CN212362489U - Heat radiator using semiconductor refrigeration - Google Patents
Heat radiator using semiconductor refrigeration Download PDFInfo
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- CN212362489U CN212362489U CN202021848484.2U CN202021848484U CN212362489U CN 212362489 U CN212362489 U CN 212362489U CN 202021848484 U CN202021848484 U CN 202021848484U CN 212362489 U CN212362489 U CN 212362489U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 87
- 238000005057 refrigeration Methods 0.000 title claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 239000006185 dispersion Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Abstract
The utility model discloses an adopt cryogenic heat abstractor of semiconductor, heat abstractor includes: the cold end of the semiconductor refrigeration piece is arranged corresponding to the heating element; the middle heat conduction plate is arranged between the heating element and the semiconductor refrigeration sheet and is used for absorbing the heat of the heating element; the first end of the heat conduction fin is connected with the cold end of the semiconductor refrigeration piece, the second end of the heat conduction fin is connected with the middle heat conduction plate, and the heat conduction fin is used for dispersing the cold energy generated by the cold end of the semiconductor refrigeration piece. The utility model discloses a heat abstractor makes the cold junction heat radiating area of semiconductor refrigeration piece increase through establishing heat conduction fin to make cold volume disperse more, thereby can not make cold volume too concentrated, effectively reduce the production of comdenstion water, improve the reliability of system operation.
Description
Technical Field
The utility model relates to an automatically controlled technical field, concretely relates to adopt cryogenic heat abstractor of semiconductor.
Background
Power devices are widely used in many industrial fields and play an important role. Meanwhile, the power device is also a component with a high failure rate, and the temperature has a great influence on the performance of the power device. With global climate change, extreme high temperature weather is more and more frequent, industrial equipment, household appliances and the like also face severe operating environments, and how to efficiently dissipate heat of power devices is important.
Some radiator unit and electric cabinet among the prior art utilize the semiconductor refrigeration principle to come radiating radiator structure, but this radiator unit does not well handle the comdenstion water that produces in the work, especially work in the very big south area of air humidity, and the comdenstion water that produces dredges unreasonablely, may lead to the problem of machine corrosion, short circuit.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an adopt cryogenic heat abstractor of semiconductor has solved current heat abstractor and has dredged the comdenstion water that produces unreasonablely, probably leads to the problem of machine corrosion, short circuit.
According to an aspect of the utility model, a heat abstractor is disclosed, include: the cold end of the semiconductor refrigeration piece is arranged corresponding to the heating element; the middle heat conduction plate is arranged between the heating element and the semiconductor refrigeration sheet and is used for absorbing the heat of the heating element; the first end of the heat conduction fin is connected with the cold end of the semiconductor refrigeration piece, the second end of the heat conduction fin is connected with the middle heat conduction plate, and the heat conduction fin is used for dispersing the cold energy generated by the cold end of the semiconductor refrigeration piece.
Furthermore, the middle heat conduction plate is attached to the heating element.
Furthermore, a water collecting groove for collecting condensed water is arranged on the surface of the cold end of the semiconductor refrigeration sheet.
Further, the bottom of the water collecting tank is obliquely arranged.
Furthermore, the cold junction of semiconductor refrigeration piece still is provided with the water conservancy diversion face, the water conservancy diversion face with the notch of water catch bowl links to each other, the water conservancy diversion face is used for leading-in the comdenstion water in the water catch bowl.
Further, the heat conduction fins are multiple, and the heat conduction fins are arranged at intervals along the extending direction of the water collecting tank.
Furthermore, the heat conduction fins are multiple and arranged at intervals, and a heat exchange channel is formed between every two adjacent heat conduction fins.
Further, all the heat conduction fins are obliquely arranged towards the same direction.
Further, in the direction from the first end to the second end of the heat conduction fin, the thickness of the heat conduction fin is gradually reduced, and the width of the flow surface of the heat exchange channel is gradually increased.
Further, the heat conduction fin has relative first heat transfer surface and second heat transfer surface, first heat transfer surface with form the contained angle between the second heat transfer surface, first heat transfer surface with the contained angle opening orientation of second heat transfer surface the cold junction of semiconductor refrigeration piece.
Furthermore, an included angle formed between the first heat exchange surface and the cold end surface of the semiconductor refrigeration sheet is an obtuse angle; and an included angle formed between the second heat exchange surface and the cold end surface of the semiconductor refrigerating sheet is an obtuse angle.
Further, the heat dissipation device further includes: the semiconductor refrigerating sheet comprises a plurality of semiconductor refrigerating sheets, and a plurality of radiating fins are arranged at the hot end of each semiconductor refrigerating sheet at intervals.
Furthermore, the semiconductor refrigeration piece, the middle heat conduction plate and the heat conduction fins are integrally formed.
According to another aspect of the present invention, a control method for the above heat dissipation device is disclosed, the heat dissipation device further includes: the temperature sensor is used for detecting the temperature of the heating element; the control device is electrically connected with the temperature sensor and the semiconductor refrigerating sheet respectively, and the control method comprises the following steps: step S10: acquiring the temperature of the heating element; step S20: and controlling the working state of the semiconductor refrigerating sheet according to the temperature of the heating element.
Further, the step S20 further includes the following steps: step S21: acquiring the current working state of the semiconductor refrigerating sheet; step S22: under the starting state of the semiconductor chilling plate, if the temperature of the heating element is greater than or equal to a preset value, the working state of the semiconductor chilling plate is kept unchanged; if the temperature of the heating element is less than a preset value, the semiconductor refrigerating sheet is closed; step S23: under the closed state of the semiconductor refrigerating sheet, if the temperature of the heating element is less than a preset value, the working state of the semiconductor refrigerating sheet is kept unchanged; and if the temperature of the heating element is greater than or equal to a preset value, the semiconductor refrigerating sheet is started.
The utility model discloses a heat abstractor is through heat-conducting plate and heat conduction fin in the middle of setting up, can derive the heat of heating element on the middle heat-conducting plate, then, the cold volume of guide semiconductor refrigeration piece cold junction through heat conduction fin is for middle heat-conducting plate cooling, thereby reduce the temperature of heating element, the existence of heat conduction fin makes the cold junction heat radiating area of semiconductor refrigeration piece increase, thereby make cold volume disperse more, thereby can not make cold volume too concentrate, effectively reduce the production of comdenstion water, the reliability of the operation of improvement system.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation device according to a first embodiment of the present invention;
fig. 2 is a front view of a heat dissipation device according to a first embodiment of the present invention;
fig. 3 is a side view of a heat dissipation device according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a semiconductor refrigeration sheet according to a first embodiment of the present invention;
fig. 5 is a schematic structural view of a heat dissipation device according to a second embodiment of the present invention;
fig. 6 is a front view of a heat dissipation device according to a second embodiment of the present invention;
fig. 7 is a side view of a heat dissipating device according to a second embodiment of the present invention;
legend: 10. a semiconductor refrigeration sheet; 11. a water collection tank; 12. a flow guide surface; 20. a middle heat-conducting plate; 30. a heat conductive fin; 31. a first heat exchange surface; 32. a second heat exchange surface; 40. a heat exchange channel; 50. and (4) radiating fins.
Detailed Description
The present invention is further illustrated by the following examples, but is not limited to the contents of the specification.
As shown in fig. 1 to 4, the utility model discloses a heat dissipation device, a semiconductor refrigeration piece 10 is arranged below a heating element, the heat dissipation device comprises a semiconductor refrigeration piece 10, a middle heat conduction plate 20 and heat conduction fins 30, and the cold end of the semiconductor refrigeration piece 10 is arranged corresponding to the heating element; the middle heat conducting plate 20 is arranged between the heating element and the semiconductor chilling plate 10, and the middle heat conducting plate 20 is used for absorbing the heat of the heating element; the first end of the heat conduction fin 30 is connected with the cold end of the semiconductor refrigeration piece 10, the second end of the heat conduction fin 30 is connected with the middle heat conduction plate 20, and the heat conduction fin 30 is used for dispersing the cold energy generated by the cold end of the semiconductor refrigeration piece 10. The utility model discloses a heat-conducting plate 20 and heat conduction fin 30 in the middle of the heat abstractor is through setting up, can derive the heat of heating element on the middle heat-conducting plate 20, then, the cold volume through heat conduction fin 30 guide semiconductor refrigeration piece 10 cold junction is for middle heat-conducting plate 20 cooling, thereby reduce heating element's temperature, the existence of heat conduction fin 30 makes the cold junction heat radiating area of semiconductor refrigeration piece 10 increase, thereby make cold volume disperse more, thereby can not make cold volume too concentrated, effectively reduce the production of comdenstion water, the reliability of the operation of improvement system.
In the above embodiment, the intermediate heat-conducting plate 20 is attached to the heating element. The utility model discloses a heat abstractor can improve heat transfer efficiency through pasting middle heat-conducting plate 20 and establish on heating element to improve the radiating effect.
In the above embodiment, the cold end surface of the semiconductor chilling plate 10 is provided with the water collection groove 11 for collecting the condensed water. The utility model discloses a heat abstractor can concentrate the comdenstion water in water catch bowl 11 through setting up water catch bowl 11 to greatly reduced comdenstion water is handled improperly and is leaded to machine short circuit, risks such as corrosion.
In the above embodiment, the bottom of the water collection tank 11 is disposed obliquely. The utility model discloses a heat abstractor sets up the slope of 11 tank bottoms of water catch bowl through setting up, makes the comdenstion water flow along the incline direction of water catch bowl 11, at the end of water catch bowl 11, can discharge the comdenstion water through the honeycomb duct to avoid the comdenstion water excessive, greatly reduced comdenstion water is handled improperly and is leaded to machine short circuit, risks such as corrosion.
In the above embodiment, the cold end of the semiconductor refrigeration sheet 10 is further provided with a flow guide surface 12, the flow guide surface 12 is connected to the notch of the water collection tank 11, and the flow guide surface 12 is used for guiding the condensed water into the water collection tank 11. The utility model discloses a heat abstractor is through setting up water conservancy diversion face 12, and the comdenstion water that drips outside water catch bowl 11 also can follow water conservancy diversion face 12 and flow in water catch bowl 11 to prevent that the comdenstion water from flowing to other components and parts or circuit board on, greatly reduced comdenstion water is handled improperly and is leaded to machine short circuit, risks such as corrosion.
In the above embodiment, the heat transfer fins 30 are plural, and the plural heat transfer fins 30 are provided at intervals along the extending direction of the water collection tank 11. The utility model discloses a heat abstractor can disperse the cold volume that the 10 cold junctions of semiconductor refrigeration piece produced more through setting up a plurality of heat conduction fins 30 and come to make the cold volume reduction on every heat conduction fin 30, thereby reduce the production of comdenstion water.
In the above embodiment, the number of the heat conducting fins 30 is plural, the plural heat conducting fins 30 are arranged at intervals, and the heat exchanging channel 40 is formed between two adjacent heat conducting fins 30. The utility model discloses a heat abstractor can improve the radiating efficiency through setting up a plurality of heat conduction fins 30 through heat transfer passageway 40.
In the embodiment shown in fig. 1 and 2, all the heat-conducting fins 30 are disposed obliquely in the same direction. The utility model discloses a heat abstractor sets up through inclining heat conduction fin 30, can make heat conduction fin 30 go up the cold junction of slow flow direction semiconductor refrigeration piece 10 of comdenstion water under the effect of gravity, prevents that comdenstion water speed from arousing the liquid drop sputtering too fast, and greatly reduced comdenstion water is handled improperly and is leaded to machine short circuit, risks such as corrosion.
In the second embodiment shown in fig. 5 to 7, the thickness of the heat conducting fins 30 gradually decreases and the width of the flow surface of the heat exchanging channel 40 gradually increases from the first ends to the second ends of the heat conducting fins 30. The heat dissipation device of the utility model adopts the setting mode through gradually changing the thickness of the heat conduction fins 30, on one hand, the first ends of the heat conduction fins 30 are thickened, so that the contact area of the heat conduction fins and the cold ends of the semiconductor refrigeration pieces 10 can be increased, thereby increasing the transmission efficiency of the cooling capacity, and the cooling capacity of the semiconductor refrigeration pieces 10 can be transmitted to the heat conduction fins 30 more quickly; on the other hand, because the first ends of the heat conducting fins 30 are connected with the semiconductor chilling plates 10, the temperature of the heat conducting fins 30 is lower as the heat conducting fins are closer to the first ends, the temperature of the heat conducting fins 30 is higher as the heat conducting fins are closer to the second ends, the first ends of the heat conducting fins 30 are easy to generate convection heat exchange with air due to too low temperature, and cold energy is lost.
In the above embodiment, the heat conducting fin 30 has the first heat exchanging surface 31 and the second heat exchanging surface 32 opposite to each other, an included angle is formed between the first heat exchanging surface 31 and the second heat exchanging surface 32, and the included angle between the first heat exchanging surface 31 and the second heat exchanging surface 32 opens toward the cold end of the semiconductor chilling plate 10. When the heat conduction fins 30 work, although cold energy is dispersed, a small amount of condensed water can still be generated on two heat exchange surfaces of the heat conduction fins 30, if the heat conduction fins are not well treated, the condensed water can drip and splash, and therefore the risk of short circuit and corrosion of a machine can still exist. Therefore, in order to solve the above problem, the utility model discloses a heat abstractor forms the contained angle through setting up two heat transfer surfaces with heat conduction fin 30, can play the effect of guide comdenstion water, makes the velocity of flow of comdenstion water slow down, avoids the water droplet to splash to improve the reliability.
In the above embodiment, the included angle formed between the first heat exchange surface 31 and the cold end surface of the semiconductor chilling plate 10 is an obtuse angle; the included angle formed between the second heat exchange surface 32 and the cold end surface of the semiconductor chilling plate 10 is an obtuse angle. The utility model discloses a heat abstractor sets up two faces to the obtuse angle with the angle of cold terminal surface through setting up, makes heat conduction fin 30's cross section form triangle-shaped or trapezoidal like this, and two heat-transfer faces can all slow down condensation rivers whereabouts speed to avoid the water droplet to splash, thereby improve the reliability.
It can be seen that, by setting the heat-conducting fins 30 to have a structure with one thicker end and one thinner end, the heat-conducting fins 30 have great improvement in both heat transfer and flow guiding, have the effect of one object with multiple purposes, and greatly improve the overall heat-dissipating effect and operational reliability of the heat-dissipating device.
In the above embodiment, the heat dissipating device further includes: a plurality of heat dissipation fins 50 are provided, and the plurality of heat dissipation fins 50 are arranged at the hot end of the semiconductor chilling plate 10 at intervals. The utility model discloses a heat abstractor can improve the radiating effect in hot junction through setting up radiating fin 50 to make the refrigeration effect of cold junction better.
In the above embodiment, the semiconductor chilling plate 10, the intermediate heat conducting plate 20 and the heat conducting fins 30 are integrally formed. The utility model discloses a heat abstractor adopts integrated into one piece to set up through the setting, can make the installation more convenient to heat conduction efficiency is better.
In the embodiment shown in fig. 4, the semiconductor chilling plate 10 is formed by connecting a plurality of N-type semiconductors and P-type semiconductors in parallel, wherein the N-type semiconductors are all installed on the left side, the P-type semiconductors are all installed on the right side, and the cold ends of the N-type semiconductors and the P-type semiconductors are connected with direct current.
According to another aspect of the present invention, a control method for the above heat dissipation device is disclosed, wherein the heat dissipation device further comprises: the temperature sensor is used for detecting the temperature of the heating element; the control device is respectively electrically connected with the temperature sensor and the semiconductor refrigerating sheet 10, and the control method comprises the following steps:
step S10: acquiring the temperature of the heating element;
step S20: the working state of the semiconductor chilling plate 10 is controlled according to the temperature of the heating element.
In the above embodiment, step S20 further includes the steps of:
step S21: acquiring the current working state of the semiconductor refrigerating sheet 10;
step S22: in the starting state of the semiconductor chilling plate 10, if the temperature of the heating element is greater than or equal to the preset value, the working state of the semiconductor chilling plate 10 is kept unchanged, and the step S10 is returned; if the temperature of the heating element is less than the preset value, the semiconductor refrigerating sheet 10 is closed, and the step S10 is returned;
step S23: under the closing state of the semiconductor chilling plate 10, if the temperature of the heating element is less than the preset value, the working state of the semiconductor chilling plate 10 is kept unchanged, and the step S10 is returned; if the temperature of the heating element is greater than or equal to the preset value, the semiconductor cooling plate 10 is turned on, and the process returns to step S10.
The utility model discloses a heat abstractor's control method, through monitoring heating element's temperature, control semiconductor refrigeration piece 10's operating condition, when realizing the cooling effect, reduce the energy consumption as far as possible.
It is to be understood that the above-described embodiments of the present invention are merely examples provided for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. Not all embodiments are exhaustive. All obvious changes or variations led out by the technical scheme of the utility model are still in the protection scope of the utility model.
Claims (13)
1. A heat dissipating device, comprising:
the semiconductor refrigerating sheet (10), the cold end of the semiconductor refrigerating sheet (10) is arranged corresponding to the heating element
The middle heat-conducting plate (20), the middle heat-conducting plate (20) is arranged between the heating element and the semiconductor refrigeration piece (10), and the middle heat-conducting plate (20) is used for absorbing the heat of the heating element;
heat conduction fin (30), the first end of heat conduction fin (30) with the cold junction of semiconductor refrigeration piece (10) links to each other, the second end of heat conduction fin (30) with middle heat-conducting plate (20) link to each other, heat conduction fin (30) are used for the dispersion the produced cold volume of semiconductor refrigeration piece (10) cold junction.
2. The heat dissipating device of claim 1,
the middle heat conducting plate (20) is attached to the heating element.
3. The heat dissipating device of claim 1,
and a water collecting tank (11) for collecting condensed water is arranged on the surface of the cold end of the semiconductor refrigeration sheet (10).
4. The heat dissipating device of claim 3,
the bottom of the water collecting tank (11) is obliquely arranged.
5. The heat dissipating device of claim 3,
the cold junction of semiconductor refrigeration piece (10) still is provided with water conservancy diversion face (12), water conservancy diversion face (12) with the notch of water catch bowl (11) links to each other, water conservancy diversion face (12) are used for leading-in the comdenstion water in water catch bowl (11).
6. The heat dissipating device of claim 3,
the heat conduction fins (30) are multiple, and the heat conduction fins (30) are arranged at intervals along the extending direction of the water collecting tank (11).
7. The heat dissipating device of claim 1,
the heat conduction fins (30) are multiple, the heat conduction fins (30) are arranged at intervals, and heat exchange channels (40) are formed between every two adjacent heat conduction fins (30).
8. The heat dissipating device of claim 7,
all the heat conduction fins (30) are obliquely arranged towards the same direction.
9. The heat dissipating device of claim 7,
in the direction from the first end to the second end of heat conduction fin (30), the thickness of heat conduction fin (30) reduces gradually, the width of the surface of overflowing of heat transfer passageway (40) increases gradually.
10. The heat dissipating device of claim 1,
heat conduction fin (30) have relative first heat transfer face (31) and second heat transfer face (32), first heat transfer face (31) with form the contained angle between second heat transfer face (32), first heat transfer face (31) with the contained angle opening orientation of second heat transfer face (32) the cold end of semiconductor refrigeration piece (10).
11. The heat dissipating device of claim 10,
an included angle formed between the first heat exchange surface (31) and the cold end surface of the semiconductor refrigeration sheet (10) is an obtuse angle;
an included angle formed between the second heat exchange surface (32) and the cold end surface of the semiconductor refrigeration sheet (10) is an obtuse angle.
12. The heat dissipating device of claim 1, further comprising:
the semiconductor refrigerating sheet comprises a plurality of radiating fins (50), wherein the plurality of radiating fins (50) are arranged at the hot end of the semiconductor refrigerating sheet (10) at intervals.
13. The heat dissipating device of claim 1,
the semiconductor refrigeration piece (10), the middle heat conduction plate (20) and the heat conduction fins (30) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848484.2U CN212362489U (en) | 2020-08-28 | 2020-08-28 | Heat radiator using semiconductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848484.2U CN212362489U (en) | 2020-08-28 | 2020-08-28 | Heat radiator using semiconductor refrigeration |
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| Publication Number | Publication Date |
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| CN212362489U true CN212362489U (en) | 2021-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021848484.2U Active CN212362489U (en) | 2020-08-28 | 2020-08-28 | Heat radiator using semiconductor refrigeration |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928521A (en) * | 2020-08-28 | 2020-11-13 | 珠海格力电器股份有限公司 | Heat dissipation device adopting semiconductor refrigeration and control method thereof |
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2020
- 2020-08-28 CN CN202021848484.2U patent/CN212362489U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928521A (en) * | 2020-08-28 | 2020-11-13 | 珠海格力电器股份有限公司 | Heat dissipation device adopting semiconductor refrigeration and control method thereof |
| CN111928521B (en) * | 2020-08-28 | 2024-09-24 | 珠海格力电器股份有限公司 | Heat dissipation device adopting semiconductor refrigeration and control method thereof |
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