CN117457504B - Production method for copper-clad ceramic packaging surface - Google Patents
Production method for copper-clad ceramic packaging surface Download PDFInfo
- Publication number
- CN117457504B CN117457504B CN202311775531.3A CN202311775531A CN117457504B CN 117457504 B CN117457504 B CN 117457504B CN 202311775531 A CN202311775531 A CN 202311775531A CN 117457504 B CN117457504 B CN 117457504B
- Authority
- CN
- China
- Prior art keywords
- copper
- ceramic
- copper sheet
- sintering
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 162
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 230
- 229910052802 copper Inorganic materials 0.000 claims abstract description 221
- 239000010949 copper Substances 0.000 claims abstract description 221
- 238000005245 sintering Methods 0.000 claims abstract description 89
- 239000003292 glue Substances 0.000 claims abstract description 75
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000004140 cleaning Methods 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000008367 deionised water Substances 0.000 claims abstract description 24
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 21
- 238000001035 drying Methods 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 18
- 230000001680 brushing effect Effects 0.000 claims abstract description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 239000000047 product Substances 0.000 claims description 92
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 28
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 27
- 239000004677 Nylon Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 19
- 229920001778 nylon Polymers 0.000 claims description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 13
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 12
- 239000011265 semifinished product Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- AXDJCCTWPBKUKL-UHFFFAOYSA-N 4-[(4-aminophenyl)-(4-imino-3-methylcyclohexa-2,5-dien-1-ylidene)methyl]aniline;hydron;chloride Chemical compound Cl.C1=CC(=N)C(C)=CC1=C(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 AXDJCCTWPBKUKL-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000002699 waste material Substances 0.000 claims description 9
- 239000002023 wood Substances 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
- 238000009835 boiling Methods 0.000 claims description 5
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 5
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 5
- 229940112669 cuprous oxide Drugs 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 4
- 238000011068 loading method Methods 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 3
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 230000004069 differentiation Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 16
- 238000000576 coating method Methods 0.000 abstract description 14
- 239000011248 coating agent Substances 0.000 abstract description 13
- 238000001465 metallisation Methods 0.000 abstract description 12
- 239000012535 impurity Substances 0.000 abstract description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 4
- 239000005751 Copper oxide Substances 0.000 abstract description 4
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 4
- 238000011112 process operation Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 238000005253 cladding Methods 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- BJBUTJPAZHELKY-UHFFFAOYSA-N manganese tungsten Chemical compound [Mn].[W] BJBUTJPAZHELKY-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052573 porcelain Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 235000015110 jellies Nutrition 0.000 description 4
- 239000008274 jelly Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 229910002480 Cu-O Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910018565 CuAl Inorganic materials 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003020 moisturizing effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910018516 Al—O Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008233 hard water Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a production method of copper-clad on the surface of a ceramic package, and relates to the technical field of ceramic copper-clad. The invention adopts the mode of firstly cutting the required copper sheet to shape and then sintering, thereby meeting the requirements of packaging the ceramic for copper sheets with different shapes. Sequentially performing ultrasonic cleaning, acid cleaning, clear water cleaning, deionized water cleaning and drying on the cut copper sheet to clean oil stains, impurities, copper oxide layers and other impurities on the surface of the copper sheet, so that the influence on subsequent sintering is avoided. And the glue for brushing glue is manufactured by utilizing a heating, stirring and chelating mode so as to bond the packaging ceramic and the copper sheet, ensure that the assembled packaging ceramic cannot move, and prevent the copper sheet from being displaced during sintering to cause sintering scrapping. For multi-surface products, copper coating of various three-dimensional shapes required by all surfaces is sequentially completed, so that the application range of the ceramic copper-coated DBC process is enlarged. The production process has simple production flow and good process operation performance; no pollution is generated, and compared with metallization, the method is more environment-friendly.
Description
Technical Field
The invention relates to the technical field of ceramic copper coating, in particular to a production method of ceramic packaging surface copper coating.
Background
With the development of power electronic devices, the integration level and the working frequency of circuit boards are continuously improved, and the heat dissipation problem has become a key problem to be solved in the development of power electronic devices. The ceramic substrate is the packaging material of high-power electronic devices and integrated circuit substrates, is a key matching material in the technologies of power electronics, electronic packaging, multi-chip modules and the like, and the performance of the ceramic substrate determines the heat dissipation efficiency and the reliability of the modules.
The metallization of the surface of the ceramic package is to form a metal layer for sealing on the surface of the ceramic by screen printing, and form a brazing metal layer by sintering, so that the welding between the ceramic and the metal is realized. In the prior art, copper is often coated on the surface of the ceramic to realize the metallization of the surface of the ceramic package. The copper coating on the surface of the ceramic is to bond the ceramic and copper directly at high temperature to obtain a required pattern, so as to achieve the effect of ceramic surface packaging metallization. Compared with metallization, the ceramic surface copper-clad has better thermal cycling performance, thermal conductivity, rigidity and reliability. The shape is more stable, the current which can be carried is larger, the used temperature range is wider (-55 ℃ to 850 ℃), the thermal expansion coefficient is closer to that of silicon base, and the application field is wide.
In the prior art, a plurality of ceramic metallization processes such as a molybdenum-manganese method, a tungsten-manganese method and the like are often adopted to realize the purpose of copper plating on the surface of the packaged ceramic.
The method for realizing the metallization of the ceramic packaging surface by the molybdenum-manganese method comprises the steps of mixing molybdenum-manganese powder and an organic binder to form paste, coating the mixed tungsten-manganese mixture on the surface of the ceramic, placing the ceramic in a hydrogen-nitrogen mixed gas environment, sintering at a high temperature to form a metallization layer, using a chemical deposition nickel plating method to the metallized ceramic surface, and finally brazing the nickel-plated ceramic with copper. The molybdenum-manganese method copper coating has the defects that the adhesion force is reduced after multiple times of sintering, the molybdenum-manganese metallized layer falls off after multiple times of nickel stripping, the electroplating pollution is large, the weldability is small, and the like.
The copper-clad surface of the tungsten-manganese ceramic package is a production process of mixing tungsten-manganese powder, ethyl cellulose and rosin alcohol into paste, coating the mixed tungsten-manganese mixture on the surface of the ceramic, placing the ceramic in a hydrogen-nitrogen mixed gas environment, sintering at high temperature to form a metallized layer, plating nickel on the metallized ceramic surface, and finally brazing the nickel-plated ceramic with copper. The tungsten-manganese method has the defects of thinner copper layer, smaller adhesive force, weaker conductive capability and small weldability. Meanwhile, the electroplating deposition of the nickel layer has great environmental pollution, and the tungsten and manganese may be deformed after being metallized and sintered.
In the prior art, the patent with publication number CN107819066B discloses a production method of a low-oxygen copper sintered DBC semiconductor thermoelectric substrate, and belongs to the technical field of semiconductors. The method comprises the following steps: printing glue points on the surface of ceramic chip, assembling and sinteringAnd (3) a process. The invention selects Al 2 O 3 The ceramic substrate is screen-printed with glue spots to Al according to the size of the guide strip and the corresponding size 2 O 3 A ceramic substrate surface; firstly, screening the guide strip into a mould; then Al in step A 2 O 3 The substrate with glue points printed on the surface of the ceramic substrate is buckled into a mould which is full of the guide strips; and D, putting the semi-finished DBC semiconductor thermoelectric substrate assembled in the step B into a system with high temperature and nitrogen purity of 99.999% to be directly bonded to form the DBC semiconductor thermoelectric substrate. The invention adopts Al 2 O 3 The ceramic substrate and the low-oxygen copper are directly coated with copper and sintered. Unlike the prior art which adopts Al 2 O 3 The ceramic substrate is sintered with oxygen-free copper after oxidation treatment, and the method can obtain a required pattern directly through sintering without oxidation treatment of the guide bar before sintering.
The above patent suffers from the following drawbacks:
1. as a sintering semiconductor thermoelectric refrigeration substrate, only a ceramic substrate can be sintered, namely, a flow guide strip is arranged on a plane according to the required shape, and then the product is sintered and formed. The patent cannot sinter various three-dimensional shapes of the three-dimensional packaging ceramic, and limits the application range of the ceramic DBC copper coating process.
2. Regarding the cleaning and drying of the copper sheet (flow guiding strip), the conventional cleaning and drying are adopted, so that the cleaning effect on greasy dirt, impurities, copper oxide layers and the like on the surface of the cut copper sheet is poor, and the subsequent sintering process is influenced.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention discloses a production method for coating copper on the surface of a ceramic package, which innovatively adopts a finished pattern copper sheet to form Cu-O eutectic solution and Al through high temperature of 1065-1085 DEG C 2 O 3 The thin layer undergoes a bonding reaction to bond the copper to the ceramic surface. The product has higher precision and lower cost, and each performance of the product reaches the advanced level in China.
In order to achieve the above purpose, the present invention adopts the technical scheme that:
the production method of the copper-clad ceramic packaging surface comprises the following steps:
1. pretreatment of copper sheet
S1, cutting a copper sheet into a required size shape before high-temperature sintering expansion, sequentially carrying out ultrasonic cleaning, acid cleaning, deionized water cleaning and drying on the cut copper sheet, and carrying out chemical oxidation on the copper sheet after drying;
preferably, in the step S1, before the copper sheet is cut, the expansion rate of the copper sheet is calculated first, then the required size of the copper sheet before high-temperature sintering expansion is calculated according to the expansion rate, and finally the copper sheet is cut into the required shape according to the calculated required size of the copper sheet before high-temperature sintering expansion.
According to the invention, the copper sheet is firstly cut into a required shape and then sintered, so that the requirements of packaging ceramics for copper sheets with different shapes are met.
The technical difficulties are as follows: after the copper sheet is sintered at high temperature, the copper sheet expands, and compared with the copper sheet which is metallized and can fully cover the surface of the packaging ceramic and needs copper coating, the copper sheet which is cut is required to be considered for expansion during assembly. The offset due to the expansion of the copper sheet during sintering needs to be taken into account during assembly. Generally, the packaging ceramic has higher requirements on the position of the metal layer, and if the position change difference of the copper sheets is larger, the packaging ceramic can be directly scrapped, so that the problem that the metal layer of the packaging ceramic is deviated is solved.
The specific technical scheme for solving the technical difficulties is as follows: firstly, calculating the expansion rate of the copper sheet, and then, calculating the size of the copper sheet before sintering expansion according to the expansion rate, so as to ensure that each side just reaches the required size after expansion. Meanwhile, in the assembly of the copper sheets, in order to ensure that each side of the copper sheets is consistent with the corresponding expansion rate, the copper sheets are installed in a mode of installing and positioning tools, and each side of the copper sheets is ensured to be at a proper position.
In the invention, the purpose of ultrasonic cleaning of the copper sheet is to remove various greasy dirt and impurities on the surface of the copper sheet; the purpose of acid washing is to remove the copper oxide layer on the surface of the copper sheet; the aim of cleaning is to clean the acid on the surface of the copper sheet; the deionized water is washed, and is placed in deionized water before use, so that the surface of the deionized water can be prevented from being oxidized; the purpose of drying is to remove the moisture on the surface of the copper sheet rapidly and prevent oxidation in the air.
Preferably, in the ultrasonic cleaning in the step S1, the copper sheet is first put into a nylon mesh bag; secondly, adding water into an ultrasonic cleaner to the top end of a metal basket, and adding metal cleaning powder to form an alkali solution; then placing a nylon net-mounted copper sheet in an ultrasonic cleaner, setting the temperature to 80-100 ℃, cleaning for 30 minutes by ultrasonic waves, and cleaning for 30 minutes again by changing water; finally, repeatedly cleaning the copper sheets of the nylon net by using clear water to remove redundant alkali solution; wherein the pH value of the alkali solution is more than or equal to 10.
In the invention, a large amount of greasy dirt and impurities are arranged on the surface of the just cut copper sheet, the greasy dirt and impurities on the surface are difficult to be completely removed by simple ultrasonic cleaning, and the alkaline solution can accelerate the cleaning of the greasy dirt and impurities on the surface. For alkaline solution, if the pH is too low, the cleaning capability for greasy dirt can be greatly reduced, and when the pH is more than or equal to 10, the cleaning time can be greatly shortened, and the effect is greatly improved.
Preferably, in the step S1 of acid washing, clear water washing and deionized water washing, firstly, placing the ultrasonically cleaned nylon net-mounted copper sheet into an acid solution, and cleaning until the surface is bright; secondly, cleaning the nylon net-mounted copper sheet for a plurality of times by using clear water until the acid solution becomes neutral; finally, cleaning the nylon net-packed copper sheet by deionized water; wherein the concentration of the acid solution is 13%, and the pH value is more than or equal to 0.5-1.
In the invention, the concentration of the acid solution is 13%, and the pH value is more than or equal to 0.5-1 because: too high a pH value is unfavorable for corroding an oxide layer on the surface of the copper sheet, and too low a pH value can lead the copper sheet to react with acid so as to oxidize the copper sheet. Finally, deionized water is used for cleaning the nylon net-packed copper sheet because: after the copper sheet is cleaned by using clean water, the clean water is not filtered, belongs to hard water, contains a plurality of metal ion magazines, and can be easily oxidized again when the copper sheet is not cleaned by using deionized water.
Preferably, in the drying in the step S1, the copper sheet washed with deionized water is put into a centrifugal dryer for dehydration and drying for 30 minutes until the copper sheet is completely dried, and the copper sheet is stored and kept clean after drying.
In the invention, when the copper sheet and the ceramic sheet are sintered, if the copper sheet is polluted, the defects of no sintering, insufficient tension after sintering and the like can be generated when the copper sheet and the ceramic sheet are sintered in a nitrogen furnace. Therefore, it is necessary to store and keep clean the copper sheet after drying, so that it is free from contamination.
Preferably, the copper sheet in the step S1 is punched into the copper sheet according to a specific image by adopting a punching mode.
2. Glue making
S2, preparing glue for brushing glue by using a heating, stirring and chelating mode;
preferably, in the step S2, the glue making of brushing glue includes the following steps:
s21, adding 4000g of deionized water, 1200ml of glycerol and 400-500g of polyvinyl alcohol into a 5000ml container, heating to 80-100 ℃ in a water bath, and stirring for 90 minutes;
s22, adding 250ml of ethylene glycol into the solution, and continuously heating and stirring for 60 minutes;
s23, adding 221g of fuchsin solution into the solution, continuously heating and stirring for 30 minutes, and filtering by using a 260-mesh filter screen;
s24, cooling the solution, detecting the viscosity of the solution after cooling to normal temperature, and boiling the glue when the viscosity is within the range of 2500-3300 mpa.s.
The mechanism for generating glue by using deionized water, glycerol, polyvinyl alcohol, ethylene glycol and fuchsin solution is as follows: the polyvinyl alcohol is dissolved at high temperature to form a sticky jelly, and the added glycerol plays a role in moisturizing and plasticizing, can reduce the viscosity of the glue and prevents the moisture of the polyvinyl alcohol sticky jelly from volatilizing. The added glycol and absolute ethyl alcohol ensure that the polyvinyl alcohol is completely dissolved, and prevent the occurrence of the phenomenon of end-of-line and particulate matters.
In the above method, both glycerol and ethylene glycol were analytically pure, and 221g of fuchsin solution was 220g of absolute ethanol+1 g of fuchsin. The boiled 5000ml container can be a glass or stainless steel container, and can be observed at any time in the process of boiling glue water, and scalds are noticed.
In the step S21, the purpose of heating, stirring and chelating in a water bath is as follows: the heating is more uniform, the heating temperature is more convenient to control, and the burning and sticking of the pot are prevented. At the same time, the heating temperature is prevented from being too high, because the polyvinyl alcohol is automatically dehydrated and decomposed at a temperature of more than 100 ℃, the color becomes deep, and becomes insoluble in water and organic solvents.
In the step S22, the ethylene glycol is added for heating and stirring purposes: ensure that the polyvinyl alcohol is completely dissolved.
In the step S23, the fuchsin solution is added for heating and stirring purposes: the polyvinyl alcohol is ensured to be completely dissolved, and the glue is colored, so that the positions of glue cleaning points can be easily separated in the subsequent use; the purpose of filtering with a filter screen after stopping heating and stirring is to remove insoluble substances and bubbles by filtration. The filtration is required immediately after the chelation is stopped because the fluidity of the glue is reduced at normal temperature, which is unfavorable for the filtration.
In step S24, the viscosity of the glue is 2500-3300mpa.s because: too low a viscosity, after the copper sheet is fixed with the package ceramic, the position of the copper sheet may shift during the moving and sintering processes. Too high viscosity is unfavorable for carbonization and glue discharge of glue in the sintering process. The viscosity is just suitable for bonding the copper sheet and the ceramic.
3. Encapsulation ceramic brush glue
S3, selecting Al 2 O 3 Packaging ceramic, and brushing the prepared glue points on Al by using a silk screen 2 O 3 Packaging the ceramic;
preferably, in the step S3, the Al 2 O 3 The packaging ceramic contains 96% of Al 2 O 3 。
Preferably, the step S3 includes the steps of:
s31, cleaning, debugging, checking a machine table and a screen;
in the steps, the aim of cleaning, debugging and inspecting the machine and the screen is to prevent the machine from polluting Al 2 O 3 Packaging ceramic, checking whether the machine is complete, and preventing inaccurate positioning, so that sintered commodities are unqualified.
S32, al 2 O 3 The packaging ceramic is placed on the table top and is close to the positioning right angle;
in the above steps, al is added to 2 O 3 The purpose of the package ceramic against the locating right angle is to locate.
S33, pressing the screen with the left hand to enable the screen surface to be tightly attached to Al 2 O 3 Packaging ceramic, horizontally pushing glue containing glue by right hand from bottom to top, and printing glue points to Al 2 O 3 Packaging the ceramic surface;
in the steps, the glue points are even and full, and no printing is caused.
S34, loosening the pressing screen, and taking Al from the table surface 2 O 3 Packaging the two sides of the ceramic and placing the ceramic on a clean blank plate; wherein, the surface of the blank plate is cleaned by alcohol cotton cloth before the blank is placed, fingers do not contact with the pattern glue points when the plate is spliced, and the fingers are kept clean;
in the steps, the surface is cleaned by alcohol cotton cloth before the plate blank is placed, and the alcohol can clean a machine table to remove impurities and greasy dirt on the surface; when the piece is twisted, the finger does not contact the pattern glue point, the finger keeps clean, the porcelain piece is prevented from being stained with impurities and dust, and sweat stain on the hand is prevented from being stained.
S35, placing the blank plate on a blank frame.
4. Loading piece (Screen mould)
S4, using a die to carry out chemical oxidation on the copper sheet and Al coated with glue points 2 O 3 Packaging the ceramic assembly;
preferably, the step S4 includes the steps of:
s41, checking, debugging and cleaning a die;
in the steps, the purpose of checking, debugging and cleaning the die is to ensure the cleanness and the completeness of the die, ensure the consistency and the completeness of the product and ensure that the produced product is not polluted.
S42, filling copper sheets into the die, and if the copper sheets warp, installing the copper sheets on Al 2 O 3 The packaging ceramic is concave;
in the above steps, if the copper sheet has warpage, the copper sheet needs to be ensured to be installed on the porcelain sheet to be concave because: if the concave surface of the copper sheet is upwards arranged on the porcelain sheet, the periphery of the copper sheet is firstly sintered after the copper sheet is softened during sintering, the air in the copper sheet cannot be discharged completely, and bubbles can appear after sintering. Therefore, the copper sheets need to be installed on the ceramic sheets to be concave if the copper sheets are warped, so that the copper sheets are firstly sintered and then spread to the periphery during sintering, internal bubbles are extruded, and the probability of bubbles generated by sintering a molded product is reduced.
S43, checking whether unqualified copper sheets exist or not, and removing and replacing the unqualified copper sheets;
s44, horizontally holding the left lower left side of the positioning angle of the die by the left hand;
s45, inclining the die by 35-45 degrees, and lightly knocking the two sides of the upper right corner for 3-5 times to enable the copper sheet to be tightly abutted against the lower left corner of the grid;
in the above steps, the copper sheets are all abutted against the left lower corner of the grid, and the copper sheets are positioned by taking the left lower corner as a reference, so that the consistency of the produced products is ensured.
S46, al to be coated with glue points 2 O 3 The packaging ceramic is buckled into the mould close to two sides of the positioning angle;
s47, pressing the wood block on Al 2 O 3 On the packaging ceramic, the two ends of the holding die and the wood block rotate 180 degrees from outside to inside;
in the above steps, the wood block is pressed on Al 2 O 3 The purpose of the package ceramic is to ensure that the copper sheet cannot generate position deviation when the ceramic sheet is taken off from the die; the purpose of the two ends of the gripping mould and the wood block rotating 180 degrees from outside to inside is to enable the upper and lower positions of the porcelain piece and the copper sheet to be interchanged, so that the assembled porcelain piece can be conveniently taken down.
S48, slightly and vertically lifting the die upwards, checking whether the die is defective or not, obliquely repairing the die manually, and placing the copper sheet and ceramic sheet combination assembled by the die on a white ceramic sheet tool.
In the steps, the ceramic chip cannot be placed on the molybdenum chip directly during sintering, the ceramic chip is required to be placed on the white ceramic chip fixture, and then the white ceramic chip fixture is placed on the molybdenum chip, so that the molybdenum chip is prevented from polluting products during sintering.
5. Sintering of atmospheric furnace products
S5, placing the assembled semi-finished products into an atmosphere furnace, and sintering the semi-finished products into finished products at the temperature of 1065-1085 ℃;
in the steps, the packaged semi-finished product is orderly placed in the middle of an atmosphere furnace mesh belt. Wearing gloves and taking down the burnt product at the outlet of the kiln. And cooling the burned product for 3-5 minutes after discharging from the furnace, and discharging the cooled product from the frame, so that the copper-coated surface is placed in the product box relatively.
Preferably, in the step S5, the semi-finished product is sequentially subjected to the steps of glue discharging, sintering and cooling in an atmosphere furnace;
the glue discharging is that before the temperature of the sintering system is raised to 500 ℃, glue points in the system are carbonized and volatilized;
the sintering is that the oxidized copper sheet and Al 2 O 3 Sintering the packaged ceramic at 1000-1100 ℃;
the cooling is cooling to 80 ℃ or less after sintering.
In the steps, the assembled DBC packaging ceramic semi-finished product is put into a system with high temperature and nitrogen purity of 99.999 percent and is directly sintered at high temperature. The assembled ceramic is subjected to three steps of glue discharging, sintering and cooling; the glue discharging means that glue points in the sintering system are carbonized and volatilized before the temperature of the sintering system is raised to 500 ℃; oxidized copper sheet and Al 2 O 3 Sintering the packaged ceramic at 1000-1100 ℃; cooling to 80 deg.c after sintering.
Preferably, in the step S5, the purity of nitrogen in the atmosphere furnace is more than 99.999%, and the density of the sintered ceramic chip is more than 3.7g/cm 3 。
In the sintering process of the invention, the purity of nitrogen must be maintained above 99.999%, and the density of the sintered ceramic chip is more than 3.7g/cm 3 。
Preferably, in the step S5, the time from entering the kiln to exiting the kiln is 130min, the temperature of the product is raised, maintained and lowered in the kiln in sequence, the time of the temperature raising area is 52min, the time of the temperature maintaining area is 12min, and the time of the temperature lowering is 66min.
In the invention, the sintering process is calculated from the time when the product enters the kiln and the time when the product leaves the kiln is about 130 minutes, the product is heated, insulated and cooled in the kiln, the heating area is 52 minutes, the heat-preserving area is about 12 minutes, and the cooling time is 66 minutes.
In the invention, the mechanism of copper coating on the surface of the ceramic package is as follows: after the oxygen-free copper is oxidized, a layer of cuprous oxide is generated on the surface, and the cuprous oxide on the surface can react with aluminum oxide at high temperature. Oxygen is introduced to the surface of the oxygen-free copper sheet through pre-oxidation, and Cu-O eutectic liquid is formed by copper and oxygen within the temperature range of 1065-1085 ℃. On the one hand, the eutectic liquid reacts with alumina to generate intermediate phase (CuAlO) 2 Or CuAl 2 O 4 ) On the other hand, the copper foil is soaked, so that the ceramic substrate and the copper foil are well combined.
The reaction mechanism of the invention is not the same as that of the CN107819066B patent, the invention adopts a mode that oxygen-free copper is firstly subjected to chemical oxidation and then is subjected to high-temperature sintering, and the CN107819066B patent is a mode that low-oxygen copper is directly sintered. The principle of sintering after reaction is consistent, but a chemical oxidation link is added in the earlier stage.
The main innovation points of the invention are as follows: at present, for the main process of ceramic packaging copper cladding or ceramic metallization, because packaging ceramics are mostly 3D patterns, not plane copper cladding of semiconductor refrigeration sheets or power electronic modules, but various shapes with different shapes, the mode of using DBC copper cladding is difficult to obtain the required shape, and all areas needing copper cladding are difficult to cover, and because the areas of the packaging ceramics needing copper cladding are generally irregular patterns, difficulty is increased for DBC copper cladding sintering, and the traditional process of using DBC copper cladding is unfavorable for producing packaging ceramics. The method for producing the packaging ceramic copper-clad by adopting the DBC technology is the first in the industry, a layer of glue points are brushed on the surface of the positioned packaging ceramic by adopting the tool positioning mode, then the copper sheet cut into the required shape is assembled on the packaging ceramic, the glue points ensure that the assembled packaging ceramic cannot move, and the copper sheet is prevented from being displaced during sintering to cause sintering scrapping. Meanwhile, the method of firstly cutting the required copper sheet to shape and then sintering is adopted, so that the requirements of the three-dimensional packaging ceramic for copper sheets with different shapes are met.
6. Sorting and inspection
S6, sorting the sintered finished products:
if the sintered finished product is a waste product, placing the waste product into a waste product warehouse;
if the sintered product is a multi-surface product and the other surfaces are not sintered and coated with copper, returning to the step S3, and adding Al 2 O 3 Brushing glue, loading sheets and sintering on the other surface of the packaged ceramic;
if the sintered finished product is a repaired product, repairing the repaired product, and returning to the step S5 for sintering after repairing;
and if the sintered finished product is a qualified product, checking and packaging the qualified product, and placing the qualified product in a finished product warehouse.
Preferably, in the step S6, the sticky powder is blown off by an air gun when the product is sintered, and appearance inspection and product defect distinction are performed; and removing the sintering anti-sticking powder on the surface of the product by using a hairbrush for the multi-surface product, and packaging and marking the involuted product and the unqualified product.
The invention has the beneficial effects that:
1. according to the production method for copper cladding on the ceramic packaging surface, which is provided by the invention, the requirements of packaging ceramics for copper sheets in different shapes are met by adopting a mode of firstly cutting required copper sheets and then sintering. The copper sheet is cut into the required size shape before high-temperature sintering expansion, so that each side is ensured to just reach the required size after sintering expansion. And sequentially carrying out ultrasonic cleaning, acid cleaning, clear water cleaning, deionized water cleaning and drying on the cut copper sheet so as to clean greasy dirt, impurities, copper oxide layers and the like on the surface of the copper sheet and avoid affecting the subsequent sintering. And the glue for brushing glue is manufactured by utilizing a heating, stirring and chelating mode so as to bond the packaging ceramic and the copper sheet, ensure that the assembled packaging ceramic cannot move, and prevent the copper sheet from being displaced during sintering to cause sintering scrapping.
2. The method for producing the copper-clad ceramic package surface returns Al for multi-surface products 2 O 3 And brushing, mounting and sintering the other surface of the packaged ceramic, and sequentially completing copper coating of various three-dimensional shapes required by all surfaces so as to expand the application range of the ceramic copper-coated DBC process.
3. According to the production method for copper coating on the surface of the ceramic package, provided by the invention, the copper layer and the ceramic layer have better peeling strength, and the specific reasons are as follows: the metallized packaging ceramic is thinner in metallized copper layer, generally about 0.05mm, and the compactness of the electroplated copper layer is inferior to that of copper foil. The thickness of copper foil adopted in DBC production reaches 0.3mm-0.4mm, meanwhile, the copper foil and alumina ceramic are sintered at high temperature to generate chemical reaction, the copper foil is mainly connected by Cu-Al-O chemical bonds, the bonding strength is high, the electroplating in a metallization process is mainly based on Van der Waals force and mechanical biting force, the bonding strength is lower, and therefore, the peeling strength of the DBC packaging ceramic is better.
4. The production method of copper-clad ceramic packaging surface provided by the invention has very high weldability, and the specific reasons are as follows: the copper-clad DBC technology for packaging the ceramic surface adopts a copper foil direct sintering mode, the copper layer is high in thickness, a chip or a lead wire can be directly welded with a metal copper layer, the copper layer is thinner in metallization mode, the chip or the lead wire cannot be directly welded with the copper layer, and the copper-clad DBC technology has no weldability, and only has weldability after nickel plating or gold plating is carried out on the surface of the copper layer.
5. The production method of copper-clad ceramic packaging surface provided by the invention has the advantages of simple production process flow and good process operation performance; no pollution is generated, and compared with metallization, the method is more environment-friendly.
Drawings
FIG. 1 is a flow chart of the production method of the present invention.
Detailed Description
The conception, specific structure, and technical effects produced by the present invention will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present invention.
Example 1
The production method of the copper-clad ceramic packaging surface, as shown in figure 1, comprises the following steps:
s1, cutting a copper sheet into a required size shape before high-temperature sintering expansion, sequentially carrying out ultrasonic cleaning, acid cleaning, deionized water cleaning and drying on the cut copper sheet, and carrying out chemical oxidation on the copper sheet after drying;
s2, preparing glue for brushing glue by using a heating, stirring and chelating mode;
s3, selecting Al 2 O 3 Packaging ceramic, and brushing the prepared glue points on Al by using a silk screen 2 O 3 Packaging the ceramic;
s4, using a die to carry out chemical oxidation on the copper sheet and Al coated with glue points 2 O 3 Packaging the ceramic assembly;
s5, placing the assembled semi-finished products into an atmosphere furnace, and sintering the semi-finished products into finished products at the temperature of 1065-1085 ℃;
s6, sorting the sintered finished products:
if the sintered finished product is a waste product, placing the waste product into a waste product warehouse;
if the sintered product is a multi-surface product and the other surfaces are not sintered and coated with copper, returning to the step S3, and adding Al 2 O 3 Brushing glue, loading sheets and sintering on the other surface of the packaged ceramic;
if the sintered finished product is a repaired product, repairing the repaired product, and returning to the step S5 for sintering after repairing;
and if the sintered finished product is a qualified product, checking and packaging the qualified product, and placing the qualified product in a finished product warehouse.
Example 2
This example further illustrates step S1 based on example 1.
In the step S1, before the copper sheet is cut, the expansion rate of the copper sheet is calculated firstly, then the size of the copper sheet before high-temperature sintering expansion is calculated according to the expansion rate, and finally the copper sheet is cut into the required shape according to the calculated size of the copper sheet before high-temperature sintering expansion.
According to the invention, the copper sheet is firstly cut into a required shape and then sintered, so that the requirements of packaging ceramics for copper sheets with different shapes are met.
The technical difficulties are as follows: after the copper sheet is sintered at high temperature, the copper sheet expands, and compared with the copper sheet which is metallized and can fully cover the surface of the packaging ceramic and needs copper coating, the copper sheet which is cut is required to be considered for expansion during assembly. The offset due to the expansion of the copper sheet during sintering needs to be taken into account during assembly. Generally, the packaging ceramic has higher requirements on the position of the metal layer, and if the position change difference of the copper sheets is larger, the packaging ceramic can be directly scrapped, so that the problem that the metal layer of the packaging ceramic is deviated is solved.
The specific technical scheme for solving the technical difficulties is as follows: firstly, calculating the expansion rate of the copper sheet, and then, calculating the size of the copper sheet before sintering expansion according to the expansion rate, so as to ensure that each side just reaches the required size after expansion. Meanwhile, in the assembly of the copper sheets, in order to ensure that each side of the copper sheets is consistent with the corresponding expansion rate, the copper sheets are installed in a mode of installing and positioning tools, and each side of the copper sheets is ensured to be at a proper position.
In the ultrasonic cleaning in the step S1, firstly, a copper sheet is put into a nylon mesh bag; secondly, adding water into an ultrasonic cleaner to the top end of a metal basket, and adding metal cleaning powder to form an alkali solution; then placing a nylon net-mounted copper sheet in an ultrasonic cleaner, setting the temperature to 80-100 ℃, cleaning for 30 minutes by ultrasonic waves, and cleaning for 30 minutes again by changing water; finally, repeatedly cleaning the copper sheets of the nylon net by using clear water to remove redundant alkali solution; wherein the pH value of the alkali solution is more than or equal to 10.
In the step S1 of acid washing, clear water washing and deionized water washing, firstly placing the nylon net-mounted copper sheet subjected to ultrasonic cleaning into an acid solution, and cleaning until the surface is bright; secondly, cleaning the nylon net-mounted copper sheet for a plurality of times by using clear water until the acid solution becomes neutral; finally, cleaning the nylon net-packed copper sheet by deionized water; wherein the concentration of the acid solution is 13%, and the pH value is more than or equal to 0.5-1.
And in the drying step S1, the copper sheet washed by deionized water is put into a centrifugal dryer for dehydration and drying for 30 minutes until the copper sheet is completely dried, and the copper sheet is stored and kept clean after the drying.
And (2) stamping the copper sheet in the step S1 in a stamping mode, and stamping the copper sheet into the copper sheet according to a specific image.
Example 3
This example further illustrates step S2 based on example 2.
In the step S2, the glue preparation of brushing glue comprises the following steps:
s21, adding 4000g of deionized water, 1200ml of glycerol and 400-500g of polyvinyl alcohol into a 5000ml container, heating to 80-100 ℃ in a water bath, and stirring for 90 minutes;
s22, adding 250ml of ethylene glycol into the solution, and continuously heating and stirring for 60 minutes;
s23, adding 221g of fuchsin solution into the solution, continuously heating and stirring for 30 minutes, and filtering by using a 260-mesh filter screen;
s24, cooling the solution, detecting the viscosity of the solution after cooling to normal temperature, and boiling the glue when the viscosity is within the range of 2500-3300 mpa.s.
The mechanism for generating glue by using deionized water, glycerol, polyvinyl alcohol, ethylene glycol and fuchsin solution is as follows: the polyvinyl alcohol is dissolved at high temperature to form a sticky jelly, and the added glycerol plays a role in moisturizing and plasticizing, can reduce the viscosity of the glue and prevents the moisture of the polyvinyl alcohol sticky jelly from volatilizing. The added glycol and absolute ethyl alcohol ensure that the polyvinyl alcohol is completely dissolved, and prevent the occurrence of the phenomenon of end-of-line and particulate matters.
In the above method, both glycerol and ethylene glycol were analytically pure, and 221g of fuchsin solution was 220g of absolute ethanol+1 g of fuchsin. The boiled 5000ml container can be a glass or stainless steel container, and can be observed at any time in the process of boiling glue water, and scalds are noticed.
Example 4
This example further illustrates step S3 based on example 3.
The Al is 2 O 3 The packaging ceramic contains 96% of Al 2 O 3 。
The step S3 comprises the following steps:
s31, cleaning, debugging, checking a machine table and a screen;
s32, al 2 O 3 The packaging ceramic is placed on the table top and is close to the positioning right angle;
s33, pressing the screen with the left hand to enable the screen surface to be tightly attached to Al 2 O 3 Packaging ceramic, horizontally pushing glue containing glue by right hand from bottom to top, and printing glue points to Al 2 O 3 Packaging the ceramic surface;
s34, loosening the pressing screen, and taking Al from the table surface 2 O 3 Packaging the two sides of the ceramic and placing the ceramic on a clean blank plate; wherein, the surface of the blank plate is cleaned by alcohol cotton cloth before the blank is placed, fingers do not contact with the pattern glue points when the plate is spliced, and the fingers are kept clean;
s35, placing the blank plate on a blank frame.
Example 5
This example further illustrates step S4 based on example 4.
The step S4 comprises the following steps:
s41, checking, debugging and cleaning a die;
s42, filling copper sheets into the die, and if the copper sheets warp, installing the copper sheets on Al 2 O 3 The packaging ceramic is concave;
s43, checking whether unqualified copper sheets exist or not, and removing and replacing the unqualified copper sheets;
s44, horizontally holding the left lower left side of the positioning angle of the die by the left hand;
s45, inclining the die by 35-45 degrees, and lightly knocking the two sides of the upper right corner for 3-5 times to enable the copper sheet to be tightly abutted against the lower left corner of the grid;
s46, al to be coated with glue points 2 O 3 The packaging ceramic is buckled into the mould close to two sides of the positioning angle;
s47, pressing the wood block on Al 2 O 3 On the packaging ceramic, the two ends of the holding die and the wood block rotate 180 degrees from outside to inside;
s48, slightly and vertically lifting the die upwards, checking whether the die is defective or not, obliquely repairing the die manually, and placing the copper sheet and ceramic sheet combination assembled by the die on a white ceramic sheet tool.
Example 6
This example further illustrates step S5 based on example 5.
And S5, orderly placing the packaged semi-finished product in the middle of an atmosphere furnace mesh belt. Wearing gloves and taking down the burnt product at the outlet of the kiln. And cooling the burned product for 3-5 minutes after discharging from the furnace, and discharging the cooled product from the frame, so that the copper-coated surface is placed in the product box relatively.
And S5, putting the assembled DBC packaging ceramic semi-finished product into a system with high temperature and nitrogen purity of 99.999%, and directly sintering at high temperature. The assembled ceramic is subjected to three steps of glue discharging, sintering and cooling; the glue discharging means that glue points in the sintering system are carbonized and volatilized before the temperature of the sintering system is raised to 500 ℃; oxidized copper sheet and Al 2 O 3 Sintering the packaged ceramic at 1000-1100 ℃; cooling to 80 deg.c after sintering.
In the sintering process of the step S5, the purity of the nitrogen must be maintained above 99.999%, and the density of the sintered ceramic chip is required to be more than 3.7g/cm 3 。
In the step S5, the sintering process is calculated from the time when the product enters the kiln and the time when the product leaves the kiln, the total time is about 130 minutes, the product is heated, insulated and cooled in the kiln, the heating area is 52 minutes, the heat-preserving area is about 12 minutes, and the cooling time is 66 minutes.
After the oxygen-free copper is oxidized, a layer of cuprous oxide is generated on the surface, and the cuprous oxide on the surface can react with aluminum oxide at high temperature. Oxygen is introduced to the surface of the oxygen-free copper sheet through pre-oxidation, and Cu-O eutectic liquid is formed by copper and oxygen within the temperature range of 1065-1085 ℃. On the one hand, the eutectic liquid reacts with alumina to generate intermediate phase (CuAlO) 2 Or CuAl 2 O 4 ) On the other hand, the copper foil is soaked, so that the ceramic substrate and the copper foil are well combined.
Example 7
This example further illustrates step S6 based on example 6.
In the step S6, the sticky powder generated during sintering of the product is blown off by an air gun, appearance inspection is performed, and defects of the product are distinguished; and removing the sintering anti-sticking powder on the surface of the product by using a hairbrush for the multi-surface product, and packaging and marking the involuted product and the unqualified product.
While the embodiments of the present invention have been described in detail, the present invention is not limited to the embodiments described above, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the present invention, and these are intended to be included in the scope of the present invention as defined in the appended claims.
Claims (9)
1. The production method of the copper-clad ceramic packaging surface is characterized by comprising the following steps of:
s1, cutting a copper sheet into a required size shape before high-temperature sintering and expansion, sequentially carrying out ultrasonic cleaning, acid cleaning, deionized water cleaning and drying on the cut copper sheet, and carrying out chemical oxidation on the copper sheet after drying to generate a layer of cuprous oxide on the surface of the copper sheet;
the method comprises the steps of S1, firstly calculating the expansion rate of a copper sheet before cutting the copper sheet, then calculating the required size of the copper sheet before high-temperature sintering expansion according to the expansion rate, and finally cutting the copper sheet into a required shape according to the calculated required size of the copper sheet before high-temperature sintering expansion;
s2, preparing glue for brushing glue by using a heating, stirring and chelating mode;
s3, selecting Al 2 O 3 Packaging ceramic, and brushing the prepared glue points on Al by using a silk screen 2 O 3 Packaging the ceramic;
s4, using a die to carry out chemical oxidation on the copper sheet and Al coated with glue points 2 O 3 Packaging the ceramic assembly;
s5, placing the assembled semi-finished products into an atmosphere furnace, and sintering the semi-finished products into finished products at the temperature of 1065-1085 ℃;
s6, sorting the sintered finished products:
if the sintered finished product is a waste product, placing the waste product into a waste product warehouse;
if the sintered product is a multi-surface product and the other surfaces are not sintered and coated with copper, returning to the step S3, and adding Al 2 O 3 Brushing glue, loading sheets and sintering on the other surface of the packaged ceramic;
if the sintered finished product is a repaired product, repairing the repaired product, and returning to the step S5 for sintering after repairing;
and if the sintered finished product is a qualified product, checking and packaging the qualified product, and placing the qualified product in a finished product warehouse.
2. The method for producing copper-clad ceramic package surface according to claim 1, wherein in the ultrasonic cleaning of step S1, firstly, a copper sheet is put into a nylon mesh bag; secondly, adding water into an ultrasonic cleaner to the top end of a metal basket, and adding metal cleaning powder to form an alkali solution; then placing a nylon net-mounted copper sheet in an ultrasonic cleaner, setting the temperature to 80-100 ℃, cleaning for 30 minutes by ultrasonic waves, and cleaning for 30 minutes again by changing water; finally, repeatedly cleaning the copper sheets of the nylon net by using clear water to remove redundant alkali solution; wherein the pH value of the alkali solution is more than or equal to 10.
3. The method for producing the copper-clad ceramic package surface according to claim 1, wherein in the step S1, acid washing, clean water washing and deionized water washing are performed, firstly, a nylon net-packed copper sheet which is subjected to ultrasonic cleaning is put into an acid solution, and the copper sheet is cleaned until the surface is bright; secondly, cleaning the nylon net-mounted copper sheet for a plurality of times by using clear water until the acid solution becomes neutral; finally, cleaning the nylon net-packed copper sheet by deionized water; wherein the concentration of the acid solution is 13%, and the pH value is more than or equal to 0.5-1.
4. The method for producing copper-clad ceramic package surface according to claim 1, wherein in the step S1, the copper sheet washed with deionized water is put into a centrifugal drier for dehydration and drying for 30 minutes until the copper sheet is completely dried, and the copper sheet is stored and kept clean after drying.
5. The method for producing copper-clad ceramic package surface according to claim 1, wherein in the step S2, the glue making of the brushing glue comprises the following steps:
s21, adding 4000g of deionized water, 1200ml of glycerol and 400-500g of polyvinyl alcohol into a 5000ml container, heating to 80-100 ℃ in a water bath, and stirring for 90 minutes;
s22, adding 250ml of ethylene glycol into the solution, and continuously heating and stirring for 60 minutes;
s23, adding 221g of fuchsin solution into the solution, continuously heating and stirring for 30 minutes, and filtering by using a 260-mesh filter screen;
s24, cooling the solution, detecting the viscosity of the solution after cooling to normal temperature, and boiling the glue when the viscosity is within the range of 2500-3300 mpa.s.
6. The method for producing copper-clad ceramic package surface according to claim 1, wherein the step S3 comprises the steps of:
s31, cleaning, debugging, checking a machine table and a screen;
s32, al 2 O 3 The packaging ceramic is placed on the table top and is close to the positioning right angle;
s33, pressing the screen with the left hand to enable the screen surface to be tightly attached to Al 2 O 3 Packaging ceramic, horizontally pushing glue containing glue by right hand from bottom to top, and printing glue points to Al 2 O 3 Packaging the ceramic surface;
s34, loosening the pressing screen, and taking Al from the table surface 2 O 3 Packaging the two sides of the ceramic and placing the ceramic on a clean blank plate; wherein, the surface of the blank plate is cleaned by alcohol cotton cloth before the blank is placed, fingers do not contact with the pattern glue points when the plate is spliced, and the fingers are kept clean;
s35, placing the blank plate on a blank frame.
7. The method for producing copper-clad ceramic package surface according to claim 1, wherein the step S4 comprises the steps of:
s41, checking, debugging and cleaning a die;
s42, filling copper sheets into the die, and if the copper sheets warp, installing the copper sheets on Al 2 O 3 The packaging ceramic is concave;
s43, checking whether unqualified copper sheets exist or not, and removing and replacing the unqualified copper sheets;
s44, horizontally holding the left lower left side of the positioning angle of the die by the left hand;
s45, inclining the die by 35-45 degrees, and lightly knocking the two sides of the upper right corner for 3-5 times to enable the copper sheet to be tightly abutted against the lower left corner of the grid;
s46, al to be coated with glue points 2 O 3 The packaging ceramic is buckled into the mould close to two sides of the positioning angle;
s47, pressing the wood block on Al 2 O 3 On the packaging ceramic, the two ends of the holding die and the wood block rotate 180 degrees from outside to inside;
s48, slightly and vertically lifting the die upwards, checking whether the die is defective or not, obliquely repairing the die manually, and placing the copper sheet and ceramic sheet combination assembled by the die on a white ceramic sheet tool.
8. The method for producing copper-clad ceramic package surface according to claim 1, wherein in the step S5, the semi-finished product is sequentially subjected to the steps of paste discharging, sintering and cooling in an atmosphere furnace;
the glue discharging is that before the temperature of the sintering system is raised to 500 ℃, glue points in the system are carbonized and volatilized;
the sintering is that the oxidized copper sheet and Al 2 O 3 Sintering the packaged ceramic at 1000-1100 ℃;
the cooling is that the temperature is cooled to be within 80 ℃ after sintering;
in the step S5, the purity of nitrogen in the atmosphere furnace is more than 99.999%, and the density of the sintered ceramic chip is more than 3.7g/cm < 3 >;
in the step S5, the time from entering the kiln to exiting the kiln is 130min, the temperature of the product is sequentially increased, maintained and reduced in the kiln, the time of a temperature increasing zone is 52min, the time of a temperature maintaining zone is 12min, and the time of reducing the temperature is 66min.
9. The method for producing copper-clad ceramic package surface according to claim 1, wherein in the step S6, the powder stuck during sintering of the product is blown off by an air gun, and appearance inspection and product defect differentiation are performed; and removing the sintering anti-sticking powder on the surface of the product by using a hairbrush for the multi-surface product, and packaging and marking the involuted product and the unqualified product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311775531.3A CN117457504B (en) | 2023-12-22 | 2023-12-22 | Production method for copper-clad ceramic packaging surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311775531.3A CN117457504B (en) | 2023-12-22 | 2023-12-22 | Production method for copper-clad ceramic packaging surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117457504A CN117457504A (en) | 2024-01-26 |
| CN117457504B true CN117457504B (en) | 2024-03-08 |
Family
ID=89591492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311775531.3A Active CN117457504B (en) | 2023-12-22 | 2023-12-22 | Production method for copper-clad ceramic packaging surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117457504B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118231263B (en) * | 2024-02-27 | 2025-02-11 | 海信家电集团股份有限公司 | Method for preparing substrate, method for preparing power module, and power module |
Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3994430A (en) * | 1975-07-30 | 1976-11-30 | General Electric Company | Direct bonding of metals to ceramics and metals |
| US4129243A (en) * | 1975-07-30 | 1978-12-12 | General Electric Company | Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof |
| US4505418A (en) * | 1980-09-25 | 1985-03-19 | Brown, Boveri & Cie Ag | Method of direct bonding copper foils to oxide-ceramic substrates |
| JPS6089354A (en) * | 1983-08-23 | 1985-05-20 | ベ−・ベ−・ツエ−・アクチエンゲゼルシヤフト・ブラウン・ボヴエリ・ウント・コンパニイ | Ceramic-metal element |
| JPH06216483A (en) * | 1993-01-12 | 1994-08-05 | Toshiba Chem Corp | Low-expansion-coefficient metal foil and laminated board for printed circuit |
| US5561321A (en) * | 1992-07-03 | 1996-10-01 | Noritake Co., Ltd. | Ceramic-metal composite structure and process of producing same |
| JP2000281462A (en) * | 1999-03-31 | 2000-10-10 | Mitsubishi Electric Corp | Production of metal-ceramic composite substrate |
| CN1416182A (en) * | 2002-10-24 | 2003-05-07 | 上海利浦电子陶瓷厂 | Technique for producing heat dispersion substrate of ceramics with copper coated |
| JP2003198134A (en) * | 2001-12-28 | 2003-07-11 | Mitsubishi Gas Chem Co Inc | Method for manufacturing composite ceramics multilayer board |
| JP2006117959A (en) * | 2004-10-19 | 2006-05-11 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electronic material |
| EP2268754A1 (en) * | 2008-04-16 | 2011-01-05 | Basf Se | Method for producing self-adhesive items |
| JP2016050355A (en) * | 2015-03-09 | 2016-04-11 | Ｊｘ金属株式会社 | Method for producing copper foil with carrier, method for producing copper clad laminate, method for producing printed wiring board, copper clad laminate, electronic device, and copper foil with carrier |
| JP2016115821A (en) * | 2014-12-16 | 2016-06-23 | Ｎｇｋエレクトロデバイス株式会社 | Copper clad ceramic circuit board, electronic apparatus with the same packaged therein, and manufacturing method of copper clad ceramic circuit board |
| CN107819066A (en) * | 2017-10-26 | 2018-03-20 | 成都万士达瓷业有限公司 | A kind of production method of hypoxemia copper sintering DBC semiconductor heat electric substrates |
| CN108615717A (en) * | 2018-07-20 | 2018-10-02 | 井敏 | A kind of metallized ceramic substrate, method for preparing substrate and substrate and chip welding method |
| RU2018113781A3 (en) * | 2018-04-16 | 2019-10-16 | ||
| JP2020038896A (en) * | 2018-09-04 | 2020-03-12 | 古河電気工業株式会社 | Junction structure and method for manufacturing the same |
| JP2020072207A (en) * | 2018-07-31 | 2020-05-07 | 國家中山科學研究院 | A method to increase the adhesive strength between the ceramic mounting plate and the thick film circuit |
| CN112248577A (en) * | 2020-10-16 | 2021-01-22 | 江苏联鑫电子工业有限公司 | Halogen-free phosphorus-containing low-dielectric copper-clad plate and preparation method thereof |
| CN112846563A (en) * | 2020-12-31 | 2021-05-28 | 松山湖材料实验室 | Solder paste, method for preparing same, device and soldering method |
| CN116705591A (en) * | 2023-06-09 | 2023-09-05 | 广德东风半导体科技有限公司 | Ceramic chip cleaning process and cleaning fluid for copper-clad ceramic substrate production |
| CN117326886A (en) * | 2022-06-24 | 2024-01-02 | 比亚迪股份有限公司 | Slurry for ceramic copper-clad part, and preparation method and application thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040137251A1 (en) * | 2003-01-14 | 2004-07-15 | Davis Michael John | Poly(phenylene ether)-polyvinyl thermosetting adhesives films, and substrates made therefrom |
| US20210162551A1 (en) * | 2017-12-18 | 2021-06-03 | Dic Corporation | Copper fine particle sintered body |
-
2023
- 2023-12-22 CN CN202311775531.3A patent/CN117457504B/en active Active
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3994430A (en) * | 1975-07-30 | 1976-11-30 | General Electric Company | Direct bonding of metals to ceramics and metals |
| US4129243A (en) * | 1975-07-30 | 1978-12-12 | General Electric Company | Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof |
| US4505418A (en) * | 1980-09-25 | 1985-03-19 | Brown, Boveri & Cie Ag | Method of direct bonding copper foils to oxide-ceramic substrates |
| JPS6089354A (en) * | 1983-08-23 | 1985-05-20 | ベ−・ベ−・ツエ−・アクチエンゲゼルシヤフト・ブラウン・ボヴエリ・ウント・コンパニイ | Ceramic-metal element |
| US5561321A (en) * | 1992-07-03 | 1996-10-01 | Noritake Co., Ltd. | Ceramic-metal composite structure and process of producing same |
| JPH06216483A (en) * | 1993-01-12 | 1994-08-05 | Toshiba Chem Corp | Low-expansion-coefficient metal foil and laminated board for printed circuit |
| JP2000281462A (en) * | 1999-03-31 | 2000-10-10 | Mitsubishi Electric Corp | Production of metal-ceramic composite substrate |
| JP2003198134A (en) * | 2001-12-28 | 2003-07-11 | Mitsubishi Gas Chem Co Inc | Method for manufacturing composite ceramics multilayer board |
| CN1416182A (en) * | 2002-10-24 | 2003-05-07 | 上海利浦电子陶瓷厂 | Technique for producing heat dispersion substrate of ceramics with copper coated |
| JP2006117959A (en) * | 2004-10-19 | 2006-05-11 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electronic material |
| EP2268754A1 (en) * | 2008-04-16 | 2011-01-05 | Basf Se | Method for producing self-adhesive items |
| JP2016115821A (en) * | 2014-12-16 | 2016-06-23 | Ｎｇｋエレクトロデバイス株式会社 | Copper clad ceramic circuit board, electronic apparatus with the same packaged therein, and manufacturing method of copper clad ceramic circuit board |
| JP2016050355A (en) * | 2015-03-09 | 2016-04-11 | Ｊｘ金属株式会社 | Method for producing copper foil with carrier, method for producing copper clad laminate, method for producing printed wiring board, copper clad laminate, electronic device, and copper foil with carrier |
| CN107819066A (en) * | 2017-10-26 | 2018-03-20 | 成都万士达瓷业有限公司 | A kind of production method of hypoxemia copper sintering DBC semiconductor heat electric substrates |
| RU2018113781A3 (en) * | 2018-04-16 | 2019-10-16 | ||
| CN108615717A (en) * | 2018-07-20 | 2018-10-02 | 井敏 | A kind of metallized ceramic substrate, method for preparing substrate and substrate and chip welding method |
| JP2020072207A (en) * | 2018-07-31 | 2020-05-07 | 國家中山科學研究院 | A method to increase the adhesive strength between the ceramic mounting plate and the thick film circuit |
| JP2020038896A (en) * | 2018-09-04 | 2020-03-12 | 古河電気工業株式会社 | Junction structure and method for manufacturing the same |
| CN112248577A (en) * | 2020-10-16 | 2021-01-22 | 江苏联鑫电子工业有限公司 | Halogen-free phosphorus-containing low-dielectric copper-clad plate and preparation method thereof |
| CN112846563A (en) * | 2020-12-31 | 2021-05-28 | 松山湖材料实验室 | Solder paste, method for preparing same, device and soldering method |
| CN117326886A (en) * | 2022-06-24 | 2024-01-02 | 比亚迪股份有限公司 | Slurry for ceramic copper-clad part, and preparation method and application thereof |
| CN116705591A (en) * | 2023-06-09 | 2023-09-05 | 广德东风半导体科技有限公司 | Ceramic chip cleaning process and cleaning fluid for copper-clad ceramic substrate production |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117457504A (en) | 2024-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117457504B (en) | Production method for copper-clad ceramic packaging surface | |
| US9136231B2 (en) | Carrier-free land grid array IC chip package and preparation method thereof | |
| CN109534842B (en) | Welding process for power semiconductor module | |
| CN113939095B (en) | Ceramic copper-clad plate and preparation method thereof | |
| CN104332550B (en) | COB formula LED encapsulation piece based on beryllium oxide ceramics substrate and production method | |
| CN105428266B (en) | The product of flip-chip eutectic bonding method and acquisition with medium bridge | |
| CN104228316B (en) | Machining technology for conducting printing and surface mounting on substrates made of various materials simultaneously and jig structure thereof | |
| CN105305995A (en) | Novel SMD (Surface Mount Device) quartz crystal resonator and complete board encapsulation machining process thereof | |
| CN104220396B (en) | Ceramic matrix and manufacture method thereof | |
| CN109309001B (en) | Method for manufacturing GPP chip by adopting printing process | |
| CN105948825A (en) | Ceramic composite layer for brazing and preparation method thereof | |
| CN111785644A (en) | Method for preparing pre-welded copper-clad ceramic substrate through laser cladding | |
| CN109755116B (en) | A method of making unidirectional TVS chip by printing process | |
| CN114899154B (en) | High-efficiency double-sided heat dissipation power module packaging method | |
| CN112151400B (en) | Method for solving problem of bonding of SMD tube shell with gold-aluminum system | |
| CN112469199A (en) | Preparation method of aluminum nitride ceramic circuit board | |
| WO2021056778A1 (en) | Welding process for cladding copper on back surface of wafer | |
| CN101425468B (en) | Coated lead wire frame | |
| CN1416182A (en) | Technique for producing heat dispersion substrate of ceramics with copper coated | |
| CN114300364A (en) | Metallization method of aluminum nitride ceramic substrate | |
| CN109378307B (en) | Production method of multi-chip module type packaging structure | |
| CN115458515B (en) | A power MOSFET module and production method | |
| CN201877457U (en) | Side-emitting LED (light-emitting diode) module integrated with LED bracket and circuit board and bracket circuit board | |
| CN111642073B (en) | Manufacturing method of stepped groove plate | |
| CN221979168U (en) | High thermal conductivity PCB circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |