CN1330399A - 拾取工具 - Google Patents
拾取工具 Download PDFInfo
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- CN1330399A CN1330399A CN01117572A CN01117572A CN1330399A CN 1330399 A CN1330399 A CN 1330399A CN 01117572 A CN01117572 A CN 01117572A CN 01117572 A CN01117572 A CN 01117572A CN 1330399 A CN1330399 A CN 1330399A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000002131 composite material Substances 0.000 claims abstract description 3
- 239000004411 aluminium Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 2
- 239000004917 carbon fiber Substances 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- -1 polytetrafluoroethylene Polymers 0.000 abstract description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 abstract description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Manipulator (AREA)
Abstract
一种拾取工具,有一个抽吸装置,用于把半导体芯片安装到基片上,所述的抽吸装置是一个用尺寸稳定的材料制成的板(4),其一个表面(5)有固化的胶合剂制成的结构(6)。所述板(4)的材料是例如铝、碳纤维复合材料或者尺寸稳定的塑料。适用于结构(6)的材料例如是以聚四氟乙烯为填料的胶合剂。
Description
本发明涉及一种拾取工具，用于把半导体芯片安装到一个基片上。这样的拾取装置在技术术语上公知为“管芯夹头”或“管芯接合工具”。
在安装半导体芯片时，在水中锯出然后粘附在一个薄膜上的半导体芯片用拾取工具抓取后放置在一个基片上。这种拾取工具基本上由一个金属杆和一个固定于其上的抽吸装置构成，所述的抽吸装置有一个空腔，引导向要抓取握的部件，可以经一个钻孔向所述部件施加真空。抽吸装置一坐落在所述部件上，真空作用就马上使所述部件吸附到抽吸装置上。
取决于应用的领域，用不同的胶合材料把半导体芯片在基片上。除了用之把半导体芯片焊接到基片上的软焊接和胶带之外，主要是使用导电的、含银及不导电液体的有环氧基的胶合剂。但是，近来基于在相对短的时间内硬化的新分子系统的胶合剂已经公知了。一方面，胶合剂层保证把半导体芯片粘附到基片上，另一方面它必须能够补偿例如由温度波动引起的剪切应力。因为所述的胶合剂的特性很大程度取决于层厚，需要有在紧密限度内的恒定的胶合剂层厚，以能够生产用相同特性的可靠的产品。
还有，为了避免安装过程中对半导体芯片造成最轻微的损伤，使用其抽吸装置由橡胶构成的拾取工具。橡胶有附加的优点，是它有效地密封空心腔从而可以用相对大的抽吸力把半导体芯片从薄膜上取下。
这些橡胶工具却有严重的缺点，就是它们不能以足够的精度制造。橡胶的工具一般地2至3个毫米厚。制造时需要昂贵的注模工具。但是成品橡胶工具有50微米或者以上的厚度偏差。结果因为半导体芯片下面的胶合剂分布不良、含有气泡，没有就半导体芯片的边缘所及到处流动，厚度不规则等等，特别在安装较大的半导体芯片，即，边缘长度20毫米或者以上的半导体芯片时发生问题。
本发明的目的是研发一种拾取工具，它使之能够完善地安装大的半导体芯片。
所述的目标.根据本发明借助于权利要求1的特征解决。
根据本发明，所述任务完成的达到在于，拾取工具有一个用尺寸稳定的材料制成的吸板，其面对半导体芯片的表面有由可固化的胶合剂制成的结构。验证过并且为半导体工业内接受的一种胶合剂起胶合作用。吸板保证拾取工具的刚性或者尺寸稳定性。固化的胶合剂制成的结构保证必须的弹性，从而不划伤半导体芯片，并且在拾取工具和半导体芯片之间形成的空腔被真空密封。
下面参照附图较详细说明本发明的一个实施。图中：
图1和图2一种拾取工具。
图1和图2示出一种拾取工具的截面图，所述拾取工具含有一个杆1和一个用尺寸稳定的材料制成的吸板2作为实际的抽吸装置。杆1形成得使把吸板2保持稳定并且对杆1的纵轴线成直角。优选地，吸板2不是仅被推到杆1上，而是附加地用快速固化的热敏胶固定。吸板2在其中心有一个钻孔2，经过杆1，可以连接到真空源上。
吸板2由大约两个毫米厚的尺寸稳定的板4构成，其一个表面5用半导体工业内经过验证的材料制造。优选地，阳极处理铝起板4的材料的作用。与非阳极处理铝比较，阳极处理铝提供耐腐蚀的优点。但是，板4还可以用碳纤维复合材料或者尺寸稳定的塑料制造。塑料制造的板4可以经济地制造，例如用注模工艺制造。碳纤维复合及塑料在表现足够的甚至于比金属有较大的尺寸稳定性的情况下有较轻的重量的优点。快速固化胶合剂起结构6的材料的作用，它优选地含有大部分聚四氟乙烯作为填充材料。这样的材料例如可以从Dexter公司以QMI536的标号购到。QMI536是电绝缘体并且有300Mpa的弹性模数。因此结构6有足够的弹性，从而它们不划伤半导体芯片。还可以使用导电胶合剂用于结构6，在运转中，结构6或直接地或者在此例中优选地经非阳极处理的板4接地。适宜的材料可以从Dexter公司以QMI506的标号购到。这各材料含有银作填充料并且有630Mpa的弹性模数。
铝板4可以用各种颜色实施。阳极处理铝板4为基片6提供想的表面。结构6含有一个封闭的边界线7以及从铝板4中心辐射出的支持线8。结构6的高度典型地约0.2毫米。为了达到结构6的较高的均匀性，首先用书写头施加约0.25毫米厚的胶合剂，硬化后再平行于铝板4的表面研磨约0.05毫米。
结构6的边界线7有由铝板4边界线7和拾取的半导体芯片形成的真空区域的任务。支承线8有支承半导体芯片和在把半导体芯片放置在基片上时防止半导体芯片弯曲的作用。而且，结构6应当由一方面除外对半导体芯片有任何损伤另一方面无论如何不会在芯片表面上留下残余物的制造。
根据本发明的拾取工具有以下的优点：
-所述拾取工具的刚性或者说尺寸稳定性显著高于寻常的具有橡胶制抽吸装置的拾取工具。支承线8在把半导体芯片放置在基片上时防止半导体芯片弯曲。因此胶合剂在半导体芯片下地分布，并且形成没有气泡的恒定胶层。
-结构6本身不贴附在半导体芯片上，在关闭真空后半导体芯片保持位置准确地放在施加到基片上的胶合剂的部分上。
-结构6的高度低结果使在半导体芯片和铝板之间的空腔容量很小，从而产生真空的力上升和释放真空的力减少进行得非常快速。
-即使对最大的芯片也可以得到细而轻的拾取工具。
只要真空保持力足够大，把拾取工具做得较半导体芯片的尺寸小就有优点，一般地小于半导体芯片的70％。以此方式，可以达到在从抽吸装置的中心看时半导体芯片的边缘总是向上偏转。其结果，在半导体芯片的边缘所及范围内完美地分布胶合剂，及接着用充分的胶合剂无气泡地开展嵌条。
所述的拾取工具还适于小的半导体芯片。这时可以省略支承线8。
Claims (6)
1.拾取工具，有一个抽吸装置，用于把半导体芯片安装到基片上，其特征在于，所述的抽吸装置是一个用尺寸稳定的材料制成的板(4)，其一个表面(5)有固化的胶合剂结构(6)。
2.权利要求1所述的拾取工具，其特征在于，所述板4用铝制造。
3.权利要求1所述的拾取工具，其特征在于，所述板(4)用铝制造，其一个表面(5)是阳极处理的。
4.权利要求1所述的拾取工具，其特征在于，所述板(4)用碳纤维复合材料构成。
5.权利要求1所述的拾取工具，其特征在于，所述板(4)用塑料制造。
6.以上权利要求1至5之一所述的拾取工具，其特征在于，所述结构(6)含有边界线(7)和支承线(8)。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH13092000 | 2000-07-03 | ||
| CH20001309/2000 | 2000-07-03 | ||
| CH1309/2000 | 2000-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1330399A true CN1330399A (zh) | 2002-01-09 |
| CN1206714C CN1206714C (zh) | 2005-06-15 |
Family
ID=4565364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011175729A Expired - Fee Related CN1206714C (zh) | 2000-07-03 | 2001-07-03 | 拾取工具 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6675465B2 (zh) |
| KR (1) | KR20020004830A (zh) |
| CN (1) | CN1206714C (zh) |
| AT (1) | AT412553B (zh) |
| CH (1) | CH695075A5 (zh) |
| HK (1) | HK1041560A1 (zh) |
| SG (1) | SG97183A1 (zh) |
| TW (1) | TW503456B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894078B (zh) * | 2003-12-19 | 2010-06-16 | 松下电器产业株式会社 | 部件安装头、吸附管嘴及吸附管嘴的制造方法 |
| CN101172539B (zh) * | 2006-11-03 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | 吸附拾取装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE526666C2 (sv) * | 2002-12-30 | 2005-10-25 | Nobel Biocare Ab | Anordning och arrangemang för fixturinstallation |
| DE10309879B4 (de) * | 2003-03-06 | 2006-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen |
| US7927976B2 (en) * | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
| EP2351068B1 (en) * | 2008-11-19 | 2020-11-04 | X Display Company Technology Limited | Printing semiconductor elements by shear-assisted elastomeric stamp transfer |
| US8261660B2 (en) * | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
| FR2967292B1 (fr) | 2010-11-05 | 2012-10-26 | Legrand France | Commutateur electrique de type push-push |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5804814A (en) * | 1994-05-20 | 1998-09-08 | Musha; Toru | Optical pick-up head and integrated type optical unit for use in optical pick-up head |
| JPS5537283A (en) * | 1978-09-08 | 1980-03-15 | Matsushita Electric Ind Co Ltd | Article shifter |
| US4763941A (en) * | 1987-06-11 | 1988-08-16 | Unisys Corporation | Automatic vacuum gripper |
| NL8701603A (nl) | 1987-07-08 | 1989-02-01 | Philips & Du Pont Optical | Vacuuminrichting voor het vastzuigen van werkstukken. |
| JPH02246233A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | ダイボンダ |
| DE69133413D1 (de) | 1990-05-07 | 2004-10-21 | Canon Kk | Substratträger des Vakuumtyps |
| JPH04188840A (ja) * | 1990-11-22 | 1992-07-07 | Toshiba Corp | ダイボンディング方法 |
| JPH0521584A (ja) * | 1991-07-16 | 1993-01-29 | Nikon Corp | 保持装置 |
| JPH06244269A (ja) * | 1992-09-07 | 1994-09-02 | Mitsubishi Electric Corp | 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法 |
| JPH0831910A (ja) * | 1994-07-18 | 1996-02-02 | Hitachi Ltd | 静電防止機能付き吸着パッドおよびその被吸着物離脱方法、ならびに静電防止機能付き吸着パッドを用いた半導体製造装置 |
| DE19530858C1 (de) * | 1995-08-22 | 1997-01-23 | Siemens Ag | Ansaugplatte für Wafer |
| CH695405A5 (de) * | 1999-12-14 | 2006-04-28 | Esec Trading Sa | Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats. |
-
2001
- 2001-06-14 CH CH01070/01A patent/CH695075A5/de not_active IP Right Cessation
- 2001-06-22 KR KR1020010035800A patent/KR20020004830A/ko not_active Application Discontinuation
- 2001-06-26 SG SG200103977A patent/SG97183A1/en unknown
- 2001-06-27 AT AT0099901A patent/AT412553B/de not_active IP Right Cessation
- 2001-06-28 US US09/896,372 patent/US6675465B2/en not_active Expired - Fee Related
- 2001-06-29 TW TW090115934A patent/TW503456B/zh active
- 2001-07-03 CN CNB011175729A patent/CN1206714C/zh not_active Expired - Fee Related
-
2002
- 2002-04-30 HK HK02103210.6A patent/HK1041560A1/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894078B (zh) * | 2003-12-19 | 2010-06-16 | 松下电器产业株式会社 | 部件安装头、吸附管嘴及吸附管嘴的制造方法 |
| US7886427B2 (en) | 2003-12-19 | 2011-02-15 | Panasonic Corporation | Component mounting head |
| CN101172539B (zh) * | 2006-11-03 | 2011-05-04 | 鸿富锦精密工业（深圳）有限公司 | 吸附拾取装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG97183A1 (en) | 2003-07-18 |
| ATA9992001A (de) | 2004-09-15 |
| KR20020004830A (ko) | 2002-01-16 |
| US6675465B2 (en) | 2004-01-13 |
| CN1206714C (zh) | 2005-06-15 |
| TW503456B (en) | 2002-09-21 |
| HK1041560A1 (zh) | 2002-07-12 |
| US20030029029A1 (en) | 2003-02-13 |
| CH695075A5 (de) | 2005-11-30 |
| AT412553B (de) | 2005-04-25 |
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