CN201302063Y - Seamless splicing type semiconductor planar light source module - Google Patents
Seamless splicing type semiconductor planar light source module Download PDFInfo
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- CN201302063Y CN201302063Y CNU200820156676XU CN200820156676U CN201302063Y CN 201302063 Y CN201302063 Y CN 201302063Y CN U200820156676X U CNU200820156676X U CN U200820156676XU CN 200820156676 U CN200820156676 U CN 200820156676U CN 201302063 Y CN201302063 Y CN 201302063Y
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- light source
- source module
- planar light
- led light
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 28
- 238000002310 reflectometry Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 19
- 239000004411 aluminium Substances 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 238000005286 illumination Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- RQMIWLMVTCKXAQ-UHFFFAOYSA-N [AlH3].[C] Chemical compound [AlH3].[C] RQMIWLMVTCKXAQ-UHFFFAOYSA-N 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model relates to a seamless splicing type semiconductor planar light source module, which belongs to the technical field of semiconductor lighting. The seamless splicing type semiconductor planar light source module mainly comprises a plurality of LED light source modules connected in series and in parallel, and the LED light source modules mainly comprise a circuit substrate (1), a substrate insulating layer (2), a circuit electrode (3), a high-reflectance thin film layer (4), a chip electrode leading wire (6), an LED chip (5), an encapsulating border (7) and a fluorescent powder silica gel luminescent layer (8). The seamless splicing type semiconductor planar light source module is characterized in that the encapsulating border is canceled, or the transparent curing encapsulating border is adopted, the edge distance of the transparent curing encapsulating border is reduced, and the transparent curing encapsulating border is covered with a fluorescent powder layer. Compared with the prior art, the utility model has the advantages that the seamless splicing exists between the modules, so the light is uniform, and the utilization ratio of light is high; and in addition, the planar light source is manufactured to be thin and light, the brightness is high, random splicing can be carried out, and the area is large.
Description
[technical field]
The utility model relates to technical field of semiconductor illumination, specifically a kind of seamless spliced formula semiconductor planar light source module.
[background technology]
Enter 21 century, the general illumination technology has progressively been carried out the transition to the semiconductor lighting The Application of Technology of more energy-conserving and environment-protective by traditional incandescent lamp, fluorescent lamp, gas-discharge lamp etc., high brightness light emitting diode LED has become the core devices of semiconductor lighting, adopt the blue led chip to excite yellow fluorescent powder and the technology that produces white light because of its luminous efficiency height and the lower mainstream technology that develops into general illumination of cost.
The encapsulation of LED is mainly based on the single-chip package form, single led because of its luminous flux limited, be made into light source module and obtain required luminous flux for actual illumination application need plurality of LEDs is integrated, because of LED is a spot light, after integrated, there is the light of dazzling to make human eye perceives uncomfortable, general employing adds leaded light in addition or astigmatic structure makes spot light transform into luminous uniform surface light source, can reduce the utilization rate of LED illumination like this, can increase cost simultaneously; Directly be encapsulated as little planar light source unit module after also having the LED of employing multicore sheet to connect in addition, and adopt the mode of module splicing to make for the large tracts of land light source, frame and the regional width that can occupy 2-10mm of electrode pad lead-in wire because of module package, when module and module are spliced like this, between the adjacent led chip of module and module certain spacing is arranged, when luminous, making has tangible dark space between the module, thereby has influence on the uniformity of whole light source.
With general plane bar-shaped LED light source module is example, as shown in Figure 1, mainly be to establish substrate insulating layer 2 at circuit substrate 1 upper surface of light high heat conducting, above substrate insulating layer 2, establish again and can carry out series-parallel circuit electrode 3, circuit electrode 3 tops are provided with the high reflectivity film layer 4 of reserving fairlead again, high reflectivity film layer 4 top are provided with led chip 5, led chip 5 adopts the contact conductor 6 connecting circuit electrodes 3 that pass fairlead, filling fluorescent powder silica gel luminescent layer 8 in the high reflectivity film layer 4 peripheral hardware aluminium frame 7, aluminium frame forms.This bar-shaped LED module generally connects into long strip source at the two ends of led light source module, but existence because of module package frame and two ends circuit electrode lead-in wire zone 31, as the border width of unit at 2-10mm, the led chip spacing that two modules are faced mutually then can be greater than 2 times of border width, can form dark space 32 and cause the inhomogeneities of light source.In addition, not luminous because of the frame and the lead-in wire zone of intermodule, inhomogeneities is then very obvious.There is certain spacing the module of this bar-shaped LED light source module and module junction, the led chip spacing that general two modules are faced mutually then can be greater than 2 times of border width, when the led light source module is luminous, between module and the module dark space is arranged, mainly be by exceeding that aluminium encapsulation frame 7 outer a part of circuit electrodes 31 have certain width and the dark space 32 that forms, can cause the inhomogeneities of light source.
[summary of the invention]
The purpose of this utility model is in order to overcome the deficiencies in the prior art, to have proposed to adopt the integrated plane light source module of LED multicore sheet of non-flanged spacing.
For achieving the above object, a kind of seamless spliced formula semiconductor planar light source module of design, mainly form by the connection in series-parallel of a plurality of led light source module, described led light source module is mainly by circuit substrate 1, substrate insulating layer 2, circuit electrode 3, high reflectivity film layer 4, chip electrode lead-in wire 6, led chip 5, encapsulation frame 7, fluorescent powder silica gel luminescent layer 8 is formed, it is characterized in that: circuit substrate 1, substrate insulating layer 2, the circuit electrode 3 of led light source module edge and encapsulation frame 7 two ends vertical alignments, four edges in encapsulation frame 7 bottoms are reserved aperture, make circuit electrode 3 expose some, the lead solder-joint district 33 that connects the circuit electrode of usefulness as module, or with circuit substrate 1, substrate insulating layer 2, the two ends vertical alignment of circuit electrode 3 and high reflectivity film layer 4, above high reflectivity film layer 4, adopt anchor clamps directly to solidify again and connect fluorescent powder silica gel luminescent layer 8, aperture is reserved for four jiaos in fluorescent powder silica gel luminescent layer 8 bottoms, make the circuit electrode of below expose a part, connect the lead solder-joint district 33 of the circuit electrode of usefulness as module; The two ends vertical alignment of the two ends of described fluorescent powder silica gel luminescent layer and high reflectivity film layer; Described encapsulation frame 7 is a transparent cured encapsulation frame in splicing place of led light source module, and the width of encapsulation frame 7 is less than 1/3 of led chip spacing.
The size in the lead solder-joint district of described circuit electrode is less than the encapsulation border width.
Described transparent cured encapsulation frame is provided with phosphor powder layer.
The luminescent layer that described led chip surface-coated has fluorescent material and transparent silica gel to mix.
Described led light source module is bar shaped or square or triangle or pentagon or hexagon.
Establish 2-100 LEDs chip in each led light source module.
The utility model is compared with prior art, make seamless splicing between the module and luminous evenly, and the utilization rate height of light; In addition, can make that planar light source makes thin and light, brightness is high, can splice arbitrarily, area is big.
[description of drawings]
Fig. 1 a is the plane bar-shaped LED light source module sectional structure chart of prior art in the utility model;
Fig. 1 b is the plane bar-shaped LED light source module vertical view of prior art in the utility model;
Fig. 1 c is two plane bar-shaped LED light source module connection diagrams in the prior art in the utility model.
Fig. 2 a is the cross-sectional view of the utility model embodiment 1 midplane bar-shaped LED light source module;
Fig. 2 b is the vertical view of the plane bar-shaped LED light source module shown in Fig. 2 a;
Fig. 2 c is two plane bar-shaped LED light source module connection diagrams among the utility model embodiment 1.
Fig. 3 a is the cross-sectional view of the plane bar-shaped LED light source module of the no frame that the employing anchor clamps solidify among the utility model embodiment 2;
Fig. 3 b is the vertical view of the plane bar-shaped LED light source module of the no frame that solidifies of the employing anchor clamps shown in Fig. 3 a;
Fig. 3 c is two plane bar-shaped LED light source module connection diagrams of removing no frame behind the anchor clamps among the utility model embodiment 2.
Fig. 4 a is 2 * 2 the linear connection diagram of square LED light source module among the utility model embodiment 3;
Fig. 4 b is the schematic diagram of 2 * 2 square LED light source module two dimension splicing up and down among the utility model embodiment 3.
Fig. 5 a is the bar shaped fluorescent lamp cross-sectional view of led light source module splicing among the utility model embodiment 4, and 51 is the led light source module; 52 are the heat conduction aluminium sheet; 53 is the transparent organic glass outer cover; 54 is the lead-in wire of circuit electrode.
Fig. 5 b is the left view of the bar shaped fluorescent lamp of the led light source module splicing shown in Fig. 5 a.
Fig. 6 a is the large-area planar light source structural representation of led light source module splicing among the utility model embodiment 5, and 61 is the led light source module; 62 are the heat conduction aluminium sheet; 63 is reflector layer; 64 is LGP.
Fig. 6 b is the right view of the large-area planar light source of the led light source module splicing shown in Fig. 6 a.
Specifying Fig. 2 a is Figure of abstract.
Referring to accompanying drawing, 1 is circuit substrate; 2 is substrate insulating layer; 3 is circuit electrode; 4 is the high reflectivity film layer; 5 is led chip; 6 are the chip electrode lead-in wire; 7 are the encapsulation frame; 8 is the fluorescent powder silica gel luminescent layer; 31 for exceeding a part of circuit electrode outside the aluminium encapsulation frame 7; 32 is the dark space; 33 is the lead solder-joint district of circuit electrode; 37 is anchor clamps.
[specific embodiment]
Below the utility model is further described, the utility model is still more clearly concerning those skilled in the art.
The circuit substrate 1 of the bottom adopts the composite plate of aluminium alloy or carbon-aluminium or carbon-to-carbon or carborundum-aluminium or aluminium nitride;
The film that is coated with good conductivity on the surface of substrate insulating layer 2 is as conductive layer, and this conductive layer is the circuit electrode 3 that connects usefulness as circuit, and the material that circuit electrode 3 adopts is copper film or thin-film materials such as silverskin or aluminium film;
Apply one deck thermal conductivity thin-film material formation high reflectivity film layer 4 of high reflectance preferably then above circuit electrode 3, the film 4 of high reflectance is pellumina or oxidation titanium film or magnesia film.
Led chip 5 is bonded in high reflectivity film 4 surfaces, and contact conductor 6 passes the reservation fairlead on the high reflectivity film 4, and contact conductor 6 one ends welding led chip 5 other ends are welded on circuit electrode 3 surfaces.
Employing can quick-setting transparent epoxy glue or silica gel form the blind side edge of certain altitude as encapsulation frame 7, the width of encapsulation frame 7 should be less than 1/3 of led chip 5 spacings, but can participate in an amount of LED excited fluorescent powder in transparent epoxy glue that forms encapsulation frame 7 or silica gel; If linear splicing, only needing to adopt two ends, the left and right sides is transparent cured encapsulation frame, and the encapsulation frame with reflector layer can be adopted in both sides in addition.
Fluorescent material is formed luminescent layers 8 with being coated in led chip 5 surfaces after transparent silica gel is mixed, be applied to the blue chip surface as gold-tinted fluorescent material and can produce white light.
The led light source module can be bar shaped, square, triangle, pentagon, hexagon, led light source module of the same type can be spliced to form the large-area planar light source light fixture mutually, led chip number in each led light source module is a 2-100 scope, can connect as required or connection in series-parallel, because the encapsulation frame of led light source module 7 is transparent narrow limit splicing, and having added phosphor material powder itself in the material of encapsulation frame also can be luminous, no dark space between the modular unit that is combined into can form the area source of even illumination.
Referring to Fig. 2 a-2c, adopt 4 LEDs chip tandem bar-shaped LED light source modules, the edge of the high reflectivity film 4 above contact conductor 3 adopts the method preparation of printing or some glue can quick-setting transparent enclosure frame 7, be reserved with the lead solder-joint district 33 of the circuit electrode that the module edge joint uses at place, four angles, the size of solder joint should be no more than the encapsulation border width, is convenient to the mutual splicing between the led light source module.
Referring to Fig. 3 a-3c, similar to embodiment 1, just adopt anchor clamps 34 at two ends, the left and right sides, the silica gel 8 that will have fluorescent material directly adds full in anchor clamps 34, after the curing anchor clamps 34 are removed, the rim frame then need not be sealed up in addition in two ends, the left and right sides, and the mutual splicing between the unit module is more tight like this.
Referring to Fig. 4 a, adopt 2 * 2 square modules, the linear splicing of one dimension that links to each other about can carrying out; Referring to Fig. 4 b, up and down two dimension splicing about also can carrying out.
Referring to Fig. 5, be the bar shaped fluorescent tube that adopts the led light source module to be spliced, 4 led light source modules 51 directly are bonded on the heat conduction aluminium sheet 52, on heat conduction aluminium sheet 52 surfaces the transparent organic glass outer cover 53 with astigmatism functions is installed then, the lead-in wire 54 of the circuit electrode of led light source module 51 is drawn from two ends, as be made into the fluorescent tube of the long LED planar light source of 600mm, and power consumption is 8W, alternative equal length power is the fluorescent tube of 18W; Be made into the fluorescent tube of the long LED planar light source of 1200mm, power consumption is 16W, and alternative equal length power is the fluorescent tube of 36W.
Referring to Fig. 6, the slim large-area planar light source that is spliced into for the led light source module, led light source module 51 directly is bonded on the interior plate of heat conduction aluminium sheet 52, the surface of heat conduction aluminium sheet 52 scribbles reflector layer 63, organic glass light guide plate 64 is installed on reflector layer 63, the organic film with astigmatic structure is sticked on LGP 64 surfaces, the large area light emitting even planar light source that splices like this, have extremely thin characteristics, thickness is less than 10mm, can be used for backlight, large tracts of land advertising lamp box, lighting source of large-area liquid crystal display etc.
Claims (6)
1, a kind of seamless spliced formula semiconductor planar light source module, mainly form by the connection in series-parallel of a plurality of led light source module, described led light source module is mainly by circuit substrate (1), substrate insulating layer (2), circuit electrode (3), high reflectivity film layer (4), chip electrode lead-in wire (6), led chip (5), encapsulation frame (7), fluorescent powder silica gel luminescent layer (8) is formed, it is characterized in that: circuit substrate (1), substrate insulating layer (2), circuit electrode of led light source module edge (3) and encapsulation frame (7) two ends vertical alignment, four edges in encapsulation frame (7) bottom are reserved with the lead solder-joint district (33) that module connects the circuit electrode of usefulness; Or with the two ends vertical alignment of circuit substrate (1), substrate insulating layer (2), circuit electrode (3) and high reflectivity film layer (4), adopt anchor clamps directly to solidify in high reflectivity film layer (4) top again and connect fluorescent powder silica gel luminescent layer (8), fluorescent powder silica gel luminescent layer (8) bottom is reserved with the lead solder-joint district (33) that module connects the circuit electrode of usefulness for four jiaos; The two ends vertical alignment of the two ends of described fluorescent powder silica gel luminescent layer and high reflectivity film layer; Described encapsulation frame 7 is a transparent cured encapsulation frame in splicing place of led light source module, and the width of encapsulation frame 7 is less than 1/3 of led chip spacing.
2, seamless spliced formula semiconductor planar light source module as claimed in claim 1 is characterized in that: the size in the lead solder-joint district of described circuit electrode is less than the encapsulation border width.
3, seamless spliced formula semiconductor planar light source module as claimed in claim 1 is characterized in that: described transparent cured encapsulation frame is provided with phosphor powder layer.
4, seamless spliced formula semiconductor planar light source module as claimed in claim 1 is characterized in that: the luminescent layer that described led chip surface-coated has fluorescent material and transparent silica gel to mix.
5, seamless spliced formula semiconductor planar light source module as claimed in claim 1 is characterized in that: described led light source module is bar shaped or square or triangle or pentagon or hexagon.
6, as claim 1 or 6 described seamless spliced formula semiconductor planar light source modules, it is characterized in that: establish 2-100 LEDs chip in each led light source module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820156676XU CN201302063Y (en) | 2008-12-05 | 2008-12-05 | Seamless splicing type semiconductor planar light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820156676XU CN201302063Y (en) | 2008-12-05 | 2008-12-05 | Seamless splicing type semiconductor planar light source module |
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| Publication Number | Publication Date |
|---|---|
| CN201302063Y true CN201302063Y (en) | 2009-09-02 |
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|---|---|---|---|
| CNU200820156676XU Expired - Fee Related CN201302063Y (en) | 2008-12-05 | 2008-12-05 | Seamless splicing type semiconductor planar light source module |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964389A (en) * | 2010-08-12 | 2011-02-02 | 木林森电子有限公司 | Chip integrated high-power LED packaging process and product thereof |
| CN102136228A (en) * | 2011-03-24 | 2011-07-27 | 深圳市中庆微科技开发有限公司 | Seamless spliced standard LED unit board and LED display device |
| CN102157117A (en) * | 2010-01-08 | 2011-08-17 | 敦网光电股份有限公司 | Lamp box |
| CN102162627A (en) * | 2010-02-12 | 2011-08-24 | 东芝照明技术株式会社 | Light-emitting device and illumination device |
| CN102261601A (en) * | 2010-05-31 | 2011-11-30 | 胡小萍 | Light source module |
| CN102297388A (en) * | 2011-08-09 | 2011-12-28 | 浙江大学 | Jigsaw type light-guiding illuminating device |
| CN103423636A (en) * | 2013-03-13 | 2013-12-04 | 立达信绿色照明股份有限公司 | Light-emitting diode (LED) lamp emitting light at large angle |
| WO2013185376A1 (en) * | 2012-06-13 | 2013-12-19 | 深圳市华星光电技术有限公司 | Backlight source, backlight system, and panel display device |
| US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| US8632212B2 (en) | 2010-02-12 | 2014-01-21 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| CN103604074A (en) * | 2013-11-28 | 2014-02-26 | 常州市武进区半导体照明应用技术研究院 | Building material lamp |
| CN104900793A (en) * | 2015-06-02 | 2015-09-09 | 华东师范大学 | Preparation and application of insulating core shell composite structure high in heat conduction and high in reflectivity |
| WO2016078048A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led module |
| WO2016078049A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led module |
| CN108257947A (en) * | 2016-12-29 | 2018-07-06 | 晶能光电（江西）有限公司 | A kind of UVLED area sources module |
| CN108443726A (en) * | 2018-05-21 | 2018-08-24 | 章开明 | A kind of low-voltage LED area array light source module complete using single string and circuit |
| CN110349942A (en) * | 2019-07-01 | 2019-10-18 | 武汉华星光电技术有限公司 | Mini LED backlight panel, backlight module |
| WO2020073525A1 (en) * | 2018-10-11 | 2020-04-16 | 惠州市华星光电技术有限公司 | Led display screen and manufacturing method therefor |
| CN111211211A (en) * | 2020-01-13 | 2020-05-29 | 业成科技（成都）有限公司 | LED surface light source and display device |
| CN112558355A (en) * | 2020-12-17 | 2021-03-26 | 业成科技（成都）有限公司 | Backlight module and display panel |
| WO2021142961A1 (en) * | 2020-01-17 | 2021-07-22 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and display panel |
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2008
- 2008-12-05 CN CNU200820156676XU patent/CN201302063Y/en not_active Expired - Fee Related
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157117A (en) * | 2010-01-08 | 2011-08-17 | 敦网光电股份有限公司 | Lamp box |
| CN102157117B (en) * | 2010-01-08 | 2014-06-11 | 敦网光电股份有限公司 | light box |
| US8632212B2 (en) | 2010-02-12 | 2014-01-21 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| CN102162627A (en) * | 2010-02-12 | 2011-08-24 | 东芝照明技术株式会社 | Light-emitting device and illumination device |
| US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| CN102261601A (en) * | 2010-05-31 | 2011-11-30 | 胡小萍 | Light source module |
| CN101964389A (en) * | 2010-08-12 | 2011-02-02 | 木林森电子有限公司 | Chip integrated high-power LED packaging process and product thereof |
| CN102136228A (en) * | 2011-03-24 | 2011-07-27 | 深圳市中庆微科技开发有限公司 | Seamless spliced standard LED unit board and LED display device |
| CN102136228B (en) * | 2011-03-24 | 2016-05-11 | 深圳市中庆微科技开发有限公司 | Seamless spliced standard LED unit board and LED display device |
| CN102297388A (en) * | 2011-08-09 | 2011-12-28 | 浙江大学 | Jigsaw type light-guiding illuminating device |
| WO2013185376A1 (en) * | 2012-06-13 | 2013-12-19 | 深圳市华星光电技术有限公司 | Backlight source, backlight system, and panel display device |
| CN103423636A (en) * | 2013-03-13 | 2013-12-04 | 立达信绿色照明股份有限公司 | Light-emitting diode (LED) lamp emitting light at large angle |
| CN103604074A (en) * | 2013-11-28 | 2014-02-26 | 常州市武进区半导体照明应用技术研究院 | Building material lamp |
| WO2016078049A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led module |
| WO2016078048A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led module |
| CN104900793A (en) * | 2015-06-02 | 2015-09-09 | 华东师范大学 | Preparation and application of insulating core shell composite structure high in heat conduction and high in reflectivity |
| CN104900793B (en) * | 2015-06-02 | 2017-11-24 | 华东师范大学 | The preparation and application of a kind of insulation core-shell structure of high heat conduction high reflectance |
| CN108257947A (en) * | 2016-12-29 | 2018-07-06 | 晶能光电（江西）有限公司 | A kind of UVLED area sources module |
| CN108443726A (en) * | 2018-05-21 | 2018-08-24 | 章开明 | A kind of low-voltage LED area array light source module complete using single string and circuit |
| WO2020073525A1 (en) * | 2018-10-11 | 2020-04-16 | 惠州市华星光电技术有限公司 | Led display screen and manufacturing method therefor |
| CN110349942A (en) * | 2019-07-01 | 2019-10-18 | 武汉华星光电技术有限公司 | Mini LED backlight panel, backlight module |
| WO2021000472A1 (en) * | 2019-07-01 | 2021-01-07 | 武汉华星光电技术有限公司 | Mini led backlight panel and backlight module |
| CN111211211A (en) * | 2020-01-13 | 2020-05-29 | 业成科技（成都）有限公司 | LED surface light source and display device |
| WO2021142961A1 (en) * | 2020-01-17 | 2021-07-22 | 深圳市华星光电半导体显示技术有限公司 | Backlight module and display panel |
| CN112558355A (en) * | 2020-12-17 | 2021-03-26 | 业成科技（成都）有限公司 | Backlight module and display panel |
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