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CN1713376A - Liquid-cooled radiator - Google Patents

Liquid-cooled radiator Download PDF

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Publication number
CN1713376A
CN1713376A CNA200410027911XA CN200410027911A CN1713376A CN 1713376 A CN1713376 A CN 1713376A CN A200410027911X A CNA200410027911X A CN A200410027911XA CN 200410027911 A CN200410027911 A CN 200410027911A CN 1713376 A CN1713376 A CN 1713376A
Authority
CN
China
Prior art keywords
heat
liquid
cooling
base
absorbing block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200410027911XA
Other languages
Chinese (zh)
Inventor
李学坤
赖振田
周志勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNA200410027911XA priority Critical patent/CN1713376A/en
Priority to US11/066,779 priority patent/US20060005953A1/en
Publication of CN1713376A publication Critical patent/CN1713376A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention consists of a heat sink to absorb the heat from heating element. A cavity for storing cooling fluid is set in the heat sink. The fluid entrance and exit connected with cavity are set in the heat sink. A channel is set between the fluid entrance and exit. The heat sink consists of a base touching the heating element and an upper cover on the base. The surface of the base touches the cooling fluid, and has a multi holes structure.

Description

Liquid-cooling heat radiator
[technical field]
The present invention relates to a kind of heat abstractor, particularly about a kind of liquid-cooling heat radiator that is used for cooling electronic components.
[background technology]
Along with electronic technology constantly develops, electronic component running frequency and speed are also in continuous lifting.But the heat that high-frequency high-speed will make electronic component produce is more and more, and temperature is also more and more higher, and performance and stability when the electronic component operation in serious threat for guaranteeing the normal operation of electronic component energy, need effectively dispel the heat to electronic component.But existing simple metal heat abstractor more and more is difficult to satisfy the heat radiation needs of high-frequency high-speed electronic component, and for this reason, liquid cooling heat radiation system is adopted by industry gradually.
Existing liquid cooling heat radiation system comprises a reservoir, and this reservoir is surrounded by the base that contacts with heater element and loam cake two parts and forms, and cooling fluid is carried out heat exchange with this base in this reservoir, by the circulation of cooling fluid the heat of this base is taken away.Yet because the heat exchange area of cooling fluid and base is little, heat exchange is abundant inadequately, and therefore most of heat is accumulated on this base, influences radiating effect.
[summary of the invention]
The object of the present invention is to provide the respond well liquid-cooling heat radiator of a kind of heat exchange.
Technical scheme of the present invention is: a kind of liquid-cooling heat radiator, comprise a heat-absorbing block in order to the heat that absorbs heater element, be provided with a cavity that is used to store cooling fluid in this heat-absorbing block, this heat-absorbing block is provided with the feed liquor interface that communicates with this cavity respectively and goes out liquid interface, this feed liquor interface and this go out to be provided with fluid path between the liquid interface, this heat-absorbing block comprises a base that contacts with heater element and a loam cake that is positioned on this base, and this base top layer contacts with cooling fluid, and this top layer has loose structure.
Because the base top layer has loose structure in the liquid-cooling heat radiator of the present invention, has effectively increased the contact area of this base and cooling fluid, strengthen the heat exchange effect of cooling fluid in heat-absorbing block, therefore, radiating effect is good than prior art.
[description of drawings]
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the assembly drawing of liquid-cooling heat radiator of the present invention.
Fig. 2 is a liquid-cooling heat radiator heat-absorbing block stereogram of the present invention.
Fig. 3 is the cutaway view of liquid-cooling heat radiator of the present invention along III-III line among Fig. 2.
Fig. 4 is the schematic diagram of liquid-cooling heat radiator heat-absorbing block base of the present invention.
[embodiment]
Below in conjunction with accompanying drawing liquid-cooling heat radiator of the present invention is described in further detail.
See also Fig. 1, assembly drawing for liquid-cooling heat radiator of the present invention, this liquid-cooling heat radiator comprises a heat-absorbing block 10 and a pump housing 50 that closely contacts with heat-generating electronic elements (figure do not show), this pump housing 50 links to each other with this heat-absorbing block 10 by a drain pipe 100 and a feed tube 200, thereby forms a fluid path.This heat-absorbing block 10 is used to absorb the heat that heat-generating electronic elements produces, be provided with an enclosure space (will introduce in detail) that is used for storing cooling fluid in it at Fig. 2, this enclosure space, drain pipe 100, the pump housing 50 and feed tube 200 form a liquid circulation loop, under the driving of this pump housing 50, this cooling fluid direction along arrow indication among Fig. 1 in this circulation circuit flows, thereby the heat that continuously heat-absorbing block 10 is absorbed is taken away.Because cooling fluid has absorbed the heat of heat-absorbing block 10, the coolant temperature that flows out heat-absorbing block 10 raises, if the cooling fluid that allows temperature raise just enters next circulation through behind the natural cooling, radiating effect is obviously bad, therefore, liquid-cooling heat radiator of the present invention also establishes one in order to reduce the cooling device of coolant temperature, as most fin 30 in the appropriate location in above-mentioned liquid circulation loop, also can on fin 30, install fan (figure does not show) additional, improve radiating effect.
Clear in order to illustrate, the heat-absorbing block 10 among Fig. 1, fin 30 and the pump housing 50 are to disperse to be provided with, and are appreciated that ground, and said elements also can be incorporated into together, as the fin 30 and the pump housing 50 directly are installed on the heat-absorbing block 10, can save than large space like this.
See also Fig. 2 and Fig. 3, this heat-absorbing block 10 comprises that a base that contacts with heater element 11 and is positioned at the loam cake 12 on this base 11, form the cavity 14 that is used to store cooling fluid of a sealing between this loam cake 12 and the base 11, cooling fluid is carried out heat exchange with heat-absorbing block 10 in this cavity 14.
This loam cake 12 is provided with a pair of interface that is connected with feed tube 200 and drain pipe 100 of being used for, according to the flow direction of cooling fluid, with its called after feed liquor interface 18 and go out liquid interface 19.
Be illustrated in figure 4 as the schematic diagram of heat-absorbing block 10 bases 11, the top layer 16 and the cooling fluid of this base 11 are carried out heat exchange, this top layer 16 is the metal sintering layer, has a large amount of micro-pores, when cooling fluid when this feed liquor interface 18 enters this cavity 14, the flow through top layer 16 of this base 11 of cooling fluid is because the existence of this hole, increased the heat exchange area of base 11, strengthened heat exchange effect with cooling fluid.Understandable, this top layer also can have the metal material layer of loose structure for other, for example metal foaming material layer etc.
By above-mentioned introduction as can be known, the present invention is by form loose structure on the base top layer, thereby increase the heat exchange area of base and cooling fluid and strengthen flowing of cooling fluid, enter cavity 14 backs of this heat-absorbing block and the heat exchange effect of base thereby strengthen cooling fluid, make cooling fluid better absorb and take away the heat of base.

Claims (5)

1. liquid-cooling heat radiator, comprise a heat-absorbing block in order to the heat that absorbs heater element, be provided with a cavity that is used to store cooling fluid in this heat-absorbing block, this heat-absorbing block is provided with the feed liquor interface that communicates with this cavity respectively and goes out liquid interface, this feed liquor interface and this go out to be provided with fluid path between the liquid interface, this heat-absorbing block comprises a base that contacts with heater element and a loam cake that is positioned on this base, and this base top layer contacts with cooling fluid, it is characterized in that: this top layer has loose structure.
2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this base top layer is the metal sintering layer.
3. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this base top layer is the metal foaming material layer.
4. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: this fluid path comprise a feed tube that is connected with the feed liquor interface and one with go out the drain pipe that liquid interface is connected, be connected with a pump housing that drives liquid flow between this feed tube and the drain pipe.
5. liquid-cooling heat radiator as claimed in claim 4 is characterized in that: further be connected with the cooling device that reduces coolant temperature between this pump housing and the drain pipe.
CNA200410027911XA 2004-06-25 2004-06-25 Liquid-cooled radiator Pending CN1713376A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA200410027911XA CN1713376A (en) 2004-06-25 2004-06-25 Liquid-cooled radiator
US11/066,779 US20060005953A1 (en) 2004-06-25 2005-02-25 Liquid cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA200410027911XA CN1713376A (en) 2004-06-25 2004-06-25 Liquid-cooled radiator

Publications (1)

Publication Number Publication Date
CN1713376A true CN1713376A (en) 2005-12-28

Family

ID=35540110

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200410027911XA Pending CN1713376A (en) 2004-06-25 2004-06-25 Liquid-cooled radiator

Country Status (2)

Country Link
US (1) US20060005953A1 (en)
CN (1) CN1713376A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935560A (en) * 2015-12-30 2017-07-07 恩斯迈电子(深圳)有限公司 Thermoelectric cooling module and heat sink comprising same
CN107062963A (en) * 2017-04-27 2017-08-18 厦门大学 A kind of alternating expression micro-channel condenser for hair cell regeneration

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5283836B2 (en) * 2006-07-25 2013-09-04 富士通株式会社 Heat receiver and liquid cooling unit for liquid cooling unit and electronic device
JP5133531B2 (en) * 2006-07-25 2013-01-30 富士通株式会社 Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment
JP2008027374A (en) * 2006-07-25 2008-02-07 Fujitsu Ltd Heat receiver and liquid cooling unit for liquid cooling unit and electronic device
JP5148079B2 (en) * 2006-07-25 2013-02-20 富士通株式会社 Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment
US8106505B2 (en) 2007-10-31 2012-01-31 International Business Machines Corporation Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
US20140076523A1 (en) * 2012-09-19 2014-03-20 Aaron Ray Batker Pritzker Devices, systems, and methods for cooling electronic device heat spreaders
CA2961001C (en) * 2014-09-15 2019-07-16 Nicholas Michael D'onofrio Liquid cooled metal core printed circuit board

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352392A (en) * 1980-12-24 1982-10-05 Thermacore, Inc. Mechanically assisted evaporator surface
US4602679A (en) * 1982-03-22 1986-07-29 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US4583582A (en) * 1982-04-09 1986-04-22 The Charles Stark Draper Laboratory, Inc. Heat exchanger system
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5365400A (en) * 1988-09-09 1994-11-15 Hitachi, Ltd. Heat sinks and semiconductor cooling device using the heat sinks
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
JPH07211832A (en) * 1994-01-03 1995-08-11 Motorola Inc Power radiating device and manufacture thereof
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6601643B2 (en) * 2001-04-27 2003-08-05 Samsung Electronics Co., Ltd Flat evaporator
US6609560B2 (en) * 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
DE10207873A1 (en) * 2002-02-23 2003-09-04 Modine Mfg Co Cooling device for electronic or electrical components in motor vehicle, has container adjoining cooling fluid flow channel for receiving heat lost from components
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US7316263B2 (en) * 2003-11-19 2008-01-08 Intel Corporation Cold plate
US20050224212A1 (en) * 2004-04-02 2005-10-13 Par Technologies, Llc Diffusion bonded wire mesh heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935560A (en) * 2015-12-30 2017-07-07 恩斯迈电子(深圳)有限公司 Thermoelectric cooling module and heat sink comprising same
CN107062963A (en) * 2017-04-27 2017-08-18 厦门大学 A kind of alternating expression micro-channel condenser for hair cell regeneration

Also Published As

Publication number Publication date
US20060005953A1 (en) 2006-01-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication