD 101, and the first The heat spreading plate 103 conducts heat to the second heat spreading plate 105 through the heat pipe 104, wherein the heat pipe 104 is connected with the first heat spreading plate 103 and the second heat spreading plate 105 by welding to reduce thermal resistance; the second heat spreading plate 105 conducts heat to the housing 106, wherein the second heat diffusion plate 105 is closely attached to the housing 106, and is fixed by screws, and the thermal conductive silicone grease is filled between the second heat diffusion plate 105 and the housing 106, reducing Small contact thermal resistance; due to the large heat dissipation area of the housing 106, enough heat can be taken away by air flow.

The DMD heat dissipation device provided by the utility model conducts the heat generated by the DMD operation through the first heat diffusion plate, the heat conduction device and the second heat diffusion plate to the housing through heat conduction, and performs multi-stage heat dissipation without the need for fans, reducing noise , Increase product reliability.

Claims (10)

1. A DMD cooling device, characterized in that the device comprises: DMD fixture (102); The first heat diffusion plate (103) is arranged on the back side of the DMD (101) through the DMD fixture (102), and the heat generated by the DMD (101) is transferred to the first heat diffusion plate (103); The second heat diffusion plate (105) is connected to the first heat diffusion plate (103) through the heat conduction device (104), and is attached to the inner surface of the casing (106) to further transfer heat to the casing for heat dissipation. 2. The heat dissipation device according to claim 1, characterized in that, indium foil, thermal conductive silicone grease or graphene sheet is filled between the first heat diffusion plate (103) and the DMD (101). 3. The heat dissipation device according to claim 1, characterized in that, the first heat diffusion plate (103) is made of red copper. 4. The heat dissipation device according to claim 1, characterized in that, the heat conducting device (104) is a heat pipe. 5. The heat dissipation device according to claim 1, characterized in that, indium foil, thermal conductive silicone grease or graphene sheet is filled between the second heat diffusion plate (105) and the housing (106). 6. The heat dissipation device according to claim 1, characterized in that, the second heat diffusion plate (105) is made of red copper. 7. The heat dissipation device according to claim 1, characterized in that, the material of the casing (106) is metal. 8. The heat dissipation device according to claim 1, characterized in that, the first heat diffusion plate (103) is connected to the heat conduction device (104) by welding. 9. The heat dissipation device according to claim 1, characterized in that, the second heat diffusion plate (105) is connected to the heat conduction device (104) by welding. 10. The heat dissipation device according to claim 1, characterized in that, the second heat diffusion plate (105) is fixed on the inner surface of the casing (106) by screws.