M328022 八、新型說明： 【新型所屬之技術領域】 尤指一種具有工作流體 本創作係有關一種散熱裝置 之水冷散熱裝置。 【先前技術】 隨者電子元件及其所包括的半導體所需要的 、越大，致使相關系統的用電密度激增，連帶的也導 控制^牛的發熱量大為增加，特別是在電腦主機内部，由 齡於電腦主機的運算效能不斷提升 秘夕^ ^ 呀周邊的電子組件亦 «夕’使付電腦整體發熱量亦隨之大幅提升，因此 ::::70件所產生過高的溫度，使電腦主機内部的工作 定’因此散熱對策無疑成為現今科技發展的一 貝更要關鍵。 就目前而言，最為被人所悉的習知技術就是風扇，由 :風扇具有產生強制氣流的作用，經由強制氣流的帶動， 丄電子元件周遭已吸引熱源的空氣帶離，在氣流不斷的猶 ~ x進行氣冷式的散熱作用；然而，風扇的體積需要 較大的容設空間，且氣冷式的散熱作用越來越上 的產生’使得對於賴效果A打折扣。 ^ 、而為了彌補氣冷式散熱作用的不足，習知的另_種作 法便疋採，水冷式散熱裝置，由於採用工作流體的散熱作 用具有較高的導熱效能，將具有工作流體流通的水冷頭直 接貼附於電子元件上，使該工作流體直接及快速的與電子 兀件產生熱交換作用，之後已吸足熱源的工作流體則再 M328022 經過所連通的一散熱排 體循環之下，以進行散熱政熱’如此不斷的工作流 雖然水冷式的散熱作用可 而，水冷式的散熱結構仍存有―二：佳::熱：果，然 熱效率取決於工作流體與散熱排、六盗…；水冷式的散 “源的工作流體與散熱排進行熱交換；：二吸有熱 .排再對外散逸，但習知的勒、 使熱源傳至散熱 過快，與散熱排接觸時間：足、::：常=為工作流體流動 冷頭時，無法再繼續進行熱交“t = f循環回到水 散熱效能；而後續的習知技術為了解 ^響到整體的 在放熱排内部迂迴流道， 口此 可改善工作流體的流動#，W作;;體逮度，雖此舉雖 觸時間，以利…：f 作流體與散熱排的接 仍：/1 與散熱排結構進行熱交換作用， 兩：：：流體與散熱排的接觸面積，仍無法快速進‘ :者間的熱傳作用’依舊具有美中不足之處。 【新型内容】 有夕述之缺失’本創作之主要目的在於提供-種具 ⑼乂之水冷式散熱排及包括該散熱排之散熱裝置， 2在組成該散熱排之同-腔體内部設置多重流道，除了 減、、喪工作流體於單-腔體内部之流速外’並透過多重流道 2置’增加工作流體與單一腔體之接觸面積，提昇整體 放熱排之散熱效率。 為達成上述之目的，本創作係主要提供一種水冷式散 …排及包括該散熱排之散熱裝置，該散熱排係主要包括複 M328022 數腔體，其中各腔體腔體内部設有複數之複數流道，於該 腔體之一側面設有複數垂直排列之散熱片’於該些腔體上 下端分別連接一固定座，且使該腔體之流道開口外露於該 些固定座之另-端面上，又於該些固定座之外側分別連^ 一上蓋及一下蓋，該上蓋及下蓋上分別設有複數凹槽，該 -些凹槽分別對應該腔體流道之開口，使相鄰之腔體内部之 ，複數⑻，形成連通’另該上蓋兩端分別^有與凹槽連通之 進水f道及-出水管道，以使卫作流體進出該散敎排。 •【實施方式】 茲將本創作之内容配合圖式來加以說明： _請㈣第i及第二圖’係分別為本創作之散熱排組 裝不意圖及腔體立體結構圖。如圖所示，該散熱排ι係主 要包括至少一腔體u，於本實施例中係具有複數腔體u， 其㈣些腔體u係呈矩形體，如第二圖之立體結構圖所示 ’賴體11係由高導熱材質所構成，且於該腔體U内部阻 #隔形成複數流道m ，又，於該腔體u上設有複數垂直立 於同-侧面之散熱片12，並在設有複數散熱片12之同一側 面兩端預留空間，以形成實質之插接端位置，另各散熱片 12=間隔㈣’並任相鄰之散熱片12形成-散熱通道13 i續參閱第-圖，之後該些腔體21之上下端分別連接一固 疋座14 °亥二固疋座14係呈一長形板體，於該些固定座μ 上刀別開。又複數貝穿板體之插槽⑷，以供該些腔體η之 兩端插設，同時該腔體η内部複數流道⑴之開口外露於 該些固定座14之另一端面上。M328022 VIII. New description: [New technical field] Especially a working fluid This paper is a water-cooling heat sink for a heat sink. [Prior Art] The larger the required electronic components and the semiconductors they contain, the greater the power density of the related systems, and the associated heat generation of the control system is greatly increased, especially in the mainframe of the computer. The computing power of the computer host is constantly improving. The surrounding electronic components are also greatly improved. Therefore, the temperature of the computer is greatly increased. Therefore, the temperature of the ::::70 is too high. Make the internal work of the computer host 'so the cooling countermeasures will undoubtedly become the key to the development of today's technology. For the time being, the most well-known technique is the fan. The fan has the function of generating a forced air flow. The forced airflow is used to drive away the air that has attracted the heat source around the electronic components. ~ x performs air-cooling heat dissipation; however, the volume of the fan requires a large space for accommodation, and the air-cooled heat dissipation effect is increasingly generated to make the effect A less favorable. ^, and in order to make up for the lack of air-cooling heat dissipation, the other methods are well-known, water-cooled heat sinks, due to the high heat transfer efficiency of the working fluid, will have water-cooled working fluid circulation The head is directly attached to the electronic component, so that the working fluid directly and quickly exchanges heat with the electronic component, and then the working fluid that has absorbed the heat source is then passed through the connected heat dissipation body cycle of the M328022. Cooling political heat's such continuous workflow, although water-cooled heat dissipation can be used, water-cooled heat dissipation structure still exists - two: good:: heat: fruit, but the thermal efficiency depends on the working fluid and heat dissipation row, six thieves... The water-cooled “source” working fluid exchanges heat with the heat dissipation row; the second suction has heat. The discharge is dissipated outside, but the conventional Le, the heat source is transmitted to the heat dissipation too fast, and the heat discharge row is in contact with the time: foot,: ::Constantly = When the working fluid flows cold head, it is no longer possible to continue the heat exchange "t = f cycle back to the water cooling efficiency; and the subsequent conventional technology is to understand the sound of the sound in the overall heat release Internal turbulent return channel, this can improve the flow of working fluid #, W;; body catching, although this action touches time, to benefit...:f for fluid and heat sink connection still: /1 and heat dissipation row structure For heat exchange, the contact area between the two::: fluid and the heat sink is still unable to quickly enter the 'heat transfer effect between the two' is still a fly in the ointment. [New content] There is a lack of eves. The main purpose of this creation is to provide a water-cooled heat sink with a (9) 及 and a heat sink including the heat sink. 2 Build multiple inside the same cavity that constitutes the heat sink. In addition to reducing the flow rate of the working fluid inside the single-cavity, the flow path increases the contact area between the working fluid and the single cavity through the multiple flow channel 2, thereby improving the heat dissipation efficiency of the overall heat release row. In order to achieve the above purpose, the present invention mainly provides a water-cooled type of heat sink and a heat sink including the heat sink, the heat dissipation system mainly includes a plurality of M328022 number of cavities, wherein a plurality of complex streams are arranged inside each cavity a plurality of vertically arranged fins are disposed on one side of the cavity, and a fixing seat is respectively connected to the upper and lower ends of the cavity, and the flow channel opening of the cavity is exposed to the other end of the fixing seat And an upper cover and a lower cover respectively connected to the outer sides of the fixed seats, wherein the upper cover and the lower cover respectively have a plurality of grooves respectively corresponding to the openings of the cavity flow passages to make adjacent Inside the cavity, the plurality (8) forms a connection. The other ends of the upper cover respectively have an inflow water path and a water outlet pipe communicating with the groove, so that the fluid flows into and out of the divergence row. • [Implementation] The content of this creation is described in conjunction with the schema: _Please (4) The i and second diagrams are the schematic diagrams of the heat dissipation assembly and the three-dimensional structure of the cavity. As shown in the figure, the heat dissipation row 1-5 mainly includes at least one cavity u. In the embodiment, the cavity has a plurality of cavities u, and (4) the cavities u are rectangular bodies, as shown in the three-dimensional structure diagram of the second figure. The 'Lai body 11 is composed of a highly thermally conductive material, and a plurality of flow passages m are formed in the internal cavity of the cavity U. Further, a plurality of fins 12 vertically standing on the same side are disposed on the cavity u. And space is reserved at both ends of the same side surface of the plurality of heat sinks 12 to form a substantial plug end position, and the other heat sinks 12=interval (four)' and adjacent heat sinks 12 are formed - heat dissipation channels 13 i In the first embodiment, the lower end of the cavity 21 is respectively connected to a solid seat. The solid frame is formed by an elongated plate. The upper plate is formed on the fixed seat μ. Further, a plurality of slots (4) of the shells are inserted through the slots (4) for inserting the two ends of the cavity η, and the openings of the plurality of flow passages (1) of the cavity η are exposed on the other end faces of the fixing blocks 14.