CN103939758A - LED lighting device - Google Patents

Abstract

The present invention relates to the field of LED lighting, and specifically provides an LED lighting device, including a transparent housing, an LED light-emitting device, and a bracket, wherein the transparent housing and the bracket form a closed cavity; the LED light-emitting device is located in the cavity Inside the body and fixed on the bracket, it is characterized in that the cavity is filled with inert gas to conduct the heat generated by the LED light emitting device to the outside of the transparent casing. The LED lighting device provided by the present invention can conduct the heat generated by the LED light-emitting device to the outside of the LED lighting device without using a radiator by using the inert gas filled in the cavity, so that the shape of the LED lighting device can be made , size and weight are no longer limited by the radiator, thereby improving the aesthetics, safety and installation convenience of the LED lighting device.

Description

A kind of LED lighting device

technical field

The invention relates to the field of LED lighting, in particular to an LED lighting device.

Background technique

In recent years, with the trend of energy conservation and environmental protection becoming more and more significant, LED lighting devices have replaced incandescent lamps and fluorescent lamps, and even high-power light sources such as iodine-tungsten lamps and high-pressure sodium lamps have begun to develop from local applications, especially in the field of lighting. , LED lighting devices are more and more widely used, and are regarded as one of the main light sources of future lighting. However, the light output of existing LED lighting devices only accounts for 20%-30% of the energy generated, and the remaining 70%-80% of the energy is all used to generate heat without being utilized. Moreover, the unoutputted light A large amount of heat will be generated inside the LED lighting device, which not only reduces the service life of the LED lighting device, but also limits the application function of the LED lighting device because it cannot use larger power.

For this reason, in order to suppress the internal temperature of the LED lighting device from being too high, the heat generated by the LED light-emitting device installed in the LED lighting device is usually conducted to the outside of the LED lighting device by means of a heat sink. However, since the heat dissipation efficiency of the heat sink depends on The size of its surface area, that is: the larger the surface area of the heat sink, the higher the heat dissipation efficiency, and vice versa, the lower. Therefore, the volume of the heat sink often limits the shape, size and weight of LED lighting devices, especially in LED lighting. When the device needs to use higher power, due to the more heat generated inside it, the volume of the heat sink must be increased accordingly, which leads to LED lighting devices compared with traditional lighting devices such as incandescent lamps. The appearance is quite different, and the LED lighting device has defects such as large size and heavy weight, which further reduces the aesthetics, safety and installation convenience of the LED lighting device.

Contents of the invention

In order to solve the above problems, the present invention provides an LED lighting device, which can conduct the heat generated by the LED light-emitting device to the outside of the LED lighting device without using a heat sink by using the inert gas filled in the cavity, so that it can The shape, size and weight of the LED lighting device are no longer limited by the radiator, thereby improving the aesthetics, safety and installation convenience of the LED lighting device.

To this end, the present invention provides an LED lighting device, comprising a transparent housing, an LED light-emitting device, and a bracket, wherein the transparent housing and the bracket form a closed cavity; the LED light-emitting device is located inside the cavity, And fixed on the bracket, it is characterized in that the cavity is filled with inert gas to conduct the heat generated by the LED light emitting device to the outside of the transparent casing.

Wherein, an inflation hole communicating with the cavity is provided on the support, and the inert gas is charged into the cavity through the inflation hole.

Preferably, a transparent fluorescent layer is formed on the entire inner surface of the transparent shell, and the fluorescent layer is made of a material mixed with a transparent adhesive and fluorescent powder, wherein the material of the adhesive includes silica gel, ring One or more of oxygen glue, silicone resin and modified resin.

Wherein, the LED light-emitting device includes: an LED light-emitting mechanism, which includes an LED chip and can emit light in all directions; an encapsulating structural member, which is a transparent body and covers the periphery of the LED light-emitting mechanism; and a pair of electrodes, which It is electrically connected with the LED light-emitting mechanism and extends to the outside of the encapsulation structure.

Wherein, the LED light-emitting mechanism further includes a carrier and a plurality of LED chips electrically connected, wherein the carrier is a transparent body, and the LED chips are arranged on the bearing surface of the carrier; among the plurality of LED chips , the LED chip at the most upstream/downstream of current transmission is connected to the positive electrode/negative electrode in the pair of electrodes respectively; and between the plurality of LED chips and in the plurality of LED chips The most upstream/downstream LED chip is electrically connected to the positive electrode/negative electrode in the pair of electrodes respectively by wires.

Wherein, a transparent first adhesive layer is formed between the carrying surface of the carrier and the bonding surface of the LED chip, for fixing the LED chip on the carrying surface of the carrier, the first The material of an adhesive layer includes one or more of silica gel, epoxy glue, silicone resin and modified resin; and/or a transparent second adhesive is formed on the non-bonding surface of the LED chip layer, and the material of the second adhesive layer includes one or more of silica gel, epoxy glue, silicone resin and modified resin.

Wherein, the LED light-emitting mechanism also includes a carrier and a plurality of LED chips electrically connected, wherein the carrier is a transparent body, and a conductor is arranged on the bearing surface of the carrier; the plurality of LED chips and the conductor Eutectic soldering is used for electrical connection to realize the electrical connection between a plurality of LED chips; The positive electrode/negative electrode in the counter electrode is correspondingly electrically connected by means of eutectic welding through the conductor.

Wherein, a transparent and heat-conducting heat dissipation layer is formed between the bearing surface of the carrier and the bonding surface of the LED chip for heat exchange with the LED chip.

Wherein, the encapsulation structural member covers the bearing surface of the carrier and the LED chip fixed thereon; or the encapsulation structural member respectively covers the bearing surface of the carrier and the LED chip fixed thereon The LED chip, the surface of the carrier away from the bearing surface and the edge regions of the two side surfaces of the carrier; or in a section perpendicular to the extending direction of the pair of electrodes, the encapsulation structure is centered The wrapping angle with an angle of 180° respectively wraps the bearing surface of the carrier and the LED chip fixed thereon and the surface of the carrier away from the bearing surface in the circumferential direction; or in a direction perpendicular to the In the cross-section of the extending direction of the pair of electrodes, the encapsulation structural member completely encloses the carrier and the LED chip in the circumferential direction at a enveloping angle with a central angle of 360°.

Wherein, the pair of electrodes is a pair of metal electrode sheets, and each of the metal electrode sheets includes an assembly part and a connecting part connected as one, wherein a limiting structure is arranged at both ends of the carrier and on its bearing surface. , the fitting part is positioned on the carrier by means of the limiting structure; the shape of the end of the connecting part away from the fitting part is different; or, on the connecting part and located in the encapsulation Marks for indicating the polarity of the metal electrode pieces are arranged in the outer area of the structural member.

Compared with the prior art, the present invention has the following beneficial effects:

The LED lighting device provided by the present invention can conduct the heat generated by the LED light-emitting device to the outside of the transparent housing without using a radiator by means of the inert gas filled in the closed cavity formed by the transparent housing and the bracket, so that the The shape, size and weight of the LED lighting device are no longer limited by the heat sink, thereby improving the aesthetics, safety and installation convenience of the LED lighting device.

In a preferred embodiment of the LED lighting device provided by the present invention, the LED light-emitting mechanism in the LED light-emitting device can emit light in all directions, and the encapsulation structure covering the periphery of the LED light-emitting mechanism is a transparent body, so the LED The light-emitting device can realize multi-dimensional light emission, which can not only improve the light extraction efficiency of the LED lighting device, but also reduce the unfavorable phenomena such as a large amount of heat generated due to the low light output in the prior art, thereby improving the reliability of the LED lighting device and prolonging the life of the LED lighting device. its service life.

Description of drawings

FIG. 1A is a schematic structural diagram of an LED lighting device provided by the first embodiment of the present invention;

FIG. 1B is a schematic structural diagram of another LED lighting device provided by the first embodiment of the present invention;

Fig. 1C is a schematic structural diagram of another LED lighting device provided by the first embodiment of the present invention;

Fig. 2A is a front view of the LED light-emitting device of the LED lighting device provided by the first embodiment of the present invention;

2B is a cross-sectional view of the carrier of the LED light emitting device in FIG. 2A;

Fig. 2C is a top view of the LED light-emitting device of the LED lighting device provided by the first embodiment of the present invention;

Fig. 2D is an optical path diagram of the LED light emitting device in Fig. 2A;

FIG. 2E is a front view of another encapsulation structure of the LED light-emitting device in FIG. 2A;

3 is a schematic structural diagram of an LED lighting device provided by a second embodiment of the present invention;

Fig. 4A is a front view of the LED light-emitting device of the LED lighting device provided by the third embodiment of the present invention;

Fig. 4B is a side view of the LED light-emitting device of the LED lighting device provided by the third embodiment of the present invention;

4C is a top view of the connection relationship between the LED chip and the carrier of the LED light emitting device in FIG. 4A;

FIG. 4D is a top view of the LED light-emitting device in FIG. 4C before the LED chip is assembled;

FIG. 4E is a schematic diagram of the bonding surface of the LED chip of the LED light-emitting device in FIG. 4C;

FIG. 4F is a top view of the connection relationship between a pair of electrodes and the carrier of the LED light-emitting device in FIG. 4A;

FIG. 4G is a transverse cross-sectional view of the connection relationship between the electrodes and the carrier of the LED light emitting device in FIG. 4F;

FIG. 4H is a schematic structural view of a pair of electrodes of the LED light emitting device in FIG. 4F;

Figure 4I is an optical path diagram of the LED light emitting device in Figure 4B;

Fig. 5A is a front view of another encapsulation structure of the LED light-emitting device in Fig. 4A; and

Fig. 5B is a top view of another conductor of the LED light emitting device in Fig. 4C.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions of the present invention, the preferred modes for implementing the present invention will be further described in detail below in conjunction with the accompanying drawings. However, the following embodiments are used to actualize the technical ideas of the LED lighting device provided by the present invention, and are not used to limit the inventive ideas of the present invention. In addition, the size and positional relationship of members shown in each drawing are exaggerated and exaggerated only for clearer description, and are not intended to limit the actual size and proportional relationship of members.

first embodiment

Please refer to FIG. 1A to FIG. 1C together, which show the structure of the LED lighting device provided by the first embodiment of the present invention. The LED lighting device 200 in this embodiment includes a transparent housing 20 , an LED light emitting device 100 and a bracket 21 . Wherein, the transparent shell 20 adopts a shell structure similar to that of a traditional incandescent lamp shell, and the bracket 21 and the transparent shell 20 form a closed cavity. Specifically, the bracket 21 includes a pillar 21a and a base 21b, wherein the base 21b is disposed in the cavity and is located at the bottom of the transparent casing 20, and the base 21b and the transparent casing 20 form a closed cavity; the pillar 21a is disposed on the upper surface of the base 21b , and support leads 22 are provided on the pillars 21a to support the LED light-emitting devices 100 inside the cavity, and when there are multiple LED light-emitting devices 100, multiple LED light-emitting devices 100 can be arranged in the transparent casing 20 according to the Arranged in a predetermined shape, and the supporting lead 22 is electrically connected to the positive electrode/negative electrode of the LED light emitting device 100 . In practical application, the transparent housing 20 only needs to be able to accommodate the LED light emitting device 100 and the bracket 21 , without limiting its structure and shape. Moreover, as long as the bracket 21 can form a closed cavity with the transparent casing 20 and can support the LED light emitting device 100 in the cavity, the structure of the bracket 21 does not need to be limited.

In addition, the cavity is filled with an inert gas to conduct the heat generated by the LED light-emitting device 100 to the outside of the transparent casing 20. In this embodiment, the way to fill the cavity with the inert gas is as follows: An air filling hole 27 communicating with the cavity is provided, through which the inert gas is filled into the cavity. In practical applications, the inert gas can include gases with high thermal conductivity such as helium and neon. Moreover, the LED lighting device provided by the present invention only needs to be able to fill the cavity with the inert gas without limiting the amount of the inert gas. fill method.

In the LED lighting device provided in this embodiment, with the help of the inert gas filled in the cavity, the heat generated by the LED light-emitting device can be conducted to the outside of the transparent casing without using a heat sink, so that the shape, The size and weight are no longer limited by the heat sink, thereby improving the aesthetics, safety and installation convenience of the LED lighting device.

In this embodiment, the specific connection method for the LED lighting device 200 to be electrically connected to the power supply supplying it with electric energy is: the LED lighting device 200 also includes a positive/negative electrode line 23, a power driver 24, a power connector 26 and a power connector connection piece 25. Wherein, one end of the positive/negative electrode line 23 is electrically connected with the support lead wire 22, and the other end is electrically connected with one end of the power driver 24; the other end of the power driver 24 is electrically connected with the power connector 26; one end of the power connector 26 is connected by the power connector The component 25 is fixedly connected to the transparent housing 20; the other end of the power connector 26 is electrically connected to a power source (not shown in the figure), so that the power source can provide power to the LED lighting device 200 . In practical applications, as long as the power supply can provide electric energy to the LED lighting device to realize the LED light emitting device to emit light, there is no need to limit the connection method of the LED lighting device 200 and the power supply.

It should be noted that, in this embodiment, there are multiple LED light-emitting devices 100, and the projected shape on the cross section of the transparent housing 20 (that is, the cross section taken perpendicular to the direction of the paper) is approximately semicircular, In order to realize all-round light emission, as shown in Fig. 1A. However, the present invention is not limited thereto. In practical applications, multiple LED light emitting devices 100 can also be arranged in other shapes according to specific needs. For example, multiple LED light emitting devices 100 can be arranged in the following shapes, namely: The projection shape on the longitudinal section of the transparent housing 20 (that is, the section obtained parallel to the direction of the paper) is "X" shape, or "eight" shape, as shown in Figure 1B and Figure 1C, this shape can make Each LED lighting device 100 complements each other, so that the LED lighting device 200 can emit light evenly on the basis of realizing omnidirectional lighting.

In the LED lighting device provided in this embodiment, the LED light-emitting device includes the following components: an LED light-emitting mechanism that includes an LED chip and can emit light in all directions, a transparent encapsulation structure that wraps around the periphery of the LED light-emitting mechanism, and the The LED light-emitting mechanism is electrically connected and extended to a pair of electrodes outside the encapsulation structure. Moreover, the number of LED chips in the LED lighting mechanism can be one or more.

Wherein, the LED light-emitting mechanism may include a plurality of LED chips electrically connected, and among the plurality of LED chips, the LED chip at the most upstream of current transmission is connected to the positive electrode of the above-mentioned pair of electrodes, and the LED chip at the most downstream of current transmission The wafer is connected to the negative electrode of the aforementioned pair of electrodes. The so-called LED chip at the most upstream of current transmission refers to the LED chip through which the current flows first among these LED chips; the so-called LED chip at the most downstream of current transmission refers to the LED through which the current flows last among these LED chips. wafer. In fact, the LED chip at the most upstream/downstream of current transmission is not consistent with the physical location of the LED chip, that is, among these LED chips, the LED chips at the most extreme ends in physical position may not be the most upstream in terms of current transmission / most downstream. Only when a plurality of LED chips are electrically connected by wires in sequence according to their arrangement positions, the LED chip at the most upstream of the current transmission and the LED chip at the most downstream of the current transmission are the ends of the plurality of LED chips. Those two wafers. And the above-mentioned electrodes can be wires, rod-shaped electrodes, sheet-shaped electrodes (abbreviated as electrode sheets), etc., as long as the conductors that can realize the electrical connection between the LED chip in the LED light-emitting mechanism and the power supply can be used, and Its shape is not necessarily limited.

In practical applications, the LED lighting mechanism further includes a transparent carrier, and one or more LED chips included in the LED lighting mechanism are arranged on the carrying surface of the carrier. The so-called carrying surface refers to the surface on the carrier for setting the LED chip. Preferably, the surface of the carrier is roughened to form a roughened reflective layer with a concave-convex structure, and the carrier with the roughened reflective layer with a concave-convex structure is translucent when viewed from the outside.

Since the LED light-emitting mechanism can emit light in all directions, and the encapsulation structure covering the periphery of the LED light-emitting mechanism is a transparent body, the LED light-emitting device can realize multi-dimensional light emission, which can not only improve the light extraction efficiency of the LED lighting device (in fact, In general, the light extraction efficiency of the LED lighting device provided by the present invention is 30%-50% higher than that of the existing LED lighting device); and it can reduce the bad phenomena such as a large amount of heat generated due to the low light output, thereby improving The reliability of the LED lighting device is improved, and its service life is prolonged.

It should be pointed out that the so-called omnidirectional light means that the LED light emitting mechanism itself as a whole can output the light emitted by the LED chips contained therein in all directions. That is to say, when the LED light-emitting mechanism does not include a carrier, the so-called omnidirectional light refers to the light emitted directly by the LED chip in all directions; when the LED light-emitting mechanism includes a carrier, the so-called omnidirectional light refers to the light directly emitted by the LED chip. The light emitted in various directions and the light emitted by the LED chip and output through the carrier.

The specific structure of the LED lighting device of the LED lighting device provided in this embodiment will be described in detail below with reference to FIGS. 2A to 2E .

Specifically, the LED lighting device 100 includes: a carrier 11, a plurality of LED chips 12, an encapsulation structure 13 and a pair of metal electrode sheets (17a, 17b). Wherein, the carrier 11 is a transparent body, which can be made of one of glass, ceramics, plastic and other materials or a mixture of multiple materials. The surface of the carrier 11 is roughened to form a roughened reflective layer 110 with a concave-convex structure, which makes the carrier 11 look translucent from the outside, as shown in FIG. 2B . Also, in the longitudinal section of the roughened reflective layer 110 (ie, the section taken perpendicular to the direction of the paper), the shape of the convex part in the concave-convex structure may be semicircle, ellipse, zigzag, triangle, etc. The light emitted by the LED chip 12 can be reflected by means of the roughened reflective layer 110 with a concave-convex structure, and the light beams can be mutually coupled, so that the light output by the LED light emitting device 100 is uniform and soft. In practical applications, the surface of the carrier 11 can be roughened to different degrees according to the light-emitting structures of different LED chips 12, so that it has different concave-convex structure shapes, recessed depths, and raised heights. In practical applications, the four sides of the carrier 11, that is, the four surfaces perpendicular to the direction of the paper in FIG. The surface of the bearing surface is roughened to different degrees, and only the two sides of the above-mentioned four sides of the carrier 11 except the bearing surface and the surface away from the bearing surface can be roughened to different degrees.

In this embodiment, a plurality of LED chips 12 are electrically connected through wires 14 . Specifically, as shown in FIG. 2A , a transparent first adhesive layer 15 is formed between the carrying surface of the carrier 11 and the bonding surface of the LED chip 12 . Specifically, in the area on the carrying surface of the roughened reflective layer 110 that is attached to the plurality of LED chips 12, and/or in the area on the plurality of LED chips 12 that is attached to the roughened reflective layer 110 The first adhesive is applied, and a plurality of LED chips 12 are adhered to the rough reflective layer 110 to realize the fixing of the LED chips 12 . It can be understood that since the surface of the carrier 11 is formed with a roughened reflective layer 110 with a concave-convex structure, the first adhesive layer 15 will fill the concave portion of the roughened reflective layer 110, thereby strengthening the first adhesive layer. 15 and the carrier 11, thereby increasing the bonding force between the LED chip 12 and the carrier 11, thereby enhancing the overall reliability of the LED light emitting device 100. In addition, the second adhesive layer 16 is coated on the non-bonding area of the bearing surface of the roughened reflective layer 110 and the non-bonding area on the surface of the LED chip 12 . Wherein, both the first adhesive layer 15 and the second adhesive layer 16 are formed by mixing transparent glue and fluorescent powder, and the material and mixing ratio of the transparent glue selected by the two may be the same or different.

In practical applications, when the LED light-emitting device 100 is a light-emitting device for ordinary monochromatic light, all of the plurality of LED chips 12 are corresponding ordinary monochromatic LED chips 12, for example, all of the plurality of LED chips 12 are blue chips or all are Any visible light chip other than blue light. When the LED light-emitting device 100 is a light-emitting device with high light efficiency and high color rendering index, a plurality of LED chips 12 include a blue LED chip 12a and a red (or yellow) light LED chip 12b, and the red (or yellow) light LED Between the chip 12b and the LED chip 12a of the blue light, the LED chip 12a of the blue light is spaced apart and evenly distributed. For example, as shown in FIG. Full light mixing. The so-called uniform distribution here refers to a regular distribution, for example, a red (or yellow) light LED chip is arranged at intervals of two blue LED chips; and the so-called regular distribution is not limited to the above-mentioned distribution and spacing methods, Instead, it can be adjusted and set according to the actual situation.

In addition, in order to locate and assemble the metal electrode sheets (17a, 17b) more accurately and quickly, position-limiting structures for position-limiting can be provided at both ends of the carrier 11, for example, at both ends of the carrier 11 and A limit groove is formed on its bearing surface, and one end of the metal electrode sheet (17a, 17b) is fixed in the limit groove by means of an adhesive, and the metal electrode sheet (17a, 17b) is connected to the most current transmission position by means of a wire. The upstream LED chip is electrically connected to the most downstream LED chip in current transmission. With the help of the limiting groove, not only can the metal electrode pieces (17a, 17b) be positioned and assembled more accurately and quickly, but also the adhesive can be coated on the metal electrode piece (17a) located in the limiting groove. , 17b), so that the connection reliability between the metal electrode sheets (17a, 17b) and the carrier 11 can be increased. It is easy to understand that the above-mentioned limiting groove can also be arranged at one end of the metal electrode sheet (17a, 17b), and the two ends of the carrier 11 are fixed in the limiting groove by means of an adhesive, so that the adhesive is coated on the The outer surface of the carrier 11 in the limiting groove.

In this embodiment, the encapsulation structure 13 is disposed on the bearing surface side of the roughened reflective layer 110 of the carrier 11 , and is used to cover the bearing surface of the carrier 11 and the LED chips 12 fixed thereon. The encapsulation structure 13 is a transparent body, and its material can be one or more of materials such as silica gel, silicone resin, epoxy resin and modified resin, and it is perpendicular to the extending direction of the electrode sheets (17a, 17b). The shape of the cross-section can be semicircle, ellipse, square, etc.

In this embodiment, as shown in FIG. 2D , since the first adhesive layer 15 containing transparent glue and fluorescent powder is coated in the area where a plurality of LED chips 12 are attached to the roughened reflective layer 110, and In the non-bonding area on the carrying surface of the roughened reflective layer 110 and in the non-bonding area on the surface of the LED chip 12, the second adhesive layer 16 comprising transparent glue and phosphor powder is coated. Therefore, the LED chip 12 A part of the emitted light 100a can pass through the transparent first adhesive layer 15 and the carrier 11 to be output to the outside of the LED light-emitting device 100, and another part of the light 100b emitted by the LED chip 12 can pass through the transparent second adhesive layer 15. The bonding agent layer 16 and the encapsulation structure 13 are output to the outside of the LED light-emitting device 100, thereby realizing multi-dimensional light emission; surroundings are evenly coated with a mixed layer of transparent glue and phosphor, and part of the light 100a emitted by it passes through the first adhesive layer 15 and excites the phosphor in the first adhesive layer 15, and White light is output outside through the carrier 11, and another part of the light 100b emitted by it passes through the second adhesive layer 16 and excites the phosphor in the second adhesive layer 16, and then passes through the encapsulating structural member 13 to output white light to the outside, so that uniform white light can be output to the outside.

It should be noted that, in this embodiment, the encapsulation structure 13 is a transparent body without phosphor powder, and a mixture of transparent glue and phosphor powder is formed between the carrying surface of the carrier 11 and the bonding surface of the LED chip 12. The formed first adhesive layer 15; in the non-bonded area of the bearing surface of the roughened reflective layer 110 and in the non-bonded area of the LED chip 12 surface, it is formed by mixing transparent glue and fluorescent powder The second adhesive layer 16, but the present invention is not limited thereto. In practical applications, the material of the encapsulating structural member 13 can also be a mixture of transparent glue and fluorescent powder, and it can also be used only in roughening On the bearing surface of the reflective layer 110, apply the first bonding agent in the area attached to the plurality of LED chips 12, and/or in the area attached to the roughened reflective layer 110 on the plurality of LED chips 12. The adhesive layer 15 is not coated with the second adhesive layer 16 in the non-attached area of the bearing surface of the roughened reflective layer 110 and/or in the non-adhered area of the surface of the LED chip 12 .

Moreover, the encapsulation structural member 13 is not limited to only covering the carrying surface of the carrier 11 and the LED chip 12 fixed thereon in this embodiment. In practical applications, the encapsulation structural member 13 can also In the plane of the extension direction of the sheet (17a, 17b), the carrier 11 and the LED chip 12 are completely covered in the circumferential direction with a coverage range of 360 ° of central angle (that is, with a central angle of 360 degrees of wrapping angle), As shown in FIG. 2E , this also makes it possible to output uniform white light when the LED chip 12 is a blue LED chip. In addition, the shape of the cross-section of the above-mentioned encapsulating structural member 13 along the direction perpendicular to the extending direction of the electrode sheets (17a, 17b) can be any other shape such as square, ellipse, rhombus, etc. in addition to the circle shown in Figure 2E. shape, as long as the encapsulating structural member 13 can completely cover the carrier 11 and the LED chip 12 with a coverage range of 360° in a plane perpendicular to the extending direction of the electrode sheets (17a, 17b).

second embodiment

Please refer to FIG. 3 , which shows the structure of the LED lighting device provided by the second embodiment of the present invention. Similar to the aforementioned first embodiment, the LED lighting device 200 provided by the second embodiment also includes a transparent housing 20, an LED lighting device 100 and bracket 21. Among them, the structure and shape of the transparent casing 20 and the bracket 21 and the way of filling the cavity formed by the two with inert gas, the way of electrically connecting the LED lighting device 200 to the power supply, the specific structure of the LED light emitting device 100 and the lighting of multiple LEDs. The way of arrangement of the devices 100 in the transparent casing 20 is similar to the above-mentioned first embodiment, and will not be repeated here. Parts of the second embodiment different from the first embodiment will be described in detail below.

In the second embodiment, a transparent fluorescent layer 28 is formed on the entire inner surface of the transparent casing 20, and the fluorescent layer 28 is made of a material mixed with a transparent binder and phosphor powder, wherein the material of the binder includes One or more of silica gel, epoxy glue, silicone resin and modified resin. When the LED light-emitting device 100 is a light-emitting device with high luminous efficiency and high color rendering index, the multiple LED chips 12 are blue light, a combination of blue light and red light, or a combination of blue light and orange light. The surface is coated with yellow fluorescent powder or a mixture of yellow, green and red fluorescent powder, so that the LED chip 12 can excite the fluorescent powder to output white light because of the emitted light. Moreover, since the entire inner surface of the transparent shell 20 Coating with the fluorescent layer 28 makes it unnecessary to add fluorescent powder to the material of the carrier 11 and/or the encapsulating structural member 13 , thereby simplifying the manufacturing process of the LED lighting device 200 .

third embodiment

Similar to the aforementioned first and second embodiments, the LED lighting device 200 provided by the third embodiment also includes a transparent casing 20 , an LED light emitting device 100 and a bracket 21 . Among them, the structure and shape of the transparent casing 20 and the bracket 21 and the way of filling the cavity formed by the two with inert gas, the way of electrically connecting the LED lighting device 200 to the power supply, the specific structure of the LED light emitting device 100 and the lighting of multiple LEDs. The arrangement of the devices 100 in the transparent casing 20 is similar to the first and second embodiments described above, and will not be repeated here. The parts of the third embodiment that are different from the first and second embodiments will be described in detail below.

Please refer to FIG. 4A to FIG. 4I , which show the specific structure of the LED lighting device of the LED lighting device provided by the third embodiment of the present invention. Compared with the first and second embodiments, the third embodiment differs in that: a conductor 30 is arranged on the carrying surface of the carrier 11, and a plurality of LED chips 12 are electrically connected to the conductor 30 by eutectic welding, so as to The electrical connection between the multiple LED chips 12 is realized. Moreover, among the plurality of LED chips 12, the most upstream/downstream LED chip 12 in the current transmission and the positive electrode/negative electrode in a pair of electrode sheets (17a, 17b) respectively adopt eutectic welding by means of a conductor 30. The way corresponds to the electrical connection.

Specifically, the number of LED chips 12 is N, and N+1 conductors 30 are arranged on the carrying surface of the carrier 11, and N is an integer greater than 1, and the N LED chips 12 are arranged along the metal electrode sheets (17a, 17b ) is arranged alternately with N+1 conductors 30 , that is, an LED chip 12 is arranged between two consecutive conductors 30 at every interval, as shown in FIG. 4C . Moreover, at both ends of each LED chip 12 and on its bonding surface, there are chip soldering points 41, as shown in FIG. The wiring pad 31 is shown in FIG. 4D , and the wafer pad 41 corresponds to the shape of the wiring pad 31 . The so-called bonding surface of the LED chip 12 refers to the surface of the LED chip 12 for bonding with the carrying surface of the carrier 11 . Each LED chip 12 and the two adjacent conductors 30 are electrically connected by welding the above-mentioned chip pads 41 and line pads 31 by eutectic welding, so that N LED chips 12 are electrically connected, For example, series, parallel or hybrid.

In addition, since the LED chip 12 is fixed on the carrier 11 by soldering together the chip solder joints 41 and the circuit solder joints 31, that is, the support point of the LED chip 12 on the carrier 11 is located on the conductor 30, which often causes the LED chip There is a gap between the bonding surface of 12 and the bearing surface of the carrier 11. In other words, the LED chip 12 is suspended above the bearing surface of the carrier 11, which is not conducive to the heat dissipation of the LED chip 12. For this reason, between the bearing surface of the carrier 11 and the LED chip A transparent and thermally conductive heat dissipation layer 42 is formed between the bonding surfaces of 12 for heat exchange with the LED chip 12 , so that the heat generated by the LED chip 12 is conducted to the outside of the LED lighting device 100 through the heat dissipation layer 42 and the carrier 11 . The material of the heat dissipation layer 42 may include one or more of silica gel, epoxy glue, silicone resin and modified resin.

In this embodiment, a pair of electrode sheets (17a, 17b) are used as the positive/negative electrodes of the LED light-emitting device 100, and are respectively arranged at both ends of the carrier 11 and are at least 0.5 from the LED chips 12 arranged at the two ends of the carrier 11. mm, as shown in FIG. 4H , the metal electrode sheet (17a, 17b) includes an integrated assembly part 176 and a connecting part (175a, 175b). Wherein, a limiting groove is provided at one end of the fitting portion 176 away from the connecting portion (175a, 175b), and the two ends of the carrier 11 are fixed in the limiting groove by means of a conductive adhesive (19a, 19b), and glued The bonding agent ( 19 a , 19 b ) is electrically connected to the corresponding conductor 30 by means of eutectic soldering, reflow soldering or high-temperature curing, that is, electrically connected to the conductor 30 disposed on both ends of the carrier 11 . The adhesives (19a, 19b) can be made of conductive materials such as solder paste or silver glue with high thermal conductivity and high adhesion. With the help of the limiting groove, not only can the metal electrode sheets (17a, 17b) be positioned and assembled more accurately and quickly, but also the adhesive 19 can cover the entire carrier 11 located in the limiting groove. The outer surface, that is, the four sides of the carrier 11 in FIG. 4G perpendicular to the direction of the paper, can increase the connection reliability between the metal electrode sheets ( 17 a , 17 b ) and the carrier 11 .

Moreover, in order to identify the polarity at both ends of the LED light-emitting device 100, the shapes of the ends of the two connecting parts (175a, 175b) of the above-mentioned pair of metal electrode sheets (17a, 17b) away from the mounting part 176 are designed to be different shapes, It is marked as the polarity of both ends of the LED light emitting device 100, as shown in FIG. 4H. In practical applications, the shapes of the ends of the two connecting parts (175a, 175b) away from the fitting part 176 may be different arbitrary shapes, which are not specifically limited here. In addition, preferably, the width of the assembling part 176 is greater than that of the connecting part (175a, 175b), which is more conducive to the assembling of the metal electrode sheets (17a, 17b).

It should be noted that although in this embodiment, the limiting groove is provided at the end of the fitting portion 176 away from the connecting portion (175a, 175b), the present invention is not limited thereto, and in practical applications, The limiting grooves can be arranged on both ends of the carrier 11 and on its bearing surface. In this case, the ends of the fitting part 176 away from the connecting parts (175a, 175b) are fixed on the carrier by means of the above-mentioned adhesive. In the limit groove, and the adhesive covers the outer surface of the assembly part 176 located in the limit groove, which can also achieve more accurate and faster positioning and assembly of the metal electrode sheets (17a, 17b), And increase the connection reliability between the metal electrode sheets (17a, 17b) and the carrier 11.

In addition, in practical applications, it is also possible not to provide limiting grooves at the two ends of the bearing surface of the carrier 11 or the ends of the fitting part 176 away from the connecting parts (175a, 175b), but only by means of a conductive adhesive (19a) , 19b) metal electrode sheets (17a, 17b) are fixed on the carrying surface of the carrier 11, and are electrically connected to the corresponding conductor 30 by means of eutectic soldering, reflow soldering or high-temperature curing, or can also be placed on the carrier 11 At both ends and on its bearing surface, a limiting structure such as a square step or a trapezoidal step is set, and the assembly part 176 is positioned on the carrier 11 by means of the limiting structure, so as to more accurately and quickly align the metal electrode sheets (17a, 17b ) for positioning.

It should also be noted that although in this embodiment, the polarities of the two ends of the LED light-emitting device 100 are identified by designing the shapes of the ends of the two connecting parts (175a, 175b) away from the mounting part 176 into different shapes, this embodiment The invention is not limited thereto. In practical applications, the ends of the two connecting parts (175a, 175b) away from the fitting part 176 may also have the same shape, and the front and/or sides of the two connecting parts (175a, 175b) Or the back is provided with a positive mark marked "+" and a negative mark marked "-", which can also identify the polarity of the two ends of the LED light emitting device 100 .

In this embodiment, as shown in FIG. 4A , the encapsulating structural member 13 is a transparent body, and is formed of a mixture of transparent glue and fluorescent powder, and the encapsulating structural member 13 respectively covers the bearing surface of the carrier 11 and the mounting surface fixed thereon. The LED chip 12, the surface of the carrier 11 away from the bearing surface and the edge regions of the two side surfaces of the carrier 11, specifically, the encapsulation structure 13 is composed of two parts whose cross-sectional shapes are approximately semicircular: the first part 131 is used to cover the surface of the carrier 11 away from the bearing surface and the edge regions of the two side surfaces of the carrier 11 (that is, the upper surface of the carrier 11 in FIG. 4A and the upper regions of the two sides adjacent thereto); the second It is partially used to cover the carrying surface of the carrier 11 and the edge regions of the LED chips 12 fixed on it and the two side surfaces of the carrier 11 (that is, the lower surface of the carrier 11 in FIG. 4A and the lower parts of the two sides adjacent to it area). In practical applications, the cross-sectional shape of the encapsulation structure 13 in the direction perpendicular to the extending direction of the metal electrode sheets (17a, 17b) may be semicircular, elliptical, square, or the like.

Since the LED light-emitting device 100 covers the edge regions of the two side surfaces of the carrier 11 by means of the encapsulating structural member 13 formed of a mixture of transparent glue and phosphor powder, this can prevent a part of the light emitted by the LED chip 12 from directly emitting from the carrier. 11, the edge areas on both sides of the surface are output, so that when the LED chip 12 is a blue or red LED chip, the light emitted from the edge area is blue or red, thereby ensuring that the LED light emitting device 100 can output uniformly in all directions. white light. Moreover, since the LED light-emitting device 100 does not cover the entire surface of the carrier 11 with the encapsulation structural member 13, but exposes the central areas of the two side surfaces of the carrier 11 outside the encapsulation structural member 13, this is beneficial The heat dissipation of the LED chip 12 can make the LED chip 12 suitable for a larger driving current, thereby not only increasing the light output of a single LED chip 12, but also reducing the manufacturing cost of the light emitting device.

In addition, since the encapsulation structure 13 is formed of a mixture of transparent glue and phosphor material, as shown in FIG. 4I , a part of the light 50b emitted by the LED chip 12 can pass through the transparent heat dissipation layer 42, the carrier 11 and the encapsulation structure. part 13 and output to the outside of the LED light-emitting device 100, and another part of the light 50a emitted by the LED chip 12 can pass through the encapsulation structure 13 and output to the outside of the LED light-emitting device 100, thereby realizing multi-dimensional light emission; and when the LED When the chip 12 is a blue LED chip, part of the light 50b emitted by it passes through the heat dissipation layer 42, the carrier 11 and the encapsulation structure 13, and excites the phosphor in the encapsulation structure 13 to output white light; Another part of the emitted light 50 a passes through the encapsulation structure 13 and excites the phosphor in the encapsulation structure 13 to output white light, so that uniform white light can be output to the outside.

It should be noted that, in this embodiment, the encapsulating structural member 13 respectively covers the carrying surface of the carrier 11 and the LED chips 12 fixed thereon, the surface of the carrier 11 away from the carrying surface, and the edges of the two side surfaces of the carrier 11. area, but the present invention is not limited thereto. In practical applications, similar to the aforementioned first and second embodiments, the encapsulation structure 13 can be made In the plane, the carrier 11 and the LED chip 12 are completely covered by a coverage range of a central angle of 360°.

In addition, as shown in FIG. 5A , the encapsulating structural member 13 can also be made to be in a section perpendicular to the extending direction of the metal electrode sheets (17a, 17b), along the circumferential direction of the carrier 11 with a central angle of 180°. Covering the carrying surface of the carrier 11 and the LED chip 12 fixed on it and the surface of the carrier 11 away from the carrying surface, that is, the two side surfaces of the carrier 11 are completely exposed outside the encapsulating structural member 13, which can not only further improve LED performance. The heat dissipation efficiency of the chip 12, and because the encapsulation structure 13 only needs to cover the carrying surface of the carrier 11 and the LED chip 12 fixed thereon and the surface of the carrier 11 away from the carrying surface, this simplifies the encapsulation structure to a certain extent The structure of the component 13 can simplify the manufacturing process of the encapsulating structural component 13, thereby reducing the processing cost of the LED lighting device 200 to a certain extent.

In addition, as shown in FIG. 5B , in order to prevent a part of the light emitted by the LED chip 12 from directly outputting from the edge areas of the two side surfaces of the carrier 11, so that the LED light emitting device 100 has a color cast in the edge areas, it can be continuously spaced at intervals. The two conductors 30 are provided with two protrusions 32 extending toward each other, and the two protrusions 32 are located on both sides of the LED chip 12 between the two conductors 30 that are continuously spaced. With the help of the convex portion 32, a part of the light emitted by the LED chip 12 can be blocked from being directly output from the edge regions of the two side surfaces of the carrier 11, but a part of the light emitted by the LED chip 12 is refracted by the convex portion 32 and output from other directions, thereby It can prevent the LED light-emitting device 100 from appearing color cast in the edge areas of the two sides of the carrier 11 , thereby ensuring that the LED lighting device 200 can output uniform light in all directions. Preferably, the length of the two protrusions 32 between the two conductors 30 with continuous intervals can be as long as possible without contacting the corresponding conductors 30, so as to block the LED chip 12 from both sides of the carrier 11 to the greatest extent. The light output from the edge region of the surface. In addition, in the above case, when the LED chip 12 is a blue LED chip, the heat dissipation layer 42 should be made of a mixture of transparent glue and phosphor powder, so as to ensure that the LED chip 12 outputs light from the edge regions of the two sides of the carrier 11. It is white light, so as to ensure that the LED lighting device 200 can output uniform white light in all directions.

It can be understood that, in practical applications, it may be determined according to actual needs whether the inner surface of the transparent casing, each adhesive layer, the encapsulating structural member and/or the carrier contains phosphor. In addition, in this application, the transparent housing, transparent heat dissipation layer, encapsulation structure and/or carrier means that the light emitted by the LED chip can penetrate the transparent housing, heat dissipation layer, encapsulation structure and/or carrier.

It can also be understood that the above implementations are only exemplary implementations adopted to illustrate the principle of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims (10)

1. a LED lighting device, comprises transparent outer cover, LED luminescent device and support, and wherein, described transparent outer cover and described support form the cavity of sealing; Described LED luminescent device is positioned at described inside cavity, and is fixed on described support, it is characterized in that, in described cavity, is filled with inert gas, conducts to the outside of described transparent outer cover in order to the heat that described LED luminescent device is produced.

2. LED lighting device according to claim 1, is characterized in that, is provided with the air-filled pore being connected with described cavity on described support, and described inert gas is filled with in described cavity via described air-filled pore.

3. LED lighting device according to claim 1, is characterized in that, at the whole inner surface of described transparent outer cover, is formed with transparent fluorescence coating, and described fluorescence coating adopts the material being mixed by transparent binding agent and fluorescent material to make, wherein

The material of described binding agent comprises one or more in silica gel, epoxy glue, silicones and modified resin.

4. according to the LED lighting device described in claim 1-3 any one claim, it is characterized in that, described LED luminescent device comprises:

LED lighting means, it comprises LED wafer and energy is omnibearing luminous;

Encapsulating structure part, it is the transparent body and the periphery that is coated on described LED lighting means; And

Pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure part.

5. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein

Described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier;

In described a plurality of LED wafers, the LED wafer in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes; And

Between described a plurality of LED wafer, and the LED wafer in current delivery upstream/downstream is electrically connected to by wire respectively with between positive electrode/negative electrode in described pair of electrodes in described a plurality of LED wafers.

6. LED lighting device according to claim 5, it is characterized in that, between the loading end of described carrier and the faying face of described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or

On non-binding of described LED wafer, be formed with the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.

7. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein

Described carrier is the transparent body, on the loading end of described carrier, is provided with conductor;

Described a plurality of LED wafer adopts the mode of eutectic weldering to be electrically connected to described conductor, to realize the electric connection between a plurality of described LED wafers; And

In described a plurality of LED wafers, the LED wafer in the upstream of current delivery/downstream adopts the corresponding electrical connection of mode of eutectic weldering by described conductor respectively with between positive electrode/negative electrode in described pair of electrodes.

8. LED lighting device according to claim 7, is characterized in that, is formed with the heat dissipating layer of transparent and heat conduction between the loading end of described carrier and the faying face of described LED wafer, in order to carry out heat exchange with described LED wafer.

9. LED lighting device according to claim 4, is characterized in that, the loading end of the coated described carrier of described encapsulating structure part and on the described LED wafer fixed; Or

Described encapsulating structure part is the loading end of coated described carrier and the fringe region of described LED wafer fixed thereon, the surface that deviates from described loading end of described carrier and the both side surface of described carrier respectively; Or

In the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take coated angle that central angle is 180 ° coated loading end of described carrier and the surface that deviates from described loading end of described LED wafer fixed thereon and described carrier respectively in circumferential direction; Or

In the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take the coated angle that central angle is 360 °, and described carrier and described LED wafer is completely coated in circumferential direction.

10. LED lighting device according to claim 4, is characterized in that, described pair of electrodes is pair of metal electrodes sheet, and described in each, metal electrode film comprises department of assembly and the connecting portion being connected as a single entity, wherein

At the two ends of described carrier and be positioned on its loading end and be provided with position limiting structure, described department of assembly is positioned on described carrier by means of described position limiting structure;

The end shape away from described department of assembly of described connecting portion is different; Or, on described connecting portion and the outside region that is positioned at described encapsulating structure part be provided with the mark that is used to indicate metal electrode film polarity.