201106510 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光模組。 【先前技術】 由於發光二極體（LightEmittingDiGde，LED)具有高 亮度及省電等優點，因此，隨著發光二極體的技術逐漸成 熟’其應用領域也越來越廣泛，例如照明設備及液晶顯示 m 裝置的背光源。 請參照圖1所不，其為一種習知的發光模組i剖面示 意圖。發光模組1包含一電路板u、一發光二極體12、 一絕緣導熱膠13、一散熱墊片14及一散熱鰭片15。發光 二極體12經由散熱貧P及絕緣導熱膠13設置於電路板n 上，而散熱鰭片15則藉由散熱墊片14貼合於電路板n 的另一側。 • 於發光模組1中，發光二極體12發光時所產生的大 量熱能，係藉由熱傳導方式經由散熱膏P、絕緣導熱膠13、 電路板11、散熱墊片14及散熱鰭片15再散逸至空氣中。 然而，電路板11、絕緣導熱膠13及散熱墊片14的導熱係 數（絕緣導熱膠13及散熱墊片14的導熱係數約介於'〇 2 〜6W/mK)都不高，因此也使得發光模組丨的散熱效果不 佳。但，若將電路板11改為金屬電路板不僅成本較高， 且散熱效率也無法明顯的提升。 因此，如何提供一種能夠改善散熱效果並降低成本的 201106510 發光模組，已成為 【發明内容】 批有鑑於上述課題，本發目的為提供—種能夠改善 散…政果並降低成本的發光模叙。 為達上述目的’依據本發明之―種發光模組包含一非 '电路板、至少—發光二極體及—散熱單元。非金屬電 路反、有相對的-第一表面及_第二表面，發光二極體毁 置於非金屬Ί路板的第—表面，散熱單元焊接於非金 路板的第二表面。 ％ 為達上述目的’依據本發明之—種發光模組包含 ^㈣板'至少―發光二極體及—散熱單元。非金屬電 路板具有至少一開孔以及相對的一第一表面及一第二】 面’發光二極體設置於非金屬電路板的第—表面，並^ =孔’散熱單元經由開孔内之—焊料連接於發光^ 承上所述，依據本發明之發光模組係利用非金 板，並藉㈣接方式連接散熱單元於非金屬電路板上^ 對於發光二極體的另-個表面。因此，藉 不僅可降低材料成本，且利用焊王离电略板 可“製作政率，並進-步提高發光模組的散熱效果。也 【實施方式】 貫施例之 β下將參照相關圖式，說明依本發明較佳 201106510 種發光模組，其中相同的元件將以相同的符號加以說明。 請參照圖2所示，其為本發明較佳實施例之發光模組 2的剖面示意圖。發光模組2包含一非金屬電路板21、至 少一發光二極體22及一散熱單元23。 非金屬電路板21例如可為一玻璃電路板、或一樹脂 電路板、或一陶瓷電路板、或一玻璃纖維電路板，並具有 相對的一第一表面211及一第二表面212。其中，相對的 第一表面211與第二表面212係可為實質上平行的二表 ® 面。 發光二極體22設置於非金屬電路板21的第一表面 211。發光二極體22例如可具有一發光二極體晶粒設置於 一導線架221，再以一透鏡222修飾發光二極體晶粒的光 形。另外，發光二極體22也可以是發光二極體晶粒打線 連結或覆晶設置於一子基板（sub-mount )，再將子基板與 非金屬電路板21電性連結。發光二極體22可藉由焊料s • 表面連接（SMT)於非金屬電路板21，且焊料S直接與發 光二極體22接觸。其中，焊料S例如可包含錫、或錫合 金（例如錫鎳合金）或其組合，原本熔融狀的焊料s，經 迴銲（reflow)冷卻後，即可固化以連結發光二極體22與 非金屬電路板21。再者，由於焊料§與電路板連接處未具 有金屬材質，因此為使發光二極體22能經由焊料s與非 金屬電路板21緊密連接，非金屬電路板21更可具有金屬 層24設置於第一表面211 ’金屬層24之材質可包含銅、 鎳、銀或錫。藉此，以使發光二極體22能經由焊料s確 201106510 實地連接於非金屬電故 ^ 梵路板21的第一表面211。 政.、、、單元23蟬接於非金屬電路板21的第二表面 212。散熱單元23例如可包含-散熱鱗片、或-散熱板、 或-散熱片、或-熱管或其組合。於此，散熱單元23以 包含散熱鰭片作說明，其非限制性，而散熱鰭片可利用擠 型製程來製作’而為一擠型散熱鰭片。而散熱單元23係 可藉由焊料S連接於非金屬電路板21。同樣的，由於非金 屬電路板21與焊料S連接處未具有金屬材質，因此為使 散熱單元23可經由焊料S與非金屬電路板21緊密連接， 非金屬電路板21的第二表面212亦可具有金屬層24。需 =意的是，金屬層24亦可設置於散熱單元23面對非金屬 之表面（例如電鑛形成）。換言之，散熱單元μ ±使散熱早元23能確實地連接於 开至屬％路板21的第二表面212。 藉此，發光模組2係利用非八 接方式連接散鮮元23 ”金^電純21，並藉由焊 光二極體22的另一個表面。藉電路板21上，相對於發 降低材料成本，且利用焊接方9非金屬電路板21不僅可 提高製作效率。再者，焊料s的1來連接散熱單元23也可 遠大於習知所彻之導鱗熱係數係高於5 G W/mK ’ 於0.2〜6W/mK)，因此，發光1…、塾片等的導熱係數（介 果。 可進一步提高散熱效 2a 請參照圖3所示，其為本發 — 的另-態樣剖面示意圖* ^佳實施例之發光模: 發先横組2a之非金屬電路4 201106510 21a對應於發光二極體22更可設置至少—開孔& 料S充填於開孔213。再者，開孔213之孔壁上 = 金屬層24,以使焊料S能連接於非金屬電路板^。八 因此，當發光二極體22經由焊料S連接於非金啻 路板21的第一表面211時，焊料S亦會充填開孔2 流至非金屬電路板21的第二表面212。藉此，即 ^ 散熱單元23焊接於非金屬電路板21的第二表面，、： 而可更進-步提高發光模組2a的製作效率。且，， 2 a經實驗量測後，發光二極體2 2之p N接合到散熱草、、、且 鋁材為例）23之間所得的熱阻值約為2 5t/w，而如以 之發光模組1的熱阻值則約為7.3°c/w。換言之，菸圖j 組2a的熱阻值遠小於如圖i之發光模·丄的_^光= 二發光模組2a的熱量傳遞效果較好，也使得其散熱二 值得-提的是，發光模組2a亦可具有複數發光 22,且非金屬電路板21a對應於該等發光二極體22笋 數開孔犯。藉此，可提高發光模組以的亮度，^ = 應用範圍。 八 請參照圖4所示，其為本發明較佳實施例之 2b的另-態樣剖面示意圖。發光模級办之非金 = 爪具有至少-開孔213b以及相對的第—表面211^ = 表面m，發光二極體μ設置於非金屬電路板叫的第一 表面川，並對應於開孔213b。於此，以非金屬電路板爪 具有稷數開孔213b，而各發光二極體22對應的開孔數量 201106510 並不限制，可為一個或複數個，於此係以各發光二極體U 對應複數開孔213b設置，其非限制性。 散熱單το 23經由開孔2i3b内之焊料s直接連接於發 光二極體22的背側。換言之，散熱單元23位於非金屬電 路板21b的第二表面212’但未與非金屬電路板抓接觸。 需注意的是’與散熱單元23連接的焊料S可能因表面張 力’而略為突出於開孔213b外的範圍。 ' 藉此，除可於焊接發光二極體U時，同時將散熱單 元23焊接於非金屬電路板2lb的第二表面以2外，更可 減少焊料S的使用量，以進一步降低成本。 綜上所述，依據本發明之發光模組係利用非金屬電路 板，並藉由焊接方式連接散熱單元於非金屬電路板上， 對於發光二極體的另一個表面。因此，藉由非金屬電路7 不僅可降低材料成本，且利用焊接方式來連接散熱單元反 可提高製作效率，並進一步提高發光模組的散熱效=疋也 以上所述僅為舉例性，而非為限制性去 $。任何未脫雜 本發明之精神與範疇，而對其進行之等效修改或變 择 應包含於後附之申請專利範圍中。 ’ 均 【圖式簡單說明】 圖1為一種習知的發光模組示意圖； 示意圖； 悲樣剖面 圖2為本發明較佳實施例之發光模組的杳丨面 圖3為本發明較佳實施例之發光模組的另— 示意圖；以及 201106510 圖4為本發明較佳實施例之發光模組的另一態樣剖面 示意圖。 【主要元件符號說明】 1 ' 2、2a、2b :發光模組 11 :電路板 12、22 :發光二極體 13 絕緣導熱膠 14 散熱墊片 15 散熱鰭片201106510 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a lighting module. [Prior Art] Since the Light Emitting DiGde (LED) has the advantages of high brightness and power saving, as the technology of the LED is gradually matured, its application fields are becoming more and more extensive, such as lighting equipment and liquid crystal. Displays the backlight of the m unit. Please refer to FIG. 1, which is a cross-sectional view of a conventional illumination module i. The light emitting module 1 includes a circuit board u, a light emitting diode 12, an insulating thermal conductive adhesive 13, a heat dissipating pad 14, and a heat dissipating fin 15. The light-emitting diode 12 is disposed on the circuit board n via the heat-dissipating P and the insulating thermal conductive material 13, and the heat-dissipating fins 15 are attached to the other side of the circuit board n by the heat-dissipating pads 14. In the light-emitting module 1, a large amount of thermal energy generated when the light-emitting diode 12 emits light is thermally transferred through the heat-dissipating paste P, the insulating heat-conductive adhesive 13, the circuit board 11, the heat-dissipating pad 14, and the heat-dissipating fins 15 Dissipate into the air. However, the thermal conductivity of the circuit board 11, the insulating thermal conductive adhesive 13 and the heat dissipating pad 14 (the thermal conductivity of the insulating thermal conductive adhesive 13 and the thermal dissipating pad 14 is not higher than '〇2 to 6 W/mK), so that the light is also emitted. The heat dissipation effect of the module 不 is not good. However, if the circuit board 11 is changed to a metal circuit board, the cost is not high, and the heat dissipation efficiency cannot be significantly improved. Therefore, how to provide a 201106510 light-emitting module capable of improving heat dissipation and reducing cost has become [invention]. In view of the above problems, the object of the present invention is to provide a light-emitting model capable of improving the efficiency and reducing the cost. . In order to achieve the above object, a light-emitting module according to the present invention comprises a non-circuit board, at least a light-emitting diode and a heat-dissipating unit. The non-metal circuit is reversed, has a relative first surface and a second surface, the light emitting diode is destroyed on the first surface of the non-metal circuit board, and the heat radiating unit is soldered to the second surface of the non-metal plate. % for the above purpose 'The light-emitting module according to the present invention comprises ^ (four) board 'at least the light-emitting diode and the heat-dissipating unit. The non-metal circuit board has at least one opening and an opposite first surface and a second surface 'light emitting diode disposed on the first surface of the non-metal circuit board, and the hole 'heat dissipation unit passes through the opening - The solder is connected to the light-emitting device. The light-emitting module according to the present invention utilizes a non-gold plate and connects the heat-dissipating unit to the non-metal circuit board by means of a (four) connection to the other surface of the light-emitting diode. Therefore, not only can the material cost be reduced, but also the power of the welding king can be used to create a political rate, and further improve the heat dissipation effect of the light-emitting module. [Embodiment] The reference pattern will be referred to in the relevant example. The light emitting module of the preferred embodiment of the present invention will be described with the same reference numerals. Referring to FIG. 2, it is a schematic cross-sectional view of a light emitting module 2 according to a preferred embodiment of the present invention. The module 2 includes a non-metal circuit board 21, at least one light-emitting diode 22, and a heat dissipation unit 23. The non-metal circuit board 21 can be, for example, a glass circuit board, a resin circuit board, or a ceramic circuit board, or a fiberglass circuit board having a first surface 211 and a second surface 212. The opposite first surface 211 and second surface 212 are substantially parallel to each other. The body 22 is disposed on the first surface 211 of the non-metal circuit board 21. The light-emitting diode 22 may have a light-emitting diode die disposed on a lead frame 221, and the lens 222 is modified by a lens 222. Light shape. In addition, the light-emitting diode 22 may be a light-emitting diode die-bonding or flip-chip bonding on a sub-mount, and electrically connecting the sub-substrate and the non-metal circuit board 21. The light-emitting diode 22 may be soldered s • surface-bonded (SMT) to the non-metal circuit board 21, and the solder S is directly in contact with the light-emitting diode 22. The solder S may, for example, comprise tin, or a tin alloy (eg tin-nickel alloy) or In combination, the originally molten solder s is cooled by reflow to bond the light-emitting diode 22 and the non-metal circuit board 21. Further, since the solder § does not have a metal at the junction with the board The material, so that the light-emitting diode 22 can be closely connected to the non-metal circuit board 21 via the solder s, the non-metal circuit board 21 can have the metal layer 24 disposed on the first surface 211. The material of the metal layer 24 can comprise copper, Nickel, silver or tin. Thereby, the light-emitting diode 22 can be physically connected to the first surface 211 of the non-metal electric valve panel 21 via the solder s. 201106510. The government, the unit 23 is connected to The second surface 212 of the non-metal circuit board 21. The unit 23 may include, for example, a heat dissipating scale, or a heat sink, or a heat sink, or a heat pipe or a combination thereof. Here, the heat dissipating unit 23 is described by including a heat dissipating fin, which is not limited, and the heat dissipating fin may be The extrusion process is used to make an extruded heat sink fin. The heat sink unit 23 can be connected to the non-metal circuit board 21 by solder S. Similarly, since the non-metal circuit board 21 and the solder S are not connected at the joint The metal material, so that the heat dissipating unit 23 can be closely connected to the non-metal circuit board 21 via the solder S, the second surface 212 of the non-metal circuit board 21 can also have the metal layer 24. It is desirable that the metal layer 24 can also The heat dissipating unit 23 is disposed on a surface facing the non-metal (for example, an electric ore formation). In other words, the heat dissipating unit μ ± enables the heat dissipating element 23 to be surely connected to the second surface 212 which is opened to the % road plate 21. Therefore, the light-emitting module 2 is connected to the fresh element 23 by using a non-eight-connection method, and by soldering the other surface of the diode 22. By using the circuit board 21, the material cost is reduced relative to the hair. Moreover, the use of the soldering side 9 non-metal circuit board 21 can not only improve the manufacturing efficiency. Furthermore, the solder s 1 can be connected to the heat dissipating unit 23, which can be much larger than the well-known guide scale thermal coefficient system higher than 5 GW/mK ' 0.2 to 6W/mK), therefore, the thermal conductivity of the light-emitting 1..., the cymbal, etc. (the effect can be further improved. 2a, please refer to FIG. 3, which is a cross-sectional view of another aspect of the present invention. The light-emitting mode of the preferred embodiment: the non-metal circuit 4 of the first horizontal group 2a 201106510 21a corresponds to the light-emitting diode 22, and at least the opening & material S is filled in the opening 213. Further, the opening 213 On the wall of the hole = metal layer 24, so that the solder S can be connected to the non-metal circuit board. Therefore, when the light-emitting diode 22 is connected to the first surface 211 of the non-metal circuit board 21 via the solder S, the solder S will also fill the opening 2 to the second surface 212 of the non-metal circuit board 21. Thereby, the heat dissipation unit 23 is soldered. On the second surface of the non-metal circuit board 21, the manufacturing efficiency of the light-emitting module 2a can be further improved. Moreover, after the experimental measurement of 2 a, the p N of the light-emitting diode 2 is bonded to The heat resistance value obtained between the heat-dissipating grass, and the aluminum material is as follows: 23, and the thermal resistance value of the light-emitting module 1 is about 7.3 ° c / w. In other words, the smoke The heat resistance value of the group 2a of Fig. j is much smaller than that of the light-emitting mode of Fig. i. The light-emitting effect of the second light-emitting module 2a is better, and the heat dissipation is also worthwhile. The plurality of light-emitting elements 22 may also be provided, and the non-metal circuit board 21a corresponds to the number of openings of the light-emitting diodes 22. Thereby, the brightness of the light-emitting module can be improved, and the application range can be improved. Shown is a cross-sectional view of another embodiment of the preferred embodiment of the present invention. The non-gold=claw of the illuminating mode has at least an opening 213b and an opposite first surface 211^=surface m, two light The pole body μ is disposed on the first surface of the non-metal circuit board and corresponds to the opening 213b. Here, the non-metal circuit board claw has a plurality of opening holes 213b, The number of openings corresponding to each of the light-emitting diodes 22 is not limited, and may be one or plural. Here, each of the light-emitting diodes U is provided corresponding to the plurality of openings 213b, which is not limited. The solder s in the opening 2i3b is directly connected to the back side of the light emitting diode 22. In other words, the heat radiating unit 23 is located on the second surface 212' of the non-metal circuit board 21b but is not in contact with the non-metal circuit board. The solder S connected to the heat radiating unit 23 may slightly protrude beyond the opening 213b due to the surface tension '. In this way, in addition to soldering the light-emitting diode U, the heat dissipating unit 23 is simultaneously soldered to the second surface of the non-metal circuit board 2lb by 2, which further reduces the amount of solder S used, thereby further reducing the cost. In summary, the light-emitting module according to the present invention utilizes a non-metal circuit board and connects the heat-dissipating unit to the non-metal circuit board by soldering to the other surface of the light-emitting diode. Therefore, the non-metal circuit 7 can not only reduce the material cost, but also use the soldering method to connect the heat dissipation unit, thereby improving the manufacturing efficiency and further improving the heat dissipation efficiency of the light-emitting module. Go to $ for restrictions. The spirit and scope of the present invention are not intended to be exhaustive, and equivalent modifications or alterations thereof are included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light-emitting module; schematic view; FIG. 2 is a front view of a light-emitting module according to a preferred embodiment of the present invention; FIG. Another schematic diagram of a light-emitting module of the present invention; and 201106510 FIG. 4 is a cross-sectional view showing another aspect of a light-emitting module according to a preferred embodiment of the present invention. [Main component symbol description] 1 '2, 2a, 2b: Light-emitting module 11: Circuit board 12, 22: Light-emitting diode 13 Insulation thermal adhesive 14 Heat-dissipating gasket 15 Heat-dissipating fin
21、21a、21b :非金屬電路板 211 :第一表面 212 :第二表面 213、213b :開孔 221 :導線架 222 :透鏡 23 :散熱單元 24 :金屬層 P :散熱膏 S :焊料21, 21a, 21b: non-metal circuit board 211: first surface 212: second surface 213, 213b: opening 221: lead frame 222: lens 23: heat dissipation unit 24: metal layer P: thermal grease S: solder