CN103939758A - LED lighting device - Google Patents
LED lighting device Download PDFInfo
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- CN103939758A CN103939758A CN201310024344.1A CN201310024344A CN103939758A CN 103939758 A CN103939758 A CN 103939758A CN 201310024344 A CN201310024344 A CN 201310024344A CN 103939758 A CN103939758 A CN 103939758A
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- led
- carrier
- led lighting
- lighting device
- led wafer
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- 229910002027 silica gel Inorganic materials 0.000 claims description 9
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to the field of LED lighting, and particularly provides an LED lighting device. The LED lighting device comprises a transparent outer shell, an LED luminescent device and a support, wherein the transparent outer shell and the support form a closed cavity and the LED luminescent device is located inside the cavity and fixed onto the support. The LED lighting device is characterized in that the cavity is filled with inert gas which is used for transmitting heat generated by the LED luminescent device to the outer portion of the transparent outer shell. According to the LED lighting device, through the inert gas arranged in the cavity in a filled mode, the heat generated by the LED luminescent device can be transmitted to the outer portion of the LED lighting device without adopting a heat dissipation body, and therefore the shape, the size and the weight of the LED lighting device cannot be limited by the heat dissipating body. Thus, the attractiveness, the safety and the installation convenience of the LED lighting device can be improved.
Description
Technical field
The present invention relates to LED lighting field, be specifically related to a kind of LED lighting device.
Background technology
In recent years, along with the trend of energy-conserving and environment-protective is more and more significant, the alternative trend of the high power light sources such as LED lighting device replace incandescent and fluorescent lamp or even iodine-tungsten lamp, high-pressure mercury lamp has started development from topical application field, especially at lighting field, LED lighting device is more and more widely used especially, and is regarded as one of principal light source of following illumination.Yet, the light output quantity of existing LED lighting device only accounts for its energy-producing 20%-30%, the energy of remaining 70%-80% is all used for producing heat and fails to be utilized, and, the light of output can not produce in the inside of LED lighting device a large amount of heat, this not only causes reduce the service life of LED lighting device, but also can make LED lighting device limit its application function because adopting compared with large power.
For this reason, too high in order to suppress the internal temperature of LED lighting device, conventionally the heat by radiator, the LED luminescent device being arranged in LED lighting device being produced conducts to the outside of LED lighting device, yet, because the radiating efficiency of radiator depends on the size of its surface area, that is: the surface area of radiator is larger, its radiating efficiency is higher, otherwise, lower, therefore, the volume of radiator tends to limit the shape of LED lighting device, size and weight, especially when LED lighting device need to adopt relatively high power, because its inner heat producing is more, this also must correspondingly increase the volume of radiator, thereby cause LED lighting device to be compared with the conventional illuminator of incandescent lamp etc., not only the profile of the two differs larger, and LED lighting device exists size large, the defects such as Heavy Weight, and then reduced the aesthetic property of LED lighting device, security and installation convenience.
Summary of the invention
For addressing the above problem, the invention provides a kind of LED lighting device, it is by the inert gas by being filled in cavity, can be without adopting radiator just can realize the outside that the heat that LED luminescent device is produced conducts to LED lighting device, thereby shape, size and the weight that can make LED lighting device are no longer subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.
For this reason, the invention provides a kind of LED lighting device, comprise transparent outer cover, LED luminescent device and support, wherein, described transparent outer cover and described support form the cavity of sealing; Described LED luminescent device is positioned at described inside cavity, and is fixed on described support, it is characterized in that, in described cavity, is filled with inert gas, conducts to the outside of described transparent outer cover in order to the heat that described LED luminescent device is produced.
Wherein, be provided with the air-filled pore being connected with described cavity on described support, described inert gas is filled with in described cavity via described air-filled pore.
Preferably, whole inner surface at described transparent outer cover is formed with transparent fluorescence coating, described fluorescence coating adopts the material being mixed by transparent binding agent and fluorescent material to make, and the material of wherein said binding agent comprises one or more in silica gel, epoxy glue, silicones and modified resin.
Wherein, described LED luminescent device comprises: LED lighting means, and it comprises LED wafer and energy is omnibearing luminous; Encapsulating structure part, it is the transparent body and the periphery that is coated on described LED lighting means; And pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure part.
Wherein, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, and wherein said carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier; In described a plurality of LED wafers, the LED wafer in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes; And between described a plurality of LED wafer, and the LED wafer in current delivery upstream/downstream is electrically connected to by wire respectively with between positive electrode/negative electrode in described pair of electrodes in described a plurality of LED wafers.
Wherein, between the loading end of described carrier and the faying face of described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or on non-binding of described LED wafer, being formed with the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
Wherein, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, and wherein said carrier is the transparent body, on the loading end of described carrier, is provided with conductor; Described a plurality of LED wafer adopts the mode of eutectic weldering to be electrically connected to described conductor, to realize the electric connection between a plurality of described LED wafers; And in described a plurality of LED wafers, the LED wafer in the upstream of current delivery/downstream adopts the corresponding electrical connection of mode of eutectic weldering by described conductor respectively with between positive electrode/negative electrode in described pair of electrodes.
Wherein, between the loading end of described carrier and the faying face of described LED wafer, be formed with the heat dissipating layer of transparent and heat conduction, in order to carry out heat exchange with described LED wafer.
Wherein, the loading end of the coated described carrier of described encapsulating structure part and on the described LED wafer fixed; Or described encapsulating structure part is the loading end of coated described carrier and the fringe region of described LED wafer fixed thereon, the surface that deviates from described loading end of described carrier and the both side surface of described carrier respectively; Or in the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take coated angle that central angle is 180 ° coated loading end of described carrier and the surface that deviates from described loading end of described LED wafer fixed thereon and described carrier respectively in circumferential direction; Or in the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take the coated angle that central angle is 360 °, and described carrier and described LED wafer is completely coated in circumferential direction.
Wherein, described pair of electrodes is pair of metal electrodes sheet, described in each, metal electrode film comprises department of assembly and the connecting portion being connected as a single entity, wherein at the two ends of described carrier and be positioned on its loading end and be provided with position limiting structure, described department of assembly is positioned on described carrier by means of described position limiting structure; The end shape away from described department of assembly of described connecting portion is different; Or, on described connecting portion and the outside region that is positioned at described encapsulating structure part be provided with the mark that is used to indicate metal electrode film polarity.
With respect to prior art, the present invention has following beneficial effect:
LED lighting device provided by the invention, it forms the inert gas in the cavity sealing by being filled in by transparent outer cover and support, can conduct to without the heat that uses radiator just LED luminescent device can be produced the outside of transparent outer cover, thereby shape, size and the weight that can make LED lighting device are no longer subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.
In a preferred embodiment of LED lighting device provided by the invention, LED lighting means in LED luminescent device can be omnibearing luminous, and the peripheral encapsulating structure part that is coated on this LED lighting means is the transparent body, therefore can to realize multidimensional luminous for this LED luminescent device, this not only can improve the light extraction efficiency of LED lighting device, and can reduce in prior art and produce a large amount of bad phenomenon such as heat because light output quantity is few, thereby improve this LED lighting device reliability, extend its service life.
Accompanying drawing explanation
The structural representation of a kind of LED lighting device that Figure 1A provides for first embodiment of the invention;
The structural representation of the another kind of LED lighting device that Figure 1B provides for first embodiment of the invention;
The structural representation of another LED lighting device that Fig. 1 C provides for first embodiment of the invention;
The front view of the LED luminescent device of the LED lighting device that Fig. 2 A provides for first embodiment of the invention;
Fig. 2 B is the cutaway view of the carrier of LED luminescent device in Fig. 2 A;
The top view of the LED luminescent device of the LED lighting device that Fig. 2 C provides for first embodiment of the invention;
Fig. 2 D is the index path of LED luminescent device in Fig. 2 A;
Fig. 2 E is the front view of the another kind of encapsulating structure part of LED luminescent device in Fig. 2 A;
The structural representation of the LED lighting device that Fig. 3 provides for second embodiment of the invention;
The front view of the LED luminescent device of the LED lighting device that Fig. 4 A provides for third embodiment of the invention;
The side view of the LED luminescent device of the LED lighting device that Fig. 4 B provides for third embodiment of the invention;
Fig. 4 C is the top view of the LED wafer of LED luminescent device in Fig. 4 A and the annexation of carrier;
Fig. 4 D is the top view of LED luminescent device before assembling LED wafer in Fig. 4 C;
Fig. 4 E is the schematic diagram of faying face of the LED wafer of LED luminescent device in Fig. 4 C;
Fig. 4 F is the top view of the pair of electrodes of LED luminescent device and the annexation of carrier in Fig. 4 A;
Fig. 4 G is the electrode of LED luminescent device and the view in transverse section of the annexation between carrier in Fig. 4 F;
Fig. 4 H is the structural representation of the pair of electrodes of LED luminescent device in Fig. 4 F;
Fig. 4 I is the index path of LED luminescent device in Fig. 4 B;
Fig. 5 A is the front view of the another kind of encapsulating structure part of LED luminescent device in Fig. 4 A; And
Fig. 5 B is the top view of the another kind of conductor of LED luminescent device in Fig. 4 C.
The specific embodiment
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with accompanying drawing, further describe and be used for implementing optimal way of the present invention.But embodiment shown below, is for the technical thought of LED lighting device provided by the invention is specialized, not for invention thinking of the present invention is limited.And, each member size shown in the drawings and position relationship etc., just be only that explanation is more clear and definite amplifies exaggeration to some extent in order to make, and be not intended to limit actual member size and proportionate relationship.
The first embodiment
See also Figure 1A to Fig. 1 C, wherein show the structure of the LED lighting device that first embodiment of the invention provides, the LED lighting device 200 in the present embodiment comprises transparent outer cover 20, LED luminescent device 100 and support 21.Wherein, transparent outer cover 20 has adopted the shell structure similar with traditional incandescent lamp shell, and support 21 forms with transparent outer cover 20 cavity sealing.Particularly, support 21 comprises pillar 21a and base 21b, and wherein, base 21b is arranged in cavity and is positioned at the bottom of transparent outer cover 20, and the cavity of base 21b and transparent outer cover 20 formation sealings; Pillar 21a is arranged on the upper surface of base 21b, and on pillar 21a, be provided with supporting wire 22, in order to support the LED luminescent device 100 that is positioned at inside cavity, and at LED luminescent device 100 while being a plurality of, can make a plurality of LED luminescent devices 100 by reservation shape, arrange in transparent outer cover 20, and supporting wire 22 is electrically connected to the positive electrode/negative electrode of LED luminescent device 100.In actual applications, as long as transparent outer cover 20 can hold LED luminescent device 100 and support 21, and needn't limit its structure and shape.And, as long as support 21 can form the cavity of sealing and can support the LED luminescent device 100 that is positioned at cavity with transparent outer cover 20, and structure that needn't limit bracket 21.
In addition, in cavity, be filled with inert gas, in order to the heat that LED luminescent device 100 is produced, conduct to the outside of transparent outer cover 20, in the present embodiment, the mode that inert gas is filled with in cavity is specially: on support 21, be provided with the air-filled pore 27 being connected with cavity, inert gas is filled with in cavity via this air-filled pore 27.In actual applications, inert gas can comprise that helium, neon etc. have the gas of high thermal conductivity, and, as long as LED lighting device provided by the invention can be filled with inert gas in its cavity, and needn't limit the filling mode of inert gas.
In the LED lighting device providing at the present embodiment, by the inert gas being filled in cavity, can conduct to without the heat that uses radiator just LED luminescent device can be produced the outside of transparent outer cover, thereby shape, size and the weight that can make LED lighting device are no longer subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.
In the present embodiment, LED lighting device 200 with the concrete connected mode that the power supply that electric energy is provided to it is electrically connected to is: LED lighting device 200 also includes positive/negative electrode wires 23, power supply driver 24, power connection 26 and power connection connector 25.Wherein, one end of positive/negative electrode wires 23 is electrically connected to supporting wire 22, and the other end is electrically connected to one end of power supply driver 24; The other end of power supply driver 24 is electrically connected to power connection 26; One end of power connection 26 is fixedly connected with transparent shell 20 by power connection connector 25; The other end of power connection 26 is electrically connected to power supply (not shown), thereby realize power supply, to LED lighting device 200, provides electric energy.In actual applications, as long as power supply can provide electric energy to LED lighting device, luminous to realize LED luminescent device, and needn't limit the connected mode that LED lighting device 200 is electrically connected to power supply.
It should be noted that, in the present embodiment, LED luminescent device 100 is a plurality of, and the projection of shape on the cross section (that is, the cross section obtaining perpendicular to paper direction) of transparent shell 20 is approximately semicircle, omnibearing luminous to realize, as shown in Figure 1A.But, the present invention is not limited thereto, in actual applications, also can according to specific needs a plurality of LED luminescent devices 100 be arranged as to other shapes, for example, a plurality of LED luminescent devices 100 can be arranged in to following shape, that is: in the longitudinal section of transparent shell 20 (, be parallel to the cross section that paper direction obtains) on projection of shape for " X " shape, or "eight" shape, as shown in Figure 1B and Fig. 1 C, this shape can make each LED luminescent device 100 phase complementary light, thereby can realize on omnibearing luminous basis, make the LED lighting device 200 can be luminous equably.
In the LED lighting device providing at the present embodiment, LED luminescent device comprises following assembly: comprise LED wafer LED lighting means that can be omnibearing luminous, be coated on the transparent encapsulating structure part of this LED lighting means periphery and be electrically connected and extend to the pair of electrodes of encapsulating structure part outside with this LED lighting means.And the quantity of the LED wafer in LED lighting means can be for one or more.
Wherein, LED lighting means can comprise a plurality of LED wafers of electric connection, and in a plurality of LED wafers, the LED wafer in the upstream of current delivery is connected with the positive electrode in above-mentioned pair of electrodes, and the LED wafer in the downstream of current delivery is connected with the negative electrode in above-mentioned pair of electrodes.The so-called LED wafer in the upstream of current delivery refers to that LED wafer that first electric current flows through in these LED wafers; The so-called LED wafer in the downstream of current delivery refers to that LED wafer that electric current is finally flowed through in these LED wafers.In fact, in the upstream of current delivery/LED wafer and the LED wafer setting position physically inconsistent in downstream, that is, in these LED wafers, geographically the LED wafer in two ends may not be upstream in current delivery/downstream.Only have when a plurality of LED wafers are electrically connected by wire successively according to its setting position, the LED wafer in the upstream of current delivery and the LED wafer in the downstream of current delivery are just those two wafers in end in described a plurality of LED wafer.And above-mentioned electrode can be wire, stick electrode, shape electrode (referred to as electrode slice) in the form of sheets etc., as long as can realize LED wafer in LED lighting means and the conductor of the electric connection between power supply, just can adopt, and needn't limit its shape.
In actual applications, LED lighting means also comprises transparent carrier, and one or more LED wafers that LED lighting means comprises are arranged on the loading end of this carrier.So-called loading end refer on this carrier for the surface of LED wafer is set.Preferably, the surface of carrier is formed with through roughening treatment the alligatoring reflecting layer that is concaveconvex structure, with the carrier in the alligatoring reflecting layer of concaveconvex structure, is translucent from the appearance.
Because LED lighting means can be omnibearing luminous, and the peripheral encapsulating structure part that is coated on this LED lighting means is the transparent body, therefore can to realize multidimensional luminous for this LED luminescent device, this not only can improve the light extraction efficiency (in fact, the light extraction efficiency of LED lighting device provided by the invention exceeds 30%-50% than the light extraction efficiency of existing LED lighting device) of LED lighting device; And can reduce and because light output quantity is few, produce a large amount of bad phenomenon such as heat, thereby can improve this LED lighting device reliability, extend its service life.
It is pointed out that so-called omnibearing luminous referring to, this LED lighting means itself is made the light that the as a whole LED wafer that can be comprised by it to all directions output sends.That is to say, when LED lighting means does not comprise carrier, the so-called omnibearing luminous light directly being sent to all directions by LED wafer that refers to; When LED lighting means comprises carrier, so-called omnibearing luminous refer to the light directly being sent to all directions by LED wafer and by LED wafer, sent and see through carrier and the light exported.
The concrete structure of the LED luminescent device of LED lighting device the present embodiment being provided below in conjunction with accompanying drawing 2A to 2E is described in detail.
Particularly, LED luminescent device 100 comprises: carrier 11, a plurality of LED wafer 12, encapsulating structure part 13 and pair of metal electrodes sheet (17a, 17b).Wherein, carrier 11 is the transparent body, and it can adopt wherein a kind of material in glass, pottery, plastic or other material or the mixing of multiple material to make.The surface of carrier 11 forms the alligatoring reflecting layer 110 with concaveconvex structure through roughening treatment, this makes carrier 11 body that is translucent from the appearance, as shown in Figure 2 B.And in the longitudinal section in alligatoring reflecting layer 110 (that is, the cross section obtaining perpendicular to paper direction), the shape of the bossing in concaveconvex structure can be semicircle, ellipse, zigzag, triangle etc.The light that LED wafer 12 can be sent by the alligatoring reflecting layer 110 with concaveconvex structure reflects, and carries out light beam mutual coupling, so that the light of these LED luminescent device 100 outputs is evenly soft.In actual applications, can alligatoring in various degree be carried out in the surface of carrier 11 according to the ray structure of different LED wafer 12, make it have different concaveconvex structure shapes, the recessed degree of depth and height of projection etc.In actual applications, can be to four of carrier 11 sides,, alligatoring is in various degree carried out on four surfaces perpendicular to paper direction in Fig. 2 B, also can only to the surface that deviates from its loading end of the loading end of carrier 11 and carrier 11, carry out alligatoring in various degree, can also be only in above-mentioned four sides of carrier 11 except alligatoring is in various degree carried out in its loading end and two sides deviating from the surface of this loading end.
In the present embodiment, a plurality of LED wafers 12 are realized and being electrically connected by wire 14.Particularly, as shown in Figure 2 A, between the loading end of carrier 11 and the faying face of LED wafer 12, be formed with the first transparent adhesive layer 15.Particularly, in the region fitting with a plurality of LED wafers 12 on the loading end in alligatoring reflecting layer 110, and/or apply the first binding agent in the region fitting with alligatoring reflecting layer 110 on a plurality of LED wafers 12, and a plurality of LED wafers 12 are fitted with alligatoring reflecting layer 110 and realize the fixing of LED wafer 12.Be appreciated that, because the surface of carrier 11 is formed with the alligatoring reflecting layer 110 with concaveconvex structure, therefore the first adhesive layer 15 can be filled in the recess in alligatoring reflecting layer 110, thereby can strengthen the snap-in force between the first adhesive layer 15 and carrier 11, and then increase the adhesion between LED wafer 12 and carrier 11, with this, strengthen the reliability of these LED luminescent device 100 integral body.In addition, in the non-fit area on the loading end in alligatoring reflecting layer 110 and in the non-fit area on LED wafer 12 surfaces, be coated with the second adhesive layer 16.Wherein, the two mixes the first adhesive layer 15 and the second adhesive layer 16 by transparent adhesive tape and fluorescent material, and the material of the two selected transparent adhesive tape and mixing ratio etc. can be identical or different.
In actual applications, when light-emitting device that LED luminescent device 100 is ordinary monochromatic light, a plurality of LED wafers 12 are all corresponding common monochromatic LED wafer 12, and for example, a plurality of LED wafers 12 are all blue light wafer or are all the arbitrary visible ray wafer beyond blue light.When LED luminescent device 100 is the luminescent device of high light efficiency, high color rendering index (CRI), a plurality of LED wafers 12 comprise the LED wafer 12a of blue light and the LED wafer 12b of redness (or yellow) light, and between red (or yellow) LED wafer 12b of light and the LED wafer 12a of blue light apart from one another by and distribution equably, example as shown in Figure 2 C, the LED wafer 12b of a redness (or yellow) light is set, to realize sufficient mixed light at interval of the LED wafer 12a of two continuous blue lights.In this what is called, be uniformly distributed and refer to regular distribution, for example, two, an interval blue led wafer and redness (or yellow) light LED wafer is set; And so-called regular distribution is not limited to above-mentioned distribution and interval mode, but can adjusts and set according to actual conditions.
In addition, for more accurately, more quickly metal electrode film (17a, 17b) is positioned and is assembled, can be provided at the two ends of carrier 11 spacing position limiting structure, for example, can and be positioned on its loading end at the two ends of carrier 11 and form limited impression, one end of metal electrode film (17a, 17b) is fixed in this limited impression by binding agent, and metal electrode film (17a, 17b) is connected with the LED wafer electric in the downstream of current delivery with the LED wafer in the upstream of current delivery by wire.By means of limited impression, not only can be more accurately, more quickly metal electrode film (17a, 17b) is positioned and is assembled, but also can make the coated outer surface that is positioned at the metal electrode film (17a, 17b) of limited impression of binding agent, thereby can increase the connection reliability between metal electrode film (17a, 17b) and carrier 11.Easily understand, above-mentioned limited impression can also be arranged on one end of metal electrode film (17a, 17b), and the two ends of carrier 11 are fixed in this limited impression by binding agent, so that the coated outer surface that is positioned at the carrier 11 of limited impression of binding agent.
In the present embodiment, encapsulating structure part 13 is arranged on the loading end side in the alligatoring reflecting layer 110 of carrier 11, for the loading end of carrier 11 and LED wafer 12 fixed thereon are enveloped.Encapsulating structure part 13 is the transparent body, and its material can be one or more in the materials such as silica gel, silicones, epoxy resin and modified resin, and it can be for semicircle, oval, square etc. at the cross sectional shape perpendicular on electrode slice (17a, 17b) bearing of trend.
In the present embodiment, as shown in Figure 2 D, owing to being coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material in the region fitting in a plurality of LED wafers 12 and alligatoring reflecting layer 110, and in the non-fit area on the loading end in alligatoring reflecting layer 110 and in the non-fit area on LED wafer 12 surfaces, be coated with the second adhesive layer 16 that comprises transparent adhesive tape and fluorescent material, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15 and carrier 11 and output to the outside of this LED luminescent device 100, and another part light 100b that LED wafer 12 sends can see through the second transparent adhesive layer 16 and encapsulating structure part 13 and output to the outside of this LED luminescent device 100, thereby it is luminous to realize multidimensional, and when LED wafer 12 is blue-ray LED wafer, adopt above-mentioned encapsulating structure, can make the surrounding of each blue-ray LED wafer 12 be coated with equably the mixed layer of transparent adhesive tape and fluorescent material, and its a part of light 100a sending is by seeing through the first adhesive layer 15 and exciting the fluorescent material in the first adhesive layer 15, and outwards export white light through carrier 11, another part light 100b that it sends is by seeing through the second adhesive layer 16 and exciting the fluorescent material in the second adhesive layer 16, and outwards export white light through encapsulating structure part 13, thereby can outwards export uniform white light.
It should be noted that, in the present embodiment, encapsulating structure part 13 is not contain the transparent body of fluorescent material, and between the loading end of carrier 11 and the faying face of LED wafer 12, is formed with the first adhesive layer 15 being mixed by transparent adhesive tape and fluorescent material, in non-fit area on the loading end in alligatoring reflecting layer 110 and in the non-fit area on LED wafer 12 surfaces, apply the second adhesive layer 16 being mixed by transparent adhesive tape and fluorescent material, but, the present invention is not limited thereto, in actual applications, the material of encapsulating structure part 13 can be also the mixture of transparent adhesive tape and fluorescent material, and, also can be only in the region fitting with a plurality of LED wafers 12 on the loading end in alligatoring reflecting layer 110, and/or apply the first adhesive layer 15 in the region fitting with alligatoring reflecting layer 110 on a plurality of LED wafers 12, and not in the non-fit area on the loading end in alligatoring reflecting layer 110 and/or apply again the second adhesive layer 16 in the non-fit area on LED wafer 12 surfaces.
And, encapsulating structure part 13 is also not limited in the present embodiment the only loading end of coated carrier 11 and LED wafer 12 fixed thereon, in actual applications, encapsulating structure part 13 also can be in the plane perpendicular to electrode slice (17a, 17b) bearing of trend, with the coverage of 360 ° of central angles (, the coated angle that the central angle of take is 360 degree) carrier 11 and LED wafer 12 is completely coated in circumferential direction, as shown in Figure 2 E, this can make, when LED wafer 12 is blue-ray LED wafer, can outwards export uniform white light equally.In addition, the shape in the cross section that above-mentioned encapsulating structure part 13 edges obtain perpendicular to electrode slice (17a, 17b) bearing of trend is except circle as shown in Figure 2 E, can also be other arbitrary shapes such as square, oval, rhombus, as long as this encapsulating structure part 13 can the coverage with 360 ° of central angles be coated carrier 11 and LED wafer 12 completely the plane perpendicular to electrode slice (17a, 17b) bearing of trend in.
The second embodiment
Refer to Fig. 3, wherein show the structure of the LED lighting device that second embodiment of the invention provides, be similar to aforementioned the first embodiment, the LED lighting device 200 that the second embodiment provides comprises transparent outer cover 20, LED luminescent device 100 and support 21 equally.Wherein, the structure of transparent outer cover 20 and support 21 and shape and in the cavity of the two formation, fill the concrete structure of the mode of inert gas, mode that LED lighting device 200 is electrically connected to power supply, LED luminescent device 100 and the arrangement mode of a plurality of LED luminescent device 100 in transparent outer cover 20 etc. is all similar to aforementioned the first embodiment, do not repeat them here.Describe the part that the second embodiment is different from the first embodiment below in detail.
In a second embodiment, whole inner surface at transparent outer cover 20 is formed with transparent fluorescence coating 28, this fluorescence coating 28 adopts the material being mixed by transparent binding agent and fluorescent material to make, and wherein, the material of binding agent comprises one or more in silica gel, epoxy glue, silicones and modified resin.When LED luminescent device 100 is high light efficiency, during the luminescent device of high color rendering index (CRI), a plurality of LED wafers 12 are blue light, the combination of the combination of blue light and ruddiness or blue light and orange light, now by the whole inner surface at transparent outer cover 20, apply yellow fluorescent powder or yellow, green and the red fluorescent material mixing, can make LED wafer 12 outwards export white light because of its this fluorescent material of optical excitation of sending, and, because the whole inner surface at transparent outer cover 20 is coated with fluorescence coating 28, this makes without adding fluorescent material in the material at carrier 11 and/or encapsulating structure part 13 etc., and then can simplify the manufacturing process of LED lighting device 200.
The 3rd embodiment
Be similar to aforementioned first, second embodiment, the LED lighting device 200 that the 3rd embodiment provides comprises transparent outer cover 20, LED luminescent device 100 and support 21 equally.Wherein, the structure of transparent outer cover 20 and support 21 and shape and in the cavity of the two formation, fill the concrete structure of the mode of inert gas, mode that LED lighting device 200 is electrically connected to power supply, LED luminescent device 100 and the arrangement mode of a plurality of LED luminescent device 100 in transparent outer cover 20 etc. is all similar to aforementioned first, second embodiment, do not repeat them here.Describe the part that the 3rd embodiment is different from first, second embodiment below in detail.
Refer to Fig. 4 A to Fig. 4 I, wherein show the concrete structure of the LED luminescent device of the LED lighting device that third embodiment of the invention provides.The 3rd embodiment compares with first, second embodiment, and its difference is: on the loading end of carrier 11, be provided with conductor 30, a plurality of LED wafers 12 adopt the mode of eutectic weldering to be electrically connected to this conductor 30, to realize the electric connection between a plurality of LED wafers 12.And in a plurality of LED wafers 12, the LED wafer 12 in the upstream of current delivery/downstream adopts the corresponding electrical connection of mode of eutectics weldering by conductor 30 respectively with between positive electrode/negative electrode in pair of electrodes sheet (17a, 17b).
Particularly, the quantity of LED wafer 12 is N, and on the loading end of carrier 11, be provided with N+1 conductor 30, and N is greater than 1 integer, and N LED wafer 12 is along metal electrode film (17a, 17b) bearing of trend and N+1 the alternate setting of conductor 30, that is, at interval of being provided with a LED wafer 12 between two continuous conductors 30, as shown in Figure 4 C.And, at the two ends of each LED wafer 12 and be positioned at and be provided with wafer solder joint 41 on its faying face, as shown in Figure 4 E, at the two ends of two conductors 30 adjacent with this LED wafer 12, be provided with circuit solder joint 31 accordingly, as shown in Figure 4 D, and wafer solder joint 41 corresponding with the shape of circuit solder joint 31.The faying face of so-called LED wafer 12 refers to the surface combining for the loading end with carrier 11 on LED wafer 12.Each LED wafer 12 and with it adjacent two conductors 30 are electrically connected to by adopting the mode of eutectics weldering to weld above-mentioned wafer solder joint 41 and circuit solder joint 31, thereby make N LED wafer 12 realize electric connections, for example, and series, parallel or series-parallel connection.
In addition, because LED wafer 12 is to weld together and be fixed on carrier 11 by wafer solder joint 41 and circuit solder joint 31, , the strong point of LED wafer 12 on carrier 11 is positioned on conductor 30, this tends to cause have gap between the faying face of LED wafer 12 and the loading end of carrier 11, in other words, LED wafer 12 is unsettled above the loading end of carrier 11, thereby be unfavorable for the heat radiation of LED wafer 12, for this reason, between the loading end of carrier 11 and the faying face of LED wafer 12, be formed with the heat dissipating layer 42 of transparent and heat conduction, in order to carry out heat exchange with LED wafer 12, thereby the heat that LED wafer 12 is produced conducts to the outside of LED luminescent device 100 via heat dissipating layer 42 and carrier 11.The material of heat dissipating layer 42 can comprise one or more in silica gel, epoxy glue, silicones and modified resin.
In the present embodiment, pair of electrodes sheet (17a, 17b) is as the positive/negative electrode of LED luminescent device 100, be separately positioned on carrier 11 two ends and be arranged on LED wafer 12 on the two ends of carrier 11 at a distance of 0.5mm at least, as shown in Fig. 4 H, metal electrode film (17a, 17b) comprises department of assembly 176 and the connecting portion (175a, 175b) being connected as a single entity.Wherein, in department of assembly, one end away from connecting portion (175a, 175b) of 176 is provided with limited impression, the two ends of carrier 11 are fixed in this limited impression by the binding agent (19a, 19b) of conduction, and binding agent (19a, 19b) adopts the mode of eutectic weldering, Reflow Soldering or hot setting to be electrically connected to corresponding conductor 30, that is, be electrically connected to the conductor 30 being arranged on the two ends of carrier 11.Binding agent (19a, 19b) can adopt the conductive material of the elargol of tin cream or high heat conduction high adhesion etc. to make.By means of limited impression, not only can be more accurately, more quickly metal electrode film (17a, 17b) is positioned and is assembled, but also can make the coated whole outer surface that is positioned at the carrier 11 of limited impression of binding agent 19,, four sides perpendicular to paper direction of carrier 11 in Fig. 4 G, thus the connection reliability between metal electrode film (17a, 17b) and carrier 11 can be increased.
And, in order to identify the polarity at LED luminescent device 100 two ends, the end shape away from department of assembly 176 of two connecting portions (175a, 175b) of above-mentioned pair of metal electrodes sheet (17a, 17b) is designed to different shapes, the polarity mark of usining as LED luminescent device 100 two ends, as shown in Fig. 4 H.In actual applications, the end shape away from department of assembly 176 of two connecting portions (175a, 175b) can be different arbitrary shapes, at this, does not do concrete restriction.In addition, preferably, the width of department of assembly 176 is greater than the width of connecting portion (175a, 175b), and this is more conducive to the assembling of metal electrode film (17a, 17b).
It should be noted that, although in the present embodiment, limited impression be arranged on department of assembly 176 away from connecting portion (175a, end 175b), but the present invention is not limited thereto, in actual applications, limited impression can also be arranged on to two ends of carrier 11 and be positioned on its loading end, in this case, department of assembly 176 away from connecting portion (175a, end 175b) is fixed in limited impression by above-mentioned binding agent, and the coated outer surface that is positioned at the department of assembly 176 of limited impression of binding agent, it is more accurate that this can realize equally, more quickly to metal electrode film (17a, 17b) position and assemble, and increase metal electrode film (17a, connection reliability 17b) and between carrier 11.
In addition, in actual applications, can be not yet at the two ends of the loading end of carrier 11 or department of assembly 176 away from connecting portion (175a, end 175b) arranges limited impression, and only by the binding agent (19a conducting electricity, 19b) by metal electrode film (17a, 17b) be fixed on the loading end of carrier 11, and adopt eutectic weldering, the mode of Reflow Soldering or hot setting is electrically connected to corresponding conductor 30, or, can also and be positioned at the position limiting structure that square step or terraced steps etc. are set on its loading end at the two ends of carrier 11, department of assembly 176 is positioned on carrier 11 by means of this position limiting structure, with more accurate, quickly to metal electrode film (17a, 17b) position.
Also it should be noted that, although the present embodiment is by by two connecting portion (175a, the end shape away from department of assembly 176 175b) is designed to the polarity that different shapes is identified LED luminescent device 100 two ends, but, the present invention is not limited thereto, in actual applications, can also make two connecting portion (175a, the end shape away from department of assembly 176 175b) is identical, and at two connecting portion (175a, front 175b) and/or the back side are provided with the positive pole sign that is labeled as "+" and the negative pole sign that is labeled as "-", this can identify the polarity at LED luminescent device 100 two ends equally.
In the present embodiment, as shown in Figure 4 A, encapsulating structure part 13 is the transparent body, and formed by transparent adhesive tape and phosphor mixture material, and encapsulating structure part 13 is loading end and the LED wafer 12 fixed thereon of coated carrier 11 respectively, the fringe region of the surface that deviates from loading end of carrier 11 and the both side surface of carrier 11, particularly, encapsulating structure part 13 adopts and by two shape of cross sections, is approximately semicircular two parts and forms: first 131 for the fringe region of the surface that deviates from loading end of coated carrier 11 and the both side surface of carrier 11 (, the upper surface of carrier 11 and the upper area of two adjacent sides with it in Fig. 4 A), second portion is for the fringe region of the loading end of coated carrier 11 and the both side surface of LED wafer 12 fixed thereon and carrier 11 (that is, the lower surface of carrier 11 and the lower area of two adjacent sides with it in Fig. 4 A).In actual applications, encapsulating structure part 13 can be for semicircle, oval, square etc. at the cross sectional shape perpendicular on metal electrode film (17a, 17b) bearing of trend.
Because LED luminescent device 100 envelopes the fringe region of the both side surface of carrier 11 by the encapsulating structure part 13 by being formed by transparent adhesive tape and phosphor mixture material, this can prevent a part of light that LED wafer 12 sends directly from the fringe region output of the both side surface of carrier 11, thereby while causing LED wafer 12 for blue light or red-light LED wafer, its light sending from this fringe region is blue light or ruddiness, and then assurance LED luminescent device 100 can be exported to each orientation uniform white light.And, because LED luminescent device 100 does not envelope all surfaces of carrier 11 by encapsulating structure part 13, but the central area of the both side surface of carrier 11 is exposed to outside encapsulating structure part 13, this is conducive to the heat radiation of LED wafer 12, thereby can make LED wafer 12 can be applicable to larger drive current, thereby not only can improve the light output quantity of single led wafer 12, but also can reduce the manufacturing cost of light-emitting device.
In addition, because encapsulating structure part 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, as shown in Fig. 4 I, a part of light 50b that LED wafer 12 sends can output to through transparent heat dissipating layer 42, carrier 11 and encapsulating structure part 13 outside of this LED luminescent device 100, and another part light 50a that LED wafer 12 sends can output to through encapsulating structure part 13 outside of this LED luminescent device 100, thereby it is luminous to realize multidimensional; And when LED wafer 12 is blue-ray LED wafer, its a part of light 50b sending is by seeing through heat dissipating layer 42, carrier 11 and encapsulating structure part 13, and the fluorescent material in excite encapsulated structural member 13 and outwards export white light; Another part light 50a that it sends outwards exports white light by seeing through the fluorescent material in encapsulating structure part 13 excite encapsulated structural member 13, thereby can outwards export uniform white light.
It should be noted that, in the present embodiment, encapsulating structure part 13 is the loading end of coated carrier 11 and the fringe region of LED wafer 12 fixed thereon, the surface that deviates from loading end of carrier 11 and the both side surface of carrier 11 respectively, but the present invention is not limited thereto, in actual applications, also can be similar with aforementioned first, second embodiment, make encapsulating structure part 13 coverage with 360 ° of central angles in the plane perpendicular to metal electrode film (17a, 17b) bearing of trend that carrier 11 and LED wafer 12 is completely coated.
In addition, as shown in Figure 5A, can also make encapsulating structure part 13 perpendicular to metal electrode film (17a, 17b) in the cross section of bearing of trend, along the circumferencial direction of carrier 11, take coated angle that central angle is 180 ° loading end of coated carrier 11 and the surface that deviates from loading end of LED wafer 12 fixed thereon and carrier 11 respectively, , the both side surface of carrier 11 is exposed to outside encapsulating structure part 13 completely, this not only can further improve the radiating efficiency of LED wafer 12, and because encapsulating structure part 13 only needs the surface that deviates from loading end of loading end and LED wafer 12 fixed thereon and the carrier 11 of coated carrier 11, this has simplified the structure of encapsulating structure part 13 to a certain extent, thereby can simplify the manufacturing process of encapsulating structure part 13, and then can reduce to a certain extent the processing cost of LED lighting device 200.
In addition, as shown in Figure 5 B, in order to prevent a part of light that LED wafer 12 sends directly from the fringe region output of the both side surface of carrier 11, so that there is the situation of colour cast at this fringe region in LED luminescent device 100, two protuberances 32 that extend toward each other can be set on continuous two conductors 30 in interval, and the both sides of two protuberances 32 LED wafer 12 between continuous two conductors 30 in interval.By protuberance 32, can stop that a part of light that LED wafer 12 sends is directly from the fringe region output of the both side surface of carrier 11, but make a part of light and protuberance 32 that LED wafer 12 sends refraction occur and export from other orientation, thereby can prevent that LED luminescent device 100 from occurring colour cast at the fringe region of the both side surface of carrier 11, and then can guarantee that LED lighting device 200 can export to each orientation uniform light.Preferably, the growth of can trying one's best under the prerequisite not contacting with corresponding conductor 30 of two protuberances 32 length between continuous two conductors 30 in interval, farthest to stop that LED wafer 12 is from the light of the fringe region output of the both side surface of carrier 11.In addition, in these cases, when LED wafer 12 is blue-ray LED wafer, heat dissipating layer 42 should adopt by transparent adhesive tape and phosphor mixture material and make, take and guarantee that LED wafer 12 is white light from the light of the fringe region output of the both side surface of carrier 11, thereby assurance LED lighting device 200 can be exported to each orientation uniform white light.
Be understandable that, in actual applications, can determine whether according to actual needs to make to comprise fluorescent material in inner surface, each adhesive layer, encapsulating structure part and/or the carrier of transparent outer cover.In addition, in this application, transparent outer cover and transparent heat dissipating layer, encapsulating structure part and/or carrier refer to that the light that LED wafer sends can penetrate transparent outer cover, heat dissipating layer, encapsulating structure part and/or carrier.
The illustrative embodiments that will also be appreciated that above embodiment to be only used to principle of the present invention is described and adopt, however the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a LED lighting device, comprises transparent outer cover, LED luminescent device and support, and wherein, described transparent outer cover and described support form the cavity of sealing; Described LED luminescent device is positioned at described inside cavity, and is fixed on described support, it is characterized in that, in described cavity, is filled with inert gas, conducts to the outside of described transparent outer cover in order to the heat that described LED luminescent device is produced.
2. LED lighting device according to claim 1, is characterized in that, is provided with the air-filled pore being connected with described cavity on described support, and described inert gas is filled with in described cavity via described air-filled pore.
3. LED lighting device according to claim 1, is characterized in that, at the whole inner surface of described transparent outer cover, is formed with transparent fluorescence coating, and described fluorescence coating adopts the material being mixed by transparent binding agent and fluorescent material to make, wherein
The material of described binding agent comprises one or more in silica gel, epoxy glue, silicones and modified resin.
4. according to the LED lighting device described in claim 1-3 any one claim, it is characterized in that, described LED luminescent device comprises:
LED lighting means, it comprises LED wafer and energy is omnibearing luminous;
Encapsulating structure part, it is the transparent body and the periphery that is coated on described LED lighting means; And
Pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure part.
5. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein
Described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier;
In described a plurality of LED wafers, the LED wafer in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes; And
Between described a plurality of LED wafer, and the LED wafer in current delivery upstream/downstream is electrically connected to by wire respectively with between positive electrode/negative electrode in described pair of electrodes in described a plurality of LED wafers.
6. LED lighting device according to claim 5, it is characterized in that, between the loading end of described carrier and the faying face of described LED wafer, be formed with the first transparent adhesive layer, in order to described LED wafer is fixed on the loading end of described carrier, the material of described the first adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin; And/or
On non-binding of described LED wafer, be formed with the second transparent adhesive layer, the material of described the second adhesive layer comprises one or more in silica gel, epoxy glue, silicones and modified resin.
7. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein
Described carrier is the transparent body, on the loading end of described carrier, is provided with conductor;
Described a plurality of LED wafer adopts the mode of eutectic weldering to be electrically connected to described conductor, to realize the electric connection between a plurality of described LED wafers; And
In described a plurality of LED wafers, the LED wafer in the upstream of current delivery/downstream adopts the corresponding electrical connection of mode of eutectic weldering by described conductor respectively with between positive electrode/negative electrode in described pair of electrodes.
8. LED lighting device according to claim 7, is characterized in that, is formed with the heat dissipating layer of transparent and heat conduction between the loading end of described carrier and the faying face of described LED wafer, in order to carry out heat exchange with described LED wafer.
9. LED lighting device according to claim 4, is characterized in that, the loading end of the coated described carrier of described encapsulating structure part and on the described LED wafer fixed; Or
Described encapsulating structure part is the loading end of coated described carrier and the fringe region of described LED wafer fixed thereon, the surface that deviates from described loading end of described carrier and the both side surface of described carrier respectively; Or
In the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take coated angle that central angle is 180 ° coated loading end of described carrier and the surface that deviates from described loading end of described LED wafer fixed thereon and described carrier respectively in circumferential direction; Or
In the cross section of the bearing of trend perpendicular to described pair of electrodes, described encapsulating structure part be take the coated angle that central angle is 360 °, and described carrier and described LED wafer is completely coated in circumferential direction.
10. LED lighting device according to claim 4, is characterized in that, described pair of electrodes is pair of metal electrodes sheet, and described in each, metal electrode film comprises department of assembly and the connecting portion being connected as a single entity, wherein
At the two ends of described carrier and be positioned on its loading end and be provided with position limiting structure, described department of assembly is positioned on described carrier by means of described position limiting structure;
The end shape away from described department of assembly of described connecting portion is different; Or, on described connecting portion and the outside region that is positioned at described encapsulating structure part be provided with the mark that is used to indicate metal electrode film polarity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310024344.1A CN103939758A (en) | 2013-01-22 | 2013-01-22 | LED lighting device |
| PCT/CN2014/071153 WO2014114241A1 (en) | 2013-01-22 | 2014-01-22 | Led illumination device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310024344.1A CN103939758A (en) | 2013-01-22 | 2013-01-22 | LED lighting device |
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