CN200953119Y - Computer radiating device with cooling function - Google Patents
Computer radiating device with cooling function Download PDFInfo
- Publication number
- CN200953119Y CN200953119Y CN 200620079239 CN200620079239U CN200953119Y CN 200953119 Y CN200953119 Y CN 200953119Y CN 200620079239 CN200620079239 CN 200620079239 CN 200620079239 U CN200620079239 U CN 200620079239U CN 200953119 Y CN200953119 Y CN 200953119Y
- Authority
- CN
- China
- Prior art keywords
- heat
- computer
- liquid
- conducting
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 238000005057 refrigeration Methods 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 6
- 239000002250 absorbent Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This utility model relates to one computer radiating device that is also capable of refrigeration. It includes semiconductor refrigerating piece and liquid-circulating heating system. The liquid-circulating heating system consists of refrigerating circuit and radiating circuit. The semiconductor refrigerating piece adopted in this utility model can fully, automatically and effectively radiate the heat from the electronic heating elements in the computer. Liquids are continuously circulated in the refrigerating circuit and radiating circuit. The radiator in the radiating circuit sucks in air from the outside via the fan and wind guide pipes for convective radiation. This radiating device is fully enclosed so that the incoming air and outgoing air do not circulate inside the computer casing, thus realizing dustproofness of the computer casing and reducing noises generated during radiation. Therefore, the computer works in a low-noise environment. With the two modes of the valve, either refrigeration-based radiation or liquid-based radiation can be realized with one set of device, thus ensuring satisfactory cooling effects of the computer in both winter and summer to the highest degree.
Description
Technical field
It is the device that computing machine and electronic installation heat generating components dispel the heat that the utility model relates to a kind of, especially a kind of computer heat radiating device that has refrigerating function.
Background technology
The cooling system of computing machine as you know and electronic installation generally all is wind-cooling heat dissipating or liquid circulation heat radiation at present.The wind-cooling heat dissipating employing on heat generating components heat-absorbing block is installed and fan dispels the heat, its noise is big, and when computing machine used for a long time, the heat generating components temperature was higher, radiating effect is not remarkable, and the interior noise of computer cabinet is big, dust influences computing machine more and normally uses.Same liquid circulation heat radiation causes radiating effect not remarkable owing to the liquid self-temperature raises.The electronic component that promotes significantly for following integrated level is for example: the CPU of computing machine, the heating module of electronic installation, above-mentioned two kinds of radiating modes all have the imperfection of heat-sinking capability, thereby cause the heating of electronic component directly to limit the maximum performance of electronic component usefulness.
The utility model content
The purpose of this utility model is the limitation that has wind-cooling heat dissipating system and liquid cycle cooling system heat-sinking capability now in order to overcome, and a kind of computer heat radiating device that has refrigerating function is provided, and it can improve the radiating effect of heater element significantly.
The technical scheme that the utility model adopted is: a kind of computer heat radiating device that has refrigerating function, comprise semiconductor chilling plate and liquid circulating heat conduction system, described liquid circulating heat conduction system is made up of following part: water pump connects the refrigeration tank by conducting valve, computer heating element is provided with heat sink, liquid connects heat sink by pipeline, liquid connects water pump by pipeline and forms refrigerating circuit, another water pump connects heating radiator by pipeline, liquid connects the heat absorption tank by pipeline, liquid connects water pump by conducting valve and forms heat-radiation loop, the refrigeration end of semiconductor chilling plate is connected with the heat absorption tank with the refrigeration tank respectively with radiating end, and the heating radiator top is provided with fan.
Described conducting valve is made up of rotatable two conducting sheets, and top conducting sheet is provided with four through holes, and bottom conducting sheet is provided with four tanks, respectively two through holes in four through holes of conducting.
Described heat sink is the solid components that there is fluid path an inside, and it has a face heat absorption at least, and this heat-absorbent surface pastes and touches heating face on heat-generating electronic elements, and each heat sink is provided with water inlet and two pipe adapters of water delivering orifice.
The utility model adopts semiconductor chilling plate fully initiatively to carry out efficiently radiates heat to electronic heating element in the computing machine, and liquid constantly recycles by refrigerating circuit and heat-radiation loop.The utility model does not need in the computer casing inner air and outer air circulation that heat abstractor is dispelled the heat, so cabinet can be designed to not have louvre, totally enclosed type cabinet on computer cabinet the plug receptacle of necessity, thereby having reached the minimizing dust invades, reduce the generation that causes computer operation instability and fault, and shield or reduced the irradiation of electromagnetic waves and the leakage of generation when the computing machine components and parts are worked.Because of computer cabinet and CPU and the video card aerofoil fan high speed rotating that do not need to dispel the heat carries out the cross-ventilation heat radiation, reduced the generation of noise, so whole computer operation is to be in one very in the lower noise environment.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model liquid circulation theory synoptic diagram.
Fig. 3 is semiconductor chilling plate and refrigeration tank and heat absorption sink structure synoptic diagram.
Fig. 4 is the conducting valve structural representation.
Fig. 5 is a top conducting chip architecture synoptic diagram.
Fig. 6 is a bottom conducting chip architecture synoptic diagram.
Fig. 7 is one of the heat sink structural representation.
Fig. 8 is two structural representations of heat sink.
Embodiment
A kind of computer heat radiating device that has refrigerating function, shown in Fig. 1～8, be provided with semiconductor chilling plate 6 and liquid circulating heat conduction system in the computer box 16, described liquid circulating heat conduction system is made up of following part: liquid connects refrigeration tanks 7 water inlets 12 by conducting valve 9 in the water pump 1, the refrigeration end of semiconductor chilling plate 6 is connected with refrigeration tank 7, described conducting valve 9 is by rotatable two conducting sheets 17,18 form, top conducting sheet 17 is provided with four through hole A, B, C, D, bottom conducting sheet 18 is provided with four tanks, respectively two through hole AB in four through holes of conducting, DC and AC, BD.Be respectively equipped with heat sink 8 on a plurality of heater elements 10 in the computing machine, described heat sink 8 is solid componentss that there is fluid path an inside, it has a face heat absorption at least, this heat-absorbent surface pastes the heating face on heater element 10 that touches, each heat sink 8 top or side are provided with water inlet and two pipe adapters 12 of water delivering orifice, heat sink 8 is provided with fixedly card 11, by screw 13 fixedly heat sink 8 and heater element 10.Refrigeration tank 7 water delivering orifices 12 liquid are by the water inlet 12 of pipeline 15 connection heat sinks 8, and heat sink 8 water delivering orifices 12 liquid connect water pumps 1 by pipeline 15 again and form refrigerating circuit.Liquid connects heating radiator 4 water inlets by pipeline 15 in another water pump 2, heating radiator 4 tops are provided with fan 3, described fan 3 can be shared with computer power supply 14, heating radiator 4 water delivering orifice liquid connect heat absorption tank 5 water inlets 12 by pipeline 15, the radiating end of semiconductor chilling plate 6 is connected with heat absorption tank 5, and heat absorption tank 5 water delivering orifices 12 connect water pump 2 by conducting valve 9 again and form heat-radiation loop.
As shown in Figure 1, 2, when semiconductor chilling plate 6 energising refrigeration, conducting valve 9 is arranged on when DC communicates and AB communicates, the liquid that refrigerating circuit is promoted by water pump 1, through D, the C through hole connection refrigeration tank 7 of conducting valve, semiconductor chilling plate 6 is lowered the temperature to liquid, flow of liquid after the cooling is crossed connection in series-parallel several heat sinks 8 on heater element 10, fluid temperature raises, and flows back to water pump 1 by connecting water pipe 15, constitutes a complete liquid refrigerating circulation.Another route water pump 2 promotes liquid to heating radiator 4 simultaneously, lower the temperature to liquid with power supply fan 3 (or other fan), liquid after the cooling heat absorption tank 5 that continues to flow through is taken away the heat of semiconductor chilling plate 6 heating ends, flow back to water pump 2 through conducting valve 9 through hole AB, constitute a complete liquid heat radiation circulation.Above liquid refrigerating circulation and liquid heat radiation circulate, and have constituted the refrigerating plant of a complete computing machine heat-generating electronic elements.
When winter, computer temperature is lower, semiconductor chilling plate no power refrigeration, rotation conducting valve 9 is arranged on BD and communicates, when AC communicates, liquid by water pump 1 promotion, pass through the through hole BD of conducting valve 9 to water pump 2 through water pipe 15, water pump 2 continues to promote liquid to heating radiator 4, and to the liquid cooling, the flow of liquid after the cooling is through heat absorption tank 5 with power supply fan 3 (or other fan), through hole AC through conducting valve 9, to refrigeration tank 7, continue to flow through connection in series-parallel several heat sinks 8 on heater element 10 by water pipe 15, this moment, fluid temperature raise, flow of liquid back water pump 1 after temperature raises constitutes a complete liquid heat radiation circulation.Heating radiator 4 sucks by the guide duct that is located at heating radiator 4 bottoms after cabinet external cooling air gives liquid heat exchange cooling through passing through fan 3 or computer power supply fan, and the air after the heat exchange is discharged outside the cabinet.
The utility model refrigerating circuit and semiconductor chilling plate directly contact the electronic heating element and cause dewfall by also solved the semiconductor chilling plate cold junction to circulating fluid cooling heat conduction, damage the problem of circuit board and electron device.Heating radiator in the heat-radiation loop carries by power supply or other aerofoil fan and guide duct suck the computer cabinet outer air and carry out heat loss through convection, this heat abstractor is totally enclosed, the heat radiation air of the air that sucks and discharge in computer cabinet, do not circulate, thereby reach the dustproof purpose of computer cabinet.
By two kinds of patterns of conducting valve, can constitute two kinds of purposes that a covering device is finished refrigeration radiating or liquid heat radiation, guarantee that to greatest extent computing machine is in winter, different cooling requirement of summer.
Claims (3)
1, a kind of computer heat radiating device that has refrigerating function, it is characterized in that: comprise semiconductor chilling plate (6) and liquid circulating heat conduction system, described liquid circulating heat conduction system is made up of following part: water pump (1) connects refrigeration tank (7) by conducting valve (9), computer heating element (10) is provided with heat sink (8), liquid connects heat sink (8) by pipeline (15), liquid connects water pump (1) by pipeline (15) again and forms refrigerating circuit, another water pump (2) connects heating radiator (4) by pipeline (15), liquid connects heat absorption tank (5) by pipeline (15), connect water pump (2) by conducting valve (9) again and form heat-radiation loop, the refrigeration end of semiconductor chilling plate (6) is connected with heat absorption tank (5) with refrigeration tank (7) respectively with radiating end, and heating radiator (4) top is provided with fan (3).
2, the computer heat radiating device that has refrigerating function as claimed in claim 1, it is characterized in that: described conducting valve (9) is made up of rotatable two conducting sheets (17,18), top conducting sheet (17) is provided with four through holes (A, B, C, D), bottom conducting sheet (18) is provided with four tanks, respectively two through holes (AB, DC, AC, BD) in four through holes of conducting.
3, the computer heat radiating device that has refrigerating function as claimed in claim 1, it is characterized in that: described heat sink (8) is the solid components that there is fluid path an inside, it has a face heat absorption at least, this heat-absorbent surface pastes to touch in heater element (10) goes up heating face, and each heat sink (8) is provided with water inlet and two pipe adapters of water delivering orifice (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620079239 CN200953119Y (en) | 2006-06-23 | 2006-06-23 | Computer radiating device with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620079239 CN200953119Y (en) | 2006-06-23 | 2006-06-23 | Computer radiating device with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200953119Y true CN200953119Y (en) | 2007-09-26 |
Family
ID=38811421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620079239 Expired - Fee Related CN200953119Y (en) | 2006-06-23 | 2006-06-23 | Computer radiating device with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200953119Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020831A (en) * | 2014-06-19 | 2014-09-03 | 安徽春勤教育装备有限公司 | Heat dissipation structure of optical electronic whiteboard |
| CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
-
2006
- 2006-06-23 CN CN 200620079239 patent/CN200953119Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020831A (en) * | 2014-06-19 | 2014-09-03 | 安徽春勤教育装备有限公司 | Heat dissipation structure of optical electronic whiteboard |
| CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070926 |