CN222017067U - Composite cooling device - Google Patents

Abstract

A composite heat dissipation device includes a water-cooled heat dissipation module, an air-cooled heat dissipation module, and a fan module. The water-cooled heat dissipation module includes a substrate unit in contact with a high-temperature electronic unit, and a water-cooled heat dissipation unit. The air-cooled heat dissipation module includes two heat dissipation frame units, and a guide cover unit. The water-cooled heat dissipation module can be used to exchange the heat energy generated by the high-temperature electronic unit through water-cooled heat dissipation, and the heat dissipation frame unit of the air-cooled heat dissipation module can be used to simultaneously conduct the heat energy of the substrate unit and the high-temperature electronic unit, and can be used to perform air-cooled heat dissipation through external airflow, thereby achieving a composite heat dissipation method that combines water-cooled heat dissipation and air-cooled heat dissipation. In addition, the guide cover unit covers the interval between the heat dissipation frame units to define a guide space, and the hollow structure of the guide space can be used to effectively reduce the fluid resistance of the airflow and increase the efficiency of air cooling and heat dissipation when the airflow flows through the heat dissipation frame unit.

Description

Combined heat radiator

Technical Field

The present utility model relates to a heat sink, and more particularly to a composite heat sink.

Background

In the prior art, in electronic devices such as computers and servers, high-efficiency operation high-thermal electronic components (such as electronic chips such as CPU or GPU) are commonly used, and because high temperature is generated during operation, a water-cooled radiator is often required to be arranged on the electronic components, cold water flows into the water-cooled radiator from a cold water pipe and dissipates heat of the electronic components generating high temperature, so that the cold water flows through the water-cooled radiator to be heated into hot water, flows out of the water-cooled radiator module to a heat dissipation row to be cooled into cold water, and the cold water flows back to the water-cooled radiator to perform water-cooled heat dissipation operation in a continuous circulation mode. However, in the existing water-cooled radiator, only cold water flows through the water-cooled radiator to perform heat exchange, and then the warmed water flows out to the heat dissipation row to cool the heat dissipation row to form cold water, so that heat is taken away quickly in a liquid single circulation mode, but if the temperature generated by the high-heat electronic element is very high, the water-cooled radiator can not cool down effectively in time, so that the problem that internal heat accumulation or local hot spots can not dissipate heat can be caused, and the heat dissipation device is really worthy of careful study, study and improvement by practitioners.

Disclosure of Invention

Therefore, the present utility model provides a composite heat sink with excellent heat dissipation efficiency.

Thus, the composite heat dissipating device comprises a water cooling module, a cooling monitoring module connected with the water cooling module, and an air cooling module. The water cooling module comprises a substrate unit contacted with a high-thermal electronic unit and a water cooling unit arranged on the substrate unit. The cooling monitoring module comprises a heat dissipation row unit. The air-cooled heat dissipation module comprises two heat dissipation frame units which are positioned above the water-cooled heat dissipation units of the water-cooled heat dissipation module and are spaced from each other, and a guide cover unit which is connected with the heat dissipation frame units. The heat dissipation frame unit is positioned at two opposite ends of the air guide sleeve unit. The air guide cover unit is combined with the heat dissipation frame units and covers the intervals among the heat dissipation frame units to define an air guide space. Each heat dissipation frame unit is provided with a heat dissipation fin group and a heat pipe unit which extends upwards from the base plate unit of the water cooling heat dissipation module and penetrates through the heat dissipation fin group.

In particular, the heat dissipation fin group of each heat dissipation frame unit of the air-cooled heat dissipation module is provided with a plurality of heat dissipation fins which are mutually parallel and spaced, the heat dissipation fins are matched to define a plurality of heat dissipation channels, the heat pipe units of the heat dissipation frame units respectively penetrate through at least part of the heat dissipation fins of the heat dissipation fin group, and the heat pipe units conduct heat energy of the substrate unit and the high-heat electronic unit to the heat dissipation fins for heat dissipation.

In particular, after the external air flows through the radiating fins of one radiating fin group and the air flows into the diversion space gradually, the air flows in the diversion space continuously flow to the radiating fins of the other radiating fin group and gradually flow out from the radiating fins of the other radiating fin group.

Specifically, cold water flows into the water cooling unit of the water cooling module, the water cooling unit dissipates heat of the substrate unit and the high-thermal electronic unit, the cold water flows through the water cooling unit and then rises to hot water, the hot water flows out of the water cooling unit, the cooling monitoring module further comprises a cold water pipe communicated with the heat radiating row unit and the water cooling unit, and a hot water pipe communicated with the heat radiating row unit and the water cooling unit, the hot water generated by flowing through the water cooling unit flows into the heat radiating row unit from the hot water pipe of the cooling monitoring module to cool down to cold water, and the cold water flows into the water cooling unit from the cold water pipe of the cooling monitoring module.

The base plate unit of the water cooling module is provided with a water cooling base plate contacting the high-heat electronic unit and two partition plates which are parallel and spaced and transversely arranged on the water cooling base plate and extend upwards from the water cooling base plate, the water cooling unit is provided with a water cooling shell which is covered on the water cooling base plate and communicated with the cooling monitoring module, the water cooling shell is matched with the water cooling base plate to define a water cooling space, the water cooling shell is provided with two parallel and spaced side surfaces, a cold water pipe of the cooling monitoring module is connected with one side surface of the water cooling shell, the hot water pipe is connected with the other side surface of the water cooling shell, the partition plates are positioned in the water cooling space and respectively connected with the side surfaces of the water cooling shell, each partition plate extends from the corresponding side surface to the other side surface and is separated from the other side surface by a water inlet, the partition plates are matched with the side surfaces to separate the water cooling space into a cold water area corresponding to the cold water pipe, a diversion area positioned between the partition plates, and a hot water area corresponding to the hot water pipe, the cold water pipe flows into the cold water area in the water cooling shell from the cold water pipe, and the hot water pipe flows out of the diversion area from the water pipe through the diversion area to the hot water pipe from the hot water pipe to the hot water pipe.

Particularly, the base plate unit of the water cooling module is also provided with a first heat transfer sheet group transversely arranged on the water cooling bottom plate and positioned in the cold water area, a second heat transfer sheet group transversely arranged on the water cooling bottom plate and positioned in the flow guiding area, and a third heat transfer sheet group transversely arranged on the water cooling bottom plate and positioned in the hot water area.

Particularly, the heat pipe unit of the heat dissipation frame unit of the air-cooled heat dissipation module is provided with a plurality of heat pipes penetrating through the heat dissipation fin groups, wherein each heat pipe of one heat pipe unit is provided with a horizontal pipe body penetrating through the water cooling shell and penetrating through at least part of the first heat transfer fin group of the base plate unit, and an upright pipe body penetrating through the heat dissipation fins of the corresponding heat dissipation fin group from one end of the horizontal pipe body penetrating out of the water cooling shell upwards extends; each heat pipe of the other heat pipe unit is provided with a horizontal pipe body penetrating through the water cooling shell and penetrating through at least part of the substrate unit, and an upright pipe body penetrating through the heat radiating fins of the corresponding heat radiating fin group, wherein one end of the horizontal pipe body penetrating out of the water cooling shell extends upwards.

In particular, the horizontal tube body of each heat tube of the heat tube units of the heat-dissipating rack unit of the air-cooled heat-dissipating module is L-shaped in cooperation with the vertical tube body.

The heat-transferring base is provided with a mounting opening through which the shell of the water-cooling shell can pass, and the shell of the water-cooling shell passes through the mounting opening of the heat-transferring base and enables the heat-transferring base to be combined with the fixing frame.

Particularly, the air guide sleeve unit of the air-cooled heat dissipation module is provided with a frame body connected with the heat dissipation frame unit and two combined frames which are positioned on two opposite sides of the frame body and combined on the heat dissipation base.

Compared with the prior art, the composite heat dissipating device of the utility model utilizes the water cooling unit of the water cooling heat dissipating module to dissipate heat of the substrate unit and the high thermal electron unit, so that heat energy generated by the high thermal electron unit can be subjected to heat exchange in a water cooling heat dissipating mode, and the heat pipe unit of the heat dissipating frame unit of the air cooling heat dissipating module is utilized to synchronously conduct heat energy of the substrate unit and the high thermal electron unit to the application of the heat dissipating fin group and cooperate with the interval between the heat dissipating frame units covered by the air guide cover unit to define the air guide space, so that heat energy generated by the high thermal electron unit can be synchronously transferred to the heat dissipating fin group through the heat pipe unit in a heat conducting rapid heat conducting mode directly to perform air cooling heat dissipating action through external air flow, and besides the composite heat dissipating mode of water cooling heat dissipating and air cooling heat dissipating is achieved, the hollow structural design of the air guide space between the heat dissipating frame units can be utilized, so that the fluid resistance of air flow is effectively reduced, and the air cooling efficiency of the air flow flowing through the heat dissipating fin group is greatly increased.

Drawings

Other features and advantages of the utility model will be apparent from the following description of the embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a schematic side view illustrating an embodiment of a composite heat sink according to the present utility model;

FIG. 2 is a schematic perspective view illustrating a connection relationship between a water cooling module and an air cooling module in the embodiment;

FIG. 3 is a schematic perspective view illustrating the connection between a dome unit and two heat dissipating rack units of the air-cooled heat dissipating module in FIG. 2;

FIG. 4 is a schematic perspective view, aided by the illustration of FIG. 2;

FIG. 5 is a schematic perspective view illustrating the connection relationship between a base unit of the water cooling module, a water cooling unit and two heat pipe units of the heat sink unit of the air cooling module;

FIG. 6 is a schematic perspective view illustrating the combination of a water-cooling shell and a heat-transferring base of the water-cooling unit of the water-cooling module in the embodiment;

FIG. 7 is a schematic side cross-sectional view, aided by the illustration of FIG. 6; and

Fig. 8 is a schematic top view illustrating the relationship among a fin module, the base module and the water cooling module in the embodiment.

Detailed Description

Before the present utility model is described in detail, it should be noted that in the following description, like elements are denoted by the same reference numerals.

Referring to fig. 1 to 8, the composite heat dissipating device of the present utility model includes a water cooling module 1, a cooling monitor module 4 connected to the water cooling module 1, and an air cooling module 5.

The water cooling module 1 includes a base unit 2 contacting with a high thermal electronic unit (not shown), and a water cooling unit 3 disposed on the base unit 2. The water cooling unit 3 is used for cooling the substrate unit 2 and the high-thermal electronic unit. The cooling monitoring module 4 includes a heat dissipating bank 41. The hot water generated by the water cooling unit 3 flowing through the water cooling module 1 flows into the heat dissipation row unit 41 of the cooling monitoring module 4 to be cooled down into cold water and then flows back to the water cooling unit 3.

The air-cooled heat dissipation module 5 comprises two heat dissipation frame units 6 which are positioned above the water-cooled heat dissipation units 3 of the water-cooled heat dissipation module 1 and are spaced from each other, and a flow guide cover unit 7 connected with the heat dissipation frame units 6. The heat dissipation frame unit 6 is located at two opposite ends of the air guide sleeve unit 7. The air guide cover unit 7 is combined with the heat dissipation frame units 6 and covers the intervals between the heat dissipation frame units 6 and the partial structure of the water cooling heat dissipation unit 3 to define an air guide space 71. Each heat sink unit 6 has a heat sink fin set 61, and a heat pipe unit 62 extending from the base unit 2 of the water-cooling module 1 to a direction away from the base unit 2 and penetrating the heat sink fin set 61. In this embodiment, the number of the heat dissipating rack units 6 is two, for convenience of description, a first heat dissipating rack unit 6a and a second heat dissipating rack unit 6b are further indicated by the heat dissipating rack units 6, and it is clear that the heat dissipating rack units 6 are the first heat dissipating rack unit 6a or the second heat dissipating rack unit 6b, and the heat dissipating fin groups 61 of the heat dissipating rack units 6 and the internal components such as the heat pipe units 62 are indicated by the same element numbers, so that the heat dissipating fin groups 61 of the first heat dissipating rack units 6a and the heat pipe units 62 or the heat dissipating fin groups 61 of the second heat dissipating rack units 6b and the heat pipe units 62 can be known according to the content of the drawings.

The heat pipe unit 62 of the heat sink unit 6 of the air-cooled heat sink module 5 conducts the heat energy of the substrate unit 2 and the high thermal electron unit to the heat sink fin group 61, and the air flow generated from the outside blows into the heat sink fin group 61 of the first heat sink unit 6a and flows through the air flow guiding space 71, and flows out of the heat sink fin group 61 of the second heat sink unit 6b to dissipate heat. In the present embodiment, the externally generated air flow is generated by using a fan module 8, but not limited thereto, and may be generated by natural convection due to temperature difference or other manners.

When in use, the substrate unit 2 of the water cooling heat dissipation module 1 is contacted with the design of the high thermal electron unit, so that the heat energy generated by the high thermal electron unit can be thermally conducted to the substrate unit 2, the water cooling heat dissipation unit 3 is utilized to conduct water cooling heat dissipation, and the heat energy of the substrate unit 2 and the high thermal electron unit can be thermally conducted to the heat dissipation fin groups 61 corresponding to the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6b through the heat pipe units 62 of the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6b of the air cooling heat dissipation module 5, so that the heat energy generated by the operation of the high thermal electron unit can be rapidly conducted to the heat dissipation fin groups 61 in a heat conduction mode, and the air flow generated by natural convection or generated by the fan module 8 is blown in from the air inlet face of the first heat dissipation frame unit 6a and flows into the diversion space 71 through the corresponding heat dissipation fin groups 61 and the air outlet face of the first heat dissipation frame unit 6a in sequence, the air inlet surface of the second heat dissipation frame unit 6b flows through the corresponding heat dissipation fin group 61 to flow out of the air outlet surface of the second heat dissipation frame unit 6b, so that the flowing air flow takes away heat energy, wherein the area of the air inlet surface of the first heat dissipation frame unit 6a is larger than the area of the air outlet surface of the first heat dissipation frame unit 6a, the area of the air inlet surface of the second heat dissipation frame unit 6b is smaller than the area of the air outlet surface of the second heat dissipation frame unit 6b, the air guiding space 71 between the air outlet surface of the first heat dissipation frame unit 6a and the air inlet surface of the second heat dissipation frame unit 6b has the design that the air outlet surface of the first heat dissipation frame unit 6a gradually expands and gradually contracts to be adjacent to the air inlet surface of the second heat dissipation frame unit 6b, the air flow flowing into the diversion space 71 is pressurized and then flows into the air inlet surface of the second heat dissipation frame unit 6b, so that the air flow is accelerated to flow through the second heat dissipation frame unit 6b, and the heat dissipation frame units 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) are effectively cooled, so that the heat dissipation of the high-heat electronic unit is synchronously performed in a combined heat dissipation mode with water cooling heat dissipation and air cooling heat dissipation, and the heat dissipation efficiency is greatly improved. The water-cooled heat dissipation of the water-cooled heat dissipation unit 3 is that liquid (hereinafter, cold water is taken as an example, but not limited to, and other liquid fluids such as a cooling liquid may be used) flows into the water-cooled heat dissipation unit 3 of the water-cooled heat dissipation module 1, and the water-cooled heat dissipation unit 3 dissipates heat from the substrate unit 2 and the high-heat electronic unit, and the cold water flows through the water-cooled heat dissipation unit 3, and then rises to hot water and flows out of the water-cooled heat dissipation unit 3, but not limited to.

Further, in the present embodiment, each heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) of the air-cooled heat dissipation module 5 has a plurality of heat dissipation fins 611 spaced in parallel from each other. The heat sink 611 cooperatively defines a plurality of heat dissipation channels 612. The heat pipe units 62 of the heat sink units 6 (the first heat sink unit 6a and the second heat sink unit 6 b) respectively penetrate through at least part of the heat dissipation fins 611 of the corresponding heat dissipation fin group 61, and the heat pipe units 62 thermally conduct the heat energy of the substrate unit 2 and the high thermal electronic unit to the heat dissipation fins 611. In this embodiment, the high thermal electronic unit is an electronic processing chip, but not limited to this. The air flow generated by the fan module 8 blows across the heat sink 611 of one of the heat sink groups 61 and flows through the air guiding space 71, and flows out of the heat sink 611 of the other heat sink group 61. In particular, in the present embodiment, the air flow generated by the fan module 8 flows through the air inlet surface of the first heat sink frame unit 6a and blows into the heat sink fins 611 of the heat sink fin set 61 of the first heat sink frame unit 6a, and flows into the air guiding space 71 from the air outlet surface of the first heat sink frame unit 6a, and the air flow in the air guiding space 71 continues to flow to the air inlet surface of the second heat sink frame unit 6b and flows through the heat sink fins 611 of the heat sink fin set 61 of the second heat sink frame unit 6b, and sequentially expands and contracts from the air outlet surface adjacent to the first heat sink frame unit 6a to the air inlet surface adjacent to the second heat sink frame unit 6b, The air flow is accelerated by the compressed design to flow out of the heat sink 611 of the heat sink fin set 61 of the second heat sink frame unit 6b, so as to take away the heat energy of the heat sink 611. That is, the heat dissipation channel 612 defined by the heat dissipation fin set 61 is a planar channel as shown in the figure, and the hollow structure of the air guiding space 71 between the heat dissipation frame units 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) is designed to reduce the overall flow resistance, when the air flows through the heat dissipation fins 611 of the heat dissipation fin set 61 of the first heat dissipation frame unit 6a and the heat dissipation channel 612, the air flows into the air guiding space 71 gradually and expanding, and when the air flows into the air guiding space 71 gradually and expanding, the air flow is greatly reduced in the fluid kinetic energy, The hydrodynamic pressure is released in advance, the air flow in the diversion space 71 continues to flow to the heat dissipation fin set 61 of the second heat dissipation frame unit 6b after the design of tapering the diversion space 71, and the air flow pressurized by the design of tapering the diversion space 71 flows through the heat dissipation fins 611 and the heat dissipation channels 612 of the heat dissipation fin set 61 of the second heat dissipation frame unit 6b in an accelerating manner, so that the air flow is re-accelerated to greatly improve the heat exchange benefit by the characteristic that the air flow is pressurized in the tapering diversion space 71, the flowing resistance of the air flow is effectively reduced, and the air cooling heat dissipation efficiency of the air flow flowing through the heat dissipation fin set 61 is greatly improved.

The water cooling unit 3 of the water cooling module 1 is used for cooling the substrate unit 2 and the high thermal electron unit inside, so that heat energy generated by the high thermal electron unit can exchange heat through a water cooling heat dissipation mode, the heat pipe unit 62 of the heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) of the air cooling module 5 is used for synchronously conducting the heat energy of the substrate unit 2 and the high thermal electron unit to the application of the heat dissipation fin group 61, and the air flow guiding space 71 is defined by matching with the air guiding cover unit 7 to cover the interval between the heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b), besides the heat energy generated by the high thermal electron unit can be directly transferred to the heat dissipation fin group 61 through the heat pipe unit 62 in a quick heat conduction mode of heat conduction, so that air cooling action can be performed through the fan module 8, and the air flow guiding structure of the air flow between the heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) can be increased, and the air flow guiding efficiency of the air flow can be greatly reduced, and the heat dissipation effect of the air flow can be greatly increased through the heat dissipation structure of the heat dissipation frame unit 61.

In addition, in the present embodiment, the cooling monitor module 4 further includes a cold water pipe 42 connecting the heat dissipating unit 41 and the water cooling unit 3, and a hot water pipe 43 connecting the heat dissipating unit 41 and the water cooling unit 3. The hot water generated through the water cooling unit 3 flows into the heat discharging unit 41 from the hot water pipe 43 of the cooling monitor module 4 to cool down into cold water and flows into the water cooling unit 3 from the cold water pipe 42 of the cooling monitor module 4. That is, since the base plate unit 2 of the water cooling module 1 contacts the high thermal electron unit, the cold water pipe 42 of the cooling monitor module 4 flows into the water cooling unit 3 of the water cooling module 1 to perform water cooling heat dissipation, absorbs the heat energy of the base plate unit 2 and the high thermal electron unit, and causes cold water to flow through the water cooling unit 3 to heat up into hot water, and flows out from the water cooling unit 3 to the hot water pipe 43 of the cooling monitor module 4 to flow into the heat dissipation and discharging unit 41 to cool down into cold water, and then causes cold water to flow back into the water cooling unit 3 from the cold water pipe 42 of the cooling monitor module 4 to form a liquid cooling cycle, so that the heat energy is continuously taken away.

It should be noted that, in the present embodiment, the base plate unit 2 of the water cooling module 1 has a water cooling base plate 21 contacting the high thermal electronic unit, and two partition plates 22 disposed on the water cooling base plate 21 in parallel and laterally spaced apart from each other and extending upward from the water cooling base plate 21. The water cooling unit 3 has a water cooling shell 31 covering the water cooling base plate 21 and communicating with the cooling monitor module 4. The water-cooling shell 31 cooperates with the water-cooling bottom plate 21 to define a water-cooling space 32. The water-cooled shell 31 has two parallel side surfaces 311 spaced apart and disposed on opposite sides of the water-cooled shell 31. The cold water pipe 42 of the cooling monitor module 4 is connected to a water inlet of one side 311 of the water-cooled shell 31, and the hot water pipe 43 is connected to a water outlet of the other side 311 of the water-cooled shell 31. The separation plates 22 are located in the water cooling space 32, located between the water inlet and the water outlet, and respectively connected to the side surfaces 311 of the water cooling shell 31, and each separation plate 22 extends from the corresponding side surface 311 toward the other side surface 311 and is separated from the other side surface 311 by a flow channel opening 33. The partition plate 22 cooperates with the side surface 311 to partition the water cooling space 32 into a cold water area 321 adjacent to the water inlet and corresponding to the cold water pipe 42, a diversion area 323 between the partition plates, and a hot water area 322 adjacent to the water outlet and corresponding to the hot water pipe 43. Cold water flows from the cold water pipe 42 into the cold water area 321 in the water-cooled shell 31 through the water inlet, flows through one of the flow passage openings 33 through the flow guiding area 323, continues to flow from the other flow passage opening 33 to the hot water area 322, and flows out of the hot water pipe 43 through the water outlet, thereby taking away the heat energy of the base plate unit 2 conducted to the water-cooling unit 3 arranged thereon by contacting the high-heat electronic unit, and dissipating heat by the water flow flowing through the water-cooling unit 3. In short, the water cooling space 32 is separated by the partition plate 22 and the side surface 311 in the form of a water channel space of the cold water area 321, the guide area 323 and the hot water area 322 as shown in fig. 8, so that cold water flowing into the water cooling shell 31 from the cold water pipe 42 flows through the cold water area 321 as shown in fig. 8, flows through one of the flow channels 33 through the guide area 323 and continues to flow from the other flow channel 33 to the hot water area 322, and the generated hot water flows out from the hot water pipe 43, but not limited thereto. In the present embodiment, the separation plates 22 are located at one third of the side surfaces 311 as shown in fig. 8, and the separation plates 22 have a diversion structure as shown in fig. 8, so as to ensure the water flow from the cold water area 321 to the hot water area 322 through the diversion area 323, and the water flow in the water cooling space 32 can flow at a uniform speed, but not limited thereto.

In addition, in the present embodiment, the base unit 2 of the water cooling module 1 further has a first heat transfer plate set 23 disposed on the water cooling base 21 and located in the cold water area 321, a second heat transfer plate set 24 disposed on the water cooling base 21 and located in the guiding area 323 and approximately parallel to the partition 22, and a third heat transfer plate set 25 disposed on the water cooling base 21 and located in the hot water area 322 and approximately parallel to the partition 22. That is, the heat energy of the water-cooled bottom plate 21 can be thermally conducted through the first heat-transferring plate set 23, the second heat-transferring plate set 24 and the third heat-transferring plate set 25 in the form of a plurality of heat-transferring fins as shown in the figure, so that the heat energy transmission path is increased and the water flow can be divided. Incidentally, in the present embodiment, the first heat-transfer plate set 23, the second heat-transfer plate set 24 and the third heat-transfer plate set 25 are shown in the drawings to show the H-shape heat-transfer characteristic perpendicular to the water-cooled bottom plate 21, but not limited thereto.

In this embodiment, the heat pipe unit 62 of the heat sink unit 6 (the first heat sink unit 6a and the second heat sink unit 6 b) of the air-cooled heat sink module 5 has a plurality of heat pipes 621 penetrating at least part of the heat dissipation fin group 61. In the present embodiment, the heat pipe 621 is a metal heat pipe 621, but not limited thereto. One heat pipe 621 of one heat pipe unit 62 has a horizontal pipe body 622 penetrating through the water-cooling shell 31 and penetrating through at least part of the first heat-transfer fin group 23 of the substrate unit 2, and an upright pipe body 623 penetrating through the heat-transfer fin 611 of the corresponding heat-transfer fin group 61 from one end of the horizontal pipe body 622 penetrating out of the water-cooling shell 31 and extending upward; One heat pipe 621 of the other heat pipe unit 62 has another horizontal pipe 622 penetrating through the water-cooling shell 31 and penetrating through at least part of the third heat-transfer fin group 25 of the substrate unit 2, and another vertical pipe 623 penetrating through the other end of the water-cooling shell 31 from the other horizontal pipe 622 and extending upward and penetrating through the heat-dissipating fin 611 of the corresponding heat-dissipating fin group 61. Incidentally, in the present embodiment, only the horizontal tube 622 of one heat pipe 621 of the heat pipe unit 62 is inserted through the water-cooling shell 31, or only the horizontal tube 622 of a part of the heat pipes 621 is inserted through the water-cooling shell 31, or all the horizontal tube 622 of the heat pipes 621 of the heat pipe unit 62 are inserted through the water-cooling shell 31 as shown in fig. 5, but not limited thereto. In the present embodiment, the horizontal tube 622 of the heat pipe 621 of the heat pipe unit 62 of the heat pipe unit 6 of the air-cooled heat dissipation module 5 is L-shaped in cooperation with the corresponding vertical tube 623, but not limited thereto. Briefly, as shown in fig. 5, the vertical tube 623 of the heat pipe unit 62 of the left heat sink unit 6 (the first heat sink unit 6 a) and the vertical tube 623 of the heat pipe unit 62 of the other right heat sink unit 6 (the second heat sink unit 6 b) are respectively penetrated by the heat sinks 611 of the corresponding heat sink fin groups 61, while the horizontal tube 622 of the left in fig. 5 is penetrated by the water-cooling shell 31 and penetrated by at least part of the corresponding first heat sink fin groups 23 of the base plate unit 2 and the horizontal tube 622 of the right in fig. 5 is penetrated by the water-cooling shell 31 and penetrated by at least part of the corresponding third heat sink fin groups 25 of the base plate unit 2, But is not limited thereto. Whereas the water flow flowing in from the cold water pipe 42 of the cooling monitor module 4 is shown as vertically flowing through the horizontal pipe 622 as shown in fig. 7 by using the structure that the horizontal pipe 622 of the heat pipe unit 62 of one of the heat sink units 6 (first heat sink unit 6 a) penetrates at least part of the structures of the corresponding first heat transfer fin group 23 and does not penetrate the structures of the partition plate 22 and the second heat transfer fin group 24 in the base plate unit 2 as shown in fig. 5, and the structure that the horizontal pipe 622 of the heat pipe unit 62 of the other heat sink unit 6 (second heat sink unit 6 b) penetrates at least part of the structures of the corresponding third heat transfer fin group 25 and does not penetrate the structures of the partition plate 22 and the second heat transfer fin group 24 in the base plate unit 2, Therefore, when the water flows through the horizontal pipe 622, a boundary layer separation is formed, the flow of the water flow is separated from the surface of the pipe, and a vortex phenomenon is generated, so that the turbulence of the fluid is greatly increased, the turbulence of the fluid is enhanced, and the heat exchange benefit of the water flow fluid is effectively improved, but the invention is not limited thereto.

In addition, in the present embodiment, a heat transfer base 9 is further included and is combined with the water cooling module 1. The water cooling shell 31 of the water cooling unit 3 of the water cooling module 1 further has a housing 312 covering the water cooling base plate 21 and communicating the hot water pipe 43 of the cooling monitor module 4 with the cold water pipe 42, and a fixing frame 313 located at two opposite sides of the housing 312 and combined with the water cooling base plate 21. The heat transfer base 9 has a mounting opening 91 through which the shell 312 of the water-cooled shell 31 passes, and the shell 312 of the water-cooled shell 31 passes through the mounting opening 91 of the heat transfer base 9 and bonds the heat transfer base 9 to the fixing frame 313. In short, the water-cooling shell 31 of the water-cooling module 1 is a combination structure in which the fixing frame 313 is combined with the heat-transferring base 9 and penetrates through the mounting opening 91 of the heat-transferring base 9 as shown in fig. 3 and 6, but not limited thereto. Incidentally, in the present embodiment, the air guide cover unit 7 of the air-cooled heat dissipation module 5 has a frame 72 connected to the heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b), and two combining frames 73 located at two opposite sides of the frame 72 and combined to the heat dissipation base 9. That is, the air guide cover unit 7 of the air-cooled heat dissipation module 5 is connected to the heat dissipation frame unit 6 (the first heat dissipation frame unit 6a and the second heat dissipation frame unit 6 b) and covers the space between the heat dissipation frame units 6, and the bonding frame 73 is a bonding pattern fixed on the heat dissipation base 9 as shown in fig. 3 and 4, but not limited thereto.

In summary, in the composite heat dissipating device of the present utility model, the water cooling unit 3 of the water cooling heat dissipating module 1 is used to dissipate heat from the substrate unit 2 and the high thermal electron unit, so that heat generated by the high thermal electron unit can exchange heat through the water cooling heat dissipation mode, and the heat pipe unit 62 of the heat dissipating frame unit 6 (the first heat dissipating frame unit 6a and the second heat dissipating frame unit 6 b) of the air cooling heat dissipating module 5 is used to synchronously conduct heat generated by the substrate unit 2 and the high thermal electron unit to the heat dissipating fin set 61, and the air flow guiding space 71 is defined by matching with the air guiding cover unit 7 to cover the space between the heat dissipating frame unit 6 (the first heat dissipating frame unit 6a and the second heat dissipating frame unit 6 b), so that heat generated by the high thermal electron unit can be directly transferred to the heat dissipating fin set 61 through the heat pipe unit 62 in a heat conducting rapid heat conducting mode, so as to realize a cold heat dissipating action through the fan module 8, and further reduce the heat dissipation efficiency of the air flow between the heat dissipating frame unit 6 and the heat dissipating frame unit 6 (the heat dissipating frame unit 6b is further, and the air flow guiding space 71 is greatly reduced by the air flow between the heat dissipating frame unit and the heat dissipating frame unit 6 b).

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (10)

1. A composite heat sink, comprising:

the water cooling module comprises a substrate unit contacted with a high-thermal electronic unit and a water cooling unit arranged on the substrate unit;

The cooling monitoring module is connected with the water cooling module and comprises a heat dissipation row unit;

The air-cooled heat dissipation module comprises two heat dissipation frame units which are arranged above the water cooling heat dissipation units of the water cooling heat dissipation module and are spaced from each other, and a guide cover unit which is connected with the heat dissipation frame units, wherein the heat dissipation frame units are arranged at two opposite ends of the guide cover unit, the guide cover unit is combined with the heat dissipation frame units and covers the space between the heat dissipation frame units to define a guide space, and each heat dissipation frame unit is provided with a heat dissipation fin group and a heat pipe unit which extends upwards from a base plate unit of the water cooling heat dissipation module and penetrates through the heat dissipation fin group.

2. The composite heat sink of claim 1, wherein the heat sink fin group of each heat sink frame unit of the air-cooled heat sink module has a plurality of heat sinks spaced parallel to each other, the heat sinks cooperate to define a plurality of heat dissipation channels, the heat pipe units of the heat sink frame unit respectively penetrate at least part of the heat sinks of the heat sink fin group, and the heat pipe units thermally conduct the heat energy of the substrate unit and the high thermal electron unit to the heat sinks for heat dissipation.

3. The composite heat sink of claim 2, wherein the external air flows through the fins of one of the fin groups and gradually flows into the flow guiding space, and the air flows in the flow guiding space continuously flows to the fins of the other fin group and gradually flows out from the fins of the other fin group.

4. The composite heat sink of claim 2 wherein cold water flows into the water cooling unit of the water cooling module and causes the water cooling unit to dissipate heat from the base unit and the high thermal electron unit, and the cold water flows through the water cooling unit and then warms up to hot water and flows out of the water cooling unit, the cooling monitor module further comprising a cold water pipe connecting the heat sink unit and the water cooling unit, and a hot water pipe connecting the heat sink unit and the water cooling unit, the hot water generated by flowing through the water cooling unit flowing from the hot water pipe of the cooling monitor module into the heat sink unit to cool down to cold water and the cold water flowing from the cold water pipe of the cooling monitor module into the water cooling unit.

5. The heat sink of claim 4, wherein the base plate unit of the heat sink module has a water cooling base plate contacting the high-temperature electronic unit, and two parallel partition plates disposed on the water cooling base plate and extending upward from the water cooling base plate, the heat sink unit has a water cooling shell covering the water cooling base plate and connected to the cooling monitor module, the water cooling shell and the water cooling base plate cooperate to define a water cooling space, the water cooling shell has two parallel sides, the cold water pipe of the cooling monitor module is connected to one side of the water cooling shell, the hot water pipe is connected to the other side of the water cooling shell, the partition plates are disposed in the water cooling space and are respectively connected to the sides of the water cooling shell, each partition plate extends from the corresponding side to the other side and is separated from the other side by a flow port, the partition plates cooperate with the sides to partition the water cooling space into a cold water area corresponding to the cold water pipe, a flow guiding area between the partition plates, and a hot water area corresponding to the hot water pipe, the cold water pipe flows from the water cooling shell into the water cooling shell and flows through the flow port to the other side of the flow channel, and the hot water pipe continues from the flow channel to the flow channel.

6. The device of claim 5, wherein the base unit of the water cooling module further comprises a first heat transfer plate set transversely disposed on the water cooling base plate and located in the cold water area, a second heat transfer plate set transversely disposed on the water cooling base plate and located in the flow guiding area, and a third heat transfer plate set transversely disposed on the water cooling base plate and located in the hot water area.

7. The composite heat sink of claim 6 wherein the heat pipe unit of the heat sink unit of the air-cooled heat sink module has a plurality of heat pipes penetrating the heat sink groups, wherein each heat pipe of a heat pipe unit has a horizontal pipe body penetrating the water-cooled shell and penetrating at least a portion of the first heat-transfer fin group of the base unit, and an upright pipe body extending upward from an end of the horizontal pipe body penetrating the water-cooled shell and penetrating the heat sink of the corresponding heat sink group; each heat pipe of the other heat pipe unit is provided with a horizontal pipe body penetrating through the water cooling shell and penetrating through at least part of the substrate unit, and an upright pipe body penetrating through the heat radiating fins of the corresponding heat radiating fin group, wherein one end of the horizontal pipe body penetrating out of the water cooling shell extends upwards.

8. The composite heat sink of claim 7, wherein the horizontal tube body of each heat pipe of the heat pipe units of the heat frame unit of the air-cooled heat sink module is L-shaped in cooperation with the vertical tube body.

9. The device of claim 5, further comprising a heat-transferring base coupled to the water-cooling module, wherein the water-cooling shell of the water-cooling unit of the water-cooling module further comprises a housing covering the water-cooling base plate and communicating the hot water pipe of the cooling monitor module with the cold water pipe, and two fixing frames located on two opposite sides of the housing and coupled to the water-cooling base plate, the heat-transferring base has a mounting opening through which the housing of the water-cooling shell can pass, and the housing of the water-cooling shell passes through the mounting opening of the heat-transferring base and couples the heat-transferring base to the fixing frames.

10. The device of claim 9, wherein the air-cooled heat dissipating module has a frame connected to the heat dissipating frame, and two bonding frames located on opposite sides of the frame and bonded to the heat dissipating base.