CN110783219A - Thermal resistance test heater for integrated packaged LED carrier - Google Patents

Abstract

The invention discloses an integrated packaged LED carrier thermal resistance test heater, which comprises an analog power electric heating body, the electric heating body comprises a heat conducting base body, an electric heating core is inserted in the heat conducting base body, and one end of the heat conducting base body is provided with The test junction surface is attached with a thermally conductive double-sided film; the thermally conductive base is provided with a heat dissipation adjustment device, and the heat dissipation adjustment device includes a heat insulation sleeve sleeved on the heat conduction base body, and the heat insulation sleeve is provided with There is an adjusting screw that can adjust the degree of connection between the heat-conducting base and the heat-insulating sleeve. The invention is mainly used for the thermal resistance simulation test of the integrated package LED carrier. When used, it is used as an LED simulation device and is directly connected to the LED carrier. The method and requirements are used to measure the thermal resistance of the LED carrier, which is convenient to use. The thermally conductive base is provided with a lively connected heat shield, which can not only meet the requirements of thermal resistance measurement specifications, but also meet the needs of LED carrier testing of different specifications, models and packaging methods.

Description

Integrated package LED carrier thermal resistance test heater

technical field

The invention belongs to the technical field of thermal resistance testing of LED lamps and radiators, in particular to a heating device for thermal resistance testing of an integrated packaged LED carrier.

Background technique

With the development of LED semiconductor lighting technology, the integrated LED multi-chip package light source with small volume, large luminous flux and uniform light emission has been paid more and more attention by the industry and the market. LED integrated package lamps made by encapsulating multiple chips on a bracket have the advantages of low power unit price per watt and simpler light distribution compared to lamps made by single chip packaging, but at the same time, there is also a large heat flux density. , heat dissipation difficulties, etc. In this integrated packaged LED, the heat generated by the chip is mainly dissipated by its carrier. Therefore, the heat dissipation capability of the integrated packaged LED carrier plays a crucial role in the chip life, light efficiency, etc. This requires testing the thermal resistance of the LED carrier in the design of integrated packaged LED lamps to ensure that parameters such as lamp life, light efficiency, and color drift meet the design requirements. At present, there is no specific method and specification for LED carrier thermal resistance test; the existing thermal resistance test is generally carried out with reference to the methods and specifications required by GB/T8446.2-2004. According to this specification, the heat source heating can be performed by the DC method or the simulation method when conducting the thermal resistance test. The DC method is to install the heating device at the working position and apply a DC current to generate power, while the simulation method is to use an analog device to replace the packaged chip, and apply current to the analog device for testing. Resistive elements instead. But for LED integrated package lamps, neither of the above two methods can be directly realized. Using the DC method to test, as long as the DC power is applied, the LED chip will emit light, and the input power cannot be completely converted into heat. The simulation method is used for testing. Due to the small size of the LED chip and the special packaging form, the production and installation of the analog device is difficult and difficult to achieve. In order to solve the problem of thermal resistance test of LED street lamp radiator, the applicant previously submitted a Chinese invention patent application for "heating module for thermal resistance test of street lamp radiator" (application number 201910102953.1), which is mainly for each LED light-emitting unit The heating module for thermal resistance testing cannot meet the requirements of testing the thermal resistance of the integrated package LED carrier and establishing test specifications.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a heating device that facilitates accurate analog detection of the thermal resistance of the integrated packaged LED carrier.

In order to solve the above-mentioned technical problems, the present invention includes a simulated power electric heating body, the structural feature of which is that the electric heating body comprises a thermally conductive base, an electric heating core is inserted in the thermally conductive base, and one end of the thermally conductive base is provided with a test junction, A heat-conducting double-sided film is attached to the test junction surface; a heat-dissipating adjusting device is arranged outside the heat-conducting base, and the heat-dissipating adjusting device includes a heat-insulating sleeve sleeved on the heat-conducting base, and an adjustable heat-conducting sleeve is arranged on the heat-dissipating sleeve. Adjusting screw for the degree of connection between the base body and the heat insulation sleeve.

The heat-conducting base is an aluminum-based cuboid, one end of the aluminum-based cuboid is a test junction, the other end is provided with a blind hole, and the electric heating core is inserted into the blind hole.

The heat insulating sleeve is a box-shaped body with an open end, and the test junction of the heat-conducting substrate is located outside the plane where the opening of the box-shaped body is located.

One end of the heat-conducting base with blind holes is also provided with connecting screw holes, the bottom plate of the heat-insulating sleeve is provided with wire holes and connecting holes corresponding to the blind holes and the connecting screw holes, respectively, and the heat-insulating sleeve and the heat-conducting base are connected. There are connecting screws between.

The bottom plate of the heat insulating sleeve is provided with three adjusting screw holes, the adjusting screw holes are placed in the adjusting screw holes, and the side surface of the heat conducting base body is tightly slidingly connected with the inner wall of the heat insulating sleeve.

After the above structure is adopted, the electric heating body is used as an analog power device to be encapsulated on the LED carrier to be tested, because the electric heating body is externally and sheathed with a heat insulation sleeve that is flexibly connected to it, including a thermally conductive base and an electric heating core. One end of the heat-conducting base is provided with a test junction, and the test junction is attached with a double-sided thermally conductive film. It is mainly used for accurate simulation test of thermal resistance of carriers such as heat sinks of integrated package LED lamps. When used, the present invention is used as an LED simulation device, and the thermal conductive base of the electric heating body is connected to the LED carrier, and the electric heating core heats the thermal conductive base. thermal resistance. The heat-dissipating adjusting device includes a heat-insulating sleeve and an adjusting screw. The heat-insulating sleeve is movably connected to the heat-conducting base, which can precisely control the heat transfer and heat dissipation of the heat-conducting base. Package method LED carrier test is required. A thermally conductive double-sided film is attached to the test junction of the thermally conductive substrate. When in use, the thermally conductive substrate is directly pasted on the LED carrier through the film, which is not only easy to use, but also closely combined, which is conducive to heat conduction.

Description of drawings

Below in conjunction with accompanying drawing and embodiment, the present invention is further described:

Fig. 1 is the general schematic diagram of the present invention;

Fig. 2 is the sectional view of the present invention;

3 is a schematic diagram of a thermally conductive substrate of the present invention;

Fig. 4 is the double-sided film schematic diagram of the present invention;

Figure 5 is a schematic diagram of the thermal insulation jacket of the present invention;

6 is a schematic diagram of the bottom surface of the thermal insulation jacket of the present invention;

Fig. 7 is the electric heating core schematic diagram of the present invention;

FIG. 8 is a reference diagram for use of the present invention.

Detailed ways

Referring to the integrated packaged LED carrier thermal resistance test heater shown in FIG. 1 and FIG. 2 , the heater includes an analog power electric heating body 2, and the electric heating body 2 includes a thermally conductive base 9. The thermally conductive base 9 is inserted with an electric heating core 3. One end is provided with a test junction 93, on which a thermally conductive double-sided film 4 is attached; the thermally conductive base 9 is provided with a heat dissipation adjusting device, and the heat dissipation adjusting device comprises a heat insulating sleeve 1 sleeved on the heat conducting base 9, and the thermal insulation The sleeve 1 is provided with an adjusting screw 5 that can adjust the degree of connection between the heat-conducting base 9 and the heat-conducting base 1 . The heat-insulating sleeve 1 is movably connected to the heat-conducting base 9 . Socket depth.

2 and 3, the thermally conductive base 9 is an aluminum-based cuboid, the upper plane of the aluminum-based cuboid is a test junction 93, and the shape and size of the test junction 93 are consistent with the pre-installed integrated light source of the LED carrier to be tested. The junction surface 93 is entirely covered with a thermally conductive double-sided film 4; a circular blind hole 91 is provided at the center of the lower end face of the aluminum base cuboid, and the electric heating core 3 is inserted into the blind hole 91, and the lower end face of the aluminum base cuboid is also provided with The connecting screw holes 92 to which the heat insulating sleeve 1 is connected. The aluminum-based cuboid can be made of AL6063 aluminum material or other materials with good thermal conductivity. However, considering factors such as its ability to meet the test, weight, machinability, and production cost, it is recommended to use aluminum material. The implementation shown in the figure In the example, the test junction at the upper end of the aluminum-based cuboid is square, and its side is rectangular. The aluminum-based cuboid should preferably be flat, so as to be closer to the LED integrated packaged on the carrier and improve the accuracy of thermal resistance testing. The distance between the inner bottom surface of the blind hole 91 and the test junction surface 93 of the thermally conductive base is not less than 5 mm.

Referring to Figures 2, 5 and 6, the heat insulating sleeve 1 is a box-shaped body with one end open, and the shape and size of its inner cavity are adapted to the heat-conducting base 9, and the outer periphery of the heat-conducting base 9 slides tightly with the heat-insulating box. Connected to each other, the heat insulating sleeve 1 is made of plastic or phenolic laminate with a temperature resistance of more than 100°C. Conductor holes 11 and connecting holes 12 corresponding to the blind holes 91 and the connecting screw holes 92 are respectively provided on the bottom plate of the heat insulating sleeve 1 . The test junction 93 of the thermally conductive base 9 is located outside the plane where the box body is opened, that is, the test junction at the upper end of the thermally conductive base 9 is located 3-5 cm outside the plane where the heat shield 1 is opened. In order to meet the test requirements of LED integrated carriers of different powers and packaging forms, to meet the test requirements of LEDs under different use environments, and to achieve accurate testing of the thermal resistance of LED packaging carriers, the heat dissipation adjustment device of the present invention is provided with a heat insulation sleeve 1 on the bottom plate of the box body. There are three adjustment screw holes 13 , each adjustment screw hole 13 is provided with an adjustment screw 5 , the outer end of the adjustment screw 5 protrudes from the bottom plate of the heat insulating sleeve 1 , and the inner end of the adjustment screw 5 is in contact with the bottom surface of the heat-conducting base 9 . Then, the side surface of the heat-conducting base 9 is in close sliding contact with the inner wall of the box of the heat-insulating sleeve 1 . After the heat-conducting base 9 is loaded into the heat-insulating sleeve 1 box, the screws 6 pass through the connecting holes 12 on the bottom plate of the heat-insulating sleeve 1, and the inner ends of the screws 6 are screwed into the connecting screw holes 92 of the heat-conducting base 9, The box body and the heat-conducting base body 9 are pre-connected by means of screws 6 . Most of the heat-conducting base 9 is sheathed in the heat-insulating jacket 1, and a small part is exposed to the air. Before the measurement, according to the specific packaging form of the LED to be installed on the carrier to be tested and the specific working environment used, the height of the thermally conductive base 9 exposed to the outside of the box is precisely adjusted through the three adjusting screw holes 13, and then the heat dissipation capability is adjusted so that the The heating and heat dissipation of the electric heating body 2 are consistent with the heating and heat dissipation of the corresponding integrated package LED itself, so as to ensure the accuracy of the thermal resistance test.

Referring to FIGS. 4 and 8 , the thermally conductive double-sided film 4 is provided with a plastic coating 41 ; when in use, the heating body 2 can be connected to the LED carrier 7 by removing the coating 41 .

2 and 7 , the electric heating core 3 is an electric heating rod, the rod body is integrally inserted into the blind hole 91 , and the electric heating rod lead wire 31 passes through the wire hole 11 .

FIG. 8 shows the specific usage of the present invention. The integrated packaged LED carrier 7 shown in the figure is an LED lamp radiator, and the heating power supply 8 used is an adjustable DC constant voltage or constant current power supply. Before testing, adjust the height of the heat-conducting base 9 exposed to the outside of the box by using a heat-dissipating adjusting device, and fasten the box and the heat-conducting base 9 through screws 6 . Then, according to the requirements of GB/T8446.2 specification, the LED lamp heat sink is hoisted on the test bracket 10, so that the position of the carrier to be mounted with the LEDs faces downwards. Peel off the coating 41 of the thermally conductive double-sided film on the thermally conductive base 9, so that the adhesive surface is closely connected with the radiator to be tested or the position where the LED is to be installed in the housing, the heating rod lead 31 is connected to the power supply 8, and the heating power switch is turned on to heat. Adjust the power supply to make the power stable at the predetermined value, and test after the temperature of the radiator is stable.

Claims (5)

1. The thermal resistance test heater for the integrated packaged LED carrier comprises an analog power electric heating body (2), and is characterized in that the electric heating body (2) comprises a heat-conducting base body (9), an electric heating core (3) is inserted in the heat-conducting base body (9), one end of the heat-conducting base body (9) is provided with a test connection surface (93), and a heat-conducting double-sided adhesive sheet (4) is attached to the test connection surface (93); the heat conduction base member (9) are equipped with heat dissipation adjusting device outward, heat dissipation adjusting device includes insulator sleeve (1) of suit on heat conduction base member (9), be equipped with adjusting screw (5) of adjustable heat conduction base member (9) and insulator sleeve (1) degree of cup jointing on insulator sleeve (1).

2. The heater for testing the thermal resistance of the integrally packaged LED carrier as claimed in claim 1, wherein the heat-conducting substrate (9) is an aluminum-based cuboid, one end of the aluminum-based cuboid is a testing junction surface (93), the other end of the aluminum-based cuboid is provided with a blind hole (91), and the electric heating core (3) is inserted into the blind hole (91).

3. The thermally resistance test heater for an integrally packaged LED carrier according to claim 2, wherein said heat insulating sleeve (1) is a box-shaped body with an open end, and said test junction (93) of said heat conductive substrate (9) is located outside the plane of said box-shaped body with the open end.

4. The heater for testing thermal resistance of the integrated packaging LED carrier according to claim 3, wherein one end of the heat-conducting base body (9) provided with the blind hole is also provided with a connecting screw hole (92), the bottom plate of the heat-insulating sleeve (1) is provided with a wire hole (11) and a connecting hole (12) which are respectively arranged corresponding to the blind hole (91) and the connecting screw hole (92), and a connecting screw (6) is arranged between the heat-insulating sleeve (1) and the heat-conducting base body (9).

5. The heater for testing thermal resistance of the integrated packaged LED carrier as claimed in claim 4, wherein the bottom plate of the heat insulating sleeve (1) is provided with three adjusting screw holes (13), the adjusting screw rods (5) are arranged in the adjusting screw holes (13), and the side surface of the heat conducting substrate (9) is tightly connected with the inner wall of the heat insulating sleeve (1) in a sliding manner.

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