CN210835979U - Extended computer processor heat dissipation device with display function - Google Patents
Extended computer processor heat dissipation device with display function Download PDFInfo
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- CN210835979U CN210835979U CN202020054004.9U CN202020054004U CN210835979U CN 210835979 U CN210835979 U CN 210835979U CN 202020054004 U CN202020054004 U CN 202020054004U CN 210835979 U CN210835979 U CN 210835979U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 73
- 238000001816 cooling Methods 0.000 claims abstract description 107
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000002955 isolation Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000006870 function Effects 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 8
- 239000004519 grease Substances 0.000 claims description 7
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 238000002791 soaking Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 230000032683 aging Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an electronic chip heat dissipation technical field, the utility model discloses there are technical problem such as weeping to the great and water-cooling heat dissipation technique of volume that current air-cooled radiator exists, provide an extension type computer processor heat abstractor with display function, include: including fan control circuit interface, fan control circuit, embedded fan, heat input interface, the heat pipe array, the water-cooling interface, the water-cooling radiator group, show control circuit interface, display screen and waterproof isolation container, the utility model discloses a parts such as water-cooling head and the water pipe that the water-cooling radiator group that the heat pipe array will be located on the computer processor move to the water-cooling interface that is located the mainboard outside, are encircleed by waterproof isolation container around the water-cooling interface, even the weeping takes place for the water-cooling radiator group, the liquid that spills can be collected by waterproof isolation container, avoids causing the damage to mainboard and display card etc..
Description
Technical Field
The utility model relates to an extension type computer processor heat abstractor with show function, especially one kind is through the heat pipe array, and the liquid leakage that the liquid cooling ware group and embedded fan set up the computer processor and carry out radiating device, and the device has the display screen to have waterproof isolation container and prevent the liquid cooling ware group damages the circuit of computer.
Background
Water-cooled heat sinks for computer processor heat dissipation provide a greater heat dissipation effect than air-cooled heat sinks through the circulating flow of a liquid medium and high heat capacity. At present, the mainstream computer case is a vertical case, a water-cooled radiator is usually located at the top or front part of the case, and a water-cooled head is fixed on a processor and located above an expensive display card. After the water-cooled radiator group is used for years, aging, cracking and leakage are often caused at the positions of a water pipe, a joint and the like due to high temperature and high pressure. Once liquid leakage occurs, circuits such as a computer mainboard and a display card can be burnt out in a short circuit, and thousands of yuan is lost for users. At present, the problem of liquid leakage of the water-cooled radiator due to aging is researched and developed by manufacturers for many years, and is still not thoroughly solved.
In order to avoid the ageing weeping of water-cooling radiator to cause the computer circuit to damage, consequently the utility model provides an extension type computer processor heat abstractor with show function adopts runoff fan group, and embedded fan and heat pipe array dispel the heat to the computer processor. Compared with the air-cooled heat dissipation device in the current market, the air-cooled heat dissipation device has the advantages of strong compatibility, compact size, no blocking of a memory slot or a mainboard mounting hole, convenience in installation, no need of forming an air duct and the like, and in addition, the device is provided with a display screen and a waterproof isolation container to prevent liquid leakage of a water-cooled heat dissipation device group from damaging a circuit of a computer.
Disclosure of Invention
The utility model aims at providing an extension type computer processor heat abstractor with show function, especially one kind through the heat pipe array, the liquid cooling ware group carries out radiating device with embedded fan to the computer processor, and the device has the display screen to have the circuit that the weeping that the waterproof isolation container prevented the liquid cooling ware group from damaging the computer.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the device comprises a fan control circuit interface, a fan control circuit, an embedded fan, a heat input interface, a heat pipe array, a water-cooling heat dissipation interface, a water-cooling heat radiator group, a display control circuit interface, a display screen and a waterproof isolation container, wherein the output end of the fan control circuit interface is connected with the input end of the fan control circuit, the output end of the fan control circuit is connected with the input end of the embedded fan, the output end of the heat input interface is connected with the input end of the heat pipe array, the output end of the heat pipe array is connected with the input end of the water-cooling heat dissipation interface, the output end of the water-cooling heat dissipation interface is connected with the input end of the water-cooling heat radiator group, the other output end of the water-cooling heat dissipation interface is connected with the input end of the waterproof isolation container, the heat pipe array is connected with a computer, the water pipe of the water-cooling radiator set absorbs and circularly transmits heat to the cold row of the water-cooling radiator set, the fan of the water-cooling radiator set blows air to the cold row of the water-cooling radiator set to cool the liquid in the water-cooling radiator set, the other function of the heat pipe array is to move the water cooling head, the water pipe and other components of the water-cooling radiator set which are usually positioned on the computer processor to the water-cooling radiating interface positioned outside the mainboard, the water-cooling radiating interface is surrounded by the waterproof isolating container, even if the water-cooling radiator set leaks, the leaked liquid can be collected by the waterproof isolating container to avoid damaging the mainboard, the display card and the like, the fan control circuit receives the processor temperature information provided by the temperature sensor in the computer processor through the fan control circuit interface to control the rotating speed of the embedded fan, the embedded fan is fixed above the heat pipe array and works in a downward pressure, the display screen is used for providing airflow for a power supply element and a memory of a computer mainboard, the input end of the display control circuit interface is connected with the computer mainboard, the output end of the display control circuit interface is connected with the input end of the display screen, and the display screen is fixed above the embedded fan.
The fan control circuit interface is used for establishing electrical connection between the temperature sensor in the computer processor and the fan control circuit of the extended computer processor heat dissipation device with the display function, and providing the processor temperature information provided by the temperature sensor in the computer processor for the fan control circuit of the extended computer processor heat dissipation device with the display function;
the fan control circuit is a digital pulse width modulation control chip and is used for controlling the rotating speed of an embedded fan of the extended computer processor heat dissipation device with the display function according to processor temperature information provided by a temperature sensor in a computer processor;
the embedded fan is a radial fan, an axial fan or a radial-axial mixed fan;
the heat input interface is used for connecting a computer processor and a heat pipe array of an extended computer processor heat dissipation device with a display function, is a massive metal or a soaking plate, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the computer processor, and is in close contact with the heat pipe array by adopting a welding technology so as to establish high-efficiency thermal connection;
the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the water-cooling heat dissipation interface;
the water-cooling heat dissipation interface is used for connecting the heat pipe array and the water-cooling heat dissipation set, is a block metal or a vapor chamber, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the water-cooling heat dissipation set, and is tightly connected with the heat pipe array by adopting a welding process;
the water-cooled radiator group is a single integrated water-cooled radiator, a plurality of integrated water-cooled radiators or a split water-cooled radiator, the device comprises a water-cooled head, a water pipe, a cold air exhauster, a fan, a water pump and other parts, and the common device is not described herein;
the display control circuit interface is used for establishing electrical connection between the computer and the display screen and providing information to be displayed in the computer to the display screen;
the display screen is a liquid crystal display screen, an organic light emitting diode display screen or a plasma technology display screen, can be in any shape, and is usually a rectangle with the diagonal length of 1-10 inches;
the waterproof isolation container is used for preventing liquid from splashing on circuits such as a mainboard or a display card and the like due to high pressure in the pipe when the water-cooled radiator group leaks, and collecting the leaked liquid.
The working principle of the utility model is as follows: when the computer processor cooling device is used, the temperature sensor in the computer processor is connected with the fan control circuit of the extended computer processor cooling device with the display function through the fan control circuit interface of the extended computer processor cooling device with the display function, and the fan control circuit controls the rotating speed of the embedded fan of the extended computer processor cooling device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor; the computer processor is connected with a heat pipe array of the extended computer processor heat dissipation device with the display function through a heat input interface of the extended computer processor heat dissipation device with the display function, the heat pipe array receives heat and conducts the heat to one or more water cooling heads of the water cooling heat dissipation device group through the water cooling heat dissipation interface, a water pipe of the water cooling heat dissipation device group absorbs the heat and circularly transmits the heat to a cold drain of the water cooling heat dissipation device group, a fan of the water cooling heat dissipation device group blows air to the cold drain of the water cooling heat dissipation device group to cool liquid in the water cooling heat dissipation device group, the heat pipe array moves the water cooling heads, the water pipes and other parts of the water cooling heat dissipation device group which are usually positioned on the computer processor to the water cooling heat dissipation interface positioned outside a mainboard, the periphery of the water cooling heat dissipation interface is surrounded by a waterproof isolation container, and leaked liquid can be, avoid causing damage to mainboard and display card etc, fan control circuit passes through the treater temperature information that temperature sensor provided in the fan control circuit interface receiving computer processor, the rotational speed of control embedded fan, embedded fan is fixed in the top of heat pipe array, work in the push-down state of blowing for supply element and the memory to the computer mainboard provides the air current, the input that shows the control circuit interface links to each other with the computer mainboard, the output that shows the control circuit interface links to each other with the input of display screen, the display screen is fixed in the top of embedded fan.
The utility model discloses owing to adopted above-mentioned technical scheme, have following advantage:
1. the key problem that the aging leakage of the water-cooling radiator damages a circuit is solved;
2. the heat dissipation of the computer processor is realized by simultaneously using a plurality of water-cooled radiators for the first time, the heat dissipation capacity of the computer processor is enhanced, and the calculation performance of the computer processor is indirectly improved;
3. the display screen is used for displaying text or graphic information.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a schematic view of the present invention;
fig. 3 is a schematic structural diagram of the present invention.
Detailed Description
The invention will be further explained with reference to the following figures and examples: as shown in fig. 1-3, it includes a fan control circuit interface 1, a fan control circuit 2, an embedded fan 3, a heat input interface 4, a heat pipe array 5, a water-cooling heat dissipation interface 6, a water-cooling heat sink group 7, a display control circuit interface 8, a display screen 9 and a waterproof isolation container 10, the output end of the fan control circuit interface 1 is connected with the input end of the fan control circuit 2, the output end of the fan control circuit 2 is connected with the input end of the embedded fan 3, the output end of the heat input interface 4 is connected with the input end of the heat pipe array 5, the output end of the heat pipe array 5 is connected with the input end of the water-cooling heat dissipation interface 6, the output end of the water-cooling heat dissipation interface 6 is connected with the input end of the water-cooling heat sink group 7, the other output end of the water-cooling heat dissipation interface 6 is connected with, the heat of the computer is received and is transmitted to one or more water-cooled heads of a water-cooled radiator group 7 through a water-cooled radiator interface 6, a water pipe of the water-cooled radiator group 7 absorbs and circularly transmits the heat to a cold row of the water-cooled radiator group 7, a fan of the water-cooled radiator group 7 blows air to the cold row of the water-cooled radiator group 7 to cool liquid in the water-cooled radiator group 7, the other function of the heat pipe array 5 is to move the water-cooled heads, the water pipe and other components of the water-cooled radiator group 7 which are usually positioned on a computer processor to the water-cooled radiator interface 6 positioned on the outer side of a mainboard, the periphery of the water-cooled radiator interface 6 is surrounded by a waterproof isolation container 10, even if the water-cooled radiator group 7 leaks, the leaked liquid can be collected by the waterproof isolation container 10 to avoid damaging the mainboard, a display card and the like, a fan control circuit 2 receives processor temperature information provided, the rotating speed of the embedded fan 3 is controlled, the embedded fan 3 is fixed above the heat pipe array 5 and works in a downward-pressing type blowing state and is used for providing airflow for a power supply element and a memory of a computer mainboard, the input end of the display control circuit interface 8 is connected with the computer mainboard, the output end of the display control circuit interface 8 is connected with the input end of the display screen 9, and the display screen 9 is fixed above the embedded fan 3.
The fan control circuit interface 1 is used for establishing electrical connection between a temperature sensor in the computer processor and the fan control circuit 1 of the extended computer processor heat dissipation device with the display function, and providing processor temperature information provided by the temperature sensor in the computer processor to the fan control circuit 2 of the extended computer processor heat dissipation device with the display function;
the fan control circuit 2 is a digital pulse width modulation control chip and is used for controlling the rotating speed of the embedded fan 3 of the extended computer processor heat dissipation device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor, and the working principle is not repeated because various digital pulse width modulation control chips are available in the market;
the embedded fan 3 is a radial fan, an axial fan or a radial-axial mixed fan;
the heat input interface 4 is used for connecting a computer processor and a heat pipe array 5 of an extended computer processor heat dissipation device with a display function, is a massive metal or a soaking plate, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the computer processor, and is in close contact with the heat pipe array 5 by adopting a welding technology so as to establish high-efficiency thermal connection;
the heat pipe array 5 is used for efficiently conducting heat led in from the heat input interface 4 to the water-cooling heat dissipation interface 6;
the water-cooling heat dissipation interface 6 is used for connecting the heat pipe array 5 and the water-cooling heat dissipation set 7, is a block metal or a vapor chamber, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the water-cooling heat dissipation set 7, and is tightly connected with the heat pipe array 5 by adopting a welding process;
the water-cooled radiator group 7 is a single integrated water-cooled radiator, a plurality of integrated water-cooled radiators or a split water-cooled radiator, the device comprises a water-cooled head, a water pipe, a cold air exhaust, a fan, a water pump and other parts, and the common device is not described herein;
the display control circuit interface 8 is used for establishing electrical connection between the computer and the display screen 9 and providing information to be displayed in the computer to the display screen 9;
the display screen 9 is a liquid crystal display screen, an organic light emitting diode display screen or a plasma technology display screen, and can be in any shape, usually a rectangle with a diagonal length of 1-10 inches;
the waterproof isolation container 10 is used for preventing liquid from splashing on a circuit such as a mainboard or a display card and the like due to high pressure in the pipe when the water-cooled radiator group 7 leaks, and collecting the leaked liquid.
The working principle of the utility model is as follows: when the temperature sensor is used, the temperature sensor in the computer processor is connected with the fan control circuit 2 of the extended computer processor heat dissipation device with the display function through the fan control circuit interface 1 of the extended computer processor heat dissipation device with the display function, and the fan control circuit 2 controls the rotating speed of the embedded fan 3 of the extended computer processor heat dissipation device with the display function according to the processor temperature information provided by the temperature sensor in the computer processor; the computer processor is connected with a heat pipe array 5 of the expansion type computer processor heat dissipation device with the display function through a heat input interface 4 of the expansion type computer processor heat dissipation device with the display function, the heat pipe array 5 receives heat and conducts the heat to one or more water cooling heads of a water cooling radiator set 7 through a water cooling radiator set 6, a water pipe of the water cooling radiator set 7 absorbs the heat and circularly transmits the heat to a cold row of the water cooling radiator set 7, a fan of the water cooling radiator set 7 blows air to the cold row of the water cooling radiator set 7 to cool liquid in the water cooling radiator set 7, the heat pipe array 5 moves the water cooling heads, the water pipes and other parts of the water cooling radiator set 7 which are usually positioned on the computer processor to the water cooling radiator set 6 positioned on the outer side of a mainboard, the periphery of the water cooling radiator set 6 is surrounded by a waterproof isolation container 10, even if the water cooling radiator set, leaked liquid can be collected by waterproof isolation container 10, avoid causing the damage to mainboard and display card etc, fan control circuit 2 receives the treater temperature information that temperature sensor provided in the computer processor through fan control circuit interface 1, control embedded fan 3's rotational speed, embedded fan 3 is fixed in the top of heat pipe array 5, work in the push-down state of blowing, a power supply unit and the memory for to the computer mainboard provide the air current, the input of display control circuit interface 8 links to each other with the computer mainboard, the output of display control circuit interface 8 links to each other with the input of display screen 9, display screen 9 is fixed in the top of embedded fan 3.
The heat pipe array 5 of the utility model is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
The material of the heat pipe array 5 of the present invention is copper, copper alloy, aluminum or aluminum alloy.
The material of the heat input interface 4 is copper, copper alloy, aluminum or aluminum alloy.
The surface of the heat input interface 4 contacting with the computer processor is coated with heat-conducting silicone grease or liquid metal with high heat conductivity.
Adopt pressure fixture fixed between heat input interface 4 and the computer processor.
The water-cooling head of water-cooling heat dissipation interface 6 and water-cooling radiator group 7 between adopt pressure fixture fixed.
The heat input interface 4 of the utility model is a massive metal or a soaking plate.
The heat input interface 4 and the heat pipe array 5 are connected by welding process.
The water-cooling heat dissipation interface 6 and the heat pipe array 5 are connected by welding process.
Claims (9)
1. An extended computer processor heat sink with display functionality, comprising: the device comprises a fan control circuit interface, a fan control circuit, an embedded fan, a heat input interface, a heat pipe array, a water-cooling heat dissipation interface, a water-cooling heat radiator group, a display control circuit interface, a display screen and a waterproof isolation container, wherein the output end of the fan control circuit interface is connected with the input end of the fan control circuit, the output end of the fan control circuit is connected with the input end of the embedded fan, the output end of the heat input interface is connected with the input end of the heat pipe array, the output end of the heat pipe array is connected with the input end of the water-cooling heat dissipation interface, the output end of the water-cooling heat dissipation interface is connected with the input end of the water-cooling heat radiator group, the other output end of the water-cooling heat dissipation interface is connected with the input end of the waterproof isolation container, the heat pipe array is connected with a computer, the water pipe of the water-cooling radiator set absorbs and circularly transmits heat to the cold row of the water-cooling radiator set, the fan of the water-cooling radiator set blows air to the cold row of the water-cooling radiator set to cool the liquid in the water-cooling radiator set, the other function of the heat pipe array is to move the water cooling head and the water pipe of the water-cooling radiator set on the computer processor to the water-cooling radiating interface outside the mainboard, the water-cooling radiating interface is surrounded by the waterproof isolating container, even if the water-cooling radiator set leaks, the leaked liquid can be collected by the waterproof isolating container to avoid damaging the mainboard, the display card and the like, the fan control circuit receives the processor temperature information provided by the temperature sensor in the computer processor through the fan control circuit interface to control the rotating speed of the embedded fan, the embedded fan is fixed above the heat pipe array and works in a downward-pressing type blowing state, the display screen is used for providing airflow for a power supply element and a memory of a computer mainboard, the input end of a display control circuit interface is connected with the computer mainboard, the output end of the display control circuit interface is connected with the input end of a display screen, and the display screen is fixed above the embedded fan;
the fan control circuit interface is used for establishing electrical connection between the temperature sensor in the computer processor and the fan control circuit of the extended computer processor heat dissipation device with the display function, and providing the processor temperature information provided by the temperature sensor in the computer processor for the fan control circuit of the extended computer processor heat dissipation device with the display function;
the fan control circuit is a digital pulse width modulation control chip and is used for controlling the rotating speed of an embedded fan of the extended computer processor heat dissipation device with the display function according to processor temperature information provided by a temperature sensor in a computer processor; the embedded fan is a radial fan, an axial fan or a radial-axial mixed fan; the heat input interface is used for connecting a computer processor and a heat pipe array of an extended computer processor heat dissipation device with a display function, is a massive metal or a soaking plate, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the computer processor, and is in close contact with the heat pipe array by adopting a welding technology so as to establish high-efficiency thermal connection; the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the water-cooling heat dissipation interface; the water-cooling heat dissipation interface is used for connecting the heat pipe array and the water-cooling heat dissipation set, is a block metal or a vapor chamber, is coated with heat conduction silicone grease or liquid metal with high heat conductivity on the surface in contact with the water-cooling heat dissipation set, and is tightly connected with the heat pipe array by adopting a welding process; the water-cooled radiator group comprises a single integrated water-cooled radiator, a plurality of integrated water-cooled radiators or split water-cooled radiators, the device comprises a water-cooled head, a water pipe, a cold air exhaust, a fan and a water pump, and the common device is not described herein; the display control circuit interface is used for establishing electrical connection between the computer and the display screen and providing information to be displayed in the computer to the display screen; the display screen is a liquid crystal display screen, an organic light emitting diode display screen or a plasma technology display screen, can be in any shape and is a rectangle with the diagonal length of 1-10 inches; the waterproof isolation container is used for preventing liquid from splashing on circuits such as a mainboard or a display card and the like due to high pressure in the pipe when the water-cooled radiator group leaks, and collecting the leaked liquid.
2. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the heat input interface is a block metal or a soaking plate.
3. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the heat pipe array is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
4. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the heat pipe array is made of copper, copper alloy, aluminum or aluminum alloy.
5. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the heat input interface is made of copper, copper alloy, aluminum or aluminum alloy.
6. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the heat input interface is a block metal or a soaking plate.
7. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the water-cooling heat dissipation interface is made of copper, copper alloy, aluminum or aluminum alloy.
8. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the water-cooling heat dissipation interface is a block metal or a soaking plate.
9. An extended computer processor heat sink with display functionality as recited in claim 1, wherein: the waterproof isolation container is located outside the water-cooling heat dissipation interface, the water-cooling head and the water pipe of the connected water-cooling heat dissipation interface and the water-cooling heat dissipation device group are all located in the waterproof isolation container, and the waterproof isolation container is sealed towards one side of the computer mainboard.
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| CN202020054004.9U CN210835979U (en) | 2020-01-11 | 2020-01-11 | Extended computer processor heat dissipation device with display function |
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| CN202020054004.9U CN210835979U (en) | 2020-01-11 | 2020-01-11 | Extended computer processor heat dissipation device with display function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126725A (en) * | 2020-01-11 | 2021-07-16 | 苏州溢博伦光电仪器有限公司 | Extended computer processor heat dissipation device with display function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126725A (en) * | 2020-01-11 | 2021-07-16 | 苏州溢博伦光电仪器有限公司 | Extended computer processor heat dissipation device with display function |
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