CN205790041U - Led module - Google Patents

Abstract

An LED module, comprising: a substrate (1), an LED chip (2) disposed on the substrate (1), and a first fluorescent adhesive layer (3) disposed above the LED chip (2), disposed on the substrate ( 1) A thermally conductive insulating layer (4) located on one side of the LED chip (2) and attached to the LED chip (2) for heat dissipation, and a second fluorescent adhesive layer (5) arranged on the thermally conductive insulating layer (4). The heat generated by the LED chip (2) is dissipated through the heat-conducting insulating layer (4), which improves the heat dissipation efficiency, avoids the problems of large light decay and color drift, and improves the quality of the LED module. Since the second fluorescent adhesive layer (5) can absorb light from the LED chip (2) toward the substrate (1) and excite fluorescence, the overall luminous effect is improved.

Description

LED module

technical field

The present application relates to the field of light emitting diodes, in particular to an LED module.

Background technique

Light emitting diodes (Light Emitting Diode, LED) are widely used in the backlight field, and have subversive advantages in terms of color reproduction, lifespan, and response speed, and have become the main backlight source for LCD TVs. At present, the shape of the LED module is rectangular. LED modules are composed of SMD LEDs and connectors mounted on a printed circuit board (PCB). There are different types of PCB boards such as FR-4, CEM-3 and aluminum substrates, and the appearance of LEDs is also different. The packaging form of the existing LED module includes a PCB board, and a SMD LED installed on the PCB board is electrically connected to it. Specifically, the SMD LED is electrically connected to the PCB board by solder paste reflow mounting the LED. In order to meet the brightness requirements of the backlight screen, SMD LEDs generally use high-power LEDs. The existing LED modules have at least the following problems: Since the SMD LEDs are directly soldered to the PCB board, the SMD LED module is not easy to operate. The heat generated by the type LED needs to be transferred to the PCB board through the LED bracket, and then to the heat sink installed on the PCB board, resulting in poor heat dissipation effect, large heat dissipation thermal resistance, easy to cause light decay and color drift, and thus affect the image quality of the LCD TV quality.

Contents of the invention

The present application aims to solve one of the above-mentioned technical problems at least to a certain extent.

The present application provides an LED module, including: a substrate, an LED chip disposed on the substrate, and a first fluorescent glue layer covering the LED chip, and the LED module further includes: covering the A thermally conductive insulating layer located on one side of the LED chip on the substrate and attached to the LED chip for heat dissipation, and a second fluorescent adhesive layer disposed on the thermally conductive insulating layer.

Further, a transparent adhesive layer is provided on the outside of the first fluorescent adhesive layer.

Further, the thermally conductive insulating layer is made of graphene, alumina thermally conductive rubber or boron nitride thermally conductive rubber material.

Further, a metallized hole communicating with the LED chip is provided on the substrate, and the LED chip is electrically connected to the metallized hole through pins.

Further, the thermally conductive insulating layer has a through hole for the pin to pass through.

Further, a heat sink is provided on the side of the substrate opposite to the LED chip.

Further, the thermally conductive insulating layer is provided with an extension connected to the heat sink.

Further, the substrate is provided with a thermal conduction hole through which the extension part passes.

Further, the substrate is a ceramic substrate or a copper-clad substrate.

Further, the LED chip is a blue LED chip.

The beneficial effect of this application is:

By providing an LED module, including: a substrate, an LED chip disposed on the substrate, and a first fluorescent glue layer covering the LED chip, the LED module further includes: covering the LED chip A thermally conductive insulating layer on the substrate located on one side of the LED chip and attached to the LED chip for heat dissipation, and a second fluorescent adhesive layer disposed on the thermally conductive insulating layer. In this way, the heat generated by the LED chip is dissipated through the heat-conducting insulating layer, which reduces its heat dissipation thermal resistance, improves the heat dissipation efficiency, avoids the problems of large light decay and color drift, and improves the quality of the LED module; in addition, Since the second fluorescent adhesive layer can absorb light from the LED chip toward the substrate and excite fluorescence, the overall luminous effect is further improved.

Description of drawings

FIG. 1 is a schematic structural diagram of an LED module according to an embodiment of the present application.

detailed description

Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

In this application, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection, unless otherwise clearly specified and limited. , or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "below" and "under" the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is less horizontal than the second feature.

The present application will be described in further detail below through specific embodiments in conjunction with the accompanying drawings.

Please refer to FIG. 1 , this embodiment provides an LED module, which can be applied in the field of LED display or lighting, and specifically can be integrated with corresponding equipment, such as LED display screen, LED signal lamp or LED bulb lamp.

The above-mentioned LED module mainly includes: a substrate 1, an LED chip 2 disposed on the substrate 1, and a first fluorescent adhesive layer 3 covering the top of the LED chip 2. The LED module also includes: covering the substrate 1 and located on the LED One side of the chip 2 and a thermally conductive insulating layer 4 bonded to the LED chip 2 for heat dissipation, and a second fluorescent glue layer 5 disposed on the thermally conductive insulating layer 4 .

In this way, the heat generated by the LED chip is dissipated through the heat-conducting insulating layer, which reduces its heat dissipation thermal resistance, improves the heat dissipation efficiency, avoids the problems of large light decay and color drift, and improves the quality of the LED module; in addition, Since the second fluorescent adhesive layer can absorb light from the LED chip toward the substrate and excite fluorescence, the overall luminous effect is further improved.

As another embodiment, in order to improve the light emitting effect, a transparent adhesive layer is further provided on the outside of the first fluorescent adhesive layer 3 . Both the first fluorescent adhesive layer and the transparent adhesive layer can use silica gel as the colloidal base material.

In a specific application, the thermally conductive insulating layer 4 can be made of materials such as graphene, alumina thermally conductive rubber or boron nitride thermally conductive rubber.

In order to ensure the heat dissipation of the LED module, as a preferred embodiment, the substrate 1 is provided with a metallized hole 11 communicating with the LED chip 2 , and the LED chip 2 is electrically connected to the metallized hole 11 through a pin 21 . The thermally conductive insulating layer 4 has a through hole 41 through which the pin 21 passes.

In order to ensure the heat dissipation of the LED module, as another preferred embodiment, a heat sink 6 is provided on the side of the substrate 1 opposite to the LED chip 2 . The thermally conductive insulating layer 4 is provided with an extension that is in contact with the heat sink. Correspondingly, the substrate 1 is provided with a thermal conduction hole through which the extension part passes.

Generally, the substrate 1 can be a ceramic substrate or a copper clad substrate. The LED chip 2 can be a blue LED chip or a red LED chip.

In the description of this specification, reference is made to descriptions of the terms "one embodiment", "some embodiments", "an embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. It means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with specific implementation modes, and it cannot be deemed that the specific implementation of the present application is limited to these descriptions. For those of ordinary skill in the technical field to which the present application belongs, some simple deduction or replacement can also be made without departing from the concept of the present application.

Claims (10)

1. a LED module, including: substrate, the LED chip being arranged on described substrate, and cover in described LED chip First fluorescent adhesive layer of side, it is characterised in that described LED module also includes: covers and is positioned at described LED chip on described substrate Simultaneously and with the laminating of described LED chip with the thermally conductive insulating layer dispelled the heat, and be arranged in described thermally conductive insulating layer second is glimmering Light glue-line.

2. LED module as claimed in claim 1, it is characterised in that the outside of described first fluorescent adhesive layer is additionally provided with transparent Glue-line.

3. LED module as claimed in claim 1, it is characterised in that described thermally conductive insulating layer uses Graphene, aluminium oxide heat conduction Rubber or boron nitride heat conductive rubber material.

4. LED module as claimed in claim 1, it is characterised in that be provided with on described substrate and connect with described LED chip Plated through-hole, described LED chip is electrically connected with described plated through-hole by pin.

5. LED module as claimed in claim 4, it is characterised in that described thermally conductive insulating layer has what the described pin of confession passed Through hole.

6. LED module as claimed in claim 1, it is characterised in that the described LED chip opposite side that is positioned at of described substrate sets It is equipped with radiator.

7. LED module as claimed in claim 6, it is characterised in that described thermally conductive insulating layer is provided with and described radiator phase The extension connect.

8. LED module as claimed in claim 7, it is characterised in that offer on described substrate and supply described extension to pass Thermal hole.

9. the LED module as according to any one of claim 1 to 8, it is characterised in that described substrate is ceramic substrate or covers copper Substrate.

10. the LED module as according to any one of claim 1 to 8, it is characterised in that described LED chip is blue-ray LED core Sheet.