CN222213153U - Backlight heat radiation structure - Google Patents

Abstract

The present application relates to a backlight heat dissipation structure. The backlight heat dissipation structure comprises: a bracket and a heat-conducting component, wherein the heat-conducting component comprises a PCB board, an LED lamp and a heat-conducting adhesive, wherein the LED lamp is arranged on the PCB board, one end of the heat-conducting adhesive is connected to the PCB board, and the other end of the heat-conducting adhesive is connected to the bracket. The solution provided by the present application can effectively dissipate heat from the backlight and prevent heat accumulation.

Description

Backlight heat radiation structure

Technical Field

The utility model relates to the technical field of display screens, in particular to a backlight heat dissipation structure.

Background

Local Dimming is a regional Dimming technology, which can independently control the backlight brightness or color of a designated region, and can also modulate control signals of an LCD display screen, so that the power consumption is effectively saved and the contrast ratio is improved on the premise of maintaining the image brightness.

In the related art, the LEDs in the backlight using the Local Dimming technique are more numerous and closely arranged, thereby easily causing heat accumulation.

Disclosure of utility model

The utility model aims to overcome the defects in the prior art and provide a backlight heat dissipation structure which can effectively dissipate heat of backlight and prevent heat accumulation.

The aim of the utility model is realized by the following technical scheme:

The application provides a backlight radiating structure which comprises a bracket and a heat conducting component, wherein the heat conducting component comprises a PCB, an LED lamp and heat conducting glue, the LED lamp is arranged on the PCB, one end of the heat conducting glue is connected with the PCB, and the other end of the heat conducting glue is connected with the bracket.

The PCB is an aluminum substrate.

The support is an aluminum casting.

The device also comprises a diffusion plate, wherein the diffusion plate is arranged at the opening position of the bracket.

The diffusion plate is provided with a diffusion film.

The diffusion film is arranged on the substrate, and the diffusion film is arranged on the substrate.

The light-emitting diode also comprises a second light enhancement film, wherein the second light enhancement film is arranged on the first light enhancement film.

The diffusion plate and the bottom of the bracket form a heat dissipation cavity.

The PCB further comprises a colloid, wherein the colloid is arranged on the PCB.

The adhesive tape also comprises a reflecting film, wherein the reflecting film is arranged on the colloid.

Compared with the prior art, the utility model has at least the following advantages:

Through setting up PCB board, support and heat conduction glue, wherein the support is the aluminium foundry goods, and the PCB board is aluminium base board, and the heat that the LED lamp produced is through PCB board, heat conduction glue, finally to the support discharge to prevent heat accumulation effectively, avoid taking place the risk of short circuit.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.

Fig. 1 is a schematic structural diagram of a backlight heat dissipation structure according to an embodiment of the utility model.

Detailed Description

Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While embodiments of the present application are illustrated in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interactive relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the related art, the LEDs in the backlight using the Local Dimming technique are more numerous and closely arranged, thereby easily causing heat accumulation.

In view of the above problems, embodiments of the present application provide a backlight heat dissipation structure, which can effectively dissipate heat of a backlight and prevent heat accumulation.

The following describes the technical scheme of the embodiment of the present application in detail with reference to the accompanying drawings.

Referring to fig. 1, a backlight heat dissipation structure includes a bracket 100 and a heat conduction assembly 200, wherein the heat conduction assembly 200 includes a PCB board 210, an LED lamp 220 and a heat conduction glue 230, the LED lamp 220 is disposed on the PCB board 210, one end of the heat conduction glue 230 is connected with the PCB board 210, and the other end of the heat conduction glue 230 is connected with the bracket 100.

It should be noted that, the PCB 210 is an aluminum substrate, the bracket 100 is an aluminum casting, the aluminum substrate has good thermal conductivity, and can carry higher current than a conventional circuit board, and the aluminum casting has higher strength and better thermal conductivity than a conventional aluminum sheet metal part. Thus, through setting up PCB board 210, support 100 and heat conduction glue 230, wherein support 100 is the aluminium foundry goods, and PCB board 210 is the aluminium base board, and the heat that LED lamp 220 produced is through PCB board, heat conduction glue, finally discharges to support 100 to prevent heat effectively and pile up, avoid taking place the risk of short circuit.

Referring to fig. 1, in an embodiment, the device further includes a diffusion plate 300, where the diffusion plate 300 is disposed at an opening of the support 100. The diffusion plate 300 functions to increase the light transmittance.

Referring to fig. 1, in an embodiment, the diffusion device further includes a diffusion film 400, and the diffusion film 400 is disposed on the diffusion plate 300.

The diffusion film 400 serves to correct the diffusion angle, and increases the light radiation area.

Referring to fig. 1, in an embodiment, the light-increasing film further includes a first light-increasing film 500, where the first light-increasing film 500 is disposed on the diffusion film 400. Specifically, the second brightness enhancement film 600 is further included, and the second brightness enhancement film 600 is disposed on the first brightness enhancement film 500.

The brightness enhancement film is used to enhance brightness, and is assembled in front of the backlight.

Referring to fig. 1, in an embodiment, a heat dissipation cavity 700 is formed between the diffusion plate 300 and the bottom of the support 100. It should be noted that, by providing the heat dissipation cavity 700, the heat can be prevented from being accumulated around the LED lamp 220, and the heat can be dissipated into the heat dissipation cavity 700, and the heat can be dissipated through the bracket 100, thereby achieving the auxiliary heat dissipation effect.

Referring to fig. 1, in an embodiment, the device further includes a glue 800, and the glue 700 is disposed on the PCB 210. Referring to fig. 1, in an embodiment, the reflective film 900 is further included, and the reflective film 800 is disposed on the colloid 800.

The glue 800 is double-sided adhesive, and is used to fix the reflective film on the PCB 210, and the reflective film 900 plays a role in improving the reflectivity of light.

The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined and pruned according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided and pruned according to actual needs.

The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (10)

1. A backlight heat dissipation structure, comprising: Brackets; and The heat-conducting component comprises a PCB board, an LED lamp and a heat-conducting adhesive, wherein the LED lamp is arranged on the PCB board, one end of the heat-conducting adhesive is connected to the PCB board, and the other end of the heat-conducting adhesive is connected to the bracket. 2. The backlight heat dissipation structure according to claim 1, characterized in that the PCB board is an aluminum substrate. 3 . The backlight heat dissipation structure according to claim 1 , wherein the bracket is an aluminum casting. 4 . The backlight heat dissipation structure according to claim 1 , further comprising a diffusion plate, wherein the diffusion plate is disposed at an opening position of the bracket. 5 . The backlight heat dissipation structure according to claim 4 , further comprising a diffusion film, wherein the diffusion film is disposed on the diffusion plate. 6 . The backlight heat dissipation structure according to claim 5 , further comprising a first brightness enhancement film, wherein the first brightness enhancement film is disposed on the diffusion film. 7 . The backlight heat dissipation structure according to claim 6 , further comprising a second brightness enhancement film, wherein the second brightness enhancement film is disposed on the first brightness enhancement film. 8 . The backlight heat dissipation structure according to claim 6 , wherein the diffusion plate and the bottom of the bracket form a heat dissipation cavity. 9 . The backlight heat dissipation structure according to claim 8 , further comprising a colloid, wherein the colloid is disposed on the PCB board. 10 . The backlight heat dissipation structure according to claim 9 , further comprising a reflective film, wherein the reflective film is disposed on the colloid.