CN115437481A - A heat dissipation cold plate and a flexible cold plate heat dissipation device - Google Patents

Abstract

The invention provides a heat dissipation cold plate and a flexible cold plate heat dissipation device, which belong to the field of chip cold plate heat dissipation. The heat dissipation cold plate includes a cold plate body, and the cold plate body is longitudinally provided with at least two rows of inclined partition plates. The inclined partitions are arranged in parallel with at least two inclined partitions in the transverse direction, and there is an angle between the inclination directions of any adjacent two rows of inclined partitions, and all the inclined partitions in any adjacent two rows of inclined partitions are sequentially Staggered placement, so that a plurality of zigzag heat exchange channels are formed on the cold plate body, so that when the cooling liquid flows through the heat dissipation cold plate, the present invention can increase cooling through the tortuous heat exchange channels formed by the above-mentioned inclined partition plates The heat exchange stroke of the liquid and its contact area with the cold plate body increase the heat exchange area and heat conduction area of the entire heat dissipation cold plate, thereby greatly improving the heat exchange efficiency of the entire heat dissipation cold plate, and making it cool down the chip It can quickly and effectively reduce the chip temperature.

Description

A heat dissipation cold plate and a flexible cold plate heat dissipation device

technical field

The invention relates to the field of heat dissipation of a chip cold plate, in particular to a heat dissipation cold plate and a flexible cold plate heat dissipation device.

Background technique

The chip is the most critical component in the operation of the computer, but the chip will generate a lot of heat during operation, which will increase the temperature of the chip. High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, but also shorten the service life In severe cases, some components may even be burned, which will affect the normal use of the computer. Therefore, how to effectively dissipate heat from the chip has become a problem that computer manufacturers are more concerned about.

At present, common chip heat sinks are divided into water-cooled and air-cooled. The heat dissipation efficiency of air-cooled chip heat sinks is low, and due to the limitations of current fan technology, the air volume of the system has basically reached its limit. What can be done is to make reasonable use of the existing air volume to maximize the utilization rate; common water-cooled chip heat sinks are generally arranged with a cold plate outside the chip, and form a good contact with the cold plate through a thermally conductive adhesive layer , so that the heat of the chip is transferred to the cold plate by means of the thermally conductive adhesive layer, and the heat of the chip is taken away by the cooling liquid circulating in the cold plate, so the existing water-cooled chip heat sink has a better heat dissipation effect. However, due to the structure of the cold plate in the existing water-cooled chip heat sink, as shown in Figure 1, it is directly composed of a plurality of parallel plate stacks, and the internal water flow flows in a straight line, resulting in the heat exchange stroke of each heat exchange channel Short and small heat exchange area, which makes it difficult to effectively increase the heat dissipation area and increase heat exchange efficiency in a limited space.

Contents of the invention

The purpose of the present invention is to propose and design a heat dissipation cold plate and a flexible cold plate that can effectively increase the heat dissipation area in view of the defects of the existing water-cooled chip heat dissipation device such as small heat exchange area, fast water flow rate, and low heat dissipation efficiency. The cooling device is used to improve the heat exchange efficiency and heat dissipation efficiency of the cooling device, and to transfer the heat of the chip quickly and effectively.

In order to achieve the above object, on the one hand, the present invention provides a heat dissipation cold plate, which includes a cold plate body, and the cold plate body is provided with at least two rows of inclined spacers along the longitudinal direction, and each row of inclined spacers is arranged in parallel along the transverse direction. At least two inclined spacers, and there is an included angle between the inclination directions of any two adjacent rows of inclined spacers, and all inclined spacers in any adjacent two rows of inclined spacers are placed alternately in sequence, so that the cold plate body A number of meandering and zigzag heat exchange channels are formed on the top, so that when the cooling liquid flows through the heat dissipation cold plate, the present invention can increase the flow rate of the cooling liquid through the tortuous heat exchange channels formed by the above-mentioned inclined partition plates. The heat exchange stroke and its contact area with the cold plate body increase the heat exchange area and heat conduction area of the entire heat dissipation cold plate, thereby greatly improving the heat exchange efficiency of the entire heat dissipation cold plate, and enabling it to quickly cool down the chip , Effectively reduce the chip temperature.

Furthermore, any two adjacent rows of inclined partition plates have the same number of inclined partition plates and are placed in a staggered manner, so as to ensure that multiple zigzag heat exchange channels can be formed on the cold plate body.

Further, the inclination directions of any two adjacent rows of inclined partition plates are perpendicular to each other, at this time, it can change the flow direction of the cooling liquid to the greatest extent, and make it flow along the broken line; The contact area, that is to increase the heat exchange area and heat conduction area of the entire heat dissipation cold plate.

Further, the number of rows of the inclined partition plates is an even number.

On the other hand, the present invention also provides a flexible cold plate heat dissipation device, which includes at least one cooling box, the cooling box is provided with a cooling cavity, and the above-mentioned cooling cold plate is placed in the cooling cavity. The upper end of the heat dissipation cold plate is provided with a cover plate, and the cover plate is provided with a water inlet and a water outlet connected to the cooling chamber, the water inlet is connected with a water inlet pipeline, and the water outlet is connected with a water outlet pipeline. At this time, the coolant can first flow into the cooling chamber through the water inlet pipe and the water inlet, and then flow into the meandering heat exchange channel on the heat dissipation cold plate. The plate performs heat exchange, thereby taking away the heat of the chip, and finally the cooling liquid after heat exchange flows out through the water outlet and the water outlet pipe.

Further, a water flow accelerating component is arranged in the cooling chamber. In this way, when cooling some chips with high power consumption, the present invention can accelerate the flow rate of the cooling liquid in the cooling cavity through the water flow acceleration component, so that the cooling liquid after heat exchange can be discharged quickly, thereby enhancing the heat exchange efficiency.

Further, the water flow acceleration component is arranged on the side of the heat dissipation cold plate close to the water outlet, so that it can effectively increase the flow velocity near the heat dissipation cold plate, and accelerate the heat exchange efficiency of the heat dissipation cold plate, and at the same time it can effectively reduce the flow rate of the heat dissipation cold plate. The pressure drop of the water pipeline and the water outlet pipeline and the heat dissipation power consumption make the whole heat dissipation device more energy-saving and efficient.

Further, the outside of the water inlet is provided with a threaded connection part 1, and the threaded connection part 1 is threadedly connected with a pagoda head 1, and the pagoda head 1 is sealed and connected with the water inlet pipeline. The installation of the pagoda head can meet the different needs of different projects. The present invention can change the outlet direction only by rotating the pagoda head, and make the structure of the entire cooling device compatible with the chip structure or CPU structure to be cooled. , thereby greatly increasing the flexibility and safety of the present invention.

Further, the outer side of the water outlet is provided with a threaded connection part 2, and the threaded connection part 2 is threaded with a pagoda head 2, and the pagoda head 2 is sealed and connected with the water outlet pipeline. Like this because the present invention adopts threaded connection mode to carry out the installation of pagoda head two, it can be for the different needs of different projects, and the present invention can change its outlet direction only by rotating pagoda head two, and make the structure of whole cooling device and desired The cooled chip structure or CPU structure is compatible, thereby greatly increasing the flexibility and safety of the present invention.

Further, the number of the cooling boxes is more than one, and the cooling cavities of all the cooling boxes are connected in series through pipelines, so that the cooling liquid flows through each cooling cavity in sequence, and the chips placed above each cooling box are sequentially cooled. Thermal treatment.

From the above technical solutions, it can be seen that the present invention has the following advantages: First, compared with the existing heat dissipation cold plate, the heat dissipation cold plate provided by the present invention can effectively increase the amount of cooling liquid while keeping the unit area unchanged. heat exchange stroke and heat exchange area, and increase the heat exchange time of the coolant, thereby effectively improving the cooling efficiency of the coolant; in addition, since the heat dissipation cold plate provided by the present invention is composed of a plurality of staggered inclined partition plates, the present invention The provided radiating cold plate also increases the structural strength of the entire radiating cold plate, and makes it have a longer service life; secondly, when using the flexible cold plate heat dissipation device provided by the present invention to perform heat dissipation on chips, it can not only quickly Reducing the temperature of the chip can also effectively reduce the pressure drop of the corresponding cooling liquid circulation system under the action of the above-mentioned heat dissipation cold plate; in addition, the present invention also significantly reduces the module cost and has stronger reusability.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings that need to be used in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. As far as people are concerned, other drawings can also be obtained based on these drawings on the premise of not paying creative work.

FIG. 1 is a schematic structural diagram of a heat dissipation cold plate in the prior art.

Fig. 2 is a schematic structural view of the heat dissipation cold plate provided by the present invention.

Fig. 3 is a schematic structural view of the flexible cold plate cooling device provided by the present invention.

Fig. 4 is a schematic structural view of the cooling box in the present invention after removing the cover plate.

Fig. 5 is a structural schematic diagram of the first pagoda in the present invention.

In the figure: 1. Existing heat dissipation cold plate, 2. Inclined partition board, 3. Water inlet pipeline, 4. Water outlet pipeline, 5. Cooling box, 6. Cover plate, 7. Pagoda head 1, 8. Pagoda head Two, 9, heat dissipation cold plate.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Example 1

As shown in Figure 2, the present embodiment 1 provides a heat dissipation cold plate, the heat dissipation cold plate 9 includes a cold plate body, and the cold plate body is provided with at least two rows of inclined spacers 2 along the longitudinal direction, each row of inclined spacers The plate 2 is provided with at least two inclined spacers 2 in parallel in the transverse direction, and the number of inclined spacers 2 in any adjacent two rows of inclined spacers 2 is the same, and there is a gap between the inclination directions of any adjacent two rows of inclined spacers 2. Angle, all the inclined partitions 2 in any adjacent two rows of inclined partitions 2 are placed alternately in turn, so that a plurality of meandering and zigzag heat exchange channels are formed on the cold plate body, so that when there is cooling When the liquid flows through the heat dissipation cold plate 9, the present embodiment 1 can increase the heat exchange stroke of the cooling liquid and the contact area with the cold plate body through the tortuous heat exchange channel formed by the above-mentioned inclined partition plate 2, that is, increase the entire The heat exchange area and the heat conduction area of the heat dissipation cold plate 9 further greatly improve the heat exchange efficiency of the entire heat dissipation cold plate 9 and enable it to quickly and effectively reduce the chip temperature when cooling the chip.

In addition, as a preference, the angle between the inclination directions of any two adjacent rows of inclined partition plates 2 is preferably 90°, so that this embodiment 1 can change the flow direction of the cooling liquid to the greatest extent and make it flow along the broken line; Thereby, the contact area between the cooling liquid and the cold plate body is increased to the greatest extent, that is, the heat exchange area and the heat conduction area of the entire heat dissipation cold plate 9 are increased.

Example 2

As shown in Figures 3 to 5, the present embodiment 2 provides a flexible cold plate cooling device, which includes at least one cooling box 5, the cooling box 5 is provided with a cooling cavity, and the cooling cavity is placed The above-mentioned heat dissipation cold plate 9, the upper end of the heat dissipation cold plate 9 is provided with a cover plate 6, and the cover plate 6 is provided with a water inlet and a water outlet connected to the cooling chamber, and the outer side of the water inlet of the water inlet is provided Threaded connection part one is arranged, and described threaded connection part one is threadedly connected with pagoda head one 7, and described pagoda head one 7 is sealingly connected with water inlet pipeline 3; The outside of described water outlet is provided with threaded connection part two, and described threaded connection part two The second connecting part is threadedly connected with the pagoda head 2 8, and the said pagoda head 2 8 is connected with the outlet pipeline 4 in a sealed manner. In addition, in order to improve the aesthetics, the joints of the first pagoda head 7 and the second pagoda head 8 are covered with a decorative cover.

At this moment, the coolant can first flow into the cooling cavity through the water inlet pipe 3 and the water inlet, and then flow into the meandering heat exchange channel on the heat dissipation cold plate 9, and in the process of flowing through the heat exchange channel, it can interact with multiple The inclined partition plate 2 performs heat exchange, thereby taking away the heat of the chip, and finally the cooling liquid after heat exchange flows out through the water outlet and the water outlet pipe 4 .

In addition, in order to further improve the heat exchange efficiency when heat dissipation is performed on some chips with high power consumption, the second embodiment is also provided with a water flow acceleration assembly in the cooling cavity, and the water flow acceleration assembly is preferably arranged at The heat dissipation cold plate 9 is close to the side of the water outlet, so that in this embodiment 2, the flow velocity of the coolant in the cooling chamber can be accelerated through the water flow acceleration component, that is, the flow velocity near the heat dissipation cold plate 9 can be effectively increased, so that the coolant after heat exchange can be quickly discharged , thereby speeding up the heat exchange efficiency of the cooling plate 9; at the same time, it can effectively reduce the pressure drop of the water inlet pipeline 3 and the water outlet pipeline 4 and the heat dissipation power consumption, so that the entire heat dissipation device is more energy-saving and efficient.

In addition, when heat dissipation is performed on some chips with complex structures and large areas, in order to achieve precise heat dissipation and reduce the size and space occupied by a single heat dissipation device, it is preferable to set up two or more cooling boxes 5 in Embodiment 2. And the cooling cavities of all the cooling boxes 5 are connected in series through the pipelines, so that when the chips are radiated, each cooling box 5 can be placed in a place with high heat in a targeted manner, and by rotating the pagoda head-7 , Pagoda head 2 8 adapts the position of the corresponding pipeline to the structure of the chip, the structure of the CPU, and the like. At this time, the cooling liquid can flow through each cooling chamber in turn, and perform precise heat dissipation treatment on the chips placed above each cooling box 5 in turn.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides a heat dissipation cold drawing, its characterized in that, includes the cold drawing body, the cold drawing body is along vertically being provided with two row at least slope space bars, and every row of slope space bar has two at least slope space bars along horizontal parallel arrangement, and has the contained angle between the incline direction of two adjacent row arbitrary slope space bars, and all slope space bars in two adjacent row arbitrary slope space bars are crisscross in proper order and are placed.

2. The heat dissipating cold plate of claim 1, wherein the number of the slanted spacers of any two adjacent rows of the slanted spacers is the same.

3. A heat dissipating cold plate according to claim 1 wherein the oblique directions of any adjacent two rows of oblique spaced plates are perpendicular to each other.

4. A thermal cold plate according to claim 1, wherein the number of rows of said inclined spaced plates is even.

5. A flexible cold plate heat dissipation device is characterized by comprising at least one cooling box body, wherein the cooling box body is provided with a cooling cavity, the cooling cavity is internally provided with a heat dissipation cold plate according to any one of claims 1-4, the upper end of the heat dissipation cold plate is provided with a cover plate, the cover plate is provided with a water inlet and a water outlet which are communicated with the cooling cavity, the water inlet is communicated with a water inlet pipeline, and the water outlet is communicated with a water outlet pipeline.

6. The flexible cold plate heat sink of claim 5, wherein a water flow accelerating assembly is disposed within said cooling cavity.

7. The flexible cold plate heat sink of claim 6, wherein the water flow accelerating assembly is disposed on a side of the cold plate proximate the water outlet.

8. The flexible cold plate heat dissipation device as recited in claim 5, 6 or 7, wherein a first threaded connection portion is disposed outside the water inlet, the first threaded connection portion is in threaded connection with a first pagoda, and the first pagoda is in sealed connection with the water inlet pipeline.

9. The flexible cold plate heat dissipation device as recited in claim 5, 6 or 7, wherein a second threaded connection portion is disposed outside the water outlet, the second threaded connection portion is in threaded connection with a second pagoda head, and the second pagoda head is in sealed connection with the water outlet pipeline.

10. The flexible cold plate heat sink of claim 5, 6 or 7 wherein the number of cooling boxes is greater than one, and the cooling chambers of all cooling boxes are connected in series by a pipeline.

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