CN211607189U - Liquid cooling device with pumping structure - Google Patents

Abstract

The utility model relates to a liquid cooling device with pumping structure contains heat dissipation row, water-cooling head and pumping structure. The heat dissipation row comprises a shell seat and a plurality of heat dissipation fins, wherein the shell seat is provided with a water cooling connecting hole and a pumping hole, and one side of the shell seat is provided with a first combining hole; the water cooling head is in heat conduction with the heating component and is provided with a water cooling outlet and a water cooling inlet; the pump structure comprises a pump and a frame seat, the pump is provided with a water inlet hole and a water outlet hole, the pump is arranged in the frame seat, a hollow part is reserved between the pump and the frame seat, the frame seat is provided with a second combination hole corresponding to the first combination hole, the frame seat is attached to one side surface of the heat dissipation bar by penetrating the first combination hole and the second combination hole through the locking component, and the hollow part is correspondingly positioned on one outer side of the heat dissipation plate; therefore, the assembly of the liquid cooling device is simplified and the heat dissipation efficiency is improved.

Description

Liquid cooling device with pump structure

technical field

The utility model relates to a liquid cooling device, in particular to a liquid cooling device with a pump structure.

Background technique

With the development of technology, today's electronic components operate faster and have stronger functions. Therefore, it is a necessary design choice to use heat sinks to reduce the temperature of electronic components. As the heat generated by electronic components is also getting higher and higher, traditional The forced air cooling is no longer enough, replaced by a liquid cooling device with better heat dissipation efficiency.

Furthermore, a general liquid cooling system includes a cold plate, a pump, a heat dissipator and a conduit for connecting with each other, and the circulating pipeline is filled with a working fluid (usually water); In this way, the water-cooled head is brought into contact with the heat-generating source, and the heat is taken away from the heat-generating source by heat conduction. At the same time, the working fluid in the circulation pipeline is driven by a water pump to circulate, so that the working fluid flows through the water-cooled head and conducts heat exchange. The entrained heat energy is conducted to the heat sink, thereby dissipating to the outside air.

However, in order to comply with the increasingly thin and short shape of today's products, the heat dissipation structure of electronic devices is also gradually moving towards a simplified design direction. In this regard, how to provide a liquid cooling device with good heat dissipation efficiency and compact structure is the research motivation of the author.

Utility model content

One objective of the present invention is to provide a liquid cooling device with a pump structure, so as to simplify the assembly of the liquid cooling device and improve the heat dissipation efficiency.

In order to achieve the above-mentioned purpose, the present invention is a liquid cooling device with a pump structure, which includes a heat sink, a water cooling head and a pump structure. The heat sink includes a shell seat and several heat sinks arranged on one side of the shell seat. The shell seat has a first water cooling connection hole, a second water cooling connection hole, a first pump hole and a second pump hole, and the shell seat has One side is provided with several first combining holes; the water-cooled head is thermally conductively connected to the heating element, and the water-cooled head has a water-cooled inlet connected to the first water-cooled connection hole and a water-cooled outlet connected to the second water-cooled connection hole; the pump structure includes a pump and a connection pump The frame seat of the pump, the pump has a water inlet hole connected with the first pump hole and a water outlet hole connected with the second pump hole, the pump is arranged in the frame seat, and a hollow is left between the pump and the frame seat The frame seat is provided with a plurality of second bonding holes corresponding to the plurality of first bonding holes, and the frame seat is attached to the heat sink through the first bonding holes and the second bonding holes through a plurality of locking components. a side surface of the fins and the hollow portion is located on an outer side of the heat sinks.

Compared with the prior art, the liquid cooling device with the pump structure of the present invention is provided with a water cooling connection hole and a pump hole in the shell seat of the heat dissipation radiator, and a plurality of first coupling holes are arranged on one side of the shell seat. Accordingly, the frame seat of the pumping structure can be attached to one side of the heatsink through the first coupling hole of the heatsink and the second coupling hole of the pumping structure through several locking components, and the pumping structure of the pumping structure It is arranged in the frame seat, and there is a hollow part between the pump and the frame seat, and the hollow part is located on an outer side of the heat sink correspondingly, so that the heat dissipated from the heat sink will be discharged from the hollow part to the outside, thereby The assembly of the liquid cooling device is simplified, and the practicability of the utility model is increased.

Description of drawings

FIG. 1 is a schematic exploded perspective view of a liquid cooling device with a pump structure according to the present invention.

2 is a schematic three-dimensional appearance diagram of a liquid cooling device with a pump structure according to the present invention.

FIG. 3 is a front view of a liquid cooling device with a pump structure of the present invention.

FIG. 4 is another embodiment of the liquid cooling device with the pump structure of the present invention.

FIG. 5 is another embodiment of the liquid cooling device with the pump structure of the present invention.

Description of symbols in the attached drawings:

1: Liquid cooling device; 10: Radiator; 11: Shell base; 111: First water cooling connection hole; 112: Second water cooling connection hole; 113: First pump hole; 114: Second pump hole; 115: The first combination hole; 116: lug; 12: heat sink; 20: water cooling head; 21: water cooling inlet; 22: water cooling outlet; 30: pump structure; 300: hollow part; 31: pump; 32: frame base ;33: water inlet hole; 34: water outlet hole; 35: second combination hole; 36: locking component; 37: connecting pipe; 38: supporting rib; 40: cooling fan; 50: duct; 51: first duct; 52 : Second catheter.

Detailed ways

The detailed description and technical content of the present invention are described below in conjunction with the drawings. However, the accompanying drawings are only for reference and description, and are not intended to limit the present invention.

Please refer to FIG. 1 to FIG. 3 , which are a perspective exploded schematic diagram, a perspective appearance schematic diagram and a front view of a liquid cooling device with a pump structure of the present invention. The utility model is a liquid cooling device 1 with a pump structure, which is used for cooling a heating element (not shown), and includes a heat dissipation radiator 10 , a water cooling head 20 and a pump structure 30 . In this embodiment, the liquid cooling device 1 further includes a cooling fan 40 . The water cooling head 20 is connected to the heat sink 10 for attaching to the heating element. The pumping structure 30 and the cooling fan 40 are combined on two opposite sides of the cooling radiator 10 to form the liquid cooling device 1 .

The heat sink 10 includes a housing 11 and a plurality of cooling fins 12 disposed on one side of the housing 11 . The housing 11 has a first water cooling connection hole 111 , a second water cooling connection hole 112 , a first pumping hole 113 and a second pumping hole 114 , and one side of the housing seat 11 is provided with several first water cooling holes 112 . Bonding hole 115 . In this embodiment, a plurality of lugs 116 extend from the housing base 11 , and the first combining holes 115 are correspondingly disposed on the lugs 116 . It should be noted that the internal structure of the heat dissipation radiator 10 is known in the art, and details are not described herein again.

The water cooling head 20 is thermally connected to the heating element, so as to take away the heat generated by the heating element. The water cooling head 20 has a water cooling inlet 21 connected to the first water cooling connection hole 111 and a water cooling outlet 22 connected to the second water cooling connection hole 112 . In this embodiment, the water cooling head 20 is a rectangular parallelepiped, but not limited thereto. In addition, a side surface of the water cooling head 20 is flat against an outer surface of the housing base 11 . Accordingly, the water cooling inlet 21 is connected to the first water cooling connection hole 111 , and the water cooling outlet 22 is connected to the second water cooling connection hole 112 .

The pump structure 30 includes a pump 31 and a frame 32 connected to the pump 31 . The pump 31 has a water inlet hole 33 communicating with the first pump hole 113 and a water outlet hole 34 communicating with the second pump hole 114 . The pump 31 is disposed in the frame 32 , and a hollow portion 300 is left between the pump 31 and the frame 32 . In addition, the frame base 32 is provided with a plurality of second coupling holes 35 corresponding to the first coupling holes 115 of the casing base 11 ; A coupling hole 115 and the second coupling holes 35 are attached to a side surface of the heat sink 10 and the hollow portion 300 is located on an outer side of the heat sinks 12 correspondingly. Accordingly, the heat dissipated from the fins 12 is discharged to the outside through the hollow portion 300 .

It is worth noting that, in this embodiment, the pump structure 30 further includes a plurality of connecting pipes 37 , and the pump 31 communicates with the frame 32 through the connecting pipes 37 . Preferably, the pump structure 30 further includes a plurality of support ribs 38 , and the support ribs 38 are connected to the pump 31 and the frame 32 to support the pump 31 to be disposed in the frame 32 .

Furthermore, the cooling fan 40 is coupled to the other side of the cooling radiator 10 relative to the pump structure 30 . The cooling fan 40 can generate forced airflow to take away the heat of the cooling radiator 10 .

It should be noted that, in this embodiment, the water cooling head 20 of the liquid cooling device 1 with the pump structure of the present invention is directly attached to an outer side surface of the heat dissipation radiator 10, but this is not implemented in actual implementation. The form is restricted.

Please refer to FIG. 4 , which is another embodiment of the liquid cooling device with the pump structure of the present invention. In an embodiment of the present invention, the liquid cooling device 1 further includes a plurality of conduits 50 , and the water cooling head 20 is connected to the heat sink 10 through the conduits 50 . Specifically, the conduits 50 include a first conduit 51 and a second conduit 52 . Two ends of the first conduit 51 are respectively connected to the first water cooling hole 111 and the water cooling inlet 21 ; two ends of the second conduit 52 are respectively connected to the second water cooling hole 112 and the water cooling outlet 22 .

Please refer to FIG. 5 again, which is another embodiment of the liquid cooling device with the pump structure of the present invention. In another embodiment of the present invention, the liquid cooling device 1 further includes a plurality of heat sinks 10 and a plurality of pump structures 30 , and the heat sinks 10 and the pump structures 30 are in a pairwise corresponding manner. arranged side by side. The liquid cooling device 1 further includes a plurality of cooling fans 40 , and the cooling fans 40 are respectively coupled to the other side of the heat dissipation fins 10 relative to the pumping structures 30 , so as to pass the plurality of cooling fins 10 , the The pump structure 30 and several cooling fans 40 are arranged side by side to increase the cooling efficiency of the liquid cooling device 1 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Other equivalent changes using the patent spirit of the present invention shall all belong to the scope of the present invention.

Claims (10)

1. A liquid cooling device with a pumping structure for cooling a heat generating component, comprising:

the heat dissipation bar comprises a shell seat and a plurality of heat dissipation fins arranged on one side of the shell seat, wherein the shell seat is provided with a first water cooling connecting hole, a second water cooling connecting hole, a first pumping hole and a second pumping hole, and a plurality of first combination holes are formed in one side of the shell seat;

the water cooling head is in heat conduction connection with the heating component and is provided with a water cooling inlet communicated with the first water cooling connecting hole and a water cooling outlet communicated with the second water cooling connecting hole; and

the pump structure comprises a pump and a frame seat connected with the pump, the pump is provided with a water inlet communicated with the first pump hole and a water outlet communicated with the second pump hole, the pump is arranged in the frame seat, a hollow part is reserved between the pump and the frame seat, the frame seat is provided with a plurality of second combination holes corresponding to the plurality of first combination holes, the frame seat is attached to one side surface of the heat dissipation bar by penetrating the plurality of first combination holes and the plurality of second combination holes through a plurality of locking components, and the hollow part is correspondingly positioned at one outer side of the plurality of radiating fins.

2. The liquid cooling device with a pumping structure as claimed in claim 1, wherein the housing extends with a plurality of protruding lugs, and the plurality of first combining holes are correspondingly disposed on the plurality of protruding lugs.

3. The liquid cooling apparatus with pump structure as claimed in claim 1, wherein a side of the water cooling head is flush against an outer surface of the housing, the water cooling inlet is butted to the first water cooling connection hole, and the water cooling outlet is butted to the second water cooling connection hole.

4. The liquid cooling device with a pumping structure as set forth in claim 1, wherein the water cooling head is a rectangular parallelepiped.

5. The liquid cooling device with a pumping structure as claimed in claim 1, wherein the pumping structure further comprises a plurality of connecting pipes, and the pump is connected to the frame through the plurality of connecting pipes.

6. The liquid cooling device with a pumping structure as claimed in claim 1, further comprising a heat dissipation fan coupled to another side of the heat dissipation plate opposite to the pumping structure.

7. The liquid cooling device with a pumping structure as set forth in claim 1, further comprising a plurality of conduits, wherein the water cooling head is connected to the heat dissipation bank through the plurality of conduits.

8. The liquid cooling device with a pump structure as claimed in claim 7, wherein the plurality of pipes includes a first pipe and a second pipe, the first pipe has two ends respectively connected to the first water-cooling connection hole and the water-cooling inlet, and the second pipe has two ends respectively connected to the second water-cooling connection hole and the water-cooling outlet.

9. The liquid cooling device with pumping structure as claimed in claim 7, further comprising a plurality of heat dissipation rows and a plurality of pumping structures, wherein the heat dissipation rows and the pumping structures are disposed side by side in a corresponding manner.

10. The liquid cooling device with pumping structure as claimed in claim 9, further comprising a plurality of heat dissipation fans respectively coupled to the other side of each heat dissipation row opposite to the pumping structure.

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