KR102296543B1 - Liquid-cooled heat sink - Google Patents

Abstract

The present invention relates to a water-cooled heat sink, supporting one or more heat-dissipating objects, and a plurality of heat-dissipating fins for dissipating heat generated from the heat-dissipating object on one plate surface are formed to protrude at intervals, and an upper portion for cooling the heat-dissipating object a cooling plate; A main flow path formed on a surface facing the upper cooling plate and through which a cooling fluid flows, and a plurality of the heat dissipation fins are provided on the main flow path to be insertable so that the cooling fluid is continuously disposed between the plurality of heat dissipation fins. and a lower cooling plate having a plurality of heat dissipation fin insertion grooves forming a flow path for a flowing heat dissipation fin, and coupled to the upper cooling plate to cool the heat generated from the heat dissipation object.

Description

Water-cooled heat sink {LIQUID-COOLED HEAT SINK}

The present invention relates to a water-cooled heat sink, and more particularly, to a water-cooled heat sink having a semi-interlocking structure.

If the heat generated from the equipment with high heat and high heat flow rate is not effectively removed, heat accumulation occurs, which in turn promotes the deterioration of electronic equipment, and in some cases may cause a fire.

Therefore, since the temperature of the electronic equipment affects the performance and reliability, heat management is required so that the electronic equipment maintains an appropriate temperature.

However, the conventional air-cooled heat sink has difficulty in cooling high heat and high heat flux equipment such as high heat electronic components, batteries, and condensing solar panels due to the low thermal conductivity and specific heat of air.

Accordingly, recently, a water-cooled heat sink for cooling heat generated from electronic equipment using a cooling fluid such as water has been widely used.

The water-cooled heat sink is a technology that cools the heat generating part of electronic equipment by transferring the heat by forced convection by flowing the liquid using a pump.

In particular, as the heat flux exceeds 100 W/cm 2 in power semiconductors and CPUs of supercomputers, the need for a water-cooled heat sink with high heat transfer performance is increasing.

Accordingly, recent studies on increasing the density of fins due to the increase in heat flux in electronic equipment and research on complicating the shape of fins have been actively conducted and have been applied to actual industrial sites, but the complexity of the structure has increased.

In addition, since the conventional water-cooled heatsink inserts a fin having a complicated shape to increase heat transfer, there is a problem in that the manufacturing process is complicated, mass production is difficult, and the manufacturing cost is increased.

Domestic Patent Publication No. 10-2001-0027876

The present invention is to solve the above problems, it is possible to improve the heat transfer performance by increasing the heat exchange area within the same volume, and to simplify the structure to facilitate mass production and to provide a water-cooled heat sink that can reduce manufacturing costs is the purpose of the invention.

An object of the present invention is to support one or more heat-dissipating objects, and a plurality of heat-dissipating fins for dissipating heat generated from the heat-dissipating object are formed on one side of the plate to protrude at intervals, the upper cooling plate cooling the heat-dissipating object; A main flow path formed on a surface facing the upper cooling plate and through which a cooling fluid flows, and a plurality of the heat dissipation fins are provided on the main flow path to be insertable so that the cooling fluid is continuously disposed between the plurality of heat dissipation fins. Achieved by a water-cooled heat sink, characterized in that it has a plurality of heat dissipation fin insertion grooves forming a flow path for a flowing heat dissipation fin, and includes a lower cooling plate coupled to the upper cooling plate to cool the heat generated from the heat dissipation object can be

Here, the flow path for the heat dissipation fins includes: a vertical flow path through which the cooling fluid flows vertically with respect to the upper cooling plate; It may include a horizontal flow path in communication with the vertical flow path, in which the cooling fluid flows horizontally with respect to the upper cooling plate.

A plurality of heat dissipation objects may be provided and arranged in parallel at intervals, and the main flow path may have a zigzag shape transversely to an arrangement direction of the plurality of heat dissipation objects.

The plurality of heat dissipation fins may be disposed under the heat dissipation object.

The plurality of the heat dissipation fins may have the same thickness or different thicknesses.

A plurality of the heat dissipation fins may be disposed with the same spacing or different spacing.

The plurality of heat dissipation fins located in an area where the heat of the heat dissipation target is concentrated may be disposed at relatively narrow intervals compared to the plurality of heat dissipation fins located in other areas.

The upper cooling plate may include an inlet for introducing the cooling fluid into the main flow path of the lower cooling plate; and an outlet through which the cooling fluid passing through the main flow path and the heat dissipation fin flow path of the lower cooling plate is discharged.

According to the present invention, a flow path through which the cooling fluid flows is formed between the heat dissipation fin of the upper cooling plate and the heat dissipation fin insertion groove of the lower cooling plate to improve the flow structure of the fluid, thereby increasing the heat exchange area within the same volume to improve heat transfer performance. It can be improved, and by simplifying the structure, mass production is easy, and the manufacturing cost can be reduced.

1 is a perspective view of a water-cooled heat sink according to a first embodiment of the present invention;
Figure 2 is an exploded perspective view of Figure 1;
3, a cross-sectional view taken along the line III-III of FIG. 1,
4 is an exploded cross-sectional view of FIG. 3;
5 is a perspective view of a water-cooled heat sink according to a second embodiment of the present invention;
Figure 6 is an exploded perspective view of Figure 5;
7 is an exploded cross-sectional view taken along line VII-VII of FIG. 5;
8 is a view showing the configuration of a water-cooled heat sink according to a third embodiment of the present invention;
9 is a view showing the configuration of a water-cooled heat sink according to a fourth embodiment of the present invention;
10A to 10C are image diagrams simulating the cooling test results of the heat dissipation object of the water-cooled heat sink according to the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and those of ordinary skill in the art to which the present invention pertains. It is provided to fully understand the scope of the present invention to those skilled in the art.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and/or “comprising” does not exclude the presence or addition of one or more other components in addition to the stated components. Like reference numerals refer to like elements throughout, and "and/or" includes each and every combination of one or more of the recited elements.

Unless otherwise defined, all terms (including technical and scientific terms) used herein will have the meaning commonly understood by those of ordinary skill in the art to which this invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless specifically defined explicitly.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Prior to the description, in various embodiments, components having the same configuration will be typically described in the first embodiment using the same reference numerals, and in other embodiments, configurations different from those of the first embodiment will be described. do.

1 to 4 show a water-cooled heat sink according to a first embodiment of the present invention.

As shown in these drawings, the water-cooled heat sink 1a according to an embodiment of the present invention includes an upper cooling plate 10 and a lower cooling plate 30 .

The upper cooling plate 10 and the lower cooling plate 30 are each independently manufactured.

The upper cooling plate 10 and the lower cooling plate 30 may be coupled to each other by fastening means such as bolts.

In addition, rubber packings (not shown) are provided on the surfaces facing each edge of the upper cooling plate 10 and the lower cooling plate 30 to provide a main flow path 31 of the lower cooling plate 30 to be described later. The flowing cooling fluid 200 is prevented from leaking to the outside.

The upper cooling plate 10 has a rectangular cross-sectional shape having a predetermined thickness.

A heat dissipation object 100 is provided on the upper surface of the upper cooling plate 10 . Here, in the present embodiment, although the heat dissipation object 100 is illustrated as being provided on the upper surface of the upper cooling plate 10 , the present invention is not limited thereto, and the upper cooling plate 10 is separated from the upper cooling plate 10 . It may be closely supported on the bottom surface of the heat dissipation object 100 .

In addition, the upper cooling plate 10 includes an inlet 11 and an outlet 15 through which the cooling fluid 200 is introduced and discharged.

The inlet 11 and the outlet 15 are disposed to face each other with the heat dissipation object 100 interposed therebetween.

The inlet 11 is provided to introduce the cooling fluid 200 into the main flow path 31 of the lower cooling plate 30 .

The outlet 15 is provided so that the cooling fluid 200 passing through the main flow path 31 of the lower cooling plate 30 and the heat dissipation fin flow path is discharged.

In addition, the upper cooling plate 10 has a plurality of heat dissipation fins 21 protruding vertically below the heat dissipation object 100 .

The plurality of heat dissipation fins 21 have a rectangular cross-sectional shape having a predetermined width and height. In addition, each of the plurality of heat dissipation fins 21 has the same thickness.

In addition, the plurality of heat dissipation fins 21 are disposed perpendicular to the lower surface of the upper cooling plate 10 at equal intervals.

The lower cooling plate 30 is coupled to the upper cooling plate 10 to cool the heat generated from the heat-dissipating object 100 .

The lower cooling plate 30 has a rectangular cross-sectional shape, and has a relatively large thickness compared to the upper cooling plate 10 .

The lower cooling plate 30 forms a main flow path 31 through which a cooling fluid 200 for cooling the plurality of heat dissipation fins 21 flows on a surface facing the upper cooling plate 10 .

The main flow path 31 communicates with the inlet 11 and the outlet 15 of the upper cooling plate 10 .

Meanwhile, on the main flow path 31 of the lower cooling plate 30 , a plurality of heat dissipation fin insertion grooves 41 into which the plurality of heat dissipation fins 21 are inserted are provided.

The plurality of heat dissipation fin insertion grooves 41 are provided respectively corresponding to the plurality of heat dissipation fins 21 of the upper cooling plate 10 .

Each heat dissipation fin insertion groove 41 has the same cross-sectional shape as the heat dissipation fin 21, and a depth greater than the height and thickness of the heat dissipation fin 21 to form a flow path 51 for the heat dissipation fin between each heat dissipation fin 21 and have a width

Meanwhile, in the plurality of heat dissipation fin insertion grooves 41 , a flow path 51 for the heat dissipation fins through which the cooling fluid 200 continuously flows between the plurality of heat dissipation fins 21 is formed.

The flow path 51 for radiating fins includes a vertical flow path 53 and a horizontal flow path 55 .

In the vertical flow path 53 , the cooling fluid 200 flows perpendicularly to the upper cooling plate 10 .

The horizontal flow path 55 communicates with the vertical flow path 53 , and the cooling fluid 200 flows horizontally with respect to the upper cooling plate 10 .

The flow path 51 for the heat dissipation fin is continuously formed along the arrangement direction of the plurality of heat dissipation fin insertion grooves 41, and the cooling fluid 200 continuously flows.

Accordingly, the main flow path 31 and the flow path 51 for radiating fins form one flow path through which the cooling fluid 200 continuously flows.

On the other hand, the vertical flow path 53 and the horizontal flow path 55 are alternately formed in the flow path 51 for the heat dissipation fin, so that on the flow path 51 for the heat dissipation fin, a plurality of regions bent at 90 degree angles (hereinafter, For convenience of description, referred to as an 'inflection region') is continuously formed.

For example, the inflection region is formed in each boundary region of the vertical flow path 53 and the horizontal flow path 55 , and accordingly, the inner surface of the heat dissipation fin insertion groove 41 and the upper portion of the area where the heat dissipation fin 21 protrudes. Each of the cooling plates 10 has a function of a collision plate on which the cooling fluid 200 collides.

For example, the cooling fluid 200 having a high speed through the vertical flow path 53 and flowing toward the horizontal flow path 55 is the inner surface of the heat dissipation fin insertion groove 41 or the upper cooling plate 10 in the inflection region. After the jet impingement on the surface, it flows into the horizontal flow path 55 .

Here, the jet collision is one of the methods in which a fluid collides with a wall surface of a heat source to transfer heat.

Therefore, as the cooling fluid 200 jet collides with the inner surface of the heat dissipation fin insertion groove 41 or the upper cooling plate 10, the thermal boundary layer of the cooling fluid 200 with jet collision becomes thinner, thereby Due to the thinned thermal boundary layer of the cooling fluid 200 according to the heat conduction law, the cooling fluid 200 has high heat transfer performance.

In addition, in the water-cooled heat sink 1a according to the first embodiment of the present invention, the cross section of the flow path 51 has a high aspect ratio and the curved pipe portion is continuous. is formed, and the cooling fluid 200 actively flows in the flow path 51 for the heat dissipation fins and is mixed, so that heat exchange between the heat dissipation fins 21 and the cooling fluid 200 is actively performed.

According to this configuration, after coupling the upper cooling plate 10 and the lower cooling plate 30 by means of a fastening means, the cooling fluid 200 pressurized through an external pump is applied to the inlet 11 of the upper cooling plate 10 . When flowing through, the cooling fluid 200 flows into one side of the main flow path 31 of the lower cooling plate 30 and flows along the main flow path 31 .

The cooling fluid 200 introduced into the main flow path 31 passes through the heat dissipation fin flow path 51 formed between the plurality of heat dissipation fins 21 and the plurality of heat dissipation fin insertion grooves 41, and then the main flow path 31 ) flows to the other side and is discharged to the outside through the outlet 15 of the upper cooling plate 10 .

Meanwhile, while the cooling fluid 200 passes through the flow path 51 for the heat dissipation fins, heat exchange is performed between the plurality of heat dissipation fins 21 and the cooling fluid 200 on the flow path 51 for the heat dissipation fins.

The cooling fluid 200 flowing along the flow path 51 for a heat dissipation fin flows with jet collision in each inflection region of the flow path 51 for a heat dissipation fin formed continuously.

The cooling fluid 200 which jets collides in each inflection region has a thin thermal boundary layer, and thus has high heat transfer performance.

Accordingly, heat exchange between the heat dissipation fins 21 and the cooling fluid 200 is increased.

As described above, according to the present invention, the cooling fluid 200 flows between the heat dissipation fin 21 of the upper cooling plate 10 and the heat dissipation fin insertion groove 41 of the lower cooling plate 30. The flow path 51 for the heat dissipation fin By improving the flow structure of the fluid by forming

In addition, by continuously forming a region bent at a 90 degree angle on the flow path 51 for the heat dissipation fin, jet collision occurs in the region where the cooling fluid 200 is bent, and the thermal boundary layer of the cooling fluid 200 becomes thinner and thinner. Due to the thermal boundary layer, the cooling fluid 200 has high heat transfer performance, so that the heat transfer performance can be further improved.

And, since the heat dissipation fin 21 and the heat dissipation fin insertion groove 41 have a cross-sectional shape having a high aspect ratio, a vortex is formed in the flow path 51 for the heat dissipation fin, and the cooling fluid 200 flows through the flow path 51 for the heat dissipation fin. In the active flow and mixing is made, it is possible to increase the heat exchange between the heat dissipation fin 21 and the cooling fluid (200).

In addition, in order to increase heat transfer of the cooling plate, the structure of the heat dissipation fin 21 is simplified to facilitate mass production and reduce manufacturing cost.

5 to 7 show a water-cooled heat sink according to a second embodiment of the present invention.

Unlike the first embodiment, the heat sink 1b according to the second embodiment of the present invention is provided with a plurality of heat dissipation objects 100 and has a larger area than the first embodiment.

The plurality of heat-dissipating objects 100 are arranged in parallel on the upper cooling plate 10 at intervals.

On the lower surface of the upper cooling plate 10 , a plurality of heat dissipation fin units 20 configured with a plurality of heat dissipation fins 21 to correspond to each heat dissipation object 100 are formed to protrude at intervals.

In the lower cooling plate 30 , a plurality of heat dissipation fin insertion groove units 40 into which a plurality of heat dissipation fins 21 are inserted are recessed corresponding to the plurality of heat dissipation fin units 20 of the upper cooling plate 10 .

Meanwhile, the main flow path 31 forms a zigzag shape horizontally with respect to the arrangement direction of the plurality of heat dissipation objects 100 .

On the main flow path 31, a flow path 51 for heat dissipation fins formed between a plurality of heat dissipation fins 21 and a plurality of heat dissipation fin insertion grooves 41 includes a plurality of heat dissipation fin units 20 and a plurality of heat dissipation fin insertion groove units ( 40) is formed in plurality corresponding to the quantity.

With this configuration, when the cooling fluid pressurized through an external pump is introduced through the inlet 11 of the upper cooling plate 10 , the cooling fluid is supplied to one side of the main flow path 31 of the lower cooling plate 30 . It flows in and flows along the main flow path (31).

The cooling fluid introduced into the main flow path 31 flows zigzag along the zigzag-shaped flow path, and a plurality of heat dissipation fin flow paths 51 formed by each heat dissipation fin unit 20 and each heat dissipation fin insertion groove unit 40. After passing through sequentially, it flows to the other side of the main flow path 31 and is discharged to the outside through the outlet 15 of the upper cooling plate 10 .

And, during the process of passing through the flow path 51 for each heat dissipation fin, the cooling fluid flows with jet collision in each inflection region of each flow path 51 for each heat dissipation fin, and the cooling fluid that collides with the jet has a thin thermal boundary layer. It has high heat transfer performance, and heat exchange is made between the plurality of heat dissipation fins 21 and the cooling fluid.

Meanwhile, FIG. 8 shows a water-cooled heat sink according to a third embodiment of the present invention.

In the heat sink 1c according to the third embodiment of the present invention, unlike the first embodiment described above, the height of the heat dissipation fins 21 is formed to be relatively low, so that the cooling fluid flows in the flow path 51 for the heat dissipation fins. The volume of the horizontal flow path 55 is formed to be relatively large.

Compared with the heat sink 1a according to the first embodiment, the heat sink 1c according to the third embodiment of the present invention of this type has a heat dissipation fin as the volume of the horizontal flow path 55 is relatively increased. The pressure drop of the cooling fluid flowing in the flow path 51 is relatively low.

Accordingly, in the heat sink 1c according to the third embodiment of the present invention, as compared to the first embodiment, the pressure loss in the flow path 51 for the heat dissipation fin is reduced, and as the pressure loss decreases, the discharge amount of the pump As this increases, heat transfer is also increased, and heat exchange efficiency can be further improved.

On the other hand, the cooling test result of the heat dissipating object when the heat sink 1c according to the third embodiment of the present invention and the heat sink 1a according to the first embodiment of the present invention are tested under the same conditions will be described later. do.

9 shows a water-cooled heat sink according to a fourth embodiment of the present invention.

In the heat sink 1d according to the fourth embodiment of the present invention, the plurality of heat dissipation fins 21 have different thicknesses, unlike the second embodiment described above.

Among the plurality of heat dissipation fins 21 , the heat dissipation fins 21 located in the region where the heat of the heat dissipation target 100 is intensively generated has a small thickness and is formed to protrude at a narrow interval, and is located in another area of the heat dissipation target 100 . The remaining heat dissipation fins 21 have a large thickness and are formed to protrude at a wide interval.

The plurality of heat dissipation fin insertion grooves 41 are recessed to correspond to the spacing between the plurality of heat dissipation fins 21 . Among the plurality of heat dissipation fin insertion grooves 41 , the heat dissipation fin insertion grooves disposed in the region where the heat of the heat dissipation object 100 is concentrated is formed to be depressed at a narrow interval, and the remaining heat dissipation fin insertion grooves are recessed at a wide interval.

As such, in the water-cooled heat sink 1d according to the fourth embodiment of the present invention, by arranging the heat dissipation fins 21 at a location where the heat of the heat dissipation object 100 is concentrated at a narrow interval, the heat of the heat dissipation object 100 is By increasing the density of the flow path 51 for the heat dissipation fins at this concentrated position, heat exchange between the heat dissipation fins 21 and the cooling fluid is further improved, and the temperature distribution of the heat dissipation object 100 can be made uniform.

On the other hand, the cooling test result of the heat dissipating object 100 when the heat sink 1d according to the fourth embodiment of the present invention and the heat sink 1c according to the third embodiment of the present invention were tested under the same conditions. to be described later.

Meanwhile, FIGS. 10A to 10C are image diagrams simulating a cooling test result of a heat dissipation object of a water-cooled heat sink according to an embodiment of the present invention.

10A shows a heat sink according to a first embodiment of the present invention, FIG. 10B shows a heat sink according to a third embodiment of the present invention, and FIG. 10C shows a heat sink according to a fourth embodiment of the present invention A heat sink is shown.

Based on the cooling test result of the heat dissipating object 100 of the heat sink 1a according to the first exemplary embodiment of the present invention, the cooling test results of the heat dissipating object 100 of the heat sink according to the other exemplary embodiments are compared.

Compared to the heat sink 1a according to the first embodiment, the heat sink 1c according to the third embodiment of the present invention has the same standard deviation of the temperature of the heat dissipating object and the average temperature of the heat dissipating object, but the pressure drop of the cooling fluid It can be seen that is relatively low.

In addition, compared with the heat sink 1c according to the third embodiment, the heat sink 1d according to the fourth embodiment of the present invention has a standard deviation of the temperature of the heat dissipating object and the average temperature of the heat dissipating object is relatively low. , it can be seen that the pressure drop of the cooling fluid is relatively high.

Therefore, the water-cooled heat sink according to the present invention may be modified in various forms in consideration of the heat dissipation area and heat dissipation distribution of the heat dissipation object.

As described above, according to the present invention, a flow path through which the cooling fluid flows is formed between the heat dissipation fin of the upper cooling plate and the heat dissipation fin insertion groove of the lower cooling plate to improve the flow structure of the fluid, thereby increasing the heat exchange area within the same volume. It is possible to improve the heat transfer performance, and to simplify the structure to facilitate mass production and to reduce the manufacturing cost.

In the above, embodiments of the present invention have been described with reference to the accompanying drawings, but those skilled in the art to which the present invention pertains can realize that the present invention can be embodied in other specific forms without changing the technical spirit or essential features thereof. you will be able to understand Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

1a, 1b, 1c, 1d: water-cooled heat sink
10: upper cooling plate
11: Inlet
15: outlet
20: heat dissipation fin unit
21: heat dissipation fin
30: lower cooling plate
31: main flow path
40: heat dissipation fin insertion groove unit
41: heat dissipation fin insertion groove
51: flow path for heat dissipation fins
53: vertical flow path
55: horizontal flow path
100: heat dissipation object
200: cooling fluid

Claims (8)

an upper cooling plate supporting one or more heat-dissipating objects and having a plurality of heat-dissipating fins protruding at intervals to dissipate heat generated from the heat-dissipating object on one plate surface to cool the heat-dissipating object;
A main flow path formed on a surface facing the upper cooling plate and through which a cooling fluid flows, and a plurality of the heat dissipation fins are provided on the main flow path to allow insertion of the cooling fluid between the plurality of heat dissipation fins. and a lower cooling plate having a plurality of heat dissipation fin insertion grooves forming a flow path for a flowing heat dissipation fin, and coupled to the upper cooling plate to cool the heat generated from the heat dissipation object;
The flow path for the heat dissipation fin includes a vertical flow path through which the cooling fluid flows vertically with respect to the upper cooling plate, and a horizontal flow path communicating with the vertical flow path and through which the cooling fluid flows horizontally with respect to the upper cooling plate. including,
The vertical flow path and the horizontal flow path are alternately formed so that the cooling fluid flows in a vertical direction and flows in a horizontal direction alternately,
In the boundary region between the vertical flow path and the horizontal flow path, the cooling fluid flowing in the vertical direction through the vertical flow path jets impingement on the inner surface of the heat dissipation fin insertion groove or the upper cooling plate, and then the horizontal A water-cooled heat sink, characterized in that an inflection region flowing into the flow path is formed. delete According to claim 1,
The heat dissipation object is provided in plurality and arranged in parallel with an interval,
The main flow path is a water-cooled heat sink, characterized in that forming a zigzag shape transversely with respect to the arrangement direction of the plurality of heat-dissipating objects. According to claim 1,
The plurality of heat dissipation fins are water-cooled heat sinks, characterized in that disposed under the heat dissipation object. According to claim 1,
A plurality of the heat dissipation fins are water-cooled heat sinks, characterized in that having the same thickness or different thicknesses. According to claim 1,
A plurality of the heat dissipation fins are water-cooled heat sinks, characterized in that disposed with the same spacing or different spacing. According to claim 1,
The plurality of heat dissipation fins located in an area where the heat of the heat dissipation target is concentrated is disposed at relatively narrow intervals compared to the plurality of heat dissipation fins located in other areas. According to claim 1,
The upper cooling plate,
an inlet for introducing the cooling fluid into the main flow path of the lower cooling plate;
and an outlet through which the cooling fluid passing through the main flow path and the heat dissipation fin flow path of the lower cooling plate is discharged.

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