CN100399161C - Backlight module - Google Patents

Abstract

The invention discloses a backlight module, which comprises a back plate, at least one light-emitting diode, a light guide plate, a non-rectangular heat conducting block and a circuit board. The backboard is provided with at least one edge, the light emitting diode is electrically connected to the circuit board, the at least one light emitting diode is provided with a light emitting optical axis, and the at least one light emitting diode is arranged at the edge of the backboard in a mode that the light emitting optical axis is not parallel or perpendicular to the edge of the backboard. The non-rectangular heat conducting block is arranged between the back plate and the light emitting diode and is used for conducting heat energy generated by the light emitting diode to the back plate.

Description

Backlight module

technical field

The invention relates to a backlight module, in particular to a backlight module capable of improving heat dissipation.

Background technique

Backlight module (Back light module) is one of the key components of liquid crystal display panel (Liquid crystal display panel, LCD panel). The effective light mechanism converts it into a surface light source with high brightness and uniform luminance to provide the backlight source for the LCD panel. LCD panels have been widely used in electronic products with growth potential such as monitors, notebook computers, digital cameras, and projectors. Especially, large-sized panels such as notebook computers and LCD monitors have the greatest demand. Therefore, backlight modules Demand growth is also growing stronger.

Currently, the light source used in the backlight module is not only the cold cathode fluorescent tube, but also the light emitting diode is gradually applied to medium and large size liquid crystal displays. Please refer to FIG. 1 . FIG. 1 is a structural view of a prior art backlight module 10 in which light emitting diodes are mounted on a backplane. Traditionally, a plurality of light emitting diodes (light emitting diodes) 12 are installed on the periphery of the backplane 16, and generate light after receiving a signal from a driving circuit (not shown) through pins 18 (arrow A represents light emitting diodes 22 axial direction), at the same time, the light-emitting diode 12 will generate heat. Since higher power LEDs can produce higher luminance light, but also generate higher heat energy, in order to dissipate heat rapidly in real time, the LEDs 12 will be mounted on a metal core PCB 14, Once the light-emitting diodes 12 generate light and emit high heat, the generated heat will be quickly conducted to the back plate 16 through the metal circuit board 14 , and the back plate 16 achieves the purpose of heat dissipation through air circulation. In order to allow the metal circuit board 14 and the backplane 16 to have a better heat dissipation effect, the metal circuit board 14 and the backplane 16 are usually made of metal materials with high thermal conductivity such as aluminum.

However, with the advancement of LED manufacturing technology, the maximum luminance of light produced by LEDs is also greater. If the number of LEDs can be reduced, it will also help to save costs, and higher temperatures will reduce luminescence. Diode luminous efficiency and shortened operating life. Therefore, developing a backlight module that can use a smaller number of light-emitting diodes while increasing the heat dissipation effect and lowering the operating temperature will be a problem that manufacturers want to overcome.

Contents of the invention

Therefore, the object of the present invention is to provide a backlight module, wherein the light emitting diodes are arranged at the corners of the back panel, and a heat conduction block is used to increase the heat conduction area of the light emitting diodes, so as to solve the above-mentioned problems in the prior art.

The invention provides a backlight module, which includes a back plate, at least one light emitting diode, a light guide plate, a non-rectangular heat conduction block and a circuit board. The back plate has at least one edge and a bottom surface. The light emitting diode is electrically connected to the circuit board. The at least one light emitting diode has a light emitting optical axis. The light emitting light axis of the at least one light emitting diode is not parallel or perpendicular to the The edge of the backboard is arranged on the edge of the backboard. The non-rectangular heat conduction block is arranged between the backplane and the light emitting diodes, and is arranged in close contact with the edge and the bottom surface of the backplane at the same time, and is used for conducting heat energy generated by the light emitting diodes to the backplane.

In the present invention, the heat conduction block arranged between the light emitting diode and the back plate can increase the cross-sectional area of the heat conduction path between the light emitting diode and the back plate. Especially for the LEDs disposed at the corners of the backplane, since the heat conduction block is in direct contact with the side and bottom of the backplane, the temperature of the LEDs will decrease due to the increased contact area between the heat conduction block and the backplane.

Description of drawings

FIG. 1 is a structural diagram of a prior art LED mounted on a backplane;

Fig. 2 is a structural diagram of the backlight module of the present invention;

FIG. 3 is a partial top view of the backlight module of the present invention.

Description of main component symbols

10 backlight module 12 light-emitting diodes

14 circuit board 16 backplane

18-pin 20 backlight module

22 light-emitting diodes 24 circuit boards

26 backplane 28 pins

32 bottom surface 42, 44 contact area

A, B optical axis

Detailed ways

Please refer to FIG. 2 and FIG. 3 , FIG. 2 is a structural diagram of the backlight module 20 of the present invention, and FIG. 3 is a partial top view of the backlight module 20 of the present invention. The backlight module 20 includes a bezel 26 , and a light emitting diode (LED) 22 is disposed at a corner of the bezel 26 . The bottom surface 32 of the back plate 26 is used to arrange optical elements including a light guide plate, a diffusion sheet, a prism sheet (Brightness Enhancement Film) and the like, which are not shown here to simplify the drawings. These elements are shown. In addition, the LEDs 22 are disposed on a circuit board 24 , and a heat conduction block 30 is disposed between the circuit board 24 and the back plate 26 . The heat conducting block 30 and the back plate 26 can be made of metal (such as aluminum) or other materials with high thermal conductivity.

When the driving circuit (not shown) of the LED 22 drives the LED 22 to generate light through the pin 28 , the LED 22 also generates heat at the same time. The generated light will be guided to the liquid crystal display panel after passing through the patterned concave-convex surface on the light guide plate, and the generated heat energy will pass through the circuit board 24 and be conducted to the back plate 26 through the heat conducting block 30 . In addition to the areas 42 and 44 marked on FIG. The heat dissipation area via the back plate 26 is increased. Finally, the heat energy can be dissipated from the back plate 26 through air convection.

In a preferred embodiment, the circuit board 24 is a flexible print circuit board. In this way, the flexible circuit board can be laid on the backplane 26 according to the shape of the backplane 26 .

The light-emitting diodes 22 can be arranged on the corners of the backplane 26, or be arranged on the edge of the backplane 26 in a manner that is not parallel or perpendicular to the edge of the backplane 26, that is, the light-emitting optical axis B of the light-emitting diodes 22 is different. Parallel or non-perpendicular to the edge of the back plate 26 , wherein the light emitting optical axis refers to the center line of the maximum irradiation range that the light generated by the light emitting diode 22 can irradiate. In this way, the light emitting diodes 22 are arranged on the edge of the back plate 26, and the quantity of the light emitting diodes 22 only needs to be able to generate enough light and brightness to cover the required viewing area of the entire display.

The non-rectangular heat conduction block 30 is preferably a solid heat conduction block, and its material can be formed of a material with high heat conduction efficiency such as metal. In order to ensure the heat dissipation effect, the non-rectangular heat conduction block 30 is preferably arranged in close contact with the back plate 26 to minimize the gap between the non-rectangular heat conduction block 30 and the back plate 26 . The heat conduction block 30, the circuit board 24 and the back plate 26 can be combined with a high thermal conductivity polymer material to eliminate the air layer between the heat conduction block 30, the circuit board 24 and the back plate 26 to maintain better heat conduction Effect.

The backlight module of the present invention can be applied to liquid crystal displays using light-emitting diodes as light sources.

Compared with the prior art, the light-emitting diodes of the present invention are arranged on the edge of the backplane, and the arrangement direction thereof is not parallel or perpendicular to the edge of the backplane. In addition, a heat conduction block is arranged between the light emitting diode and the back plate, so as to increase the heat conduction area between the light emitting diode and the back plate. For the LEDs installed at the corners of the backplane, since the heat conduction block is directly in contact with the side and bottom of the backplane, the heat dissipation effect of the LEDs will also be improved due to the increase in the contact area between the heat conduction block and the backplane, thereby reducing the operating temperature .

Although the present invention is described with the above several embodiments, its technical content is not limited thereto, and different designs can also be made according to actual design requirements. again. In actual application, the number of LEDs can be determined according to actual design requirements, and it can be two or more LEDs that are not parallel or perpendicular to the edge of the backplane.

Although the present invention is described with the above embodiments, its technical content is not limited thereto, and it can also be designed in different variations according to actual design requirements. For example, in actual application, besides metal materials, other materials with high thermal conductivity can also be used for the material of the backplane and circuit board; in actual application, the materials of the backplane and circuit board can be changed according to the design requirements .

Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be defined by the appended claims.

Claims (8)

1. A backlight module, comprising: a back panel having at least one edge and a bottom surface; a circuit board; At least one light emitting diode is electrically connected to the circuit board, the at least one light emitting diode has a light emitting optical axis, and the at least one light emitting diode is arranged on the back plate in a manner that the light emitting optical axis is not parallel or perpendicular to the edge of the back plate back panel edge; a light guide plate; and A non-rectangular heat conduction block is arranged between the back plate and the light emitting diode, and is arranged in close contact with the edge and the bottom surface of the back plate at the same time. 2. The backlight module as claimed in claim 1, wherein the backplane is made of metal. 3. The backlight module as claimed in claim 1, wherein the circuit board is a flexible circuit board. 4. The backlight module as claimed in claim 1, wherein the heat conducting block is made of metal. 5. The backlight module as claimed in claim 1, wherein the heat conduction block, the circuit board and the back plate are combined with a high thermal conductivity polymer material. 6. The backlight module as claimed in claim 1, wherein the heat conduction block is in close contact with the backplane. 7. The backlight module as claimed in claim 1, wherein the backlight module is used for a liquid crystal display. 8. The backlight module as claimed in claim 1, wherein the light guide plate has at least one patterned concave-convex surface.

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